JPH07153875A - Ic socket device - Google Patents

Abstract

PURPOSE:To prevent breakdown of a device during measurement under the mis-inserting condition of socket and detect missing of mis-insertion preventing pin. CONSTITUTION:When a mis-insertion preventing pin 3 of a device is placed in contact with a mis-insertion preventing pin contact part 4 on the occasion of inserting a PGA type device 1 into a socket, the air in an air pump 11a provided at the lower side is compressed to flow into the air pump 11b through a communicating part 11c. Thereby, a lead pin contact substrate 8, which is patterned conforming to the arrangement of a lead pin 2 of the device 1, is lifted upward with a compressed air-pressure. Accordingly, contactness between the lead pin 2 and lead pin contact substrate 8 can be secured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket device, and more particularly to an IC socket device for PGA type package.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional PGA type IC socket device has a carrier 12 for accommodating a device, a carrier accommodating portion 13 for a socket, and a contact probe 14 as a lead pin contact portion. ing.

Device 1 for PGA type shown in FIG.
Is stored in the carrier 12 shown in FIG. 4, the position is determined, and the carrier 12 is set in the carrier storing portion 13 of the socket. Finally, the device 1 with the socket cover 5b
5, the lead pin 2 of the device 1 comes into contact with the contact probe 14, which is the contact portion of the socket, to make a contact, as shown in FIG.

[0004]

In this conventional socket device, since the device 1 is temporarily stored in the carrier 12 and then stored in the socket, the workability is poor, and the device erroneous insertion preventing pin 3 (see FIG. 7) is used. ) Is missing,
This type of package has a device side view of FIG. 6 and a device side view of FIG.
As shown in the device bottom view of FIG. 1, a large number of rows of lead pins 2 are planted at right angles to the bottom surface of the substrate, and because of the rotational symmetry with the center of the package bottom as the axis of rotation, when stored in the carrier 1, Even if the device 1 is rotated by 90 °, the device 1 can be inserted, which causes the device to be broken by the measurement in the erroneous insertion state. Further, there is a problem that the cost is increased by using the contact probe for the lead pin contact portion.

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC socket device which prevents device destruction in measurement in an erroneous insertion state and detects missing of the erroneous insertion prevention pin.

[0006]

SUMMARY OF THE INVENTION An IC socket device of the present invention is a socket housing, and is housed in the socket housing.
A lead pin contact board patterned according to the arrangement of the lead pins of the device, an incorrect insertion prevention pin contact portion that contacts the incorrect insertion prevention pin of the device, and one end connected to the incorrect insertion prevention pin contact portion. A retractable first air pump portion that penetrates and extends toward the bottom surface of the socket housing, and a telescopic second air pump that has one end connected to the back surface of the lead pin contact substrate and extends toward the bottom surface of the socket housing. And a communication portion that is provided on the bottom surface of the socket housing or in the vicinity thereof and that communicates the inside of the first air pump portion and the inside of the second air pump portion. When the device is pushed down, the first By contracting the air pump portion and extending the second air pump portion, the lead pin contact substrate is Raising the comprises a pump which finally the lead pin contact substrate is contacted with the lead pin of the device, and a socket cover.

[0007]

In the erroneous insertion state, the air pump does not operate even if the device is pushed down, so the lead pin contact substrate does not rise and the lead pin contact substrate does not contact the lead pin of the device, thus preventing device destruction.
Defects in erroneous insertion pins are detected in the same way.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a vertical sectional view of an IC socket device according to an embodiment of the present invention in a cover open state, and FIG. 2 is an IC shown in FIG.
It is a longitudinal cross-sectional view of the socket device in the cover closed state.

In the socket housing 15, a lead pin contact substrate 8 patterned according to the arrangement of the lead pins 2 of the device 1 is housed. Air pump 11
Is the air pump portion 11a, the air pump portion 11b, and the communication portion 1
It consists of 1c. The air pump portion 11a is expandable and contractable, one end of which is connected to the incorrect insertion prevention pin contact portion 4 that comes into contact with the incorrect insertion prevention pin 3 of the device 1, and extends through the lead pin contact substrate 8 toward the bottom surface of the socket housing 15. ing. The air pump portion 11b is also expandable and contractable, and one end thereof is connected to the back surface of the lead pin contact board 8 and extends toward the bottom surface of the socket housing 15. The communication portion 11c is provided on the bottom surface of the socket housing 15, and is connected to the air pump portion 11a.
To communicate with the inside of the air pump portion 11b. In the air pump 11, when the socket cover 5a is closed and the device 1 is pushed down, the air pump portion 11a contracts,
The lead pin contact substrate 8 is raised by the expansion of the air pump portion 11b, and finally the lead pin contact substrate 8 is brought into contact with the lead pins 2 of the device 1.

Next, the operation of this embodiment will be described.

First, the device 1 which is the package of FIG.
1 is inserted into the present IC socket device, as shown in FIG. 1, the portion of the bottom surface of the device substrate where the lead pins 2 are not implanted is placed on the device holder 6, and the incorrect insertion prevention pin 3 is inserted into the incorrect insertion prevention pin contact portion. It is set so that it contacts 4. Next, by closing the socket cover 5a, the spring 7 contracts and the device 1 is pushed down, and at the same time, the erroneous insertion prevention pin contact portion 4 also erroneously insertion prevention pin 3
Pushed down by. At this time, the air in the air pump portion 11a below the erroneous insertion prevention pin contact portion 4 is compressed, so that the air pump 11 passes through the communication portion 11c.
Air flows into the inside of b, the lead pin contact substrate 8 is pushed up accordingly, and the lead pin contact substrate 8 finally comes into contact with the lead pins 2 and measurement becomes possible.

[0012]

As described above, according to the present invention, since the lead pin of the device and the lead pin contact substrate cannot make contact unless the incorrect insertion prevention pin comes into contact with the incorrect insertion prevention pin contact portion, the measurement of the incorrect insertion state is performed. It is possible to prevent device destruction and detect defective assembly due to missing insertion error prevention pin. In addition, the contact probe is abolished for the contact between the lead pin and the socket of the device, and a single lead pin contact substrate patterned according to the arrangement of the lead pins is used, and the contact is made by moving the lead pin contact substrate up and down by air pressure. Since this method is adopted, it also has the effect of reducing the cost for the contact probe.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an IC socket device according to an embodiment of the present invention in a socket cover open state.

FIG. 2 is a cross-sectional view of the IC socket device shown in FIG. 1 in a socket cover closed state.

FIG. 3 is a plan view of a conventional IC socket without a socket cover.

FIG. 4 is a perspective view of the IC socket shown in FIG. 3 in a socket cover closed state.

5 is an enlarged view of a contact probe portion shown in FIG.

FIG. 6 is a side view of a PGA type device.

FIG. 7 is a bottom view of a PGA type device.

[Explanation of symbols]

 1 device 2 lead pin 3 erroneous insertion prevention pin 4 erroneous insertion prevention pin contact part 5a, 5b socket cover 6 device holder 7 spring 8 lead pin contact board 9 lead wire 10 socket pin 11 air pump 11a, 11b air pump part 11c communication part 12 carrier 13 carrier Storage 14 Contact probe

Claims (2)

[Claims] 1. A socket housing, a lead pin contact substrate housed in the socket housing and patterned according to the arrangement of lead pins of a device, an incorrect insertion prevention pin contact portion that contacts an incorrect insertion prevention pin of the device, and one end. Is connected to the erroneous insertion prevention pin contact portion, and extends and contracts a first air pump portion that extends through the lead pin contact board toward the bottom surface of the socket housing, and has one end connected to the back surface of the lead pin contact board. A telescopic second air pump portion extending toward the bottom surface of the socket housing, and a bottom surface of the socket housing or in the vicinity thereof, and an inside of the first air pump portion and a second air pump portion.
When the device is pushed down, the first air pump unit contracts and the second air pump unit extends to raise the lead pin contact substrate, and finally, the communication unit for communicating with the inside of the air pump unit of An IC socket device comprising: an air pump for bringing the lead pin contact substrate into contact with a lead pin of the device; and a socket cover. 2. The IC socket device according to claim 1, wherein the device is adapted to be pushed down when the socket cover is closed.