JPH0729637Y2 - Jig for semiconductor device measurement - Google Patents

Description

[Detailed Description of the Invention] Industrial field of application The present invention relates to a jig for measuring a semiconductor element,
More specifically, it relates to a measuring jig for fixing the wafer ring in the probe test.

2. Description of the Related Art A technique for individually dividing a large number of chips formed on one wafer is called dicing. As a method of dividing, a scribing (scribing) is performed in which a cutting groove is engraved along the tip with a laser or a diamond needle and mechanically divided.
bing) method and a dicing saw method in which a thin diamond blade cuts deeply by high-speed rotation and can be mechanically divided or divided at the time of cutting.

The wafer half-cut by the scribing or dicing is divided into individual chips by mechanical means. At the time of division, a tape is attached to the back surface of the wafer in advance. This tape is used so as to maintain the original positional relationship without the chips being dispersed even when the wafer is divided. Each chip of the divided wafer is completely separated by expanding the tape. The expanded tape on which the chips are mounted is attached to the wafer ring. Then, a probe test is performed on each chip on the expand tape to remove the defective chip.

FIG. 2 is a schematic configuration diagram of a jig for fixing the wafer ring in the probe test. The illustrated jig includes a wafer stage 11. A through hole 12 is provided vertically in the center of the wafer stage 11, and the through hole 12 communicates with a vacuum pump (not shown).

When the wafer ring 14 with the expanding tape 13 attached thereto is smaller than the stage surface 15 of the wafer stage 11, the wafer ring 14 is attached to the stage surface as shown in FIG. 2 (a).
Placed on 15. Next, the wafer ring 14 is fixed to the stage surface 15 by being evacuated by a vacuum pump (not shown). In this case, a gap is formed between the expanding tape 13 and the stage surface 15. Therefore, there is a problem that the expand tape 13 and the stage surface 15 do not come into close contact with each other, and the expand tape 13 extends due to the above vacuuming, the chip is not fixed, and the contact of the measurement probe becomes unstable. In addition, there is a problem that the chip heats up due to the measurement current during the measurement, and the tape deteriorates or burns out.

In addition, a wafer ring with expanded tape 13 attached
When 14 is larger than the stage surface 15 of the wafer stage 11, as shown in FIG.
Is placed directly on the stage surface 15. Next, a vacuum pump (not shown) is evacuated to fix the expand tape 13 to the stage surface 15. In this case, the wafer ring 14 itself is not fixed to the stage surface 15 of the wafer stage 11. Therefore, similarly to the case described above, the expand tape 13 is extended by the vacuuming, the chip is not fixed, the contact between the measurement probe and the pad becomes unstable, and the tape deteriorates or burns during measurement. there were.

Problems to be Solved by the Invention As described above, in the conventional semiconductor device measuring jig, when the chip on the expand tape attached to the wafer ring is fixed to the stage surface of the wafer stage, the expand tape is evacuated. Is extended and the chip moves. Due to this movement, the contact between the measurement probe and the pad becomes unstable, and the chip generates heat due to the measurement current, which causes the problem of deterioration or burning of the tape.

In view of this, the present invention provides a jig for measuring a semiconductor device that fixes a wafer ring and fixes and holds the positional relationship of chips on an expanded tape during probe measurement.

Means for Solving the Problems That is, according to the present invention, for supporting and fixing the tape and the chip when a probe is brought into contact with the chip affixed to the tape and measurement is performed on the chip. A jig, a support member having a flat upper end surface shape, a cylindrical side surface shape, and a lower shape complementary to the vicinity of the upper end of the wafer stage, and a jig mounted on a side surface of the support member and away from the support member. An elastic means that is urged to extend, and has a wafer ring that has an inner diameter slightly larger than the side surface of the support member and that supports a tape to which chips are attached, when the wafer ring is attached to the support member. , The wafer ring is fixed by being pressed from the inside by the elastic means, and at least the region of the tape to which the chip is attached is on the upper end surface of the supporting member. Provided is a jig for measuring a semiconductor element, characterized in that the tape is supported from below by being in close contact with each other.

According to a preferred embodiment of the present invention, the elastic means comprises:
At least three spring means provided on the cylindrical side surface of the member.

Operation As described above, in the semiconductor element measuring jig of the present invention, the member having the flat upper end surface is fixed by covering the stage surface of the wafer stage. An elastic means is provided on the cylindrical side surface of the member, and the elastic means elastically urges the wafer ring in the radial direction toward the outside to elastically fix the wafer ring. That is, the wafer ring is fitted to the member such that the expanded tape is in close contact with the upper end surface of the measuring jig. By the elastic means, the wafer ring is fixed, and as a result, the chip on the expand tape has the same effect as being fixed to the upper end surface of the measuring jig.

As described above, in the semiconductor device measuring jig of the present invention, the chip on the expand tape is fixed by fixing the wafer ring without using the conventional fixing method by evacuation. Therefore, the tip on the expanding tape holds its position accurately even during the probe measurement. Thus, the problem that the contact between the measuring probe and the pad becomes unstable due to the movement of the chip and the chip heats up due to the measuring current to deteriorate or burn the tape is solved.

Embodiment An embodiment of the semiconductor device measuring jig of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic configuration diagram of one embodiment of a semiconductor element measuring jig of the present invention.

The illustrated jig includes a wafer stage 1. A through hole 2 is provided in the vertical direction at the center of the wafer stage 1, and the through hole 2 communicates with a vacuum pump (not shown). A disk-shaped member 6 is provided on the wafer stage 1. The lower part of the disk-shaped member 6 has a complementary recessed portion that fits with the stage surface 5 of the wafer stage 1.
6A is formed. Then, a columnar portion 6B having a flat upper end surface is formed on the upper portion of the disc-shaped member 6, and at least three springs 7 are mounted on the side surfaces of the columnar portion 6B. The spring 7 is configured to bias in the normal direction toward the outside of the side surface of the cylindrical portion 6B. Further, around the disk-shaped member 6, a flange 6C on which a wafer ring is mounted is mounted.
Is provided.

The disc-shaped member 6 is preferably made of a material having high thermal conductivity. If formed of such a material, the disk-shaped member 6 can be formed by a conventionally known coolable stage.
Is also cooled. As a result, the expand tape is also cooled during the measurement, and it is possible to prevent deterioration of the expand tape due to heat generation of the chip during the measurement.

The semiconductor element measuring jig of the present invention configured as described above operates as follows.

By driving a vacuum pump (not shown) to evacuate,
The recess 6A of the disc-shaped member 6 is fixed to the stage surface 5. The wafer ring 4 is fitted around the cylindrical portion 6B of the disc-shaped member 6. As a result, the wafer ring 4 is pressed by the spring 7, and the wafer ring 4 is elastically fixed around the cylindrical portion 6B of the disk-shaped member 6. Thus, the expand tape 3 attached to the wafer ring 4 and having the large number of chips 8 attached thereto is brought into close contact with the upper end surface of the disc-shaped member 6.

A portion of the expanded tape 3 between the edge of the upper end surface of the cylindrical portion 6B and the wafer ring 4 is selected by the weight of the wafer ring 4 by appropriately selecting the step between the upper end surface of the cylindrical portion 6B and the flange portion 6C. Is preferably slightly extended so that the expanding tape 3 is in close contact with the upper end surface of the cylindrical portion 6B.

FIG. 3 is a schematic view of the configuration of another embodiment of the semiconductor element measuring jig of the present invention. Also in the embodiment shown in FIG. 3, the wafer stage 1 is covered with the disk-shaped member 9. The stage surface 5 of the wafer stage 1 is provided below the disk-shaped member 6.
The annular protrusion 9A is formed in a complementary shape so as to fit with. The upper portion of the disc-shaped member 9 has a flat surface, and the cylindrical portion 9B hangs from the periphery thereof.
At least three springs 7A are attached to the cylindrical portion 9B. The spring 7A is configured to bias the side surface of the cylindrical portion 9B toward the outside in the normal direction.

Also in the embodiment shown in FIG. 3, the inside of the annular projection 9A of the disk-shaped member 9 is fixed to the stage surface 5 by driving a vacuum pump (not shown) to evacuate. And in this case,
The cylindrical wafer ring 4A is fitted around the cylindrical portion 9B of the disk-shaped member 9. As a result, the spring 7A causes the wafer ring 4A
Is pressed, the wafer ring 4A becomes a cylindrical portion of the disk-shaped member 9.
It is elastically fixed around 9B. Thus, the expand tape 3 attached to the wafer ring 4A and having the many chips 8 attached thereto is brought into close contact with the upper end surface of the disk-shaped member 9.

In this case, since there is no means for supporting the wafer ring 4A from below corresponding to the flange portion 6C, the wafer ring 4A
The weight of the wafer ring 4A
The part of the expanded tape 3 between and expands a little, and the expanded tape 3 is easily attached to the upper end surface of the cylindrical portion 9B.

As described above, in the semiconductor element measuring jig of the present invention, by biasing and fixing the wafer ring by the elastic means,
Hold the chip on the expanding tape. The tip on the expanding tape holds its position exactly,
The chip can be gripped accurately.

Effect of the Invention As described in detail above, in the semiconductor device measuring jig of the present invention, the chip on the expand tape is fixed by fixing the wafer ring without using the conventional fixing method by evacuation. Therefore, even during probe measurement
The tip on the expanded tape holds its position accurately, allowing a stable contact between the measuring probe and the pad, without the tape deteriorating or burning.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of one embodiment of a semiconductor element measuring jig of the present invention, FIG. 2 is a schematic configuration diagram of a conventional semiconductor element measuring jig, and FIG. It is a schematic diagram of a structure of another embodiment of the jig for measuring a semiconductor element of the present invention. (Main reference numbers) 1 ... Wafer stage, 2 ... Through hole, 3 ... Expand tape, 4 ... Wafer ring, 5 ... Stage surface,
6, 9 ... Disc-shaped member, 7 ... Spring, 8 ... Chip 11 ... Wafer stage, 12 ... Through hole, 13 ... Expand tape, 14 ... Wafer ring, 15 ... Stage surface

Claims (3)

[Scope of utility model registration request] 1. A jig for supporting and fixing the tape and the chip when a probe is brought into contact with the chip attached to the tape to measure the chip, and has a flat upper end surface shape. A supporting member having a cylindrical side surface shape and a lower shape complementary to the vicinity of the upper end of the wafer stage, and elastic means attached to the side surface of the supporting member and urged to extend in a direction away from the supporting member. And a wafer ring having an inner diameter slightly larger than the side surface of the support member and supporting a tape having chips attached thereto, when the wafer ring is attached to the support member, the elastic means presses the wafer ring from the inside. The wafer ring is fixed by, and at least the area of the tape to which the chip is attached is brought into close contact with the upper end surface of the support member so that the chip is supported from below. Semiconductor device measurement jig, characterized by being configured to so that. 2. The jig according to claim 1, wherein the elastic means is at least three spring means mounted on the side surface of the support member. 3. The utility model registration claim 1 or 2, wherein the supporting member has a flange portion for supporting the mounted wafer ring from below at a lower portion of the side surface. Ingredient