JPS61252642A - Chip supporting table for testing semiconductor ic chip - Google Patents

Chip supporting table for testing semiconductor ic chip

Info

Publication number
JPS61252642A
JPS61252642A JP9514885A JP9514885A JPS61252642A JP S61252642 A JPS61252642 A JP S61252642A JP 9514885 A JP9514885 A JP 9514885A JP 9514885 A JP9514885 A JP 9514885A JP S61252642 A JPS61252642 A JP S61252642A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
part
ic
containing
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9514885A
Inventor
Tetsuo Tada
Tsuyoshi Yamada
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Abstract

PURPOSE:To shorten the testing time, by providing sucking holes for sucking semiconductor IC chips under test at a bottom part, which is approximately equal to the outer configuration of the semiconductor IC under test, and providing a plurality of containing parts having the tapered part at the peripheral part of each containing part. CONSTITUTION:Many containing parts 11 are formed on a supporting table 10 in a matrix shape. Divided IC chips 3a are conveyed to the parts close to the containing parts 11 with a machine, which automatically scans the supporting table 10 or the chip feeding side, or by manual operation. The semiconductor IC chip 3a is going to be accommodated in the bottom part of the containing part 11 through a peripheral tapered part 14 of the containing part 11. Since the chip is sucked with vacuum through a sucking hole 13 at this time, the chip is firmly held on the bottom part. The shape of the bottom surface of the containing part 11 is made equal to the shape of the IC chip 3a. Therefore, the IC is positioned accurately. When the containing parts 11 are arranged in the matrix shape, the semiconductor IC chips 3a can be tested.
JP9514885A 1985-05-01 1985-05-01 Chip supporting table for testing semiconductor ic chip Pending JPS61252642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9514885A JPS61252642A (en) 1985-05-01 1985-05-01 Chip supporting table for testing semiconductor ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9514885A JPS61252642A (en) 1985-05-01 1985-05-01 Chip supporting table for testing semiconductor ic chip

Publications (1)

Publication Number Publication Date
JPS61252642A true true JPS61252642A (en) 1986-11-10

Family

ID=14129712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9514885A Pending JPS61252642A (en) 1985-05-01 1985-05-01 Chip supporting table for testing semiconductor ic chip

Country Status (1)

Country Link
JP (1) JPS61252642A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01213181A (en) * 1988-02-17 1989-08-25 Tokyo Electron Ltd Tray to contain semiconductor element
JPH0266474A (en) * 1988-09-01 1990-03-06 Tokyo Electron Ltd Method for inspecting semiconductor element
JPH02213777A (en) * 1989-02-15 1990-08-24 Tokyo Electron Ltd Semiconductor chip prober
JPH0329335A (en) * 1989-06-26 1991-02-07 Tokyo Electron Ltd Semiconductor chip prober
US5303938A (en) * 1993-03-25 1994-04-19 Miller Donald C Kelvin chuck apparatus and method of manufacture
JP2009128204A (en) * 2007-11-26 2009-06-11 Tokyo Electron Ltd Holding member for inspection and manufacturing method of it
JP2010243314A (en) * 2009-04-06 2010-10-28 Syswave Corp Semiconductor chip element test tool and automatic test equipment
JP2016095272A (en) * 2014-11-17 2016-05-26 三菱電機株式会社 Semiconductor evaluation device, semiconductor evaluation method and test jig

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01213181A (en) * 1988-02-17 1989-08-25 Tokyo Electron Ltd Tray to contain semiconductor element
JPH0266474A (en) * 1988-09-01 1990-03-06 Tokyo Electron Ltd Method for inspecting semiconductor element
JPH02213777A (en) * 1989-02-15 1990-08-24 Tokyo Electron Ltd Semiconductor chip prober
JPH0329335A (en) * 1989-06-26 1991-02-07 Tokyo Electron Ltd Semiconductor chip prober
US5303938A (en) * 1993-03-25 1994-04-19 Miller Donald C Kelvin chuck apparatus and method of manufacture
JP2009128204A (en) * 2007-11-26 2009-06-11 Tokyo Electron Ltd Holding member for inspection and manufacturing method of it
US8468690B2 (en) 2007-11-26 2013-06-25 Tokyo Electron Limited Holding member for use in test and method for manufacturing same
JP2010243314A (en) * 2009-04-06 2010-10-28 Syswave Corp Semiconductor chip element test tool and automatic test equipment
JP2016095272A (en) * 2014-11-17 2016-05-26 三菱電機株式会社 Semiconductor evaluation device, semiconductor evaluation method and test jig

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