JPH0729637Y2 - 半導体素子測定用治具 - Google Patents
半導体素子測定用治具Info
- Publication number
- JPH0729637Y2 JPH0729637Y2 JP1987069228U JP6922887U JPH0729637Y2 JP H0729637 Y2 JPH0729637 Y2 JP H0729637Y2 JP 1987069228 U JP1987069228 U JP 1987069228U JP 6922887 U JP6922887 U JP 6922887U JP H0729637 Y2 JPH0729637 Y2 JP H0729637Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- chip
- wafer ring
- wafer
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000005259 measurement Methods 0.000 title claims description 15
- 239000000523 sample Substances 0.000 claims description 13
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000004615 ingredient Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987069228U JPH0729637Y2 (ja) | 1987-05-09 | 1987-05-09 | 半導体素子測定用治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987069228U JPH0729637Y2 (ja) | 1987-05-09 | 1987-05-09 | 半導体素子測定用治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63178333U JPS63178333U (en, 2012) | 1988-11-18 |
JPH0729637Y2 true JPH0729637Y2 (ja) | 1995-07-05 |
Family
ID=30909767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987069228U Expired - Lifetime JPH0729637Y2 (ja) | 1987-05-09 | 1987-05-09 | 半導体素子測定用治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729637Y2 (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5243101B2 (ja) * | 2008-05-14 | 2013-07-24 | 株式会社ディスコ | 破断装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5378173A (en) * | 1976-12-22 | 1978-07-11 | Toshiba Corp | Manufacture of semiconductor device |
JPS5478080A (en) * | 1977-12-05 | 1979-06-21 | Toshiba Corp | Production of semiconductor element |
JPS5483774A (en) * | 1977-12-16 | 1979-07-04 | Nec Corp | Manufacture of semiconductor device |
JPS59130437A (ja) * | 1983-01-17 | 1984-07-27 | Nec Home Electronics Ltd | 半導体装置の選別方法 |
JPS61187247A (ja) * | 1985-02-14 | 1986-08-20 | Nec Kansai Ltd | 半導体装置の製造方法 |
-
1987
- 1987-05-09 JP JP1987069228U patent/JPH0729637Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63178333U (en, 2012) | 1988-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2597449B2 (ja) | 研磨ヘッド及びリテイナの使用方法 | |
JPH07122524A (ja) | 半導体ウエハを研削するための回転研削盤用ワークホルダ及び該ワークホルダを位置決めするための方法 | |
JP2007105877A (ja) | 円板状ワークの同時両面研削のための装置 | |
KR20140043678A (ko) | 척 테이블 | |
JP6612985B2 (ja) | 試料保持具 | |
JPH0729637Y2 (ja) | 半導体素子測定用治具 | |
JP2020072176A (ja) | 試料保持具 | |
KR20010079607A (ko) | 소재 진동 댐퍼 | |
JPH0963531A (ja) | イオン注入装置の被イオン注入部材固定装置 | |
JP2017050461A (ja) | チャックテーブル | |
KR200405748Y1 (ko) | 다공질 실리콘을 이용한 이중 구조의 진공 척 | |
JPH10100136A (ja) | スライシング装置 | |
JPH03142928A (ja) | ウエーハの切り出し方法 | |
JP6723644B2 (ja) | エキスパンドシート | |
JP2025012274A (ja) | 保持テーブル、保持方法、及び、エッジトリミング方法 | |
JPH0766268A (ja) | 半導体チップの吸着装置 | |
JPH0523290Y2 (en, 2012) | ||
JP3185680B2 (ja) | ウェーハ研磨装置およびウェーハの研磨方法 | |
JP2023147552A (ja) | 拡張保持リング取り外し治具及び拡張保持リング取り外し方法 | |
JPS6116102Y2 (en, 2012) | ||
JPH0536621Y2 (en, 2012) | ||
JP2024088078A (ja) | 洗浄装置及びワークの洗浄方法 | |
JPS63263741A (ja) | 板状物の固定機構 | |
JP2603143Y2 (ja) | 防水プレート | |
JPH01294422A (ja) | 粘着シート貼着用保持装置 |