KR100253300B1 - Socket pin of socket for testing semiconductor package - Google Patents

Socket pin of socket for testing semiconductor package Download PDF

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Publication number
KR100253300B1
KR100253300B1 KR1019970031654A KR19970031654A KR100253300B1 KR 100253300 B1 KR100253300 B1 KR 100253300B1 KR 1019970031654 A KR1019970031654 A KR 1019970031654A KR 19970031654 A KR19970031654 A KR 19970031654A KR 100253300 B1 KR100253300 B1 KR 100253300B1
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KR
South Korea
Prior art keywords
socket
contact
package
pin
outlead
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KR1019970031654A
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Korean (ko)
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KR19990009288A (en
Inventor
홍진석
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김영환
현대반도체주식회사
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Priority to KR1019970031654A priority Critical patent/KR100253300B1/en
Publication of KR19990009288A publication Critical patent/KR19990009288A/en
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Publication of KR100253300B1 publication Critical patent/KR100253300B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: A socket pin for testing a semiconductor package is provided to improve the testing quality and semiconductor quality by contacting the side part and the lower part of the package's out-lead simultaneously. CONSTITUTION: A lower contact part(25) is linked to the top of a holding part(23) and is contacted with an out lead(24a) of a package(24) inwardly. A side contact part(26) which contacts with the lower side of the out lead(24a) of the package(24) is extended outwardly. During the testing of the package(24), the side part and the lower part of the package's out-lead are contacted simultaneously to improve the testing quality. The side contact part is designed to contact with the lower part of the out lead(24a) to improve the quality.

Description

반도체 패키지 검사용 소켓의 소켓핀Socket pin of socket for semiconductor package inspection

본 발명은 반도체 패키지 검사용 소켓의 소켓핀에 관한 것으로, 특히 검사시 패키지의 리드에 스크랫치를 발생하여 품질불량이 발생하는 것을 방지하도록 하는데 적합한 반도체 패키지 검사용 소켓의 소켓핀에 관한 것이다.The present invention relates to a socket pin of a socket for semiconductor package inspection, and more particularly, to a socket pin of a socket for semiconductor package inspection suitable for preventing scratches from occurring due to scratches on leads of the package during inspection.

일반적으로 패키지의 제조가 완료되면 최종검사를 실시하게 되는데, 이때 사용하는 것이 패키지를 장착하는 치구인 소켓이며, 그 소켓의 내측에는 패키지의 아웃리드와 접촉되어 전기적인 신호를 검사장치에 전달하기 위한 다수개의 소켓핀이 설치되어 있다. 이와 같이 소켓에 설치되어 있는 일반적인 소켓핀이 도 1에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In general, when the manufacture of the package is completed, the final inspection is carried out. At this time, the socket is a jig for mounting the package, and the inside of the socket is in contact with the outlead of the package to transmit an electrical signal to the inspection apparatus. Multiple socket pins are installed. A general socket pin installed in the socket as shown in FIG. 1 is briefly described as follows.

도 1은 일반적인 소켓핀의 구성을 개략적으로 보인 정면도로서, 도시된 바와 같이, 일반적인 소켓핀은 패키지(1) 아웃리드(1a)의 측면 상단부에 접촉되는 상단전촉핀(2)과, 그 패키지(1) 아웃리드(1a)의 측면 하단부에 접촉되는 하단접촉핀(3)과, 상기 상단접촉핀(2)과 하단접촉핀(3)을 고정하는 연결판(4)과, 그 연결판(4)의 하방으로 설치되는 삽입핀(5)으로 구성되어 있다.FIG. 1 is a front view schematically showing a configuration of a general socket pin. As shown in the drawing, a general socket pin includes a top electrode pin 2 contacting an upper end of a side surface of an outlead 1a of a package 1 and a package ( 1) a lower contact pin 3 in contact with the lower end of the side of the outlead 1a, a connecting plate 4 for fixing the upper contact pin 2 and the lower contact pin 3, and a connecting plate 4 thereof. It consists of an insertion pin (5) which is installed below.

상기와 같이 구성되어 있는 일반적인 소켓핀은 패키지(1)를 소켓에 장착시 상단접촉핀(2)의 내측면이 패키지(1)의 아웃리드(1a) 외측면에 접촉된 상태로 삽입되어 패키지(1)의 아웃리드(1a) 외측면에 스크랫치가 발생하는 문제점이 있었다.The general socket pin configured as described above is inserted into the package (1) when the inner surface of the upper contact pin (2) is in contact with the outer surface of the outer lid (1a) of the package (1) when the package 1 is mounted on the socket ( There was a problem that scratches occurred on the outer surface of the outlead 1a of 1).

상기와 같이 2-POINT 접촉시의 문제점을 해결하기 위하여 도 2에 도시된 바와 같은 1-POINT 접촉하는 소켓핀이 소개되고 있는바, 이를 간단히 설명하면 다음과 같다.In order to solve the problem of the 2-POINT contact as described above, a socket pin for 1-POINT contact as shown in FIG. 2 is introduced, which is briefly described as follows.

도 2는 종래 소켓핀의 구성을 개략적으로 보인 정면도로서, 도시된 바와 같이, 패키지(1)의 아웃리드(1a) 하단부 외측에 접촉되는 하단접촉핀(11)과, 그 하단접촉핀(11)의 하단부에 연결되는 연결판(12)과, 그 연결판(12)의 하방으로 연결되는 삽입핀(13)으로 구성되어 있다.2 is a front view schematically showing the configuration of a conventional socket pin, as shown, the lower contact pin 11 in contact with the outer side of the lower end of the outlead (1a) of the package 1, and the lower contact pin 11 It consists of a connecting plate 12 connected to the lower end of the, and the insertion pin 13 connected to the lower side of the connecting plate 12.

상기와 같이 구성되어 있는 종래 소켓핀은 도 1에 도시한 일반적인 소켓핀에서와 같은 스크랫치는 발생하지 않았으나, 하단접촉핀(11)에 의하여 아웃리드(1a)의 하단부 일부분에 접촉한 상태로 검사가 이루어지기 때문에 장기간 반복사용시 접촉불량이 발생하는 문제점이 있었다.Conventional socket pins configured as described above have not been scratched as in the general socket pin shown in FIG. 1, but are inspected in a state in which the lower contact pin 11 contacts the lower end portion of the outlead 1a. Because of this, there is a problem that a poor contact occurs during long-term repeated use.

상기와 같은 문제점을 감안하여 안출한 본 발명의 목적은 검사시 패키지의 아웃리드에 스크랫치를 발생시키지 않음과 동시에 장기간 반복사용하여도 양호한 접촉상태를 유지할 수 있도록 하는데 적합한 반도체 패키지 검사용 소켓의 소켓핀을 제공함에 있다.An object of the present invention devised in view of the above problems is that a socket for a semiconductor package inspection socket suitable for maintaining a good contact even after repeated use for a long time without scratching the outlead of the package during inspection. In providing a pin.

도 1은 일반적인 소켓핀의 구성을 개략적으로 보인 정면도.1 is a front view schematically showing the configuration of a general socket pin.

도 2는 종래 소켓핀의 구성을 개략적으로 보인 정면도.Figure 2 is a front view schematically showing the configuration of a conventional socket pin.

도 3은 본 발명 반도체 패키지 검사용 소켓의 소켓핀을 개략적으로 보인 정면도.Figure 3 is a front view schematically showing a socket pin of the socket for inspecting the semiconductor package of the present invention.

도 4는 본 발명 반도체 패키지 검사용 소켓의 소켓핀에 패키지가 접촉되는 상태를 개략적으로 보인 정면도.Figure 4 is a front view schematically showing a state that the package is in contact with the socket pin of the socket for semiconductor package inspection of the present invention.

도 5는 도 4의 A부를 상세히 보인 확대도.5 is an enlarged view showing part A of FIG. 4 in detail;

* * 도면의 주요 부분에 대한 부호의 설명 * ** * Explanation of symbols for the main parts of the drawing * *

21 : 연결부 22 : 삽입부21: connection portion 22: insertion portion

23 : 탄지부 24 : 패키지23: bullet box 24: package

24a: 아웃리드 25 : 하면접촉부24a: Out lead 25: Bottom contact portion

26 : 측면접촉부26: side contact

상기와 같은 본 발명의 목적을 달성하기 위하여 패키지의 아웃리드의 하단부 외측에 접촉되는 측면접촉부와, 상기 아웃리드의 하면에 접촉되는 하면접촉부와, 상기 측면접촉부와 하면접촉부의 하단부에 연결되는 탄지부와, 그 탄지부의 하단부에 연결되는 연결부와, 그 연결부의 하방으로 연결설치되는 삽입부를 구비하여서 구성된 것을 특징으로 하는 반도체 패키지 검사용 소켓의 소켓핀이 제공된다.In order to achieve the object of the present invention as described above, the side contact portion which is in contact with the outside of the lower end of the outlead of the package, the bottom contact portion in contact with the lower surface of the outlead, the tangent portion connected to the lower end of the side contact portion and the bottom contact portion And a socket part of the socket for semiconductor package inspection, comprising a connection part connected to a lower end of the tungsten part and an insertion part connected to and installed below the connection part.

이하, 상기와 같이 구성되는 본 발명 반도체 패키지 검사용 소켓의 소켓핀을 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the socket pin of the socket for a semiconductor package inspection of the present invention configured as described above in more detail as follows.

도 3은 본 발명 반도체 패키지 검사용 소켓의 소켓핀을 개략적으로 보인 정면도이고, 도 4는 본 발명 반도체 패키지 검사용 소켓의 소켓핀에 패키지가 접촉되는 상태를 개략적으로 보인 정면도이며, 도 5는 도 4의 A부를 상세히 보인 확대도이다.Figure 3 is a front view schematically showing a socket pin of the socket for semiconductor package inspection of the present invention, Figure 4 is a front view schematically showing a state that the package is in contact with the socket pin of the socket for semiconductor package inspection of the present invention, Figure 5 An enlarged view showing part A of 4 in detail.

도시된 바와 같이, 본 발명 반도체 패키지 검사용 소켓의 소켓핀은 연결판(21)의 하방으로는 삽입부(22)가 연결형성되고, 상기 연결부(21)의 상방으로는 탄지부(23)가 연결형성되며, 그 탄지부(23)의 상단부에는 내측방향으로 분기되어 패키지(24)의 아웃리드(24a) 하면에 접촉되는 하면접촉부(25)와 외측상방으로 분기되어 상기 아웃리드(24a)의 하단부 측면에 접촉되는 측면접촉부(26)가 연결설치된다.As shown, the socket pin of the socket for a semiconductor package test according to the present invention has an insertion portion 22 connected to the lower side of the connecting plate 21, and a finger portion 23 is formed above the connecting portion 21. The upper end of the stop 23 is branched inwardly and branches outwardly from the bottom contact portion 25 contacting the bottom surface of the outlead 24a of the package 24 to the outside of the outer lid 24a. Side contact portion 26 is in contact with the lower end side is installed.

상기 하면접촉부(25)는 ⌒형상으로 절곡하여 상면에 아웃리드(24a)의 하면이 얹일수 있도록 되어 있고, 측면접촉부(26)은 〉형상으로 절곡되어 있어서 아웃리드(24a)의 하단부 측면을 탄력적으로 접촉할 수 있도록 되어 있다.The lower surface contact portion 25 is bent in a U-shape so that the lower surface of the outlead 24a can be placed on the upper surface, and the side contact portion 26 is bent into a " shape, so that the lower end side surface of the outer lead 24a is elastic. It is possible to contact with.

상기와 같이 구성되어 있는 본 발명 반도체 패키지 검사용 소켓의 소켓핀은 검사시 도 4와 같이 패키지(24)의 아웃리드(24a)와 접촉되는데, 이때 하면접촉부(25)의 상면에는 아웃리드(24a)의 하면이 얹혀져서 접촉되고, 측면접촉부(26)에는 아웃리드(24a)의 하단부 측면이 접촉되며 패키지의 전기적인 특성검사가 이루어진다.The socket pin of the socket for a semiconductor package inspection according to the present invention configured as described above is in contact with the outlead 24a of the package 24 as shown in FIG. 4, wherein the outlead 24a is disposed on the upper surface of the bottom contact portion 25. ) Is placed on the bottom of the contact, the side contact portion 26 is in contact with the lower end side of the outlead (24a) and the electrical characteristics of the package is made.

이상에서 상세히 설명한 바와 같이 본 발명 반도체 패키지 검사용 소켓의 소켓핀은 탄지부의 상면에 연결되어 내측방향으로 패키지의 아웃리드 하면에 접촉되는 하면접촉부를 연장형성하고, 외측방향으로 패키지의 아웃리드의 하단부 측면에 접촉되는 측면접촉부를 연장형성하여, 검사시 패키지의 아웃리드의 하단부 측면과 하면에 동시에 접촉되므로 접촉불량에 의한 검사불량을 방지하는 효과가 있고, 아웃리드의 측면에 접촉되는 측면접촉부가 아웃리드의 하단부 측면에 접촉되도록 설계함으로서, 종래와 같이 상단부에 접촉시 발생하던 스크랫치의 발생을 방지하여 품질을 향상시키는 효과가 있다.As described in detail above, the socket pin of the socket for semiconductor package inspection according to the present invention is connected to the upper surface of the finger portion and extends a lower surface contact portion which is in contact with the lower surface of the outlead of the package inwardly, By extending the side contact portion which is in contact with the lower side of the side, at the same time the bottom end side and the bottom surface of the outlead of the package at the time of inspection, it is effective to prevent inspection failure due to poor contact, the side contact portion in contact with the side of the outlead By designing to be in contact with the lower end side of the outlead, there is an effect to improve the quality by preventing the occurrence of scratches that occurred when contacting the upper end as in the prior art.

Claims (1)

패키지의 아웃리드의 하단부 외측에 접촉되는 측면접촉부와, 상기 아웃리드의 하면에 접촉되는 하면접촉부와, 상기 측면접촉부와 하면접촉부의 하단부에 연결되는 탄지부와, 그 탄지부의 하단부에 연결되는 연결부와, 그 연결부의 하방으로 연결설치되는 삽입부를 구비하여서 구성된 것을 특징으로 하는 반도체 패키지 검사용 소켓의 소켓핀.A side contact portion in contact with the outer side of the lower end of the outlead of the package, a bottom contact portion in contact with the bottom surface of the outlead, a tangent portion connected to the lower end portion of the side contact portion and the bottom contact portion, and a connection portion connected to the lower end portion of the tangent portion And an insertion part connected to be installed below the connection part.
KR1019970031654A 1997-07-09 1997-07-09 Socket pin of socket for testing semiconductor package KR100253300B1 (en)

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Application Number Priority Date Filing Date Title
KR1019970031654A KR100253300B1 (en) 1997-07-09 1997-07-09 Socket pin of socket for testing semiconductor package

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KR1019970031654A KR100253300B1 (en) 1997-07-09 1997-07-09 Socket pin of socket for testing semiconductor package

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KR19990009288A KR19990009288A (en) 1999-02-05
KR100253300B1 true KR100253300B1 (en) 2000-06-01

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KR20030078200A (en) * 2002-03-28 2003-10-08 인터스타 테크놀러지(주) A contactor for semiconductor device test socket and thereof manufacturing method

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