JPH0717022Y2 - Ic試験装置 - Google Patents

Ic試験装置

Info

Publication number
JPH0717022Y2
JPH0717022Y2 JP13027789U JP13027789U JPH0717022Y2 JP H0717022 Y2 JPH0717022 Y2 JP H0717022Y2 JP 13027789 U JP13027789 U JP 13027789U JP 13027789 U JP13027789 U JP 13027789U JP H0717022 Y2 JPH0717022 Y2 JP H0717022Y2
Authority
JP
Japan
Prior art keywords
air
spacing frame
constant temperature
temperature bath
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13027789U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0369236U (enExample
Inventor
義仁 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP13027789U priority Critical patent/JPH0717022Y2/ja
Publication of JPH0369236U publication Critical patent/JPH0369236U/ja
Application granted granted Critical
Publication of JPH0717022Y2 publication Critical patent/JPH0717022Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13027789U 1989-11-08 1989-11-08 Ic試験装置 Expired - Lifetime JPH0717022Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13027789U JPH0717022Y2 (ja) 1989-11-08 1989-11-08 Ic試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13027789U JPH0717022Y2 (ja) 1989-11-08 1989-11-08 Ic試験装置

Publications (2)

Publication Number Publication Date
JPH0369236U JPH0369236U (enExample) 1991-07-09
JPH0717022Y2 true JPH0717022Y2 (ja) 1995-04-19

Family

ID=31677862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13027789U Expired - Lifetime JPH0717022Y2 (ja) 1989-11-08 1989-11-08 Ic試験装置

Country Status (1)

Country Link
JP (1) JPH0717022Y2 (enExample)

Also Published As

Publication number Publication date
JPH0369236U (enExample) 1991-07-09

Similar Documents

Publication Publication Date Title
TWI351768B (en) Burn-in testing apparatus and method
US20080136436A1 (en) Wafer chuck, apparatus including the same and method for testing electrical characteristics of wafer
KR101104288B1 (ko) 인터페이스 부재, 테스트부 유닛 및 전자 부품 시험 장치
JP3388271B2 (ja) プローブ装置
KR20140104907A (ko) 전자소자 테스트를 위한 장치 및 방법
JPH0717022Y2 (ja) Ic試験装置
JPH06132429A (ja) キャリア
TW201537196A (zh) 處理器裝置及試驗裝置(二)
JP2000180502A (ja) 電子部品試験装置
JPH01157544A (ja) プローブ装置
JP4202492B2 (ja) 電子部品試験装置
KR101988378B1 (ko) 웨이퍼 테스트 장치
JP2001242216A (ja) 低温ハンドラとテストヘッドの接続機構
JPS6068646U (ja) ウエ−ハ試験用試料台
JPS6138189Y2 (enExample)
JPH075425Y2 (ja) 測定部の結露防止装置
JPH0424459Y2 (enExample)
JPS60253884A (ja) 恒温装置
KR200179993Y1 (ko) 패키지 테스트 장치
JPS5932140Y2 (ja) マルチicソケツト
JPH02129876U (enExample)
JPH03142944A (ja) ソケットボードの結露防止装置
JPH0536773A (ja) バーンイン方法および装置
JPH0639450Y2 (ja) Lsiテスタ
JPH0548053Y2 (enExample)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term