JPH0731960Y2 - Polishing liquid supply mechanism for surface grinding and polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a polishing liquid supply mechanism of a surface grinding and polishing apparatus for polishing an end surface of a work through a polishing liquid.

(Prior Art) To polish the end face of a cylindrical rod lens that is a work, a device 101 as shown in FIG. 6 is used.
01 is a horizontally arranged polishing plate 103 for polishing the aligned end faces of the rod lens 7, and the polishing plate 103 is provided at the center of the polishing plate 103.
Further, a rotary shaft 104 that rotates around a vertical axis, and a carrier 105 that meshes with the outer periphery of the rotary shaft 104 and revolves on the polishing plate 103 while rotating on its own axis while holding the rod lens 7 in the vertical direction. Further, the abrasive liquid 8 is dropped onto the upper part of the work 7 from a ring-shaped gutter 124 arranged above the carrier 105, that is, above the work 7, and polishing is performed. Such polishing by dropping the abrasive liquid 8 is usually performed by 4 to 5 from a fine grinding process of fine abrasive grains to a precision polishing process of gradually coarsening of abrasive grains.
The treatment is performed through the steps of steps. At this time, in each step, cleaning was performed by ultrasonic waves or the like before performing the polishing treatment in the next step so that the rough polishing liquid during the pretreatment was not brought in.

(Problems to be Solved by the Invention) However, according to the above-mentioned conventional method of dropping the abrasive liquid, the abrasive liquid is dropped from above the work, so that even if both the carrier and the work are cleaned by ultrasonic waves or the like. , The fine particles of the carrier or uncleanable parts such as holes cannot be removed completely,
Therefore, it causes the transfer of coarse abrasive grains to the next step, and if scratches are generated on the work polishing surface due to the transfer of coarse abrasive particles in the previous step, it is not possible to remove the scratches with fine abrasive particles from the next step. Therefore, a high quality polished surface could not be obtained.

Therefore, an object of the present invention is to provide a plurality of grinding / polishing treatment processes from a process using a polishing liquid containing coarse abrasive grains to a process using a polishing liquid containing fine abrasive grains, in which the coarse abrasive grains in the previous process are processed in the next process. Another object of the present invention is to provide a polishing liquid supply mechanism for a surface grinding and polishing apparatus that is not brought into a grinding and polishing process.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a horizontal polishing plate, a rotating shaft disposed in the center of the polishing plate, and rotating about a vertical axis. A surface grinding / polishing device is provided which is in contact with the outer periphery of the rotating shaft and revolves on the polishing plate around the rotating shaft and which holds the work in a vertical direction.
The polishing plate and the carrier were vertically separated from each other by a predetermined distance, and a polishing liquid outlet for supplying a polishing liquid onto the polishing plate from a polishing liquid supply passage near the outer circumference of the rotating shaft was provided below the carrier. It is characterized by

(Operation) Since the polishing platen and the carrier are vertically separated by a predetermined distance, the polishing liquid supplied onto the polishing plate does not adhere to the carrier, and the polishing liquid is a polishing liquid near the outer circumference of the rotating shaft. Since it is supplied from the supply path to the polishing solution outlet below the carrier, it flows in the outer peripheral direction on the polishing machine, and a new polishing solution is constantly available on the polishing surface of the work and on the polishing machine from the inner peripheral side to the outer peripheral side. Supplied and self-cleaning.

(Examples) Examples will be described below with reference to the accompanying drawings.

FIG. 1 shows a surface grinding / polishing device according to the present invention. The device 1 is a horizontal polishing table 3 for polishing an end surface of a rod lens.
A rotary shaft 4 disposed in the center of the polishing plate 3, a carrier 5 that contacts the outer periphery of the rotary shaft 4 and revolves on the polishing plate 3 around the rotary shaft 4, The polishing plate 3 is provided with a polishing liquid supply mechanism 2 for supplying a polishing liquid.

The polishing table 3 has a ring shape having a polishing surface on its upper surface, and is connected to a drive mechanism (not shown) to rotate in a horizontal plane. A rotating shaft 4 protruding upward is provided in the inner diameter of the polishing plate 3.
Is provided, and a sun gear portion 41 is formed on the outer periphery of the rotating shaft 4. A planetary gear portion 51 on the outer periphery of the carrier 5 that holds a work is meshed with the sun gear portion 41. When the rotary shaft 4 is meshed and rotated in the direction of arrow A as shown in FIG.
Rotates in the direction of mark B and revolves in the direction of arrow C around the rotary shaft 4 on the polishing platen 3 between the rotary shaft 4 and the internal gear portion 61. Further, in this embodiment, the polishing platen 3 is rotated in the arrow D direction opposite to the revolving direction of the carrier 5 via a drive mechanism (not shown). As described above, in the present embodiment, the 3-way system is adopted in which the polishing platen 3 is rotated, the carrier 5 is rotated and the carrier 5 is revolved in three directions through the gear portion. However, the polishing platen 3 may be fixed or The carrier 5 may be revolved only without rotating.

As shown in FIG. 2, the carrier 5 has an inner ring 52 having a dodecagonal outer shape, a substantially trapezoidal spacer 53 screwed to the inner ring 52 via a bolt, and the adjacent spacers 53. A pressing plate 54, which is supported between the pressing plate 54 and presses the work in the direction of the inner ring 52 while maintaining a right angle through a pair of screws 55 with a built-in spring, and a planetary gear portion 51 screwed to the pressing plate 54 and on the outer periphery. The outer ring 56 and the outer ring 56 are disposed above the polishing plate 3 with a predetermined distance (l).

As shown in FIG. 3, the work held by the carrier 5 is formed by arranging cylindrical rod lenses 7 ... Between two yatoi glass plates 71, 71 with spacers 72, 72 interposed therebetween while maintaining a right angle. Both end surfaces 7a and 7b of the rod lens 7 are exposed vertically.

Inside the sun gear portion 41 of the rotary shaft 4 for rotating the carrier 5, as shown in FIG. A plurality of holes are provided in the direction, and the polishing liquid supply port 22 at the lower end thereof is arranged below the carrier 5. A ring-shaped gutter portion 24 is connected to the upper end of the abrasive liquid supply hole 21 via a tube 23, and a not shown abrasive liquid supply source is provided in the gutter part 24 via a supply hose 25 and a fixed pipe 26. The polishing liquid 8 is supplied, and the polishing liquid 8 is dropped from the trough portion 24 through the tube 23 and the polishing liquid supply hole 21 through the polishing liquid supply port 22 which is a polishing liquid outlet, and further the rotation of the rotating shaft 4 is performed. Due to the centrifugal force generated by the aforesaid polishing liquid 8 having abrasive grains of the same roughness between the end surface 7a or 7b, which is the polishing surface of the rod lens 7, and the polishing surface of the polishing disk 3.
The new liquid is supplied, which has a self-cleaning action. In this way, polishing is sequentially performed from the process using the abrasive liquid 8 containing coarse abrasive grains to the process using the abrasive liquid 8 containing fine abrasive grains, and a cleaning process is performed at the end of each process. At this time, since the polishing platen 3 and the carrier 5 are vertically separated from each other by a predetermined distance (l), the polishing liquid 8 does not adhere to the carrier 5, and the end surface 7a or 7b of the bundle of rod lenses 7 as a work is not attached. Can be attached only to. In this way, the polishing liquid supply mechanism 2 is constructed.

The flow of the polishing liquid 8 can be increased by rotating the polishing disk 3.

Further, as shown in FIG. 4, the polishing liquid supply mechanism includes a rotary shaft 4
The polishing liquid 8 dropped from the polishing liquid supply port 22 of the polishing liquid supply hole 21 near the outer periphery is stored in a polishing liquid reservoir 9 formed below the polishing surface of the one-side polishing plate 30, and the polishing liquid reservoir 9 and the polishing plate are stored. From the upper end opening 92, which is the abrasive solution outlet of the communication hole 91 that communicates with the upper surface of 30, the head pressure difference H and the centrifugal force due to the rotation of the rotating shaft 4 cause grinding from the inner peripheral side of the upper surface of the polishing machine 30 to the outer peripheral side as indicated by the arrow. The liquid may be made to flow.

(Effect of the Invention) As described above, according to the present invention, since the polishing platen and the carrier are vertically separated by a predetermined distance, the abrasive liquid supplied from below the carrier onto the polishing platen may adhere to the carrier. Therefore, the rough abrasive grains in the previous step do not remain in the non-cleanable portion such as the carrier or the hole, and the scratch on the polished surface of the work can be prevented. Furthermore, since the polishing liquid supplied on the polishing plate has a self-cleaning action that flows on the polishing plate in the outer peripheral direction, the cleaning effect before moving to the next step is improved, and it is possible to prevent the occurrence of defective scratches, so that high-quality workpieces can be prevented. It is possible to obtain a polished surface.

[Brief description of drawings]

FIG. 1 is a partial sectional front view of a surface grinding and polishing apparatus having a polishing liquid supply mechanism, FIG. 2 is a plan view of a carrier, FIG. 3 is a perspective view of a work, and FIG. 4 is another embodiment of the polishing liquid supply mechanism. FIG. 5 is a diagram showing an example, FIG. 5 is a diagram showing an operation of the surface grinding and polishing apparatus, and FIG. 6 is a diagram showing a conventional polishing liquid supply mechanism. In the figure, 1 is a surface grinding and polishing device, 2 is a polishing liquid supply mechanism, 3
Is a polishing plate, 4 is a rotary shaft, 5 is a carrier, 7 is a rod lens, 8 is a polishing liquid, 21 is a polishing liquid supply passage, and 22 and 92 are polishing liquid outlets.

Claims (1)

[Scope of utility model registration request] 1. A horizontal polishing plate for sequentially polishing an end surface of a work from a polishing liquid containing coarse abrasive grains through a polishing liquid containing fine abrasive grains, and a centrally disposed polishing plate and around a vertical axis. Surface grinding and polishing including a rotating shaft that rotates in a vertical direction and a carrier that contacts the outer periphery of the rotating shaft and revolves on the polishing plate around the rotating shaft and holds the work in the vertical direction. In the apparatus, the polishing platen and the carrier are vertically separated from each other by a predetermined distance, and a polishing liquid outlet for supplying a polishing liquid onto the polishing plate from a polishing liquid supply passage near the outer periphery of the rotating shaft is provided below the carrier. A polishing liquid supply mechanism for a surface grinding / polishing device, characterized in that