JPH07249863A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To enable insert parts to be easily mounted on a printed wiring board by insertion without deteriorating the board in mounting density. CONSTITUTION:A printed wiring board 10 is composed of an insulating board 11, wiring patterns 12 formed on the insulating board 11, and through-holes 15 in which conductive paste is filled to electrically connect the wiring patterns 12 together, wherein a flow of hot air is made to blow against the required through-hole 15 out of the through-holes 15 from both the sides of the insulating board 11 at different times to fuse the conductive paste 14 filled in the through- hole 15 to make the required through-hole 15 through to mount an insert part on the wiring board 10 by insertion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board having a through-hole portion capable of surface mounting and insertion mounting of components.

[0002]

2. Description of the Related Art As a conventional printed wiring board, there is a so-called paste filling type through-hole wiring board.
In this type of printed wiring board, the through holes are formed by filling the through holes that penetrate the insulating substrate with the conductive paste, and electrically connect the wiring patterns formed on, for example, both sides of the insulating substrate. It is provided for conduction. Therefore, components without lead wires are surface-mounted on such a wiring board, and the through-hole portion plays only the role of transmitting signals.

[0003]

In the printed wiring board in which the through holes are filled with the conductive paste as described above, the through holes are formed for conduction. For this reason, when a so-called plug-in component with a lead wire is to be inserted and mounted, a hole for newly mounting the plug-in component must be formed in the insulating substrate, and the inner wall of the hole must be plated with a conductive material. However, complicated work was required.
There is also a problem that the mounting density is reduced.

The present invention has been made in view of the above problems, and in a printed wiring board having through holes filled with a conductive paste, insert components can be easily mounted by insertion without lowering the mounting density. An object of the present invention is to provide a method for manufacturing a printed wiring board that can be used.

[0005]

In order to solve the above problems, the present invention comprises an insulating substrate and a plurality of through hole portions formed by filling a through hole penetrating the insulating substrate with a conductive paste. In the printed wiring board, hot air is blown to desired through-hole portions of the plurality of through-hole portions from different sides of the insulating substrate at different timings to melt the conductive paste, thereby penetrating the required through-hole portions. The printed wiring board is manufactured.

According to the present invention, in the above-described method for manufacturing a printed wiring board, blowing jigs for blowing hot air are arranged on both sides of the insulating substrate in a state where the blowing jig faces the insulating substrate and faces each other. By blowing hot air from the respective blowing jigs at different timings, the hot air is blown to the required through-hole portions from both sides of the insulating substrate at different timings.

Further, in the above-described method for manufacturing a printed wiring board according to the present invention, a blow-out jig for blowing the hot air is provided on each of both sides of the insulating substrate, with its blow-out port facing the insulating substrate and substantially the center of each blow-out port. Are arranged in a state of being displaced from each other along the insulating substrate, and hot air is blown from each of the blowing jigs, and at the time of blowing hot air, the insulating substrate and the blowing port are substantially orthogonal to the blowing direction. By moving relative to the approximate center, hot air is blown to the required through holes from both sides of the insulating substrate at different timings. Further, according to the present invention, in any of the above-described printed wiring board manufacturing methods, after the through hole portion is penetrated, the inner wall of the penetrated through hole portion is plated with a conductive material.

[0008]

According to the present invention, by staggering the timing of blowing hot air to the required through-hole portion, an escape route for the resin or the like in the conductive paste that is blown by the blowing of hot air is secured. Therefore, the through-hole portion smoothly penetrates. Further, by blowing hot air from both sides of the insulating substrate, the conductive paste is applied to the inner wall of the penetrating through hole with a uniform thickness. In addition, by plating the inner wall of the through-hole portion that is penetrated with a conductive material, the connection between the wiring patterns becomes more reliable, and the physical strength of the inner wall of the through-hole portion increases.

[0009]

Embodiments of the method for manufacturing a printed wiring board according to the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing an example of a method for manufacturing a printed wiring board of the present invention. The present invention is a method of manufacturing a printed wiring board in which the through holes are filled with a conductive paste, and in the drawing, reference numeral 10 indicates this type of printed wiring board.

That is, the printed wiring board 10 is formed by filling the insulating substrate 11, the wiring patterns 12 formed on both sides of the insulating substrate 11, and the through holes 13 penetrating the insulating substrate 11 with the conductive paste 14. It is composed of a plurality of through holes 15. The conductive paste 14 is, for example, a fine metal powder such as copper or silver kneaded with a resin to form a paste, and the through-hole 13 is formed by, for example, printing.
Is filled in. Therefore, the filled conductive paste 14 is in a state in which both sides of the insulating substrate 11 are slightly depressed as shown in FIG.

The insulating substrate 1 around the through hole portion 15
Pads 16 made of, for example, copper foil are provided on both surfaces, and the wiring patterns 12 are electrically connected to each other via the pads 16 and the conductive paste 14. In the method of this embodiment, first, the blowing jigs 30 for blowing the hot air H are arranged on both sides of the insulating substrate 11. At the time of arrangement, the blowout ports 31 are directed toward the insulating substrate 11 and face each other. Further, the hot air H from the blowing jig 30 is made to hit the required through hole portion 15 of the plurality of through hole portions 15 of the through hole wiring board 10.

As the blowing jig 30, for example, an existing jig can be used in which the blowing port 31 has a very small diameter and the hot air H having a predetermined temperature is jetted from the blowing port 31 at a required pressure. Then, as shown in (b) and (c) of FIG. 1, the hot air H is blown from the respective blowing jigs 30 on both sides of the insulating substrate 11 at different timings. That is, the hot air H is blown from the both sides of the insulating substrate 11 to the required through holes 15 at different timings. At this time, the hot air H is blown at a pressure of, for example, 1 to 3 kg / cm ₂ so that the insulating substrate 11 and the wiring pattern 12 are not heavily heat-loaded.

For example, as shown in FIG. 1B, when hot air H is blown to a desired through hole portion 15 from one of both surface sides of the insulating substrate 11, the conductive paste filled in the through hole portion 15 is formed. 14 melts from the sprayed side. Then, the resin in the conductive pattern 14 flies from the side opposite to the side on which the hot air H is blown, and the through hole portion 15 penetrates. Through hole part 15 which penetrated
In the above, the conductive paste 14 is in a state of being slightly thicker on the side opposite to the side on which the hot air H is blown.

If the hot air H is blown to the same through-hole portion 15 from the other side of the insulating substrate 11 as shown in FIG. The resin remaining in the running conductive paste 14 flies from the side opposite to the side on which the resin is sprayed. Along with this, the conductive paste 14, which is attached slightly thicker, moves to the side opposite to the side on which the conductive paste 14 is sprayed. As a result, the conductive paste 14 has a uniform thickness in the through hole portion 15 penetrating therethrough.

By thus shifting the timing of blowing the hot air H to the required through-hole portion 15, the hot air H
By the spraying, the escape route for the resin or the like in the conductive paste 14 is secured. Therefore, the through hole portion 15 penetrates smoothly. Further, by blowing hot air H from both sides of the insulating substrate 11, the through hole portion 15 penetrating therethrough can be obtained.
The conductive paste 14 is applied to the inner wall of the substrate in a uniform thickness.
Therefore, by blowing the hot air H onto the required through-hole portion 15, the through-hole portion 15 can be attached with the plug component and ensure the conduction of the wiring pattern 12.

As described above, in this embodiment, the printed wiring board 1 having the through holes 15 filled with the conductive paste is used.
In 0, the required through-hole portion 15 can be made to be capable of attaching the insertion part and achieving conduction. Therefore, according to this embodiment, the printed wiring board 10
In addition, the insertion mounting of the plug-in component can be performed without lowering the mounting density.

Further, since the hot air H is blown to the required through-hole portions 15 from both sides of the insulating substrate 11 at different timings, the required through-hole portions 15 can be smoothly penetrated and the conductive paste 14 has a uniform thickness on the inner wall thereof. Can be attached to. Therefore, according to this embodiment, it is possible to easily form the through hole portion 15 that can be inserted and mounted and has high reliability.

By the way, the through hole portion 15 which is penetrated
Can also be thinly plated with a conductive material on its inner wall after penetration. FIG. 2 is a cross-sectional view showing a state in which the through hole portion 15 penetrating therethrough is plated.

As shown in the figure, the inner wall of the penetrating through hole portion 15 is thinly plated with the conductive material 17 to the extent that it covers the conductive paste 14, for example, about 0.02 μm. As a result, the wiring patterns 12 are more reliably connected to each other and the physical strength of the inner wall is increased, so that the reliability of the through-hole portion 15 can be further improved in terms of conduction and strength at the time of attaching the plug component. . The conductive material used in this case can be selected from various materials such as solder, copper, gold and palladium depending on the process of insertion mounting and the material of the lead wire to be inserted.

Next, another example of the method for manufacturing a printed wiring board of the present invention will be described. FIG. 3 is an explanatory view showing another example of the printed wiring board of the present invention. In this embodiment, the method of shifting the timing of the hot air H blown to a required through hole portion 15 is different from that of the above embodiment.

That is, as shown in FIG. 3, in this embodiment, the blowing jigs 30 are provided on both sides of the insulating substrate 11 and the blowing ports 31 are directed toward the insulating substrate 11 in the same manner as the above embodiment. To place. On the other hand, Fig. 3
As shown in (a), the blow-out jigs 30 are arranged such that the centers of the blow-out openings 31 are displaced from each other along the insulating substrate 11 by a predetermined dimension a. The dimension a is set to be at least larger than the diameter of the through hole 13 so that the hot air H is not simultaneously blown to the same through hole portion 15 from both surface sides of the insulating substrate 11. And
The hot air H is blown out from each of the blowing jigs 30.

When the hot air H is blown out, the insulating substrate 11 and the substantial center of the blowout port 31 are moved relatively in a direction substantially orthogonal to the blowing direction. In addition, in FIG. 3, only the insulating substrate 11 is heated by the hot air
Although the case of moving in a direction substantially orthogonal to the blowing direction of is shown, in addition to this, it is also possible to move only the substantially center of the blowing port 31 of the blowing jig 30, or the insulating substrate 11 and the blowing port 31. It is also possible to move the approximate center of. Further, it can be moved in any direction as long as it is a direction substantially orthogonal to the blowing direction of the hot air H.

As described above, the blowing holes 31 of the blowing jig 30 are arranged so that their centers are displaced from each other to blow out the hot air H, and the insulating substrate 11 and the blowing port 31 are relatively centered at the time of blowing. When moved to, the hot air H is blown from the both sides of the insulating substrate 11 to the required through holes 15 at different timings.

For example, when the insulating substrate 11 is moved as shown in FIG. 3B, the hot air H is first blown from one of the both sides of the insulating substrate 11 to the required through hole portion 15. Then, as in the case of the above-mentioned embodiment, the conductive paste 14 filled in the through-hole portion 15 is melted from the sprayed side, and the through-hole portion 15 penetrates.

When the insulating substrate 11 is moved in the same direction as it is, the insulating substrate 1 is moved as shown in FIG.
Required through-hole portion 15 from the other side of 1
Hot air H is blown onto the. That is, the hot air H is blown to the same through-hole portion 15 at a timing different from that of the above-mentioned blowing, so that the conductive paste 14 has a uniform thickness in the penetrating through-hole portion 15. If there is another required through-hole portion 15 to be penetrated, the insulating substrate 11 is further moved so that the other through-hole portion 15 is similarly penetrated.

As described above, also in this embodiment, since the hot air H can be blown to the required through-hole portion 15 from both sides of the insulating substrate 11 at different timings, the through-hole portion 15 can be smoothly penetrated. In addition, the conductive paste 14 can be applied to the inner wall of the through hole portion 15 which is penetrated to have a uniform thickness. Moreover, since the insulating substrate 11 and the approximate center of the blowout port 31 are relatively moved in a direction substantially orthogonal to the blowing direction of the hot air H,
A plurality of required through-hole portions 15 can be continuously subjected to penetration processing.

Further, since the insulating substrate 11 and the approximate center of the blow-out port 31 are moved relative to each other, the required through-hole portion 15 and the blow-out port 31 to be pierced are not required to be precisely aligned with each other. The hot air H is blown to the through hole portion 15.

Therefore, according to this embodiment as well, in the printed wiring board 10 in which the through holes 15 are filled with the conductive paste, the required through holes 15 can be used both as attachment parts and for high reliability. it can. Therefore, it is possible to realize the insertion mounting of the plug components without lowering the mounting density. Further, since a plurality of required through-hole portions 15 can be continuously and surely penetrated, the manufacturing can be efficiently performed. The reliability of the through hole portion 15 can be further improved by further thinning the inner wall of the through hole portion 15 penetrating in this embodiment with a conductive material after the penetration.

[0029]

As described above, according to the method for manufacturing a printed wiring board of the present invention, in the printed wiring board in which the conductive paste is filled in the through holes, the through holes can be attached with the components. And it should be able to achieve continuity. Therefore, it is possible to realize the insertion mounting of the plug component without lowering the mounting density. Further, since hot air is blown from the both sides of the insulating substrate to the required through-hole portions at different timings, the required through-hole portions can be smoothly penetrated and the conductive paste can be applied to the inner wall to a uniform thickness.

Therefore, according to the present invention, since the through hole portion which can be inserted and mounted and is highly reliable is easily formed, the printed wiring board is excellent in reliability and can be applied to various mounting patterns. It can be a board.
Further, by plating the inner wall of the through hole portion that is penetrated with a conductive material, the reliability of the through hole portion can be further improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an example of the present invention.

FIG. 2 is a cross-sectional view showing a state in which a through hole portion that penetrates is plated.

FIG. 3 is an explanatory diagram showing another example of the present invention.

[Explanation of symbols]

 10 Printed Wiring Board 11 Insulating Substrate 13 Through Hole 14 Conductive Paste 15 Through Hole Part 17 Conductive Material 30 Blow Jig 31 Blow Out H Hot Air

Claims (4)

[Claims] 1. A printed wiring board comprising: an insulating substrate; and a plurality of through-hole portions formed by filling a through-hole penetrating the insulating substrate with a conductive paste. A method of manufacturing a printed wiring board which penetrates a required through-hole portion, wherein hot air is blown from the both sides of the insulating substrate to the required through-hole portion at different timings to melt the conductive paste, A method for manufacturing a printed wiring board, which comprises penetrating required through holes. 2. The method for manufacturing a printed wiring board according to claim 1, wherein a blowing jig for blowing the hot air is provided on each of both sides of the insulating substrate so that the blowing ports face the insulating substrate and face each other. A method for manufacturing a printed wiring board, characterized in that the hot air is blown from each of the blowing jigs at different timings. 3. The method for manufacturing a printed wiring board according to claim 1, wherein a blowing jig that blows out the hot air is provided on each of both sides of the insulating substrate, and the blowing outlet is directed toward the insulating substrate. The mouths are arranged so that their centers are shifted from each other along the insulating substrate, and hot air is blown from each of the blowing jigs, and at the time of blowing the hot air, the hot air is substantially orthogonal to the blowing direction. A method for manufacturing a printed wiring board, characterized in that the insulating substrate and the approximate center of the blowout port are moved relative to each other in a direction. 4. The method for manufacturing a printed wiring board according to claim 1, claim 2, or claim 3, wherein after the through hole portion is penetrated, a conductive material is plated on the inner wall of the penetrated through hole portion. A method for manufacturing a printed wiring board, comprising: