JPH0717156Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0717156Y2 JPH0717156Y2 JP1988026615U JP2661588U JPH0717156Y2 JP H0717156 Y2 JPH0717156 Y2 JP H0717156Y2 JP 1988026615 U JP1988026615 U JP 1988026615U JP 2661588 U JP2661588 U JP 2661588U JP H0717156 Y2 JPH0717156 Y2 JP H0717156Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiator
- circuit board
- conductor layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 24
- 230000005855 radiation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026615U JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026615U JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130591U JPH01130591U (enrdf_load_html_response) | 1989-09-05 |
| JPH0717156Y2 true JPH0717156Y2 (ja) | 1995-04-19 |
Family
ID=31248403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988026615U Expired - Lifetime JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717156Y2 (enrdf_load_html_response) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169573U (enrdf_load_html_response) * | 1980-05-16 | 1981-12-15 | ||
| JPS6183098U (enrdf_load_html_response) * | 1984-11-06 | 1986-06-02 |
-
1988
- 1988-02-29 JP JP1988026615U patent/JPH0717156Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01130591U (enrdf_load_html_response) | 1989-09-05 |
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