JPH07226430A - Transfer collet supporting apparatus in die bonder - Google Patents

Abstract

PURPOSE:To accurately set within a short period the parallelism of a transfer collet for the reference surface. CONSTITUTION:There is provided a regulating means having a semispherical member 11 arranging downward the spherical surface 11a, also having a first collet supporting member 2 for supporting a transfer collet 1 at the lower end portion and a recessed portion 9 pressed with a pressure in the shape of a ring to the spherical surface 11a of the semispherical member 11 and regulating, under the condition that is being engaged with the upper end portion of the first collet supporting portion 2, the swinging operation, with its vacuum operation, of the second collet supporting portion 3 swingingly supporting, with the engaging portion operated as the fulcrum, the first collet supporting portion 2 and the first collet supporting portion 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer collet supporting device for sucking and holding a die separated from a wafer in a lead frame or a package mounted on a lead frame or a package.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view of an essential part showing an example of a conventional die bonder. In the figure, 30 is a transfer collet, and this transfer collet 30 is attached to the lower end of a support rod 31 having a hollow structure. The support rod 31 is fitted and fixed to the first support plate 32 having a U-shape. The first support plate 32 is fixed to a second support plate 34 having an L shape by a pair of mounting screws 33. Further, the second support plate 34 is fixed to the column 36 by a pair of mounting screws 35.

When actually performing die bonding, first, while sucking air from the air tube 37 connected to the support rod 31, the transfer collet 30 is moved by a drive mechanism (not shown), and the die is attracted by its suction surface 30a. (Not shown) is adsorbed and held, and then the support column 36 is driven by the drive mechanism.
At the same time, the transfer collet 30 is moved to mount the die that has been sucked and held on the lead frame or the package.

In the conventional die bonder, when the size of the die to be handled is changed by switching the die type, the transfer collet 30 needs to be exchanged accordingly. The parallelism of the transfer collet 30 with respect to the frame surface or the package surface will be incorrect. Therefore, in the conventional die bonder, the adjustment eccentric pin 38 attached to the first support plate 32 and the adjustment eccentric pin 39 attached to the second support plate 34 are rotated clockwise or counterclockwise, respectively. This allows the transfer collet 30 to
The parallelism of the transfer collet 30 with respect to the reference plane was adjusted by displacing it to _x · θ _y .

[0005]

However, since the parallelism of the transfer collet 30 with respect to the reference plane has a great influence on the mounting accuracy when mounting the die on the lead frame or the package, very high adjustment accuracy is required. Therefore, it requires considerable skill to adjust it, and
It takes a lot of time because the die must be tacked many times and the fine adjustment must be repeated while confirming the tacking accuracy.

The present invention has been made to solve the above problems, and an object thereof is to enable the parallelism of the transfer collet with respect to the reference surface to be accurately adjusted in a short time.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and is provided with a transfer collet for sucking and holding a die divided from a wafer, and the die sucked and held by the transfer collet is a lead frame. Alternatively, in a die bonder attached to a package, the first collet support portion that supports the transfer collet at the lower end portion and the upper end portion of the first collet support portion are fitted to each other, and the fitting portion serves as a fulcrum for the first collet support portion. The configuration is provided with a second collet support part that swingably supports the collet support part, and a regulation means that regulates the swinging motion of the first collet support part. More specifically, the second collet support portion has a hemispherical member whose spherical surface is arranged downward at the fitting portion, and the first collet support portion is annularly formed on the spherical surface of the hemispherical member at the fitting portion. It has a concave portion that is pressed against the surface. Further, the restricting means is composed of a suction hole that communicates with the recess and is formed in the second collet support, and a vacuum device that is connected to the suction hole via an air tube.

[0008]

In the supporting structure of the transfer collet of the present invention,
Since the first collet support portion is swingably supported by the second collet support portion, the transfer collet supported by the lower end portion of the first collet support portion is pressed against the reference surface, thereby The deviation of the parallelism of the transfer collet is corrected along with the swinging movement of the collet support portion. Further, by restricting the swinging motion of the first collet support portion by the restricting means from this state, the parallel accuracy of the transfer collet with respect to the reference surface is maintained even when the transfer collet is separated from the reference surface.

[0009]

Embodiments of the present invention will now be described in detail with reference to the drawings. 1A and 1B are views for explaining a supporting device for a transfer collet of a die bonder according to the present invention, in which FIG. 1A is a perspective view thereof, and FIG.
First, in FIG. 1A, reference numeral 1 is a transfer collet for sucking and holding a die divided from a wafer (not shown), and this transfer collet 1 is supported by a lower end portion of a first collet supporting portion 2. . The first collet support portion 2 is swingably supported by the second collet support portion 3.

Now, the structure of the first collet support portion 2 will be described. First, the transfer collet 1 described above is attached to the lower end of a support rod 4 having a hollow structure, and the support rod 4 is fitted and fixed to a first support plate 5 having a U-shape. The first support plate 5 is fixed to the second support plate 6 having an L shape. Further, a lid 7 is attached to the upper surface of the second support plate 6, and a through hole 8 is formed in the upper portion of the lid 7. In addition, as shown in FIG. 1B, a recess 9 is formed in the upper surface of the second support plate 6 in a state of being cut out in a hemispherical shape, and the recess 9 has an annular protrusion 9a.
Is provided.

Next, the structure of the second collet support portion 3 will be described. First, the main shaft rod 10 is arranged in the second collet support portion 3 along the vertical direction, and the lower end side of the main shaft rod 10 is fitted into the through hole 8 of the lid body 7 with a predetermined gap. . A hemispherical member 11 is provided at the lower end of the spindle rod 10 as shown in FIG. A spherical surface 11a is formed on the hemispherical member 11, and the spherical surface 11a is arranged downward.

Here, an elastic body 12 composed of a plurality of coil springs as shown in the drawing is interposed between the hemispherical member 11 provided at the lower end of the spindle rod 10 and the above-mentioned lid 7. The elastic force of the elastic body 12 supports the weight of the first collet support portion 2 including the transfer collet 1, and the concave portion 9 formed on the second support plate 6 causes the protruding strip 9a to move. It is annularly pressed against the spherical surface 11a of the hemispherical member 11. In the above structure, the elastic force of the elastic body 12 is set to such an extent that the protruding strip 9a of the recess 9 can freely slide along the spherical surface 11a of the hemispherical member 11 by appropriately selecting the elastic coefficient. ing. With such a configuration, the first collet support portion 2 has a second fitting centered on the fitting portion with the second collet support portion 3, more specifically, the sliding portion between the concave portion 9 and the hemispherical member 11 inside the lid 7. It is swingably supported by the collet support portion 3.

Further, the structure of this embodiment is provided with a restricting means for restricting the swinging motion of the first collet support portion 2. That is, as shown in FIG. 1B, the second support plate 6 communicates with the recess 9 and the suction hole 1 is formed.
3 is drilled. In addition, the suction hole 13 is shown in FIG.
One end of the air tube 14 shown in (a) is connected, and the other end of the air tube 14 is connected to a vacuum device (not shown). When a vacuum device (not shown) is operated in the above-mentioned regulation means, the air in the recess 9 is sucked through the suction hole 13 and the air tube 14. As a result, the atmospheric pressure in the recess 9 surrounded by the protruding piece 9a becomes a negative pressure state, so that the spherical surface 11a of the hemispherical member 11 is firmly pressed against the protruding piece 9a of the recess 9 by the vacuum action.
The swinging motion of the first collet support portion 2 is restricted.

Next, in the die bonder of this embodiment,
A procedure for exchanging the transfer collet 1 will be described.
First, when the size of the handled die is changed by switching the die type, the transfer collet 1 is replaced accordingly. That is, the transfer collet 1 previously attached to the support rod 4 is removed, and another transfer collet 1 corresponding to the size of the die after the product type switching is attached to the support rod 4
Attach to. Next, the transfer collet 1 is lowered together with the first collet support portion 2 and the second collet support portion 3 to form a die mounting surface (reference surface) on a lead frame surface, a package surface, or a separately provided reference surface. On the other hand, the suction surface 1a of the transfer collet 1 is brought into contact. At this time, the vacuum device (not shown) is not operated, and the first collet support portion 2 is set in a swingable state.

As a result, when the parallelism of the transfer collet 1 with respect to the reference plane is distorted, as shown in FIG. 2, the transfer collet 1 strikes the reference surface 15 and at the same time, the first collet support is carried out. The part 2 starts swinging motion,
In cooperation with this, the transfer collet 1 is inclined in the direction of the arrow in the figure, so that the above deviation is corrected. Then, when the suction surface 1a of the transfer collet 1 is uniformly pressed against the reference surface 15, the above deviation is completely corrected, and the parallelism of the transfer collet 1 with respect to the reference surface 15 is ensured with high accuracy.

Subsequently, a vacuum device (not shown) is operated while the transfer collet 1 is pressed against the reference surface 15. As a result, the atmospheric pressure in the recess 9 surrounded by the protruding strip 9a becomes a negative pressure state, and the swinging operation of the first collet support portion 2 is restricted. That is, the first collet support portion 2 is fixed to the second collet support portion 3. After that, the transfer collet 1 is raised while operating a vacuum device (not shown), and a series of operations for collet exchange is completed.

In the configuration of the above embodiment, the first
The elastic body 12 including a plurality of coil springs is provided at the fitting portion between the collet support portion 2 and the second collet support portion 3, and the concave portion 9 is pressed against the spherical surface 11a of the hemispherical member 11 via the ridge portion 9a. However, the present invention is not limited to this, and for example, as shown in FIG. 3, an elastic body 12 composed of one coil spring is wound around the lower end side of the spindle rod 12, or a leaf spring or the like (not shown). The elastic body may be used to support the self-weight of the collet support portion 2. Further, as for the concave portion 9, a circular groove is simply formed as shown in the figure, and its edge portion is formed into a spherical surface of the hemispherical member 11. 1
You may make it carry out annular pressure contact with 1a.

[0018]

As described above, according to the present invention,
Since the first collet support portion is swingably supported by the second collet support portion, when the transfer collet is exchanged by changing the type of die, the lower end portion of the first collet support portion is used. By simply pressing the supported transfer collet against the reference surface, it is possible to completely correct the deviation of the parallelism of the transfer collet with respect to the reference surface. Further, with the transfer collet abutting the reference surface, the first collet support portion is provided by the regulating means. By restricting the swinging movement of the transfer collet, even if the transfer collet is separated from the reference surface, the parallel accuracy of the transfer collet with respect to the reference surface can be reliably maintained. As a result, the parallelism of the transfer collet with respect to the reference surface can be adjusted accurately and in a short time without the need for skilled techniques as in the conventional case.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an embodiment of a supporting device for a transfer collet according to the present invention.

FIG. 2 is a diagram for explaining the operation of the apparatus in the embodiment.

FIG. 3 is a sectional view of an essential part for explaining another embodiment.

FIG. 4 is a main part perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer collet 2 1st collet support part 3 2nd collet support part 9 Recessed part 11 Hemispherical member 11a Spherical surface 13 Suction hole 14 Air tube

Claims (3)

[Claims] 1. A die bonder having a transfer collet for holding a die divided from a wafer by suction and mounting the die sucked and held by the transfer collet on a lead frame or a package, wherein the transfer collet is supported at a lower end portion. A first collet support portion, and a second collet support that is fitted to the upper end portion of the first collet support portion and that swingably supports the first collet support portion with the fitting portion as a fulcrum. A support device for a transfer collet in a die bonder, comprising: a part; and a restricting device that restricts a swinging motion of the first collet support part. 2. The second collet support portion has a hemispherical member whose spherical surface is arranged downward in the fitting portion, and the first collet support portion has a spherical surface of the hemispherical member in the fitting portion. The support device for a transfer collet in a die bonder according to claim 1, wherein the support device has a concave portion which is pressed into a ring shape. 3. The regulating means comprises a suction hole communicating with the recess and formed in the second collet support, and a vacuum device connected to the suction hole via an air tube. The support device for the transfer collet in the die bonding apparatus according to claim 2, wherein