JP2603143Y2 - Waterproof plate - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof plate for preventing cutting water, cutting chips, etc. from flying toward the machine body when dicing a semiconductor wafer with a precision cutting device such as a dicing device. is there.

[0002]

2. Description of the Related Art As shown in FIG. 5, for example, a conventional waterproof plate includes a fixed frame 1 and a movable plate 2 which is held on the fixed frame 1 in a vertical direction or a circumferential direction with a predetermined radius of curvature. The movable plate 2 is provided with a hole 2a through which the spindle housing 3 is inserted. The spindle housing 3 holds a spindle 4,
A rotary blade 5 is attached to the tip thereof. The semiconductor wafer 7 placed on the table 6 is diced with the rotary blade 5 while applying cutting water 8a from a nozzle 8, and the cutting scattered in the cutting area A at that time. The waterproof plate C is used to prevent water, cutting chips and the like from entering the machine area B.

[0003]

According to the conventional waterproof plate C, the movable plate 2 may be damaged by being rubbed or caught in the hole 2a of the movable plate 2 when the spindle housing 3 moves back and forth. In some cases, the proper movement of the spindle housing 3 is hindered, resulting in defective dicing. In order to prevent such a problem, the hole 2a of the movable plate 2 may be enlarged so that the spindle housing 3 does not come into contact with it. A situation in which it easily enters the B side occurs.

The present invention has been made in view of the above-mentioned conventional situation, and has an object to provide a waterproof plate capable of preventing contact with a spindle housing without enlarging a hole of a movable plate. It was done.

[0005]

As a means for technically solving this problem, the present invention provides a waterproof plate for separating a cutting area and a mechanical area in a precision cutting device such as a dicing device for dicing a semiconductor wafer. In the above, the waterproof plate comprises a movable plate and a fixed frame for slidably holding the movable plate, and a hole for inserting a spindle housing is formed in a central portion of the movable plate, and around the hole, A bearing for avoiding contact between the spindle housing and the hole is provided at two or more places, and for reducing the contact area on either the movable plate or the fixed frame to smoothly slide the movable plate. The gist is a waterproof plate having irregularities.

[0006]

[Operation] The spindle housing is guided by the bearings, and moves back and forth in a stable manner, so that it does not come into contact with the holes of the movable plate. In addition, there is no need to make the holes of the movable plate large, so cutting water, cutting chips, etc. Can be reliably prevented from entering the machine area side.
Further, by forming irregularities on the movable plate or the fixed frame, the movable plate can slide smoothly.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings (however, the same members as those in the conventional example are denoted by the same reference numerals as described above). In FIG. 1, reference numeral 1 denotes a fixed frame, which separates a cutting area A and a mechanical area B, in which a movable plate 2 is held movably in a vertical direction linearly or with a predetermined radius of curvature. I have.

The movable plate 2 has a hole 2a formed at the center thereof for inserting the spindle housing 3, and has a vertical surface on one surface for smooth sliding with respect to the fixed frame 1 as shown in FIG. Are arranged side by side at regular intervals. The ridges 2b may be formed on both surfaces of the movable plate 2, or may be formed on the inner surface of the fixed frame 1 without being formed on the movable plate 2.

Numeral 9 denotes a bearing, which is attached at three places around the hole 2a of the movable plate 2 via a stay 10 as shown in FIGS.
Guide the back and forth movement of That is, the outer ring of the bearing 9 contacts the outer peripheral surface of the spindle housing 3 and rotates,
The back and forth movement of the spindle housing 3 can be performed smoothly. Also, since the spindle housing 3 is supported at three points by bearings 9 on the upper part of the outer periphery and on both sides of the side part, a constant distance is always provided between the outer peripheral surface of the spindle housing 3 and the hole 2a of the movable plate 2. Is maintained, and this interval is a minimum required minimum. Therefore, the hole 2a of the movable plate 2 can be smaller than before.

Further, when the spindle housing 3 moves up and down, a fixed distance is maintained between the outer peripheral surface of the spindle housing 3 and the hole 2a of the movable plate 2 by the bearing, and the movable plate 2 moves together with the spindle housing 3. Therefore, the spindle housing 3 does not contact the hole 2a of the movable plate 2. Therefore, the movable plate 2 will not be damaged, and the proper movement of the spindle housing 3 will not be hindered, resulting in defective dicing.

Reference numeral 4 denotes a spindle rotatably held by a spindle housing 3. As shown in FIG. 1, a rotating blade 5 is attached to the tip of the spindle, and a semiconductor wafer 7 mounted on a table 6 is nozzle 8 The dicing is performed by the rotating blade 5 while the cutting water 8a is sprayed from the nozzle. At this time, the fixed frame 1 and the movable plate 2 are fixed so that cutting water, cutting chips, etc. scattered in the cutting area A do not enter the machine area B.
Can be prevented by a waterproof plate C made of

In the above-described embodiment, the bearings are provided at three places. However, the present invention is not limited to this. The bearings can be provided at at least two places, and can be provided on the movable plate or the fixed frame. Is not limited to the above-mentioned one, and may be any suitable protrusion. In short, it is only necessary that irregularities for reducing the contact area between the movable plate and the fixed frame can be formed.

[0013]

[Effects of the Invention] As described above, according to the present invention,
In a waterproof plate comprising a fixed frame such as a dicing device and a movable plate, at least two bearings are arranged around the hole of the movable plate, and the bearing holds the spindle housing inserted through the hole and the front and rear of the spindle housing. Since the movement is guided, the spindle housing moves stably by the bearings and does not come into contact with the holes in the movable plate. In addition, there is no need to make the holes in the movable plate large, so cutting water and cutting debris etc. And the like can be reliably prevented from entering the mechanical region side. Further, by forming irregularities on the movable plate or the fixed frame, it is possible to smoothly slide the movable plate.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX in FIG.

FIG. 3 is a sectional view taken along line YY in FIG.

FIG. 4 is a plan view of a bearing portion.

FIG. 5 is a perspective view of a main part showing a conventional example.

FIG. 6 is a sectional view taken along line YY in FIG. 5;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Fixed frame 2 ... Movable plate 2a ... Hole 2b
... Protrusions 3 ... Spindle housing 4 ... Spindle 5 ... Rotating blade 6 ... Table 7 ... Semiconductor wafer 8 ... Nozzle 8a ... Cutting water
9: Bearing 10: Stay A: Cutting area
B: Machine area C: Waterproof plate

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) B23Q 11/08 B28D 5/02 B28D ^7/ 00-7/02 H01L 21/301

Claims (1)

(57) [Scope of request for utility model registration] 1. A waterproof plate that separates a cutting area and a mechanical area in a precision cutting device such as a dicing device for dicing a semiconductor wafer, wherein the waterproof plate is a movable plate and a fixed member that slidably holds the movable plate. is composed of a frame, in a central portion of the movable plate is drilled a hole for inserting the spindle housing, a bearing to avoid contact between the spindle housing and the hole in two or more places around the hole is disposed The contact area on either the movable plate or the fixed frame
Unevenness to reduce and smooth the sliding of the movable plate
A waterproof plate , wherein a waterproof plate is formed .