JPH06169171A - Method for joinning conductor pin - Google Patents

Abstract

PURPOSE:To provide the joinning method of conductor pin capable of disposing the conductor pin needless of a through hole in upright without fail thereby enabling a conductor circuit to be miniaturized while the conductor pin to be increased. CONSTITUTION:After the formation of a land 14 around a pin inserting hole 12, a solder layer 15 is formed in this land 14 making the layer 15 reflow in the state of the flange part 21 of a conductor pin 20 abutting against the solder layer 15 so that the conductor pin 20 may be joined in the inserting hole 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to how to erect conductor pins when arranging them on a circuit board to form a pin insertion board.

[0002]

2. Description of the Related Art A pin insertion board constructed by arranging a large number of conductor pins on a circuit board is mounted on a printed circuit board by inserting the conductor pins into a printed circuit board. Since it can be performed efficiently, it is often used as one of the mounting techniques for electronic components. Since this pin insertion board guides the connection terminals of the electronic component mounted on it to the outside through each conductor pin, a conductor circuit for connecting the electronic component and each conductor pin is formed on the circuit board. In addition, it is necessary to form a pin insertion hole for standing the conductor pin while electrically connecting each conductor circuit and the conductor pin.

In the conventional pin insertion board, when the conductor pins are erected in the pin insertion holes formed in the circuit board, in order to ensure electrical connection with the conductor circuit on the circuit board, FIG. As shown, a through hole 32 is formed in the circuit board 30, and the conductor pin 20 is inserted into the through hole 32, and then fixed by the solder 22. Of course, each through hole 32
And the conductor circuits 31 on the circuit board 30 are selectively connected as needed, and the conductor circuits 31 and electronic components (not shown) are connected by bonding wires or the like. Each through hole 32 is formed by plating the circuit board 30 with the conductor circuit 31 on the circuit board 30, and the conductor circuit 31 forms the through hole 32. It is generally thicker (about 36 μm) than the thickness (about 18 μm) of a metal foil or the like for forming.

By the way, when the density of electronic parts to be mounted on such a pin insertion board is increased, the number of conductor pins for connecting the electronic parts to the outside becomes very large.
In response to this, the conductor circuit formed on the circuit board must be so-called finer. However, as described above, the through hole 3 is used as the pin insertion hole.
When 2 is used, since the conductor circuit 31 formed on the circuit board 30 is also plated when forming the through hole 32, the conductor circuit 31 itself cannot be made fine. Of.

Therefore, the inventors of the present invention have stipulated that the conductor pins of the pin insertion board for which the fineness of the conductor circuit is required in accordance with the increase in density of electronic parts are to be erected by mere pin insertion holes. The present invention has been completed as a result of various studies on how to eliminate the use of through holes.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and the problem to be solved is to increase the number of conductor pins and the number of conductor pins on a pin insertion board. is there.

The object of the present invention is to ensure that the conductor pins can be erected upright without the need for through holes, resulting in finer conductor circuits and more conductor pins. Another object of the present invention is to provide a method of joining conductor pins that can be used.

[0008]

In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the embodiments. In forming the pin insertion board by forming the insertion hole 12 and joining the conductor pin 20 inserted in this pin insertion hole 12 with the solder 22, after forming the land 14 around the pin insertion hole 12. , A solder layer 15 is applied on the land 14, and the solder layer 15
The joining method is characterized in that the conductor layer 20 is joined to the pin insertion hole 12 by reflowing the solder layer 15 in a state where the flange portion 21 of the conductor pin 20 is in contact therewith ". .

[0009]

Next, the operation of joining and fixing the conductor pin 20 to the conductor circuit 11 of the circuit board 10 by the joining method according to the present invention configured as described above will be described as a pin insertion board. The steps will be described in order.

First, the circuit board 10 which should also be the main body of the pin insertion board must be constructed. The circuit board 10 before the conductor circuit 11 is fixed upright should be as follows. I have to. That is,
As shown in FIG. 1, after forming a conductor circuit 11 on a portion where the conductor pin 20 of the circuit board 10 is to be erected, a predetermined conductor circuit 11 is formed on the circuit board 10, and at the same time, the conductor circuit 11 is formed. The land 14 is formed in the portion located around the circumference 11.

Next, on the land 14, a solder layer 15 (for example, a solder layer 15 to be the solder 22 for joining the conductor pins 20) is formed.
Formed by plating or printing). In this case, the portion where the solder layer 15 is not necessary is formed as shown in FIG.
As described above, the solder resist 13 is applied, and the solder resist 13 is used to form the solder layer 15 only on the portion where the land 14 and the like are specified.

After the above procedure, as shown in FIG. 2, the conductor pin 20 is inserted into each conductor circuit 11,
The flange portion 21 of the conductor pin 20 is brought into contact with the solder layer 15 on the land 14, and in this state, the solder layer previously formed on the solder layer 15 and the conductor pin 20 is reflowed. As a result, the solder layer 15 is melted, and the melted solder layer 15 and the like penetrate into the conductor circuit 11 through the gap between the collar portion 21 and the land 14, and the solder 22
When it is cooled and solidified, it becomes the solder 22 for fixing the conductor pin 20 as shown in FIG.

To reflow the solder layer 15 on the land 14, the circuit board 10 having the conductor pins 20 inserted in the conductor circuit 11 may be immersed in the molten solder bath as it is. This method, which is called so-called solder flow, involves solder layer 1 on land 14.
This is an advantageous method because the solder 22 for fixing the conductor pin 20 to the conductor circuit 11 can be sufficiently supplied at the same time as the reflow of FIG.

According to such a joining method, the conductor circuit 1
1 is sufficiently achieved, and since it is not necessary to purposely perform through-hole plating in the conductor circuit 11, the pin insertion board can be manufactured very efficiently. Since each conductor pin 20 and the land 14 are electrically connected by the solder 22, and each land 14 and the conductor circuit 11 on the circuit board 10 are selectively connected, this pin insertion board The electrical connection between the electronic components mounted on the and the conductor pins 20 is also completed.

[0015]

EXAMPLES Next, the joining method according to the present invention will be explained based on the examples shown in the drawings as follows.

First, the conductor circuit 11 is formed by making a hole in a double-sided laminate having a copper foil having a thickness of 18 μm by drilling at a position where the conductor pin 20 should be erected.
Etc., and after forming a predetermined etching resist,
The copper foil was etched (tenting method) to form a predetermined conductor circuit 11. At the same time, the conductor circuit 11
A land 14 having a diameter of about 0.8 mm was formed around the circumference.
The diameter of the conductor pin 20 in this embodiment is 0.5 m.
It was m.

In this embodiment, the land 14 is provided on the surface of the circuit board 10 on which the flange portion 21 of the conductor pin 20 faces.
And the circuit board 1 on the side opposite to the land 14
The bonding lands 16 are also formed on the back surface of 0. As shown in FIG. 2, the joint land 16 is provided to sufficiently attach the solder 22, and has a diameter of 0.7 to 1.
It is set to 2 mm. In addition, this joint land 1
When the diameters of 6 are 0.7, 0.8, 1.0, 1.2 mm, the pin strengths are about 3.6, 5.0,
It was 5.9 and 6.5 kgf.

As shown in FIG. 1, a solder resist 13 was formed on the circuit board 10 on which the conductor circuits 11 and the lands 14 were formed as described above to provide predetermined protection. After that, the outer shape of the circuit board 10 was adjusted by punching or the like, and then the solder paste was printed only on the lands 14 of the individual circuit board 10. This state is shown in FIG.

Then, as shown in FIG. 2, each conductor circuit 1
The conductor pin 20 was inserted into the connector 1 so that the flange portion 21 was brought into contact with the solder paste of the land 14. By immersing this state in the molten solder bath, the solder 22 necessary for fixing each conductor circuit 11 was supplied, and the solder paste on the land 14 was reflowed by the heat of this molten solder. When the solder 22 is sufficient, the solder 22 is cooled to complete the joining of the conductor pin 20 to each conductor circuit 11, as shown in FIG. The bonding strength of the conductor pin 20 at this time was 6.85 Kgf.

In this embodiment, the solder layer 15 is formed by printing solder paste, but the present invention is not limited to this. Solder plating, solder coat (hot air leveled solder), etc. It can be formed by various construction methods.

As described above in detail, in the present invention,
As illustrated in the above-described embodiment, "the pin insertion hole 12 is formed in the circuit board 10 having the conductor circuit 11, and the conductor pin 20 inserted into the pin insertion hole 12 is joined by the solder 22 to insert the pin. When forming the substrate, a land 14 is formed around the pin insertion hole 12, a solder layer 15 is applied on the land 14, and the flange portion 21 of the conductor pin 20 is brought into contact with the solder layer 15. The conductor layer 20 is joined to the pin insertion hole 12 by reflowing the solder layer 15 in this state. " It is possible to provide a method for joining conductor pins, which can surely stand up the conductors, and as a result can achieve finer conductor circuits and increase the number of conductor pins. It is.

[Brief description of drawings]

FIG. 1 is a partially enlarged cross-sectional view of a circuit board before connecting conductor pins.

FIG. 2 is a partially enlarged cross-sectional view of a circuit board after being joined to a conductor pin.

FIG. 3 is a partially enlarged sectional view of a circuit board to which conductor pins are joined by a conventional method.

[Explanation of symbols]

 10 Circuit Board 11 Conductor Circuit 12 Conductor Circuit 13 Solder Resist 14 Land 15 Solder Layer 16 Bonding Land 20 Conductor Pin 21 Collar 22 Solder

Claims (1)

[Claims] 1. When forming a pin insertion hole by forming a pin insertion hole in a circuit board having a conductor circuit and soldering the conductor pins inserted in the pin insertion hole, the periphery of the pin insertion hole is formed. After forming a land on the land, a solder layer is formed on the land, and the solder layer is reflowed in a state where the flange portion of the conductor pin is in contact with the solder layer. A joining method characterized in that the conductor pins are joined together.