JPH0730681Y2 - スパッタリングカソード - Google Patents
スパッタリングカソードInfo
- Publication number
- JPH0730681Y2 JPH0730681Y2 JP1988122426U JP12242688U JPH0730681Y2 JP H0730681 Y2 JPH0730681 Y2 JP H0730681Y2 JP 1988122426 U JP1988122426 U JP 1988122426U JP 12242688 U JP12242688 U JP 12242688U JP H0730681 Y2 JPH0730681 Y2 JP H0730681Y2
- Authority
- JP
- Japan
- Prior art keywords
- target
- back plate
- protective material
- sputtering cathode
- peripheral portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 14
- 230000001681 protective effect Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000002245 particle Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122426U JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122426U JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0246855U JPH0246855U (en:Method) | 1990-03-30 |
| JPH0730681Y2 true JPH0730681Y2 (ja) | 1995-07-12 |
Family
ID=31370347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122426U Expired - Lifetime JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730681Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8968537B2 (en) * | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5647564A (en) * | 1979-09-26 | 1981-04-30 | Ulvac Corp | Operation of magnetron-type sputtering device |
| JPS609873A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | スパツタ用タ−ゲツトの固定方法 |
-
1988
- 1988-09-19 JP JP1988122426U patent/JPH0730681Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0246855U (en:Method) | 1990-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5651145B2 (ja) | 物理蒸着用ターゲット構造物 | |
| JP2962912B2 (ja) | 陰極スパッタリング装置で基板を被覆するためのスパッタカソード | |
| EP0365249A3 (en) | Method and apparatus for sputtering | |
| JPH0730681Y2 (ja) | スパッタリングカソード | |
| JP3066507B2 (ja) | 半導体処理装置 | |
| US5240580A (en) | Conmag shield | |
| US5846389A (en) | Sputtering target protection device | |
| JPS60197873A (ja) | スパツタリング装置における絶縁物タ−ゲツト用ア−スシ−ルド装置 | |
| JPH0317907B2 (en:Method) | ||
| JPH0220210Y2 (en:Method) | ||
| JPH11305675A (ja) | ディスプレイ装置 | |
| JPS60248876A (ja) | スパツタ装置 | |
| JPH05275341A (ja) | スパッタ装置のシールド体 | |
| JPS5665981A (en) | Sputtering device | |
| JP2580149B2 (ja) | スパツタ装置 | |
| JPS55141721A (en) | Sputtering apparatus for magnetic body | |
| JPH08239761A (ja) | スパッタリング装置 | |
| JP2783421B2 (ja) | スパッタリング装置 | |
| JPH0527047U (ja) | 対向ターゲツト式スパツタ装置のシールドカバー | |
| JPH1161396A5 (en:Method) | ||
| JPH07126841A (ja) | スパッタ装置 | |
| JPH0219461A (ja) | スパッタ装置 | |
| JP2019157144A (ja) | 成膜装置 | |
| JPH0734925Y2 (ja) | イオンビ−ムスパツタリング装置 | |
| JPS60140761U (ja) | マグネトロンスパツタリング装置 |