JP6077105B2 - IC tag-attached electronic component assembly, error detection system thereof, and error detection method - Google Patents

Description

  The present invention relates to an IC tag mounting electronic component assembly, an error detection system thereof, and an error detection method.

  As an electronic component assembly, the electronic component is housed in a metal container, covered and fixed with an insulator such as resin, and a plurality of conductive pins that serve as power supply terminals and various signal terminals of the electronic component are placed outside the insulator There is a structure that protrudes into the space. Each of the plurality of conductive pins is properly connected to a power source or a signal source by a connector, so that the electronic component exhibits its original function.

  2. Description of the Related Art Conventionally, a technique for directly manufacturing or printing manufacturing information or specifications on the surface of an electronic component, or printing with a barcode or the like is known. Thereby, it is possible to determine how to connect the plurality of conductive pins. An electronic component that has been misaligned into a container is a defective product. However, it is difficult to externally observe or detect the state of an electronic component housed in a metal container or the like and sealed with a resin or the like. It is possible to be connected to.

  In Patent Document 1, an IC tag is arranged side by side with an electronic component such as an LSI covered with an insulator and the whole is covered with an insulator so that information on the electronic component can be accurately grasped even in a packaged state. What has been disclosed is disclosed.

  Patent Document 2 discloses an electronic component in which a semiconductor LSI chip and an IC tag are integrated in the same insulation coating package inside the LSI package.

  Further, Patent Document 3 discloses an RFID tag reader / writer device that includes a micro loop and communicates with a small metal RFID tag.

JP 2007-226574 A JP 2000-306064 A JP 2008-90813 A

  A small electronic component such as an LSI having a plurality of conductive pins is required to be assembled accurately in order to ensure its operation. In the conventional technology in which manufacturing information and specifications are directly stamped or printed on the surface of the part, or printed with a barcode, human error may occur if the backlash detection of the conductive pin is performed at the assembly stage, such as visual check of the X-ray image. There is sex.

  Furthermore, a small electronic component is protected by a metal container depending on the application. Regarding an electronic component assembly protected by a metal container, an IC tag could not be disposed therein. This is because the electromagnetic wave for the operation of the IC tag is blocked by the shielding effect by the metal container, and the communication of the IC tag becomes impossible. For this reason, it has been proposed to attach a metal-compatible IC tag to the outside of a metal container. However, in this case, there is a problem that the size of the electronic component becomes large.

  On the other hand, an IC tag is required to have a function of blocking a noise electromagnetic wave and a mechanical strength against impact (impact resistance, heat shock resistance, etc.) depending on its application. In an electronic component assembly in which an IC tag that is not protected by a metal container is integrally molded with a general resin, the IC tag may be crushed or broken.

  For example, since the electronic component of Patent Document 1 is not supposed to be housed in a metal container, there arises a problem that the inside of the electronic component cannot be protected from an impact.

  The electronic component of Patent Document 2 also has a problem in mechanical strength against impact since the component is covered with an insulator.

  Further, Patent Documents 1 to 3 do not disclose a solution relating to detection of back pinning of a signal pin of an electronic component.

  It is an object of the present invention to provide an electronic component assembly, an error detection system thereof, and an error detection method capable of efficiently detecting a back pin of a signal pin of an electronic component.

  The representative ones of the present invention are as follows. The electronic component assembly includes a metal container and an electronic component fixed in the metal container, and a plurality of conductive pins are connected to the electronic component, and the plurality of conductive pins and the electronic component are connected to the electronic component. An insulating layer is interposed between the components, and the other ends of the plurality of conductive pins extend to a connector connection space in the metal container, and are in the insulating layer and in the vicinity of the plurality of conductive pins In addition, at least one IC tag is disposed, and the at least one IC tag is installed in association with the specific conductive pin, and corresponds to the position of the at least one IC tag in the metal container. A positioning portion for detecting error is provided.

  According to the present invention, by embedding an IC tag at a predetermined position of an electronic component assembly, it is possible to efficiently detect the back pin of the signal pin of the electronic component from the outside.

It is a perspective view of the 1st container holding electronic parts concerning one example of the present invention. It is a circuit diagram of the electronic component of FIG. 1A. 1 is a perspective view of an electronic component assembly according to an embodiment of the present invention. It is a longitudinal cross-sectional view of the electronic component assembly of FIG. It is a figure explaining the relationship between each conductive pin of the electronic component of FIG. 1, and an IC tag. It is a front view of the IC tag embedded in the electronic component assembly. It is a sectional side view of the IC tag of FIG. 5A. It is explanatory drawing of the reader / writer apparatus for IC tag communication in a present Example. It is a front view of the detection part of the reader / writer apparatus for IC tag communication. It is a longitudinal cross-sectional view explaining the structure which sets the reader / writer apparatus for IC tag communication in the predetermined position of an electronic component assembly, and detects the insertion state of a several conductive pin by non-contact. It is an enlarged view of the A section of FIG. It is a figure explaining the effect | action of the detection part of the reader / writer apparatus for IC tag communication. It is a figure which shows the magnetic flux in the state in which insertion of the some conductive pin of an electronic component is normal. It is a perspective view which shows the magnetic flux of the state of FIG. 11A. It is a perspective view of an electronic component assembly in a state where insertion of a plurality of conductive pins of the electronic component is reversed. It is a figure which shows the magnetic flux in the state where the insertion of the conductive pin of FIG. 12A is reverse.

  According to the embodiment of the present invention, a plurality of electric signal lines (conductive pins) are led out from an internal circuit of a metal container of an electronic component assembly to the outside through an insulating layer, and in the vicinity of at least one conductive pin An IC tag for reverse difference detection is installed inside the insulating layer, and a connector connection space in a metal container is used as a window for detecting the IC tag. In this case, an IC tag is incorporated in the metal container in the immediate vicinity of the conductive pin to be detected, and the electromagnetic wave of the reader / writer is sent directly from the outside of the insulating layer to the immediate vicinity of the conductive pin to be detected. IC tag communication is performed by calling an IC tag installed opposite to the other side. It is assumed that the primary current flows through the micro loop antenna of the IC tag reader / writer, and the coil antenna of the IC tag is opposed to the opposite side through the insulating layer. With this arrangement, a secondary current is induced in the coil antenna of the IC tag. By this principle, IC tag communication is possible, and whether the insertion of the conductive pin is normal or reverse can be detected based on whether or not a secondary current is induced in the coil antenna of the IC tag.

  Since the insulating layer of the first container and the signal line is used as a field for electromagnetic coupling between the primary current and the secondary current, the thinner the insulating layer covering the IC tag, the better the coupling efficiency.

  As an apparatus that can use the electronic component assembly of the present invention, for example, various amplifier circuits, sensors, comparators, arithmetic circuits, converters, oscillation circuits, power supply circuits, or control of various electronic devices combining these circuits. And a composite electronic circuit for driving. Thereby, the reliability of the various electronic devices finally assembled is also improved.

  Next, a first embodiment of the electronic component assembly of the present invention will be described. FIG. 1A is a perspective view of a first container holding an electronic component according to an embodiment of the present invention. FIG. 1B is an example of a circuit diagram of the electronic component of FIG. 1A. An electronic component 102 as an internal circuit is held inside the first container 100, and a plurality of electric signal lines (from the electronic component to the outside through the hole 104 of the tag attachment auxiliary sheet 103 of the first container 100 ( Conductive pins (P1, P2, Pn) are drawn out. The electronic component assembly of the present invention is, for example, an LSI package having at least two conductive pins. The first container 100 may be made of either a metal material or a non-metal material. IC tags 105 (105-1, 105-2, 105-n) are respectively fixed on the surface of the tag attachment auxiliary sheet 103 and in the vicinity of the conductive pins P1, P2, Pn.

  The electronic component 102 shown in FIG. 1B is a push-pull amplifier circuit in which the emitter sides of the PNP transistor and the NPN transistor are connected in common, and the conductive pin P1 and the conductive pin P5, which are terminals of this push-pull amplifier circuit, are used as a power source. An output voltage amplified in response to input signals from the conductive pins P2 and P4 is output to a load resistor (not shown) connected to the conductive pin P3.

  Such an electronic component 102 is housed in the first container 100 as a semiconductor LSI chip, sealed with an insulating resin or the like, and each conductive pin drawn to the outside has a predetermined electric circuit. Connected to the connector to configure.

  2 is a perspective view of an electronic component assembly according to an embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of the electronic component assembly of FIG.

  In the second container 200 made of metal, the first container 100 that houses the electronic component 102 is housed and sealed with an insulating resin 300. A pair of holes 203 are provided in the flange 202 around the opening 204 at the top of the second container 200 made of metal. The pair of holes 203 are provided at positions along an axis passing through the centers of the plurality of conductive pins. This hole 203 serves as a positioning portion for an IC tag communication reader / writer described later. Since this positioning unit is used to specify the position of each conductive pin, for example, the diameter of the pair of holes 203 is different on the left and right, and at the time of detection, the reader / writer for IC tag communication is used. The electronic component assembly is always fixed in a predetermined positional relationship. The alignment portion is not limited to a hole, and any positioning device can be used as long as it can fix the relative positional relationship between a plurality of conductive pins and an IC tag communication reader / writer, such as an uneven structure for positioning. Such a structure may be used.

  In the present invention, an integrated body of the second container 200 made of metal and the first container 100 containing the electronic component 102 is defined as an electronic component assembly.

  In the electronic component assembly, the periphery of the plurality of conductive pins is a connector insertion space surrounded by a cylindrical protective ring 201.

  The electronic component assembly is integrated by inserting the first container 100 into the second container 200 made of metal together with the root portion of the conductive pin and sealing with an insulating layer 300 such as an insulating resin. Therefore, after the first container 100 is sealed in the second container 200, only the plurality of conductive pins extend outward, and the electronic component 102 and the IC tag 105 cannot be seen. Even if the electronic component 102 is inserted into the second container 200 in a state where the conductive pins of the electronic component 102 are reversed right and left (reverse insertion) and the electronic component assembly sealed with resin is manufactured, the appearance is not known. . FIG. 3 represents a state in which the conductive pins P1, P2, and Pn of the electronic component assembly are properly inserted for convenience of explanation.

  The relationship between each conductive pin of the electronic component and the IC tag will be described with reference to FIG. First, the IC tag 105 (105-1, 105-2, 105-n) is sealed with a resin or the like in a recess or the like at a position corresponding to the hole 104 through which each conductive pin passes. Stopped and fixed. Each IC tag 105 is arranged so as to be a non-target position with respect to each conductive pin. For example, assuming that the conductive pins (holes 104) are arranged at equal intervals along a straight line passing through the center of the surface of the auxiliary sheet 103, the IC tag 105-1 corresponding to the conductive pin P1 is connected to the conductive pin P1. The IC tag 105-2 corresponding to the conductive pin P2 is positioned behind the conductive pin P2, and the IC tag 105-3 corresponding to the conductive pin P3 is shifted in front of the conductive pin P3 while alternately shifting the position. Deploy. Thereby, the distance between IC tags corresponding to adjacent conductive pins can be ensured, and interference can be avoided.

  Note that the number of IC tags 105 may be one for one electronic component 102 as long as error detection is intended. In the example of the electronic unit in FIG. 1A, one IC tag 105-1 may be fixed only in the vicinity of a specific conductive pin among the plurality of conductive pins, for example, the conductive pin P1. However, the reverse insertion cannot be detected by the conductive pin at the center of the surface of the auxiliary sheet 103, in other words, at the center of the connector insertion space. Therefore, the specific one conductive pin and the corresponding IC tag must be present at a position shifted radially outward from the center of the surface of the auxiliary sheet 103, in other words, the center of the connector insertion space. . In the case of reverse insertion, one IC tag at a position shifted from the center of the connector insertion space becomes “no response” to the IC tag communication reader / writer, and reverse insertion can be detected. Also, assuming that one IC tag is installed, the IC tag communication reader / writer can detect whether the IC tag is not installed or the IC tag is faulty.

  By fixing such a tag attaching auxiliary sheet 103 to the first container 100, each conductive pin and each IC tag 105 have a predetermined positional relationship. The IC tag 105 has a flat plate shape, and the IC tag is disposed at a right angle with or close to the conductive pin. That is, the IC tag 105 is installed so as to be at a right angle or close to each conductive pin coming out from the electronic component 102 toward the outside.

  Next, an IC tag embedded in the electronic component assembly will be described. FIG. 5A is a front view of the IC tag, and FIG. 5B is a side sectional view of the IC tag. The IC tag 105 has an IC tag main body 1051 provided on the front surface side of a flat substrate and an IC tag insulating substrate 1054 formed on the back surface of the substrate. The IC tag main body 1051 includes an IC chip 1052, a planar coil antenna 1053 wound around the IC chip 1052 in a spiral manner, and a protective material. The coil antenna has an inner end connected to the IC chip 1052 and an outer end connected to the IC chip 1052 via an insulating layer on the back surface.

  UHF and microwave band IC tags can be broadly classified as follows: (1) an IC tag having a half-wavelength resonant dipole-based antenna with remarkable wavelength dependence, and (2) a wavelength. There is an ultra-small size IC tag with a side of 10 mm or less that incorporates a resonance circuit using a coil or a capacitor having no dependency.

  In the present invention, an ultra-small IC tag is used in order to incorporate an IC tag near the electronic component 102 to be attached. As a device suitable for such downsizing applications, for example, a UHF band ultra-small tag (Hitachi Chemical Co., Ltd. IM5) having an outer dimension of 2.5 mm × 2.5 mm and a thickness of 0.4 mm. -PK2525 type tag). As an example, this tag can provide a flight distance of about several millimeters with a predetermined detection radio wave output from an IC tag communication reader / writer.

Next, a description will be given of means for detecting whether or not an electronic component assembly sealed with resin is manufactured by inserting the conductive pins of the electronic component 102 into the second container 200 in a normal state.
FIG. 6 is an explanatory diagram of the IC tag communication reader / writer device 500 in this embodiment. FIG. 7 is a front view of the detection unit 530 of the IC tag communication reader / writer device.

  The IC tag communication reader / writer device 500 includes a main body 510 having a high-frequency antenna circuit (not shown), and a detection coil (micro loop) 533 connected to the main body by a pair of signal transmission units (cables) 520. A section 530 and a database 540. The main body 510 is connected to the backup database 560 via the network 550.

  The main body 510 is provided with a control circuit unit 511, a display screen 512, and a port switching unit 513. The detection unit 530 includes a base plate 531, an engagement unit (concave or convex) 532, a plurality of detection coils 533 extending in an arc shape in a direction perpendicular to the axis of the cable 520, a positioning hole 535, and a detection hole A space 536 and a hole 537 corresponding to the conductive pin 534 are provided. By mechanically engaging the engaging portion 532 of the IC tag communication reader / writer device 500 with the alignment fitting portion of the electronic component assembly, the detection coil 533 of the detecting portion 530 is in the cylindrical shape of the electronic component assembly. Are fixed to a predetermined position in the connector insertion space, that is, a position where a specific IC tag corresponding to a specific conductive pin Pn of the electronic component assembly can be detected and a predetermined depth. Even when there are a plurality of conductive pins, when one IC tag is incorporated, it is sufficient to configure one detection coil 533.

  FIG. 8 is a longitudinal cross-sectional view illustrating a configuration in which the detection unit 530 of the IC tag communication reader / writer device is set at a predetermined position of the electronic component assembly and the inserted state of the plurality of detection coils 533 is detected in a non-contact manner. FIG. FIG. 9 is an enlarged view of a portion A in FIG.

  The engagement portion 532 of the IC tag communication reader / writer device 500 is engaged with the flange of the electronic component assembly, and the detection portion 533 is mechanically set at a predetermined rotational position and a predetermined depth in the connector insertion space. . That is, in order to detect reverse insertion, the detection coil 533 is inserted into the connector insertion space and is brought close to the IC tag. In this state, the micro loop of the detection unit 530 of the IC tag communication reader / writer device 500, that is, the detection coil 533 and the coil of the IC tag are electromagnetically coupled to each other, so that the microminiature incorporated in the root of the specific conductive pin 534 The presence or absence of the IC tag is detected without contact.

  The engagement portion 532 is a mark for distinguishing, for example, that the first conductive pin P1 is disposed in the immediate vicinity of the engagement portion 532 and the nth conductive pin Pn is disposed on the far side as “correct”, and the reverse insertion as “false”. There is a role. Further, for example, the IC tag communication reader / writer device 500 is mechanically predetermined in a state where the detection coil 533 is inserted into the cylinder in order to detect the ultra-small IC tag 100 incorporated in the root of the first conductive pin P1. It has the role of determining the rotational position and the predetermined depth.

  As shown in FIG. 9, the coil surface of the detection coil (micro loop) 533 of the detection unit 530 and the coil surface of the IC tag 105 facing each other through the insulating layer 300 are parallel to each other and are electromagnetically coupled by the magnetic flux Φ. Φ indicates a magnetic field line of electromagnetic induction. This IC tag communication reader / writer device 500 has a one-to-one correspondence with the alignment fitting portion of the electronic component assembly. A series of detection devices is made from the high-frequency antenna circuit of the IC tag communication reader / writer device 500 to the signal transmission unit 520. Only when the depth of the engaging portion is predetermined and the IC tag communication reader / writer device 500 is fitted here, the minute loop becomes parallel to the surface of the coil of the IC tag 100, and the minute loop The IC tag is fixed within a predetermined distance, and in this state, the micro loop and the IC tag are electromagnetically coupled by the magnetic flux Φ.

  FIG. 10 is a diagram for explaining the operation of the detection unit 530 of the IC tag communication reader / writer device. The coil surface of the IC tag 105 near the conductive pin Pn and the coil surface of the detection coil 533 are parallel and are electromagnetically coupled by the magnetic fluxes Φ1 to Φ3.

  FIG. 11A is a diagram illustrating the magnetic flux in a state where the insertion of the plurality of conductive pins of the electronic component is normal, and FIG. 11B is a perspective view illustrating the magnetic flux in the state of FIG. 11A. Reference numeral 600 denotes a cross section of the range of the magnetic force lines coming out from the detection coil (micro loop) 533 of the detection unit 530, and magnetic force lines are generated across the conductive pins 534 and the IC tag 105 in the vicinity thereof. However, the range 600 of each magnetic force line does not reach the adjacent conductive pin Pn or the IC tag 105 in the vicinity thereof, so that no communication interference occurs.

  FIG. 11A shows the IC tag 105-1 in the magnetic field range 600-1 on the side close to the first conductive pin P1, and the IC tag 105-n in the magnetic line range 600-n on the side close to the nth conductive pin Pn. It is buried and the insertion of the first conductive pin P1, the nth conductive pin Pn, etc. of the electronic component assembly is in a normal state. The minute loop and the IC tag are fixed within a predetermined distance, and the detection coil 533 and the IC tag are electromagnetically coupled by the magnetic flux Φ in the magnetic force range 600 to detect that they are in a normal state.

  That is, in the case of regular insertion, the minute loop 533 is electromagnetically coupled to the loop surface of the IC tag 105, so that communication with the reader / writer device 500 becomes possible. The IC tag and the micro loop 533 have a relationship between the primary coil and the secondary coil of the transformer. When the high-frequency current of the minute loop 533 is a primary current, the magnetic field lines induced by the primary current generate a secondary current in the coil antenna 1053 of the IC tag (not shown). The IC tag 105 operated with the secondary current returns a signal such as an ID from the micro loop 533 to the reader / writer device 500 following the cable 520 in the reverse direction. When viewed from the IC tag communication reader / writer device 500, the sensitivity becomes higher as the micro loop 533, that is, the detection coil and the tag 105 are closer to each other. Therefore, when the alignment fitting portion 532 of the micro loop 533 coincides with the positioning structure of the electronic component assembly, the IC tag 105 is detected immediately below the micro loop 533 as the detection coil, and the result is the IC tag communication. Is displayed on the display unit 512 of the reader / writer device 500.

  By detecting the presence / absence of such magnetic field lines by the detection unit 530 of the IC tag communication reader / writer device 500, the IC tag 105 corresponding to each conductive pin Pn is detected, whereby each conductive pin of the electronic component assembly is detected. It is possible to easily determine whether or not Pn is integrated in a normal state.

  If the first conductive pin P1, the second conductive pin P2, etc. are accidentally inserted into the electronic component assembly, the IC tag is displaced from a predetermined position. FIG. 12A is a perspective view of the electronic component assembly in which the insertion of the plurality of conductive pins of the electronic component is reversed. FIG. 12B is a diagram illustrating a cross section (600) of the magnetic flux in the state where the insertion of the conductive pin is reversed in FIG. 12A.

  In FIG. 12A, contrary to FIG. 3, the nth conductive pin Pn is embedded on the left side of the metal second container 200, and the first conductive pin P1 is embedded on the right side of the metal second container 200, This is a case where the insertion of the first conductive pin P1 and the second conductive pin P2 is reversed. At this time, the IC tag 105-n corresponding to the nth conductive pin Pn is outside the range 600-1 that can be detected by the magnetic flux Φ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-n cannot be detected. Similarly, the IC tag 105-1 corresponding to the first conductive pin Pn is outside the range 600-n that can be detected by the magnetic flux Φ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-1 cannot be detected. As a result, since nothing is displayed on the display unit 512 of the IC tag communication reader / writer device 500, the state of FIG. 12A is determined to be an error.

  As described above, when the plurality of conductive pins of the electronic component assembly, at least one IC tag, and the tag are integrated, and the error is reversed in the electronic component assembly, the position of the IC tag 105 is engaged. It shifts to the opposite side with respect to the part 532. The state of FIG. 12B is adjusted so that the deviation width is an electromagnetic distance that cannot be detected by the detection coil 533.

  According to the present embodiment, by embedding the IC tag in a predetermined position of the electronic component assembly, it is possible to efficiently perform the reverse of the conductive pin of the electronic component without affecting the characteristics of the electric component of the electronic component assembly. Sting detection can be performed.

  If the determination method of the present embodiment is employed, a plurality of conductive pins included in the electronic component assembly can be easily determined at low cost by a conventional method. For this reason, even in the assembly of electronic components, it is possible to assemble the electronic components so that they are properly connected to the connection terminals of the electronic components corresponding to the respective conductive pins without confusing a plurality of conductive pins. Be improved.

  The IC tag communication reader / writer device 500 does not have to have an integral structure as described in the first embodiment as a whole. For example, each part of the reader / writer device such as the port switching unit 513 or the like. May be configured separately, and these may be connected to each other wirelessly with a cable or electromagnetically.

  The alignment part in Example 1 is not limited to what is ensured with a mechanical structure.

  In the second embodiment, an optical detection mechanism is employed. For example, a detection mark is provided on the surface of the flange 202 of FIG. 2 as a positioning portion for the reader / writer for IC tag communication. Then, the reader / writer device or the electronic component assembly is placed on a table or a robot arm that can be moved in XY coordinates, and the mark of the positioning portion is detected by a camera provided in the reader / writer for IC tag communication. After processing, the relative positional relationship between the two is confirmed, the reader / writer device and the electronic component assembly are accurately positioned, and then reverse insertion is detected in the same manner as in the first embodiment.

  According to the present embodiment, by embedding the IC tag in a predetermined position of the electronic component assembly, the electronic component assembly is not contacted from outside without affecting the characteristics of the electronic component assembly, and the electronic component assembly can be efficiently performed. It is possible to detect the back pin of the conductive pin.

DESCRIPTION OF SYMBOLS 100 ... 1st container, 102 ... Electronic component, 103 ... Tag attachment auxiliary sheet, 104 ... Hole, 105 (105-1, 105-2, 105-n) ... IC tag, 1052 ... IC chip, 1053 ... Coil antenna 200 ... Metal second container, 202 ... Flange, 203 ... Pair of holes, 204 ... Opening, 300 ... Resin, 500 ... Reader / writer device for IC tag communication, 530 ... Detector.

Claims (13)

A metal container ;
An electronic component fixed in the metal container,
A plurality of conductive pins are connected to the electronic component,
An insulating layer is interposed between the plurality of conductive pins and the electronic component,
The other ends of the plurality of conductive pins extend to a connector insertion space in the metal container,
At least one IC tag is disposed in the insulating layer and in the vicinity of the plurality of conductive pins;
The at least one IC tag is installed in association with the conductive pin in the vicinity of the conductive pin at a position shifted from the center of the connector insertion space ,
An electronic component assembly, wherein the metal container is provided with an error detection positioning portion corresponding to the position of the at least one IC tag. In claim 1,
The IC tag has an IC chip and a coil antenna wound around the IC chip,
The electronic tag assembly according to claim 1, wherein the surface of the coil antenna is disposed at a right angle or an angle close to the corresponding conductive pin. In claim 1,
The electronic component IC tag is an IC tag with a built-in resonance circuit formed in a plane using a coil or a capacitor,
An electronic component assembly, wherein the IC tag is arranged such that an antenna surface formed by the coil is perpendicular to or close to the conductive pin. In claim 1,
The electronic component assembly is inserted into the metal container together with the electronic component and the base portion of the conductive pin therein, and is sealed with resin. In claim 1,
The positioning part is
An electronic component assembly, which is an alignment fitting portion for aligning the electronic component assembly and an IC tag communication reader / writer device. In claim 1,
The electronic component assembly according to claim 1, wherein the positioning portion is a mark for detection by an optical detection mechanism provided on a flange portion of the metal container. An electronic component assembly error detection system using an IC tag communication reader / writer device,
The electronic component assembly is
A metal container and an electronic component fixed in the metal container;
A plurality of conductive pins are connected to the electronic component,
An insulating layer is interposed between the plurality of conductive pins and the electronic component,
The other ends of the plurality of conductive pins extend to a connector insertion space in the metal container,
At least one IC tag is disposed in the insulating layer and in the vicinity of the plurality of conductive pins;
The at least one IC tag is installed in association with the conductive pin in the vicinity of the conductive pin at a position shifted from the center of the connector insertion space ,
The metal container is provided with a positioning unit for the reader / writer device for IC tag communication corresponding to the position of the IC tag,
An error detection system for an electronic component assembly, wherein the connector insertion space is used as a window for detecting the IC tag by the IC tag communication reader / writer device. In claim 7 ,
The IC tag communication reader / writer device includes a high-frequency antenna circuit that emits electromagnetic waves for IC tag communication and a detection unit,
In a state where the IC tag communication reader / writer device is made to correspond to a predetermined position of the metal container, the coil portion of the detection unit is parallel to the surface of the coil of the IC tag,
When the detection unit and the IC tag are fixed within a predetermined distance, the detection unit and the IC tag are electromagnetically coupled by magnetic flux,
When the detection unit and the IC tag are fixed outside a predetermined distance, the detection unit and the IC tag are outside a detectable range by magnetic flux. Detection system. In claim 8 ,
The IC tag communication reader / writer device is
A high-frequency antenna circuit provided inside the main body,
The detection unit provided integrally with the tip of the main body;
An engaging portion,
The detection unit is connected to a signal transmission unit extending downward from the tip of the main body,
The detection unit is configured as a detection coil in a direction perpendicular to the axis of the signal transmission unit,
An error detection system for an electronic component assembly, wherein the detecting portion is fixed at a predetermined position in the connector insertion space of the electronic component by making the engaging portion correspond to the positioning portion. An error detection method for an electronic component assembly using a reader / writer device for IC tag communication,
The electronic component assembly is
A metal container having a positioning portion;
An electronic component fixed in the metal container,
The electronic component is
Electronic components,
A pair of conductive pins connected to the electronic component through an insulating layer;
The other end of the pair of conductive pins extends into the connector insertion space in the metal container,
An IC tag is disposed in the insulating layer and in the vicinity of one of the pair of conductive pins,
The reader / writer device for IC tag communication includes a high-frequency antenna circuit that radiates electromagnetic waves for IC tag communication and a detection unit,
Set the IC tag communication reader / writer device on the positioning part of the metal container,
Using the connector insertion space as a window for detecting the IC tag,
When the electromagnetic coupling due to the magnetic flux between the detection unit and the IC tag is detected, it is determined that the pair of conductive pins are connected to a regular position with respect to the electronic component,
An electronic component assembly, wherein when the electromagnetic coupling due to the magnetic flux between the detection unit and the IC tag cannot be detected, it is determined that the pair of conductive pins is not connected to a regular position with respect to the electronic component. Error detection method. In claim 10 ,
From the outside of the insulating layer, the electromagnetic wave of the IC tag communication reader / writer device is sent by the detection unit directly to the vicinity of the conductive pin in the metal container at a pinpoint, and opposed to the other side of the insulating layer. An error detection method for an electronic component assembly, wherein IC tag communication is performed by calling an IC tag installed. In claim 11 ,
The IC tag has an IC chip and a coil antenna wound around the IC chip,
The IC tag is arranged such that the surface of the coil antenna is at a right angle with or close to the conductive pin,
The IC tag operates by inducing a secondary current from a high-frequency primary current, and information on the IC tag is induced so as to trace back from the secondary current to the primary current. An error detection method for an electronic component assembly, comprising performing IC tag communication with a reader / writer device for tag communication. In claim 12 ,
When the IC tag communication reader / writer device is fitted into the metal container, the coil portion of the detection unit is parallel to the surface of the coil of the IC tag, and the detection unit and the IC tag are predetermined. The detection unit and the IC tag are electromagnetically coupled by magnetic flux to perform IC tag communication with the IC tag only when they are fixed within a distance of
An electronic component assembly error detection method characterized by the above.

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