JPH07312194A - Analyzer device - Google Patents

Abstract

PURPOSE:To improve position reproducibility of an analytic object by providing a supporting surface supporting the analytic object and providing a contact surface of tapered structure, brought into contact with the rotatable analytic object, in a positioning device of the analytic object. CONSTITUTION:In an analytic position measuring device, an analytic object (wafer) 5, after its analytic position is determined, is transfer fed to an analyzer from the analytic position measuring device, to set the wafer 5 in the analyzer. Here, the wafer 5 is transfer fed by an arm and placed on a supporting surface 11 of a holder 1. Next by a retaining part 4, when force in a cross direction is applied to the wafer 5, it is brought into contact with a contact surface 12 of tapered structure in a supporting part 10, to generate pressing force in a direction of the supporting surface 11. As the result, the wafer 5 is retained by the supporting surface 11. In the case of causing position displacement in an orientation flat 6 of the wafer 5, the wafer 5, by force from a retaining part 4, is applied with force in a cross direction relating to a position displaced from an axial center between the first/third supporting parts 10-1, 10-3. By this rotating force, the wafer 5 is slid on the supporting surface 11, moved to a preset position and positioned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an analyzer, and more particularly to an apparatus for positioning an analysis position of an object to be analyzed.

[0002]

2. Description of the Related Art It is known that an analyzer is provided with a positioning device for determining an analysis position of an object to be analyzed, and the positioning device improves the efficiency of analysis processing.
Generally, since the observation area in the analyzer is small, it is difficult to directly determine the analysis position on the analyzer side. Therefore, a measurement method is used in which the analysis point of the analysis target is determined in advance by using an analysis point measurement device with a relatively wide observation area, and the probe or the like is positioned at the analysis point on the analysis device side. We are working to improve the efficiency of analysis processing. FIG. 7 is a diagram for explaining a general analysis procedure of the analyzer using the positioning device. In addition,
In the figure, a semiconductor wafer is described as an example of the analysis target. In the figure, for example, when analyzing a semiconductor wafer or the like, first, the position of impurities such as dust is analyzed by the analysis point measuring device 101 on the wafer 105 which is the analysis object, and the analysis points P1, P2 ,.
Predetermined as Pi, ..., Pn, the position data of the analysis point is stored in the memory 102. Next, the wafer 105 is transferred from the analysis point measuring device 101 to the analysis device 104 such as EPMA to analyze the analysis point. On this occasion,
By using the position data of the analysis points stored in the memory 102, the XY stage 103 of the analysis device 104 is driven, and the analysis points P1, P2, ... Pi, ... ..Pn is the analyzer 10
4. Position the analysis position as reproduced on 4. The linear portion formed on a part of the wafer 105 in the figure is a component for positioning which is usually called an orientation flat surface.

In the conventional analyzer, the positioning device has a support surface for supporting the object to be analyzed and a support portion for positioning, and the object to be analyzed is placed on the support surface and the object to be analyzed is placed on the support portion. By bringing the side portions into contact with each other, the position of the analysis object in the analysis device is always fixed. FIG. 8 is a schematic diagram of a positioning device in a conventional analyzer. Wafer 10 that is the object of analysis
5 is placed and supported on the support surface 61, and is positioned by the support portion 60. For example, the support portion 6
0 is composed of three supporting portions 60-1, 60-2, and 60-3, and the supporting portions 60-1, 60-2 among them are arranged so as to contact the orientation flat surface 6 of the wafer 5. The support portion 60 has, for example, the X-coordinate on the line connecting the support portions 60-1 and 60-2 that are in contact with the orientation flat surface 6, and the wafer 5
The coordinate system is formed with the Y coordinate on the line in contact with.
Then, the positioning by the support portion 60 is performed by pressing the wafer 105 placed on the support surface 61 by the pressing portion 41.
The side of the wafer 105 is pressed in the 0 direction and the three supporting portions 6
Positioning is performed by touching 0.

[0004]

However, in the conventional analyzer, when the analysis target is positioned at the analysis position defined by the analysis point measuring device, the position of the analysis object is set on the same coordinate position as the position determined by the analysis point measuring device. It is difficult to accurately reproduce the position of the analysis target, and there is a problem in the position reproducibility of the analysis target. As a result of studying the operation of the positioning device of the conventional analyzer, the following mode, which causes a positioning error, could be obtained. FIG. 8B and FIG. 9 show the operating state of the wafer in positioning the conventional analyzer. In FIG. 8B, the wafer 5 placed on the support surface 61 is pressed against the pressing portion 41.
When the wafer 5 is pressed in the direction of the supporting portion 60 by, the side surface of the wafer 5 contacts any one of the supporting portions 60-1, 60-2, 60-3. The figure shows a state where the support portions 60-1 and 60-3 are in contact with each other.

The support portion 60 is fixed to the holder 1 at a mounting portion 63, and the support portion 60 is provided.
The contact surface 62 that contacts the wafer 105 is formed perpendicular to the support surface 61. When the side portion of the wafer 105 comes into contact with the contact surface 62 of the support portion 60 and the friction at the contact portion is sufficiently small, the wafer 5 has the contact surface 62.
And is positioned at a reference position as shown in FIG. 8 (a). However, in the conventional analyzer, the frictional force generated between the contact surface 62 of the support portion 60 and the wafer 105 causes the side portion of the wafer 105 to contact the contact surface 62 as shown in FIG. 9B. When it is fixed as it is, or when the pressing force of the pressing portion 41 is strong, the side portion of the wafer 105 is lifted from the supporting surface 61 as shown in FIG. 9C. Normally, the inside of the analyzer is in a vacuum state, and unlike the analysis position measuring device used in the atmosphere, the analysis target cannot be brought into contact with the support surface due to the atmospheric pressure difference. There will be a gap. Therefore, the movement is not performed smoothly and stops in the state of FIG. 8B, accurate positioning is not performed, and it becomes difficult to reproduce the position of the analysis target, and the height of the analysis target is reduced. Will also cause an error. Furthermore, it also causes deformation of the wafer 105 itself. Therefore, it is an object of the present invention to solve the above-mentioned problems of the conventional analyzer and to provide an analyzer having good position reproducibility of the analysis target.

[0006]

SUMMARY OF THE INVENTION The present invention is an analyzer including an apparatus for positioning an analysis position of an analysis object, and a supporting surface for supporting the analysis object on the positioning device and a rotatable support. In addition, the above-mentioned object is achieved by including a supporting portion provided with a contact surface having a tapered structure which comes into contact with the side portion of the analyte. The positioning device of the analysis device of the present invention positions the analysis object at the analysis position of the analysis device, and moves the analysis object to the coordinate position in the reference coordinate system. The support surface of the present invention is a portion having a function of supporting and holding the analysis target, and holds the analysis target by contacting at least a part thereof. In addition, the support portion of the present invention sets a reference position for positioning the analysis target, and the surface contacting the analysis target has a taper structure and has an angle with respect to the moving direction of the analysis target. It has a contact with the side portion of the analysis target and forms a component force in the direction of the support surface with respect to the analysis target. Due to this component force, the object to be analyzed receives an acting force that is pressed down in the direction of the supporting surface, and the lifting is suppressed.

According to the first embodiment of the present invention, the supporting portion of the analyzer of the present invention is rotatably supported by a rotation supporting member such as a bearing, whereby the supporting portion can be rotatably supported. it can. The second embodiment of the present invention sets at least one of the supporting parts of the analyzer of the present invention so as to correspond to the alignment part on the side of the object to be analyzed, thereby setting one coordinate axis, and The support unit sets the other coordinate axis to form a coordinate system, which enables positioning of the analysis target on the coordinate system formed by the support unit. The third embodiment of the present invention is to form a notch groove on the support surface of the analyzer of the present invention, whereby the frictional force between the analyte and the support surface can be reduced. In the fourth embodiment of the present invention, the holder forming the supporting surface of the analyzer of the present invention and the XY stage for moving the analysis target are configured to be separable, whereby the holder's Exchanges can be made. In a fifth embodiment of the present invention, the holder forming the supporting surface of the analyzer of the present invention and the object to be analyzed X are moved.
-The Y stage and the base are separable from each other,
It forms the alignment part on the base part,
As a result, the holder can be easily positioned.

[0008]

With the above-described structure, the positioning device of the analyzer of the present invention supports the analysis target on the support surface of the positioning device, and positions the analysis target by abutting the side of the analysis target. To do. In the contact between the support and the analysis target, the support is rotatable, so that the analysis target is smoothly moved horizontally along the support along the support surface. In addition, since the contact surface of the support part has a tapered structure, the side surface of the analyte contacts the contact surface of the support part at an angle with respect to the moving direction of the analyte, thereby supporting the analyte. Form a component force in the plane direction. Due to this component force, the object to be analyzed receives an acting force that is pressed down in the direction of the supporting surface, so that the object to be analyzed is prevented from rising from the supporting surface. As a result, the analyzer of the present invention can position the analyte with respect to the analyzer with good reproducibility by the smooth movement of the analyte in the horizontal direction by the positioning device and the prevention of lifting from the supporting surface. Therefore, the above object can be achieved. Therefore, in FIG. 7, the analysis points P1, which are predetermined by the analysis point measuring device 101 and stored in the memory 102,
When the position data of the positions P2, ... Pi, ... Pn are reproduced by the analysis device 104, since the positioning is accurately performed based on the position data by the configuration of the positioning device of the present invention, the object to be analyzed. A good reproduction of the analysis position of can be performed. In addition, the present invention can shorten the time required for setting the analysis position on the analysis device side due to this good position reproducibility, and can improve the processing capacity.

[0009]

Embodiments of the present invention will now be described in detail with reference to the drawings. (Structure of the embodiment of the analyzer of the present invention) FIG. 1 is a sectional view of the embodiment of the analyzer of the present invention, and FIG. 2 is a front view of the embodiment of the analyzer of the present invention. 1 and 2, only the positioning device in the analyzer of the present invention is shown, and the other components of the analyzer are well known and therefore omitted. The analyzer may be, for example, an electron beam microanalyzer. 1 and 2, a positioning device for an analysis apparatus according to the present invention includes a holder 1 that supports an analysis target, and an XY stage 3 that moves the analysis target in the X-axis direction and the Y-axis direction for positioning. , A base portion 2 connecting between the holder 1 and the XY stage 3
Composed of and.

The holder 1 includes a support surface 11 that supports an analysis target object such as a wafer on its upper surface, and a support portion 10 that determines the position of the analysis target object with respect to the support surface 11. The support surface 11 is formed, for example, in a substantially circular shape when handling the wafer 5 and the like, and a cut portion 15 for an arm for attaching and detaching the wafer 5 is formed in a part of the support surface 11. In addition,
The shape of the support surface 11 is not limited to the circular shape, but can be set arbitrarily. Further, the supporting portion 10 has a contact surface 12 that comes into contact with the wafer 5, and rotatably supports the shaft portion 13 of the holder 1 by a rotating shaft supporting member such as a bearing 14. The contact surface 12 is tapered so that the diameter on the side of the support surface 11 is small, and the height of the tapered portion is formed to be at least higher than the thickness of the object to be analyzed, so that the wafer 5 is supported by the support portion 10. When contact is made, the side portion of the wafer 5 and the contact surface of the tapered structure are brought into contact with each other. In addition, the support portion 10
Are arranged on the support surface 11 (first support portion 10-1, second support portion 10-2, third support portion 10-3), and the arrangement position is, for example, the first support portion 10-1. And the second supporting portion 10-2 are arranged so that the orientation flat surface 6 of the wafer 5 is in contact with the tangent portion of the second supporting portion 10-2 on the X coordinate axis.
The wafer 5 is arranged in contact with the tangent line of as the Y coordinate axis orthogonal to the X coordinate axis. A coordinate axis can be formed on the support surface 11 by the arrangement of the support portion 10. Further, the holder 1 is provided with a pressing portion 4 for pressing the wafer 5 against the supporting portion 10. The pressing portion 4 is in contact with a side portion of the wafer 5 to apply a lateral force, a shaft 46 that rotatably supports the pressing member 41 with respect to the holder 1, and the lateral portion. It has a spring member 42 for forming a force, and a first spring holding portion 43 and a second spring holding portion 44 that hold the spring member 42. One end of the spring member 42 is fixed to the holder 1 by the second spring holding portion 44, and the other end of the spring member 42 applies tension to the pressing member 41 toward the support portion 10 by the first spring holding portion 43. In addition,
The movable range of the pressing member 41 is limited by the stopper 45.

The XY stage 3 is a commonly used stage that is movable in two-dimensional directions, and has engagement grooves 30 and 31 for mounting the base portion 2 formed on the upper surface thereof. The base portion 2 has an exchange base 21 that is joined to the holder 1 and a common base 20 that is joined to the XY stage 3. The exchange base 21 is a member that connects the holder 1 to the common base 20, and is used together with the holder 1 according to the size or shape of the analysis target to facilitate the exchange of the holder 1. The replacement base 21 and the holder 1 can be connected, for example, by the second mounting screw 25, and the replacement base 21 and the common base 20 can be connected, for example, by the first mounting screw 24. The replacement base 21 is attached to the common base 20 by positioning the positioning recess 23 formed on the replacement base 21 side and the common base 2
Even if the holder 1 is replaced with the replacement base 21 by this structure, the coordinate system on the holder 1 is the same as that of the common base 20. You can The relationship between the positioning concave portion and the convex portion may be reversed, or the positioning concave portion and the convex portion may have different shapes. Further, the joint between the common base 20 and the XY stage 3 is fixed by the engaging grooves 30 and 31 on the XY stage 3 side, the engaging portion 26 on the common base 20 side, and one end by the locking portion 29. Spring member 28
It is performed by the engagement with the engaging movable portion 27 which is pressed by.

(Operation of the Embodiment of the Present Invention) Next, the operation of the embodiment of the present invention will be described with reference to FIGS. 3 and 4 for explaining the operation of the embodiment. FIG. 3 shows a cross section of the holder, the support, and the analyte of the present invention. After the analysis position of the analysis target is determined in the analysis position measurement device, the analysis target is transferred from the analysis position measurement device to the analysis device and set in the analysis device. At this time, the analyte is transferred by the arm and placed on the support surface 11 of the holder 1. Then, in FIG. 3A, when a force is applied laterally to the wafer 5 (broken line in the figure) by the pressing unit 4 (not shown), the wafer 5 moves in the direction of the arrow and the taper of the supporting unit 10 is generated. It abuts the contact surface 12 of the structure (FIG. 3 (b)). Since the angle formed by the contact surface 12 and the support surface 11 is an acute angle, the force that the wafer 5 receives from the contact surface 12 is divided and a force that pushes the wafer 5 toward the support surface 11 is generated. Therefore, the analyte 5 is pressed by the support surface 11 ((c) of FIG. 3).

Further, as shown in FIG. 4A, the first supporting portion 10 in which the orientation flat surface 6 of the wafer 5 forms the X coordinate axis.
-1 and the second support portion 10-2 are not at the correct positions, and for example, the first support portion 10-1 and the third support portion 10-3
When the wafer 5 is in contact with the first support portion 10-1 and the third support portion 10-3 due to the force from the pressing portion 4, the wafer 5 is displaced from the axial center of the first support portion 10-1 and the third support portion 10-3. A lateral force is applied to. This lateral force is
A rotational force in the direction indicated by the arrow is given to the first support portion 10-1 and the third support portion 10-3. Since the support portion 10 is rotatably supported by the rotation support member such as the bearing as described above, the support portion 10 is rotated in the direction of the arrow in the figure by this rotational force. By this rotation, the wafer 5 smoothly slides on the support surface 11 and moves to the set position shown in FIG. 4B. The position shown in FIG. 4B is on the reference coordinate system defined by the support portion 10, and the wafer 5 is correctly positioned with respect to this reference coordinate system. Therefore, by performing positioning based on the position data based on this reference coordinate system, it is possible to prevent displacement of the analysis position.

Next, another operation of the embodiment of the analyzer of the present invention will be described with reference to FIG.

When, for example, a semiconductor wafer is used as an object to be analyzed, the size thereof is 8 inches, 6 inches, 5
There are various types such as inches. There are cases where different holders 1 are used corresponding to the wafers of different sizes. Even when different holders 1 are used, in order to make the coordinate axes common to the XY stage 3 and the common base 20, it is necessary to make the positional relationship between the common base 20 and the exchange base 21 common. Therefore, the exchange base 21 is used for different holders, for example, the first base 21-1,
The second base 21-2 and the third base 21-3 are prepared, and a positioning recess 23 corresponding to the positioning projection 22 formed on the common base 20 side is formed on each exchange base 21. The positioning recess 23 is formed at a common position with respect to the coordinate axes of the exchange bases 21. Therefore, even if the exchange bases are exchanged, the analysis position can be set on the common coordinate axis. .

(Other Embodiments of the Present Invention) FIG. 6 is a block diagram of another embodiment of the present invention. In this embodiment, as shown in the front view of the holder shown in FIG. 6A and the sectional view of the holder shown in FIG. The groove 16 is formed by cutting out a part of the groove. The analysis target is the supporting surface 1 other than the groove 16.
1 will be supported, and the contact area will be reduced as compared with the case where the groove is not formed.

Therefore, in this embodiment, the frictional resistance due to the contact between the supporting surface and the object to be analyzed is reduced, the object to be analyzed is easily moved, and the reproducibility of positioning the object to be analyzed is improved. Become.

(Effects of the Embodiment) The positioning error according to the embodiment of the present invention can be set to ± 2 to 3 μm. For example, when the dust on the wafer is an object to be measured, its size is several μm or less. Therefore, it is possible to obtain sufficient position reproducibility in positioning.

[0019]

As described above, according to the present invention,
It is possible to provide an analyzer having good position reproducibility of the object to be analyzed.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of an analyzer of the present invention.

FIG. 2 is a front view of an embodiment of the analyzer of the present invention.

FIG. 3 is a diagram for explaining the operation of the embodiment of the present invention.

FIG. 4 is a diagram for explaining the operation of the embodiment of the present invention.

FIG. 5 is a diagram illustrating another operation of the embodiment of the analyzer of the present invention.

FIG. 6 is a configuration diagram of another embodiment of the present invention.

FIG. 7 is a diagram illustrating a general analysis procedure of an analyzer using a positioning device.

FIG. 8 is a schematic view of a positioning device in a conventional analyzer.

FIG. 9 is a diagram illustrating the operation of a conventional positioning device.

[Explanation of symbols]

1 ... Holder, 2 ... Base part, 3 ... XY stage, 4 ...
Pressing part, 5 ... Wafer, 6 ... Orientation flat surface, 10 ... Support part, 11 ... Support surface, 12 ... Contact surface, 14 ... Bearing,
20 ... Common base, 21 ... Exchange base, 22 ... Positioning projection, 23 ... Positioning recess.

Claims (1)

[Claims] 1. An analysis device comprising a device for positioning an analysis position of an analysis object, wherein the positioning device comprises:
An analyzer comprising: a support surface that supports an analysis target; and a support unit that is rotatably supported and that has a contact surface with a tapered structure that contacts the side of the analysis target.