JPH0726361Y2 - Substrate inversion mechanism of vapor deposition equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a substrate reversing mechanism of a vapor deposition apparatus.

(Prior Art) When forming a film on the front and back of a substrate by electron beam evaporation, etc., a rotation jig that can rotate around the center line passing through the evaporation source is provided in the vacuum chamber, and the substrate holder is held in a reversible manner. It is being done.

For example, in Japanese Laid-Open Patent Publication No. 63-307260, a plurality of rotating spindles are radially arranged on a rotating jig as described above along a conical surface with a large apex angle (the evaporation source is on the center line of the cone). , And one substrate holder is fixed to each of the rotation spindles. In this case, the substrate holder is turned over by the rotation of the rotation support shaft.
Further, the substrate holder is a fan-shaped flat plate, and can hold a plurality of substrates.

(Problems to be solved by the invention) By the way, in order to increase the throughput of the substrate in one deposition, the radius of the rotating jig is increased, that is, the rotating shaft is lengthened and fixed to the substrate holder. The number of substrates that can be held in the substrate holder may be increased by making the vertically long. However, in the case where the rotation support shaft is arranged along the conical surface as described above, when the radius of the rotating jig becomes large, that is, when the rotation shaft becomes long and the substrate holder fixed to it becomes vertically long, both ends of the rotation holder shaft are fixed. The difference in the distance r from the evaporation source becomes large between the substrate located at and the substrate located at the center, and the thickness of the film formed by vapor deposition becomes different. This is because the film thickness (vapor deposition amount) is proportional to 1 / r ² .

Further, the film thickness (vapor deposition amount) is proportional to cos θ when the evaporation source is a point source, where θ is the angle formed by the line connecting the substrate and the evaporation source and the center line. On the small plane, is proportional to cos ² θ. Therefore, even if the distances from the evaporation source to the substrates located at both ends of the substrate holder are the same, the film thicknesses of the two become different.

In short, since the film thickness is proportional to cos θ / r ² or cos ² θ / r ² , it is necessary to arrange each substrate on a predetermined curved surface in order to make the film thickness of each substrate uniform. However, in the above-mentioned conventional technique, when the radius of the rotating jig becomes large, the displacement of the substrate from the curved surface becomes large.

That is, an object of the present invention is to make the film thickness of each substrate uniform even if the radius of the rotating jig is increased to increase the processing amount of the substrate.

(Means for Solving the Problems) In order to solve such a problem, the present invention does not hold a plurality of substrates arranged in the radial direction of a rotating jig in a single substrate holder but rather a plurality of substrates. The substrates are divided into holders, and the respective substrate holders can be arranged at positions where the film thicknesses of the respective substrates are substantially equal to each other.
Then, in that case, each of the substrate holders divided as described above is supported by a separate rotation support shaft extending in the radial direction or the circumferential direction, and the rotation support shafts adjacent to each other in the extending direction are connected by a universal joint. By connecting them, a series of substrates can be inverted at the same time.

In other words, the specific means for doing this is to use a rotating jig that is rotatable around the center line passing through the evaporation source in a vacuum chamber for vapor deposition on the substrate, and attach a plurality of substrate holders to the front and back sides of the holder. A mechanism for reversibly supporting for vapor deposition from a substrate to a substrate, wherein the plurality of substrate holders are arranged at intervals in a radial direction and a circumferential direction of the rotating jig, and Extending along the radial or circumferential direction of the jig,
A rotation spindle that supports and rotates each substrate holder, a bearing member that rotatably supports each rotation spindle on a rotating jig, and rotation spindles that are adjacent to each other in the extending direction of the rotation spindle. A substrate reversing mechanism of a vapor deposition apparatus, comprising: a universal joint to be connected, and a rotational force applying means for applying a rotational force to a series of rotary support shafts connected by the universal joint.

(Operation) In the substrate reversing mechanism, the substrate holders are spaced from each other in the radial direction and the circumferential direction of the rotating jig so that they are supported by the respective dedicated rotation spindles. It can be arranged along a curved surface having a constant thickness. Further, since the rotation support shafts supporting the respective substrate holders are adjacent to each other in the extending direction and are connected by the universal joint, a series of substrates thereby is provided with one rotation support shaft that applies a rotational force. The means can be reversed at the same time.

(Effect of the Invention) Therefore, according to the present invention, the respective substrate holders are spaced from each other in the radial direction and the circumferential direction of the rotating jig so that they can be supported by the respective dedicated rotation spindles and extend from each other. Since the rotating spindles that are adjacent to each other in the direction are connected with a universal joint, all the substrate holders are arranged along a predetermined curved surface so that multiple substrates can be turned over at the same time, and the film thickness of each substrate is adjusted to Will be able to equalize.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

The present embodiment relates to an electron beam evaporation type vapor deposition apparatus, and its entire configuration is shown in FIG.

In the figure, reference numeral 1 is a vacuum chamber for vapor deposition on a substrate 2, and an evaporation source 4 which is heated and vaporized by an electron beam from an electron gun 3 is provided at the bottom of the vacuum chamber. A ring-shaped base 5 is supported on the inner wall surface of the vacuum chamber 1, and the rotary jig 7 that supports the first to third substrate holders 6a to 6c on the base 5 in a reversible manner is the evaporation source. It is rotatably supported around a vertical line passing through 4.

Each of the substrate holders 6a to 6c has a plurality of mounting holes for supporting the substrate 2. The substrate 2 is formed on both sides thereof, and both sides thereof are directed to the evaporation source 4 by reversing the substrate holders 6a to 6c in the state of being attached to the attachment holes.

First, the rotating jig 7 is rotated by a support roller 8 supported by a horizontal axis on the peripheral surface of the base 5 and a rotation position regulating roller 9 supported by a vertical axis on the peripheral edge of the upper surface of the base 5. The ring gear 11 is freely supported, and the bed 12 is supported on the ring gear 11. And the ring gear 11
A drive motor 13 is provided to the side of the ring gear 11 for driving the rotation of the ring gear 11, and the power thereof can be transmitted to the ring gear 11 via the drive gear 14 and the intermediate gear 15.

The bed 12 includes a ring-shaped base 16 supported by the ring gear 11 and a ring member 17 fixed on the ring-shaped base 16, and the ring member 17 and a center member 18 provided at a high position in the center thereof. A plurality of radiating frames 19 arranged radially as shown in FIG. 2 are passed between them. And
The first and second horizontal frames 21 and 22 are provided between the adjacent radiating frames 19 at intervals in the radiating direction.

Then, between the center member 18 and the first horizontal frame 21, between the first and second horizontal frames 21 and 22, and between the second horizontal frame 22 and the ring member 17 in the radial direction, respectively. First to third rotation support shafts 23 to 25 are provided to extend. That is, these rotation support shafts 23 to 35 support and rotate the first to third substrate holders 6a to 6c, respectively, and are arranged in three rows in the circumferential direction of the rotating jig 7. . The first rotation support shaft 23 is the center member 18 and the first rotation support shaft 23.
The bearing members 26 and 27 provided on the horizontal frame 21 and the second rotary support shaft 24 have the bearing members 2 provided on the first and second horizontal frames 21 and 22, respectively.
7, 28, the third rotation support shaft 25 is rotatably supported by bearing members 28, 29 provided on the second horizontal frame 22 and the ring member 17, respectively.

The bearing members 26 to 29 are arranged on a predetermined curved surface S. That is, the curved surface S is a surface on which the amount of vapor deposition from the evaporation source 4 is constant. Specifically, the amount of vapor deposition is cos θ / r ² or cos ² θ / r ^{2 as} described above.
If the distance r from the evaporation source 4 is h · co
The curved surface is s ^1/2 θ or h · cos θ (h is the height from the evaporation source 4 to the first bearing member 26). Therefore, the first to third rotary supports 23 to 25 are arranged not at a straight line but at a predetermined angle along the curved surface S.

In this case, as shown in FIG. 3 by the first and second rotary support shafts 23, 24, these rotary support shafts 23, 24 are attached to the substrate holders 6a, 6b.
The shaft members 23a, 24a are fixed to both ends in the above radial direction. The shaft members 23a, 24a of the both rotary support shafts 23, 24 are supported by bearings 31, 32 provided on the bearing member 27 of the first horizontal frame 21, and end portions protruding from the bearings 31, 32 are supported. The two are connected by a universal joint 33.
The configuration of this rotation support shaft is the same for the third rotation support shaft 25, and the second and third rotation support shafts 24, 25 are similar to the first and second rotation support shafts 23, 24. Are connected by the structure.

Further, in order to turn over the substrate holders 6a to 6c, as a means 34 for applying a rotational force to the rotary support shafts 23 to 25, the bearing member 29 of the ring member 17 coupled to the third rotary support shaft 25 is provided.
From the arm member 35 which is projected radially from the vacuum chamber 1
Side drive member 36 is provided.

That is, as shown in FIG. 4, the arm member 35 is provided with a cam 35b and a cross-shaped arm 35a on the shaft connected to the third rotation support shaft 25. And
The cam 35b is formed with recesses at an angular interval of 90 degrees on its circumferential surface, and a ball 37 that can fit in the recess is biased toward the cam 35b by a spring 38 with respect to the cam 35b. It is provided. On the other hand, the drive member 36 is provided at a position corresponding to the rotation locus of the arm member 34, and includes a rod 36b which is operated to move back and forth toward the arm 35a by a solenoid 36a.

Further, the base 5 is provided with a limit switch 39 for detecting the rotational position of the rotary jig 7.

Therefore, when forming a film with the vapor deposition apparatus, the substrate 2 is held by the substrate holders 6a to 6c of the rotating jig 7 and the driving member 36 is used.
The rotating jig 7 is rotated once while the rod 36b of 1 is projected. As a result, the arm member 35 coupled to each of the third rotation support shafts 25 is rotated by an angle of 90 degrees or less with the rotation of the rotating jig 7 due to the contact of the rod 36b with the arm 35a. The third rotation support shaft 25 and the remaining two rotation support shafts 23 and 24 connected to the third rotation support shaft 25 via the universal joint 33 rotate at the same angle.

That is, each substrate holder supported by the rotation spindles 23 to 35
6a to 6c rotate at the same angle, and by performing this rotation once or twice, the substrate holders 6a to 6c can be simultaneously directed to the evaporation source 4. Since the rotary support shafts 23 to 25 are arranged along the curved surface S where the deposition amount is constant, the first to third substrate holders 6a to 6c supported by the rotary support shafts 23 to 25 are provided. Is arranged along the curved surface S.

Then, the inside of the vacuum chamber 1 is set to a predetermined degree of vacuum, and while the rod 36b of the drive member 36 is retracted, the evaporation source 4 is irradiated with an electron beam while the rotating jig 7 is rotated to form a film forming material. Are evaporated, and evaporated particles are deposited on each substrate 2.
At this time, since the first to third substrate holders 6a to 6c are arranged along the curved surface S, each of these substrate holders
The amounts of vapor deposition on the substrates 2 held by 6a to 6c become substantially equal, and the film thickness of each substrate 2 can be made uniform.

When the film formation on one surface of the substrate 2 is completed, the rotary jig 7 is rotated twice with the rod 36b of the driving member 36 being projected, whereby the rotary support shafts 23 to 25 are rotated 90 degrees each. To bring the substrate holders 6a to 6c into an inverted state. Then, while rotating the rotating jig 7 in the same manner as described above, evaporated particles are deposited on each substrate 2.

Another embodiment is shown in FIG.

That is, in this product, the first to third rotation support shafts 42a to 42c extending along the circumferential direction of the rotating jig 41 are arranged in order from the inner peripheral side to the outer peripheral side, and there are three rows in the circumferential direction. It was done like this. In this case, the three rows of rotation support shafts 42a to 42c are
The substrate holders 45, which are arranged along the curved surface S where the amount of vapor deposition is constant, and which are supported by the rotary support shafts 42a to 42c, are all disks of the same shape.

Then, the rotary support shafts 42a to 42c are connected such that adjacent ones in each row are connected via a bearing member 46 incorporating a universal joint and a bearing, as in the case shown in FIG. Further, as the rotational force imparting means 49 for the rotary support shafts 42a to 42c, they are connected in the radial direction of the rotary jig 41 by connecting them with a bearing member 54 having a bevel gear 51 and a universal joint and a bearing incorporated therein. Transmission shafts 57-59 and the above bevel gears 51-53, respectively
A bearing member 46 having a bevel gear 61 meshed with a bearing and a bearing incorporated with a bearing is connected to the rotary support shafts 42a to 42c and the transmission shafts 67 to 69 arranged in the circumferential direction of the rotary jig 41. It is provided. An arm member 71 similar to that shown in FIG. 4 is connected to the radial transmission shaft 59.

Therefore, in the embodiment shown in FIG.
When the arm member 71 provided at one position of 41 is rotated, all the rotation support shafts 42a to 42c are simultaneously rotated.

Other configurations are substantially the same as those of the above-mentioned embodiment, and detailed description thereof will be omitted.

In the embodiment described above, the rotation support shaft is composed of a pair of shaft members coupled to both ends of the substrate holder,
The rotation support shaft may be configured by one shaft member, and the substrate holder may be supported by this. Further, although the above embodiment is an example in which vapor deposition is performed on the front and back surfaces of the substrate, the present invention can of course be applied to the case where vapor deposition is performed on only one side of the substrate. That is, in that case, the substrates are respectively held on both sides of the substrate holder, vapor deposition is performed on the substrate on one side, and then the substrate holder is inverted and vapor deposition is performed on the substrate on the other side.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, FIG. 1 is a partially sectional front view showing the entire structure of a substrate reversing mechanism, FIG. 2 is a plan view showing a part of the mechanism, and FIG. FIG. 4 is a sectional view showing a structure of a connecting portion of a rotary support shaft, FIG. 4 is a front view of a rotational force applying means, and FIG. 5 is a view similar to FIG. 2 in another embodiment. 1 ... Vacuum tank 2 ... Substrate 4 ... Evaporation source 6a-6c, 42a-42c ... Rotating spindle 7 ... Rotating jig 26-29,46 ... Bearing member 33 ... Universal joint 34,49 ... ... Rotational force applying means

Claims (1)

[Scope of utility model registration request] 1. A vacuum chamber for vapor deposition on a substrate,
A mechanism for rotatably supporting a plurality of substrate holders for holding a substrate on a rotation jig rotatable around a center line passing through an evaporation source for vapor deposition on the substrate from the front side and the back side thereof. Substrate holders are arranged at intervals in the radial direction and the circumferential direction of the rotary jig, and extend along the radial direction or the circumferential direction of the rotary jig,
A rotation spindle that supports and rotates each substrate holder, a bearing member that rotatably supports each rotation spindle on a rotating jig, and rotation spindles that are adjacent to each other in the extending direction of the rotation spindle. A substrate reversing mechanism of a vapor deposition apparatus, comprising: a universal joint to be connected, and a rotational force applying means for applying a rotational force to a series of rotary support shafts connected by the universal joint.