JPH072938B2 - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesiveInfo
- Publication number
- JPH072938B2 JPH072938B2 JP61087352A JP8735286A JPH072938B2 JP H072938 B2 JPH072938 B2 JP H072938B2 JP 61087352 A JP61087352 A JP 61087352A JP 8735286 A JP8735286 A JP 8735286A JP H072938 B2 JPH072938 B2 JP H072938B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive filler
- conductive
- conductive adhesive
- adhesive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は回路基板或いは回路部品等相互を電気的に接続
するために用いる異方導電性接着剤に関する。TECHNICAL FIELD The present invention relates to an anisotropic conductive adhesive used for electrically connecting circuit boards or circuit components to each other.
（従来の技術） 従来、複数個の回路基板相互において、対応する電極間
を電気的に接続するための接着剤として、例えば、ホッ
トメルト樹脂中に金属粉又はカーボン粉等の導電性フィ
ラーを混入して分散させてテープ状にした異方導電性熱
圧着テープがある。また最近では、ホットメルト樹脂と
その溶剤とからなる結合剤中に金属粉、カーボン粉或い
は金属酸化物の導電粉を分散し、回路基板上にスクリー
ン印刷法等により直接異方導電性塗膜を形成したものが
ある。(Prior Art) Conventionally, as an adhesive for electrically connecting corresponding electrodes on a plurality of circuit boards, for example, a conductive filler such as metal powder or carbon powder is mixed in hot melt resin. There is an anisotropic conductive thermo-compression tape which is dispersed and made into a tape shape. Recently, metal powder, carbon powder or metal oxide conductive powder is dispersed in a binder composed of hot melt resin and its solvent, and an anisotropic conductive coating film is directly formed on a circuit board by screen printing or the like. There is a formed one.
（発明が解決しようとする問題点） ところで、上記のようなポリマー溶液中に金属及び金属
酸化物等の導電フィラーを分散した異方導電性接着剤
は、ポリマーの比重に比較して導電性フィラーの比重が
８〜10倍程度大きいために経時的に導電性フィラーの沈
降現象が生じ導電性接着剤を製造した直後に見られる導
電性フィラーの均一な分散状態を維持することは困難で
ある。(Problems to be Solved by the Invention) By the way, an anisotropic conductive adhesive obtained by dispersing a conductive filler such as a metal and a metal oxide in a polymer solution as described above is a conductive filler as compared with the specific gravity of the polymer. Since the specific gravity of the conductive filler is about 8 to 10 times larger, it is difficult to maintain a uniform dispersed state of the conductive filler, which occurs immediately after the conductive adhesive is produced due to the sedimentation phenomenon of the conductive filler.
従って、このような異方導電性接着剤溶液から熱圧着テ
ープを成形したり或いはスクリーン印刷等により塗膜を
形成する場合に、その接着剤溶液製造直後には均一に導
電性フィラーが分散していてもそのテープ又は塗膜を形
成する時までに接着剤溶液中の導電性フィラーの分散状
態に偏りが生じ易い。Therefore, when a thermocompression-bonding tape is formed from such an anisotropic conductive adhesive solution or a coating film is formed by screen printing or the like, the conductive filler is uniformly dispersed immediately after the production of the adhesive solution. However, the dispersed state of the conductive filler in the adhesive solution is likely to be biased by the time the tape or coating film is formed.
また、導電性フィラーとしてカーボンを使用した場合
は、上記のように経時的に生じる導電性フィラーの沈降
減少は比較的小さいが、他の金属或いは金属酸化物のフ
ィラーに比較して固有抵抗が約100倍程度も高くなり、
電気的接続抵抗が高くなる欠点がある。When carbon is used as the conductive filler, the sedimentation decrease of the conductive filler that occurs over time as described above is relatively small, but the specific resistance is about the same as that of other metal or metal oxide fillers. About 100 times higher,
There is a drawback that the electrical connection resistance becomes high.
更に、上記のような導電性フィラーを使用した熱圧着型
の異方導電性接着剤は圧着された回路基板の電極間に導
電性フィラーが均一に分散している状態で介在している
場合であっても、その導電性フィラーが硬く弾力性に乏
しいために、温度又は湿度の変化等により経時的に接着
剤の主材であるポリマーに例えば肉痩せ、振動等により
緩み現象が生じると、電極間の結合力が低下してフィラ
ーと電極間との接続点に緩み現象が生じて電気的不接点
が生じ、電気的抵抗が増大してしまう。Further, the thermo-compression type anisotropic conductive adhesive using the conductive filler as described above is used when the conductive filler is present in a state in which the conductive filler is uniformly dispersed between the electrodes of the circuit board which is pressure-bonded. However, since the conductive filler is hard and poor in elasticity, when the polymer, which is the main material of the adhesive, is thinned due to changes in temperature or humidity over time, a loosening phenomenon occurs due to vibration, etc. The binding force between them decreases, and a loosening phenomenon occurs at the connection point between the filler and the electrode, which causes electrical non-contact and increases electrical resistance.
（問題点を解決するための手段） 上記問題点を解決するために本発明は、熱接着性を有す
る高分子材料に、弾性体の表面に金属又は導電性金属酸
化物の被膜を形成しかつ比重を1.7〜2.1としてなる導電
性フィラーを分散させたものである。(Means for Solving the Problems) In order to solve the above problems, the present invention forms a coating film of metal or conductive metal oxide on the surface of an elastic body on a polymer material having thermal adhesiveness, and It is a dispersion of a conductive filler having a specific gravity of 1.7 to 2.1.
（作用） 本発明にかかる熱接着性を有する高分子材料は、液状の
高分子ポリマー又は高分子ポリマーを溶剤に混入して溶
かしたものである。(Function) The polymer material having thermal adhesiveness according to the present invention is a liquid polymer polymer or a polymer polymer mixed and dissolved in a solvent.
ここで高分子ポリマーとして、例えば、ポリエステル樹
脂、ビニル樹脂、アクリル樹脂、ポリオレフィン樹脂、
ポリビニルアセタール樹脂、ポリカーボネート樹脂、セ
ルロース樹脂、ケトン樹脂、スチレン系樹脂、ポリアミ
ド樹脂、エポキシ樹脂、フェノール樹脂、ロジン及びテ
ルペン系樹脂等の熱可塑性又は熱硬化性樹脂等の合成樹
脂；ポリイソプレン、ブタジエンスチレン共重合体、ポ
リブタジエン、ポリクロロプレン、ブタジエンアクリロ
ニトリル共重合体、ポリウレタン、クロロスルホン化ポ
リエチレン、アクリル酸アルキルエステル共重合体、エ
チレンプロピレン共重合体等の合成ゴム等が挙げられ、
これらのポリマーは単独で使用してもよいし、適宜に２
種以上組合せても使用してもよい。Here, as the polymer, for example, polyester resin, vinyl resin, acrylic resin, polyolefin resin,
Polyvinyl acetal resin, polycarbonate resin, cellulose resin, ketone resin, styrene resin, polyamide resin, epoxy resin, phenol resin, synthetic resin such as thermosetting resin such as rosin and terpene resin; polyisoprene, butadiene styrene Copolymers, polybutadiene, polychloroprene, butadiene acrylonitrile copolymer, polyurethane, chlorosulfonated polyethylene, acrylic acid alkyl ester copolymer, synthetic rubber such as ethylene propylene copolymer, and the like,
These polymers may be used alone or appropriately 2
You may use it in combination of 2 or more types.
更に具体的には、ポリエステル樹脂としてバイロン200,
300（東洋妨社製，商品名）等、ポリビニルアセタール
樹脂としてデンカブチラール＃200−L,＃3000−１（電
気化学工業社製，商品名）等、ビニール系樹脂としてス
ミテートDA-10,DA-20（住友化学工業社製，商品名）
等、ブタジエン共重合体としてカリフレックスTR1101,T
R1102（シェル化学社製，商品名）等、ブタジエンアク
リロニトリル共重合体としてハイカー1011,1012（日本
ゼオン社製，商品名）等、ポリクロロプレンとしてはデ
ンカクロロプレンＭ−30,M120（電気化学工業社製，商
品名）等、アクリル酸アルキルエステル共重合体として
ニッポールAR51（日本ゼオン社製，商品名）等が挙げら
れる。More specifically, as a polyester resin, Byron 200,
300 (manufactured by Toyosha Co., Ltd.), polyvinyl acetal resin Denka Butyral # 200-L, # 3000-1 (manufactured by Denki Kagaku Kogyo Co., Ltd.), vinyl resin Sumitate DA-10, DA- 20 (Sumitomo Chemical Co., Ltd., trade name)
As a butadiene copolymer, Califlex TR1101, T
R1102 (manufactured by Shell Chemical Co., Ltd.), butadiene acrylonitrile copolymer Hiker 1011,1012 (manufactured by Nippon Zeon Co., Ltd.), and polychloroprene Denkachloroprene M-30, M120 (manufactured by Denki Kagaku Kogyo Co., Ltd.) , Trade name) and the like, as an acrylic acid alkyl ester copolymer, Nippole AR51 (manufactured by Nippon Zeon Co., trade name) and the like.
また、上記の熱接着性ポリマーを溶かす溶剤としては炭
化水素系、アルコール系、ケトン系、エステル系、エー
テル系等の各種溶剤の中から溶解性の良いものを適宜選
択される。Further, as the solvent for dissolving the above-mentioned heat-adhesive polymer, one having a good solubility is appropriately selected from various solvents such as hydrocarbon-based, alcohol-based, ketone-based, ester-based and ether-based solvents.
本発明に用いる導電性フィラーは弾性体に、金属メッキ
又は金属酸化物メッキを施して導電性被膜を形成したも
のである。このように表面を導電性フィラーの被膜で覆
った弾性体を熱接着性を有する高分子材料に混入して電
極間に介在させることにより安定した電気的接続を得
る。The conductive filler used in the present invention is an elastic body which is plated with metal or metal oxide to form a conductive coating. In this way, a stable electrical connection can be obtained by mixing an elastic body whose surface is covered with a conductive filler film in a polymer material having thermal adhesiveness and interposing it between electrodes.
この弾性体はプラスチック粉体或いはゴムの粉体等の熱
硬化性樹脂又は熱可塑性樹脂等で形成される有機高分子
物質であって、例えば、ナイロン、ポリプロピレン、テ
フロン、ポリカーボネート、ポリエチレン、ポリスチレ
ン、アクリル、フェノール、セルロースアセテート、ポ
リウレタンゴム、シリコーンゴム等の合成ゴム等を低温
で粉砕或いはその他の方法によって、球状粉体、不定形
状粉体その他の形状としたものである。This elastic body is an organic polymer substance formed of a thermosetting resin or a thermoplastic resin such as plastic powder or rubber powder, and is, for example, nylon, polypropylene, Teflon, polycarbonate, polyethylene, polystyrene, acrylic. A synthetic rubber such as phenol, cellulose acetate, polyurethane rubber, or silicone rubber is pulverized at a low temperature or is formed into another shape such as a spherical powder, an irregularly shaped powder, or the like.
更に具体的には、ポリスチレンとしてファインパール30
00SP,BS-11,BA-40,BA-41（住友化学社製，商品名）等、
プラスチック球（長瀬産業社製）、ポリスチレンボール
（昭和フッソ（株）社製）等を弾性体として用いること
ができる。More specifically, Fine Pearl 30 as polystyrene
00SP, BS-11, BA-40, BA-41 (Sumitomo Chemical Co., Ltd., trade name), etc.
Plastic balls (made by Nagase & Co., Ltd.), polystyrene balls (made by Showa Fuso Co., Ltd.) and the like can be used as the elastic body.
弾性体に導電性を付与して導電性フィラーを得るには、
例えば、金、銀、銅、ニッケル等の金属、酸化インジウ
ム、酸化スズ等の酸化金属の被膜を弾性体の表面に形成
するが、その形成方法としては、例えば、湿式メッキ
法、或いは真空蒸着法、スパッタリング法等の乾式メッ
キ法が挙げられる。To give conductivity to the elastic body to obtain a conductive filler,
For example, a coating film of a metal such as gold, silver, copper or nickel, or a metal oxide such as indium oxide or tin oxide is formed on the surface of the elastic body. The forming method is, for example, a wet plating method or a vacuum deposition method. Examples of the dry plating method include a sputtering method and the like.
弾性体の表面に形成される金属又は金属酸化物の被膜の
厚さは、100Å〜100,000Åである。この場合、膜厚が10
0Å以下であるとフィラーの導電性が不安定になり易
く、100,000Å以上であるとフィラーの比重が大きくな
り高分子材料中で沈降分離が生じ易くなる。The thickness of the metal or metal oxide coating formed on the surface of the elastic body is 100Å to 100,000Å. In this case, the film thickness is 10
If it is 0 Å or less, the conductivity of the filler is likely to be unstable, and if it is 100,000 Å or more, the specific gravity of the filler is large and sedimentation easily occurs in the polymer material.
また、形成された導電性フィラーの粒径は0.01〜1000μ
ｍが適当であり、粒径が0.01μｍ以下であると熱接着後
の電極に対する当たりが不十分になり易く接続後の電気
抵抗が不安定になり易い。他方、粒径が1000μｍ以上で
あると回路基板の接着力が低下し、安定した電気抵抗が
得られ難くなる。Also, the particle size of the formed conductive filler is 0.01 ~ 1000μ
When m is appropriate and the particle size is 0.01 μm or less, the contact with the electrode after thermal bonding tends to be insufficient, and the electrical resistance after connection tends to become unstable. On the other hand, when the particle size is 1000 μm or more, the adhesive strength of the circuit board is reduced and it becomes difficult to obtain stable electric resistance.
導電性フィラーの具体例としては、架橋ポリスチレン粉
末にニッケルメッキを施したもので、平均粒径が７〜９
μ、被膜の厚さが1000〜200Å、比重が1.7〜2.1、体積
固有抵抗が１〜７×102Ωcmのものが挙げられる。As a specific example of the conductive filler, a cross-linked polystyrene powder plated with nickel has an average particle size of 7 to 9
μ, the thickness of the coating is 1000 to 200Å, the specific gravity is 1.7 to 2.1, and the volume resistivity is 1 to 7 × 10 2 Ωcm.
上記のような導電性フィラーは、その比重が上記の高分
子材料にほぼ等しいために、高分子材料中に分散させた
後に沈降分離することがなく、安定した分散状態を維持
することができ、更に金属粉と比較して弾力性に優れて
いる。従って、この導電性フィラーを高分子材料に分散
させて得た異方導電性接着剤を電極間に介在させ両電極
を熱圧着させると、その後経時的に接着剤の主材である
ポリマーに緩み現象が生じても、その緩みに対応した弾
性体の復元力により安定した電気的接続を得ることがで
きる。The conductive filler as described above, because its specific gravity is almost equal to the above-mentioned polymer material, does not sediment and separate after being dispersed in the polymer material, and can maintain a stable dispersed state, Furthermore, it has excellent elasticity compared to metal powder. Therefore, when an anisotropic conductive adhesive obtained by dispersing this conductive filler in a polymer material is interposed between the electrodes and both electrodes are thermocompression bonded, they loosen in the polymer, which is the main material of the adhesive, over time. Even if a phenomenon occurs, a stable electrical connection can be obtained by the restoring force of the elastic body corresponding to the looseness.
高分子材料の主剤である高分子ポリマーに対する導電性
フィラーの配合割合は高分子ポリマー100重量部に対し
１〜70重量部である。この場合導電性フィラーの配合割
合が１重量部以下であると電極間に介在する導電性接着
剤中のフィラー数が少なくなり、電気的接続が不安定に
なる。他方、導電性フィラーの配合割合が70重量部以上
になると、導電性接着剤の塗膜を基板上に形成した際
に、その塗膜の厚さ方向の導電性のほかに塗膜の面方向
に導電性が生じて塗膜が等方性の導電性を示して、異方
導電性を示さなくなる。The compounding ratio of the conductive filler to the polymer, which is the main ingredient of the polymer material, is 1 to 70 parts by weight with respect to 100 parts by weight of the polymer. In this case, if the blending ratio of the conductive filler is 1 part by weight or less, the number of fillers in the conductive adhesive interposed between the electrodes becomes small and the electrical connection becomes unstable. On the other hand, when the mixing ratio of the conductive filler is 70 parts by weight or more, when the coating film of the conductive adhesive is formed on the substrate, in addition to the conductivity in the thickness direction of the coating film, the surface direction of the coating film Conductivity occurs in the film, the coating film exhibits isotropic conductivity, and anisotropic conductivity ceases.
なお、本発明に係る異方導電性接着剤中には、導電性フ
ィラーを高分子材料中に分散させる分散剤、酸化防止
剤、消泡剤、レベリング剤、カーボンブラック等の他の
導電性フィラー、充填剤、滑剤、帯電防止剤、顔料等を
本発明の効果を損わない範囲で必要に応じて添加され
る。Incidentally, in the anisotropic conductive adhesive according to the present invention, a dispersant for dispersing a conductive filler in a polymer material, an antioxidant, a defoaming agent, a leveling agent, other conductive fillers such as carbon black. If necessary, a filler, a lubricant, an antistatic agent, a pigment, etc. are added within a range that does not impair the effects of the present invention.
本発明の異方導電性接着剤の製造方法としては、特に限
定されないが、例えば、熱接着性を有する高分子材料中
に導電性フィラーを混入し、３本ロール、ポットミル又
はライカイ機で十分に混練してペースト状にする方法等
が挙げられる。The method for producing the anisotropic conductive adhesive of the present invention is not particularly limited, and for example, a conductive filler is mixed in a polymer material having thermal adhesiveness, and a three-roll, a pot mill or a liquor machine is sufficient. Examples thereof include a method of kneading to form a paste.
また、異方導電性接着剤を回路基板間に介在させて、回
路基板相互を電気的に接続するには、スクリーン印刷方
等により回路基板の電極間に塗布し、高分子材料中の溶
剤を乾燥させて５〜100μｍの塗膜を形成し、次のこの
異方導電性接着剤の塗膜上に接続すべき回路基板の電極
を対抗させて整合させ、両回路基板を加熱して圧着す
る。Further, in order to electrically connect the circuit boards to each other by interposing the anisotropic conductive adhesive between the circuit boards, the solution is applied between the electrodes of the circuit board by screen printing or the like, and the solvent in the polymer material is applied. After drying to form a coating film of 5-100 μm, the electrodes of the circuit board to be connected are made to oppose each other on the coating film of this anisotropic conductive adhesive, and the two circuit boards are heated and pressure-bonded. .
（実施例） 以下、本発明の一実施例を添付図面に基づいて説明す
る。尚、本発明は以下の実施例に限定されるものではな
い。また、実施例中「部」とあるのは「重量部」を意味
する。(Embodiment) An embodiment of the present invention will be described below with reference to the accompanying drawings. The present invention is not limited to the examples below. In addition, "parts" in the examples means "parts by weight".
まず、本発明を実施した異方導電性接着剤を使用した回
路基板の接続の一例を第１図を参照して説明する。First, an example of connection of a circuit board using an anisotropic conductive adhesive according to the present invention will be described with reference to FIG.
この接続された回路基板は、熱接着性を有する高分子材
料１中に弾性体としてのプラスチツクの表面に金属又は
導電性金属酸化物の被膜を形成した導電性フィラー２を
分散させてなる異方導電性接着剤３によつてフレキシブ
ル基板４上に形成した電極５とITO基板６上に形成した
電極７とを熱接着して形成されたものである。This connected circuit board is an anisotropic structure in which a conductive filler 2 having a film of a metal or a conductive metal oxide formed on the surface of a plastic as an elastic body is dispersed in a polymer material 1 having thermal adhesiveness. It is formed by thermally bonding the electrode 5 formed on the flexible substrate 4 and the electrode 7 formed on the ITO substrate 6 with the conductive adhesive 3.
この場合、熱接着された異方導電性接着剤３中の導電性
フィラー２内の電極5,7間に介在する導電性フィラー
２′は電極5,7で挟まれてつぶされるので、この導電性
フィラー２′は第２図に示すように矢示方向の復元力を
有し、しらがつて電極5,7間の間隔が広がつたときにそ
の隙間を埋めるように機能し、安定した電気的抵抗を得
ることができる。In this case, the conductive filler 2 ′ interposed between the electrodes 5 and 7 in the conductive filler 2 in the thermally conductive anisotropic conductive adhesive 3 is sandwiched between the electrodes 5 and 7 and is crushed. As shown in Fig. 2, the conductive filler 2'has a restoring force in the direction of the arrow, and when the space between the electrodes 5 and 7 is widened, the space between the electrodes 5 and 7 functions to fill the space, thus providing stable electric power. You can get the target resistance.
実施例１〜３ 第１表に示す配合割合で熱接着性樹脂、溶剤及び導電性
フィラーを配合し、３本ロールで導電性フィラーを混合
して分散してペースト状の異方導電性接着剤を製造し
た。次に得られたペースト状の接着剤をスクリーン印刷
法でフレキシブル基板上に印刷した後、温度150℃で10
分間溶剤を乾燥して異方導電性接着剤の塗膜を形成し
た。Examples 1 to 3 A thermo-adhesive resin, a solvent, and a conductive filler are mixed in the mixing ratios shown in Table 1, and the conductive filler is mixed and dispersed with a three-roll to form a paste-like anisotropic conductive adhesive. Was manufactured. Next, print the resulting paste adhesive on a flexible substrate by screen printing, and
The solvent was dried for a minute to form a coating film of the anisotropic conductive adhesive.
尚、上記のフレキシブル基板は厚さ25μｍのポリイミド
で形成されたもので、厚さ35μｍの銅箔に金メッキを施
して、線間が各150μm,計300μｍピッチで等間隔に50本
のラインが並んだ物である。The above flexible substrate is made of polyimide with a thickness of 25 μm. Gold plating is applied to a copper foil with a thickness of 35 μm, and each line is 150 μm, and 50 lines are arranged at equal intervals of 300 μm pitch. It's a crap.
次に、異方導電性接着剤の塗膜を形成したフレキシブル
基板を膜抵抗30Ωの酸化インジウムを蒸着したガラス基
板上にセットし、温度160℃，圧力30kg/cm2で10秒間熱
圧着した後、電気抵抗を測定して導電性（初期の導電
性）を確認した。Next, the flexible substrate on which a film of anisotropic conductive adhesive was formed was set on a glass substrate on which indium oxide with a film resistance of 30Ω was vapor-deposited, and thermocompression bonded for 10 seconds at a temperature of 160 ° C. and a pressure of 30 kg / cm 2 , Electrical resistance was measured to confirm the conductivity (initial conductivity).
続いて温度40℃，湿度95％RHm2で10日間後の導電性（耐
湿後の導電性）を確認した。Then, the conductivity (conductivity after moisture resistance) was confirmed after 10 days at a temperature of 40 ° C and a humidity of 95% RHm 2 .
更に第１表に示す組成のペースト状の異方導電性接着剤
の室温保存後の導電性フィラーの沈降性を確認した。Furthermore, the settling property of the conductive filler after the room temperature storage of the paste-like anisotropic conductive adhesive having the composition shown in Table 1 was confirmed.
上記の実施例１〜３における導電性接着剤の沈降性及び
導電性の確認結果を第１表に示す。Table 1 shows the results of confirming the settling property and the conductivity of the conductive adhesive in Examples 1 to 3 above.
（比較例） 比較例として、第２表に示す組成及び配合割合からなる
導電性接着剤について、実施例１〜３と同様にフレキシ
ブル基板上に塗膜を形成した後酸化インジウム基板上に
セットして、実施例１〜３と同一の条件で、導電性フィ
ラーの沈降性及び導電性を確認した。その結果を第２表
に示す。 (Comparative Example) As a comparative example, a conductive adhesive having a composition and a mixing ratio shown in Table 2 was formed on a flexible substrate and then set on an indium oxide substrate in the same manner as in Examples 1 to 3. Then, the sedimentation property and conductivity of the conductive filler were confirmed under the same conditions as in Examples 1 to 3. The results are shown in Table 2.
（発明の効果） 本発明は熱接着性を有する高分子材料に、表面に金属メ
ッキ又は導電性金属酸化物メッキを施すと共に導電性フ
ィラーとしてそのフィラー自体が適度な弾力性及び復元
力を有するものを用いたので、経時的に電極間に介在さ
せたポリマーに緩みが生じても確実な接続が得られて安
定した電気的接続抵抗を得ることができる。 (Advantages of the Invention) The present invention is one in which a polymer material having thermal adhesiveness is subjected to metal plating or conductive metal oxide plating on the surface and the filler itself has appropriate elasticity and restoring force as a conductive filler. Therefore, even if the polymer interposed between the electrodes loosens over time, a reliable connection can be obtained and a stable electrical connection resistance can be obtained.
更に導電性フィラーの比重が導電性接着剤のバインダー
の比重に近似しているため経時的にフィラーが沈降分離
して接着剤中で偏在することがなく、製造直後の均一な
分散状態を維持し、使用時においても常に安定した電気
的抵抗が得られる。Furthermore, since the specific gravity of the conductive filler is close to the specific gravity of the binder of the conductive adhesive, the filler does not segregate and segregate over time in the adhesive, maintaining a uniform dispersion state immediately after production. , A stable electric resistance is always obtained even during use.
第１図は本発明を実施した異方導電性接着剤を電極間に
介在させて熱圧着した状態を示す要部断面図、第２図は
電極間に挟さまれてつぶされたフィラーの復元力を示す
説明図である。 １……熱接着性を有する高分子材料 ２……導電性フィラー、３……導電性接着剤 ４……フレキシブル基板 5,7……電極 ６……ITO基板。FIG. 1 is a sectional view of an essential part showing a state in which an anisotropic conductive adhesive according to the present invention is interposed between electrodes and thermocompression bonded, and FIG. 2 is a restoration of a filler crushed between electrodes. It is explanatory drawing which shows force. 1 ... Polymer material having thermal adhesiveness 2 ... Conductive filler, 3 ... Conductive adhesive 4 ... Flexible substrate 5,7 ... Electrode 6 ... ITO substrate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 嶋田 和之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭60−115678（ＪＰ，Ａ) 特開 昭51−135938（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazuyuki Shimada 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-60-115678 (JP, A) JP-A-51- 135938 (JP, A)
Claims (1)
表面に金属又は導電性金属酸化物の被膜を形成しかつ比
重を1.7〜2.1としてなる導電性フィラーを分散させた異
方導電性接着剤。1. Anisotropic conductivity in which a polymer material having thermal adhesiveness is coated with a metal or conductive metal oxide film on the surface of an elastic body and dispersed with a conductive filler having a specific gravity of 1.7 to 2.1. Adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61087352A JPH072938B2 (en) | 1986-04-16 | 1986-04-16 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61087352A JPH072938B2 (en) | 1986-04-16 | 1986-04-16 | Anisotropic conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62243668A JPS62243668A (en) | 1987-10-24 |
| JPH072938B2 true JPH072938B2 (en) | 1995-01-18 |
Family
ID=13912483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61087352A Expired - Lifetime JPH072938B2 (en) | 1986-04-16 | 1986-04-16 | Anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH072938B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833180B1 (en) | 1997-07-04 | 2004-12-21 | Nippon Zeon Company, Ltd. | Adhesive for semiconductor part |
| US6315856B1 (en) * | 1998-03-19 | 2001-11-13 | Kabushiki Kaisha Toshiba | Method of mounting electronic component |
| JP3226889B2 (en) * | 1998-05-06 | 2001-11-05 | シンワ プロダクト カンパニー・リミテッド | Conductive adhesive tape |
| JP2001143409A (en) | 1999-11-17 | 2001-05-25 | Tdk Corp | Magnetic head assembly and manufacturing method therefor, and wiring method for magnetic head assembly |
| JP4735606B2 (en) * | 2007-06-14 | 2011-07-27 | 日本ゼオン株式会社 | Anisotropic conductive material |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
| JPS58111202A (en) * | 1981-12-24 | 1983-07-02 | 信越ポリマ−株式会社 | Thermal pressure conductive composition and connecting structure member |
| JPS608337A (en) * | 1983-06-27 | 1985-01-17 | Kanebo Ltd | Electrically conductive granular phenolic resin |
| JPS6012603A (en) * | 1983-07-01 | 1985-01-23 | 住友化学工業株式会社 | Conductive resin filler |
| JPS6084718A (en) * | 1983-10-14 | 1985-05-14 | 日立化成工業株式会社 | Conductive anisotropic adhesive sheet |
| JPS60115678A (en) * | 1983-11-29 | 1985-06-22 | Matsushita Electric Ind Co Ltd | Anisotropically conductive adhesive and production thereof |
| JP2512709B2 (en) * | 1985-08-16 | 1996-07-03 | ソニー株式会社 | Connection sheet |
| JPS62115679A (en) * | 1985-11-15 | 1987-05-27 | 富士高分子工業株式会社 | Electric jointing unit |
| JPS62188184A (en) * | 1986-02-14 | 1987-08-17 | 日立化成工業株式会社 | Adhesive compound with anisotropic conductivity and adhesivefilm for circuit connection and connection of circuits usingthose materials |
| JPS62206772A (en) * | 1986-03-06 | 1987-09-11 | 日立化成工業株式会社 | Circuit connection structure |
-
1986
- 1986-04-16 JP JP61087352A patent/JPH072938B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62243668A (en) | 1987-10-24 |
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