WO2014147723A1 - Electronic component assembly with ic tag, and error detection system and error detection method therefor - Google Patents

Electronic component assembly with ic tag, and error detection system and error detection method therefor Download PDF

Info

Publication number
WO2014147723A1
WO2014147723A1 PCT/JP2013/057715 JP2013057715W WO2014147723A1 WO 2014147723 A1 WO2014147723 A1 WO 2014147723A1 JP 2013057715 W JP2013057715 W JP 2013057715W WO 2014147723 A1 WO2014147723 A1 WO 2014147723A1
Authority
WO
WIPO (PCT)
Prior art keywords
tag
electronic component
component assembly
metal container
detection unit
Prior art date
Application number
PCT/JP2013/057715
Other languages
French (fr)
Japanese (ja)
Inventor
繁 山内
山方　茂
貴章 由井
Original Assignee
株式会社日立システムズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立システムズ filed Critical 株式会社日立システムズ
Priority to JP2015506406A priority Critical patent/JP6077105B2/en
Priority to PCT/JP2013/057715 priority patent/WO2014147723A1/en
Publication of WO2014147723A1 publication Critical patent/WO2014147723A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an IC tag-attached electronic component assembly, an error detection system thereof, and an error detection method.
  • the electronic component is housed in a metal container, covered and fixed with an insulator such as resin, and a plurality of conductive pins that serve as power supply terminals and various signal terminals of the electronic component are placed outside the insulator There is a structure that protrudes into the space.
  • Each of the plurality of conductive pins is properly connected to a power source or a signal source by a connector, so that the electronic component exhibits its original function.
  • Patent Document 1 an IC tag is arranged side by side with an electronic component such as an LSI covered with an insulator and the whole is covered with an insulator so that information on the electronic component can be accurately grasped even in a packaged state. What has been disclosed is disclosed.
  • Patent Document 2 discloses an electronic component in which a semiconductor LSI chip and an IC tag are integrated in the same insulation coating package inside the LSI package.
  • Patent Document 3 discloses an RFID tag reader / writer device that includes a micro loop and communicates with a small metal RFID tag.
  • ⁇ Small electronic components such as LSIs having a plurality of conductive pins are required to be assembled accurately to ensure their operation.
  • human error may occur if the backlash detection of the conductive pin is performed at the assembly stage, such as visual check of the X-ray image. There is sex.
  • the IC tag is required to have a function of blocking noise and electromagnetic waves and a mechanical strength against impact (impact resistance, heat shock resistance, etc.) depending on its application.
  • the IC tag may be crushed or broken.
  • Patent Document 1 since the electronic component of Patent Document 1 is not supposed to be housed in a metal container, there arises a problem that the inside of the electronic component cannot be protected from an impact.
  • Patent Document 2 also has a problem in mechanical strength against impact since the component is covered with an insulator.
  • Patent Documents 1 to 3 do not disclose a solution relating to the detection of the back pin of the signal pin of the electronic component.
  • the typical ones of the present invention are as follows.
  • the electronic component assembly includes a metal container and an electronic component fixed in the metal container, and a plurality of conductive pins are connected to the electronic component, and the plurality of conductive pins and the electronic component are connected to the electronic component.
  • An insulating layer is interposed between the components, and the other ends of the plurality of conductive pins extend to a connector connection space in the metal container, and are in the insulating layer and in the vicinity of the plurality of conductive pins
  • at least one IC tag is disposed, and the at least one IC tag is installed in association with the specific conductive pin, and corresponds to the position of the at least one IC tag in the metal container.
  • a positioning portion for detecting error is provided.
  • the present invention by embedding the IC tag at a predetermined position of the electronic component assembly, it is possible to efficiently detect the back pin of the signal pin of the electronic component from the outside.
  • FIG. 1 is a perspective view of an electronic component assembly according to an embodiment of the present invention. It is a longitudinal cross-sectional view of the electronic component assembly of FIG. It is a figure explaining the relationship between each conductive pin of the electronic component of FIG. 1, and an IC tag. It is a front view of the IC tag embedded in the electronic component assembly. It is a sectional side view of the IC tag of FIG. 5A. It is explanatory drawing of the reader / writer apparatus for IC tag communication in a present Example. It is a front view of the detection part of the reader / writer apparatus for IC tag communication.
  • a plurality of electric signal lines are led out from an internal circuit of a metal container of an electronic component assembly to the outside through an insulating layer, and in the vicinity of at least one conductive pin
  • An IC tag for reverse difference detection is installed inside the insulating layer, and a connector connection space in a metal container is used as a window for detecting the IC tag.
  • an IC tag is incorporated in the metal container in the immediate vicinity of the conductive pin to be detected, and the electromagnetic wave of the reader / writer is sent directly from the outside of the insulating layer to the immediate vicinity of the conductive pin to be detected.
  • IC tag communication is performed by calling an IC tag installed opposite to the other side.
  • FIG. 1A is a perspective view of a first container holding an electronic component according to an embodiment of the present invention.
  • FIG. 1B is an example of a circuit diagram of the electronic component of FIG. 1A.
  • An electronic component 102 as an internal circuit is held inside the first container 100, and a plurality of electric signal lines (from the electronic component to the outside through the hole 104 of the tag attachment auxiliary sheet 103 of the first container 100 ( Conductive pins (P1, P2, Pn) are drawn out.
  • the electronic component assembly of the present invention is, for example, an LSI package having at least two conductive pins.
  • the first container 100 may be made of either a metal material or a non-metal material.
  • IC tags 105 (105-1, 105-2, 105-n) are fixed on the surface of the tag attachment auxiliary sheet 103 and in the vicinity of the conductive pins P1, P2, Pn, respectively.
  • the electronic component 102 shown in FIG. 1B is a push-pull amplifier circuit in which the emitter sides of the PNP transistor and the NPN transistor are connected in common, and the conductive pin P1 and the conductive pin P5, which are terminals of this push-pull amplifier circuit, are used as a power source.
  • An output voltage amplified in response to input signals from the conductive pins P2 and P4 is output to a load resistor (not shown) connected to the conductive pin P3.
  • Such an electronic component 102 is housed in the first container 100 as a semiconductor LSI chip, sealed with an insulating resin or the like, and each conductive pin drawn to the outside has a predetermined electric circuit. Connected to the connector to configure.
  • FIG. 2 is a perspective view of an electronic component assembly according to an embodiment of the present invention
  • FIG. 3 is a longitudinal sectional view of the electronic component assembly of FIG.
  • the first container 100 containing the electronic component 102 is housed and sealed with an insulating resin 300.
  • a pair of holes 203 are provided in the flange 202 around the opening 204 at the top of the second container 200 made of metal.
  • the pair of holes 203 are provided at positions along an axis passing through the centers of the plurality of conductive pins.
  • This hole 203 serves as a positioning portion for an IC tag communication reader / writer described later. Since this positioning unit is used to specify the position of each conductive pin, for example, the diameter of the pair of holes 203 is different on the left and right, and at the time of detection, the reader / writer for IC tag communication is used.
  • the electronic component assembly is always fixed in a predetermined positional relationship.
  • the alignment portion is not limited to a hole, and any positioning device can be used as long as it can fix the relative positional relationship between a plurality of conductive pins and an IC tag communication reader / writer, such as an uneven structure for positioning. Such a structure may be used.
  • an integrated part of the second container 200 made of metal and the first container 100 containing the electronic component 102 is defined as an electronic component assembly.
  • the periphery of the plurality of conductive pins is a connector insertion space surrounded by a cylindrical protective ring 201.
  • the electronic component assembly is integrated by inserting the first container 100 into the second container 200 made of metal together with the base portion of the conductive pin and sealing with an insulating layer 300 such as an insulating resin. Therefore, after the first container 100 is sealed in the second container 200, only the plurality of conductive pins extend outward, and the electronic component 102 and the IC tag 105 cannot be seen. Even if the electronic component 102 is inserted into the second container 200 in a state where the conductive pins of the electronic component 102 are reversed right and left (reverse insertion) and the electronic component assembly sealed with resin is manufactured, the appearance is not known. .
  • FIG. 3 represents a state in which the conductive pins P1, P2, and Pn of the electronic component assembly are properly inserted for convenience of explanation.
  • the IC tag 105 (105-1, 105-2, 105-n) is sealed with a resin or the like in a concave portion at a position corresponding to the hole 104 through which each conductive pin passes. Stopped and fixed.
  • Each IC tag 105 is arranged so as to be a non-target position with respect to each conductive pin. For example, assuming that the conductive pins (holes 104) are arranged at equal intervals along a straight line passing through the center of the surface of the auxiliary sheet 103, the IC tag 105-1 corresponding to the conductive pin P1 is connected to the conductive pin P1.
  • the IC tag 105-2 corresponding to the conductive pin P2 is positioned behind the conductive pin P2, and the IC tag 105-2 corresponding to the conductive pin P3 is shifted in front of the conductive pin P3 while alternately shifting the position. Deploy. Thereby, the distance between IC tags corresponding to adjacent conductive pins can be ensured, and interference can be avoided.
  • the number of IC tags 105 may be one for one electronic component 102 as long as error detection is intended.
  • one IC tag 105-1 may be fixed only in the vicinity of a specific conductive pin, for example, the conductive pin P1 among the plurality of conductive pins.
  • the reverse insertion cannot be detected by the conductive pin at the center of the surface of the auxiliary sheet 103, in other words, at the center of the connector insertion space. Therefore, the specific one conductive pin and the corresponding IC tag must be present at a position shifted radially outward from the center of the surface of the auxiliary sheet 103, in other words, the center of the connector insertion space. .
  • one IC tag at a position shifted from the center of the connector insertion space becomes “no response” to the IC tag communication reader / writer, and reverse insertion can be detected. Also, assuming that one IC tag is installed, the IC tag communication reader / writer can detect whether the IC tag is not installed or the IC tag is faulty.
  • each conductive pin and each IC tag 105 have a predetermined positional relationship.
  • the IC tag 105 has a flat plate shape, and the IC tag is disposed at a right angle with or close to the conductive pin. That is, the IC tag 105 is installed so as to be at a right angle or close to each conductive pin coming out from the electronic component 102 toward the outside.
  • FIG. 5A is a front view of the IC tag
  • FIG. 5B is a side sectional view of the IC tag.
  • the IC tag 105 has an IC tag main body 1051 provided on the front surface side of a flat substrate and an IC tag insulating substrate 1054 formed on the back surface of the substrate.
  • the IC tag main body 1051 includes an IC chip 1052, a planar coil antenna 1053 wound around the IC chip 1052 in a spiral manner, and a protective material.
  • the coil antenna has an inner end connected to the IC chip 1052 and an outer end connected to the IC chip 1052 via an insulating layer on the back surface.
  • UHF and microwave band IC tags can be broadly classified as follows: (1) an IC tag having a half-wavelength resonant dipole-based antenna with remarkable wavelength dependence, and (2) a wavelength. There is an ultra-small size IC tag with a side of 10 mm or less that incorporates a resonance circuit using a coil or a capacitor having no dependency.
  • an ultra-small IC tag is used.
  • a UHF band ultra-small tag (Hitachi Chemical Co., Ltd. IM5) having an outer dimension of 2.5 mm ⁇ 2.5 mm and a thickness of 0.4 mm.
  • -PK2525 type tag As an example, this tag can provide a flight distance of about several millimeters with a predetermined detection radio wave output from an IC tag communication reader / writer.
  • FIG. 6 is an explanatory diagram of the IC tag communication reader / writer device 500 in this embodiment.
  • FIG. 7 is a front view of the detection unit 530 of the IC tag communication reader / writer device.
  • the IC tag communication reader / writer device 500 includes a main body 510 having a high-frequency antenna circuit (not shown), and a detection coil (micro loop) 533 connected to the main body by a pair of signal transmission units (cables) 520. A section 530 and a database 540. The main body 510 is connected to the backup database 560 via the network 550.
  • the main body 510 is provided with a control circuit unit 511, a display screen 512, and a port switching unit 513.
  • the detection unit 530 includes a base plate 531, an engagement unit (concave or convex) 532, a plurality of detection coils 533 extending in an arc shape in a direction perpendicular to the axis of the cable 520, a positioning hole 535, and a detection hole A space 536 and a hole 537 corresponding to the conductive pin 534 are provided.
  • a predetermined position in the connector insertion space that is, a position where a specific IC tag corresponding to a specific conductive pin Pn of the electronic component assembly can be detected and a predetermined depth. Even when there are a plurality of conductive pins, when one IC tag is incorporated, it is sufficient to configure one detection coil 533.
  • FIG. 8 is a longitudinal cross-sectional view illustrating a configuration in which the detection unit 530 of the IC tag communication reader / writer device is set at a predetermined position of the electronic component assembly and the inserted state of the plurality of detection coils 533 is detected in a non-contact manner.
  • FIG. FIG. 9 is an enlarged view of a portion A in FIG.
  • the engagement portion 532 of the IC tag communication reader / writer device 500 is engaged with the flange of the electronic component assembly, and the detection portion 533 is mechanically set at a predetermined rotational position and a predetermined depth in the connector insertion space. . That is, in order to detect reverse insertion, the detection coil 533 is inserted into the connector insertion space and is brought close to the IC tag. In this state, the micro loop of the detection unit 530 of the IC tag communication reader / writer device 500, that is, the detection coil 533 and the coil of the IC tag are electromagnetically coupled to each other, so that the microminiature incorporated in the root of the specific conductive pin 534 The presence or absence of the IC tag is detected without contact.
  • the engagement portion 532 is a mark for distinguishing, for example, that the first conductive pin P1 is disposed in the immediate vicinity of the engagement portion 532 and the nth conductive pin Pn is disposed on the far side as “correct”, and the reverse insertion as “false”. There is a role. Further, for example, the IC tag communication reader / writer device 500 is mechanically predetermined in a state where the detection coil 533 is inserted into the cylinder in order to detect the ultra-small IC tag 100 incorporated in the root of the first conductive pin P1. It has the role of determining the rotational position and the predetermined depth.
  • the coil surface of the detection coil (micro loop) 533 of the detection unit 530 and the coil surface of the IC tag 105 facing each other through the insulating layer 300 are parallel to each other and electromagnetically coupled by the magnetic flux ⁇ .
  • ⁇ indicates a magnetic field line of electromagnetic induction.
  • This IC tag communication reader / writer device 500 has a one-to-one correspondence with the alignment fitting portion of the electronic component assembly. A series of detection devices is made from the high-frequency antenna circuit of the IC tag communication reader / writer device 500 to the signal transmission unit 520.
  • the minute loop becomes parallel to the surface of the coil of the IC tag 100, and the minute loop The IC tag is fixed within a predetermined distance, and in this state, the micro loop and the IC tag are electromagnetically coupled by the magnetic flux ⁇ .
  • FIG. 10 is a diagram for explaining the operation of the detection unit 530 of the IC tag communication reader / writer device.
  • the coil surface of the IC tag 105 near the conductive pin Pn and the coil surface of the detection coil 533 are parallel to each other and are electromagnetically coupled by the magnetic fluxes ⁇ 1 to ⁇ 3.
  • FIG. 11A is a diagram showing the magnetic flux in a state where the insertion of the plurality of conductive pins of the electronic component is normal
  • FIG. 11B is a perspective view showing the magnetic flux in the state of FIG. 11A.
  • Reference numeral 600 denotes a cross section of the range of the magnetic force lines coming out from the detection coil (micro loop) 533 of the detection unit 530, and magnetic force lines are generated across the conductive pins 534 and the IC tag 105 in the vicinity thereof.
  • the range 600 of each magnetic force line does not reach the adjacent conductive pin Pn or the IC tag 105 in the vicinity thereof, so that communication interference does not occur.
  • FIG. 11A shows the IC tag 105-1 in the magnetic field line range 600-1 on the side close to the first conductive pin P1, and the IC tag 105-n in the magnetic field line range 600-n on the side close to the nth conductive pin Pn. It is buried and the insertion of the first conductive pin P1, the nth conductive pin Pn, etc. of the electronic component assembly is in a normal state.
  • the minute loop and the IC tag are fixed within a predetermined distance, and the detection coil 533 and the IC tag are electromagnetically coupled by the magnetic flux ⁇ in the magnetic force range 600 to detect that they are in a normal state.
  • the minute loop 533 is electromagnetically coupled to the loop surface of the IC tag 105, so that communication with the reader / writer device 500 becomes possible.
  • the IC tag and the micro loop 533 have a relationship between the primary coil and the secondary coil of the transformer.
  • the high-frequency current of the minute loop 533 is a primary current
  • the magnetic field lines induced by the primary current generate a secondary current in the coil antenna 1053 of the IC tag (not shown).
  • the IC tag 105 operated with the secondary current returns a signal such as an ID from the micro loop 533 to the reader / writer device 500 following the cable 520 in the reverse direction.
  • the sensitivity becomes higher as the micro loop 533, that is, the detection coil and the tag 105 are closer to each other. Therefore, when the alignment fitting portion 532 of the micro loop 533 coincides with the positioning structure of the electronic component assembly, the IC tag 105 is detected immediately below the micro loop 533 as the detection coil, and the result is the IC tag communication. Is displayed on the display unit 512 of the reader / writer device 500.
  • the IC tag 105 corresponding to each conductive pin Pn is detected, whereby each conductive pin of the electronic component assembly is detected. It is possible to easily determine whether or not Pn is integrated in a normal state.
  • FIG. 12A is a perspective view of the electronic component assembly in which the insertion of the plurality of conductive pins of the electronic component is reversed.
  • FIG. 12B is a diagram illustrating a cross section (600) of the magnetic flux in the state where the insertion of the conductive pin is reversed in FIG. 12A.
  • the nth conductive pin Pn is embedded on the left side of the metal second container 200, and the first conductive pin P1 is embedded on the right side of the metal second container 200, This is a case where the insertion of the first conductive pin P1 and the second conductive pin P2 is reversed.
  • the IC tag 105-n corresponding to the nth conductive pin Pn is outside the range 600-1 that can be detected by the magnetic flux ⁇ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-n cannot be detected.
  • the IC tag 105-1 corresponding to the first conductive pin Pn is outside the range 600-n that can be detected by the magnetic flux ⁇ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-1 cannot be detected. As a result, since nothing is displayed on the display unit 512 of the IC tag communication reader / writer device 500, the state of FIG. 12A is determined to be an error.
  • the position of the IC tag 105 is engaged. It shifts to the opposite side with respect to the part 532.
  • the state of FIG. 12B is adjusted so that the deviation width is an electromagnetic distance that cannot be detected by the detection coil 533.
  • the present embodiment by embedding the IC tag in a predetermined position of the electronic component assembly, it is possible to efficiently perform the reverse of the conductive pin of the electronic component without affecting the characteristics of the electric component of the electronic component assembly. Sting detection can be performed.
  • the discriminating method of the present embodiment is employed, the plurality of conductive pins of the electronic component assembly can be discriminated easily and at low cost by the conventional method. For this reason, even in the assembly of electronic components, it is possible to assemble the electronic components so that they are properly connected to the connection terminals of the electronic components corresponding to the respective conductive pins without confusing a plurality of conductive pins. Be improved.
  • the IC tag communication reader / writer device 500 does not have to have an integral structure as described in the first embodiment as a whole.
  • each part of the reader / writer device such as the port switching unit 513 or the like. May be configured separately, and these may be connected to each other wirelessly with a cable or electromagnetically.
  • the alignment portion in the first embodiment is not limited to the one secured by a mechanical structure.
  • Example 2 an optical detection mechanism is adopted.
  • a detection mark is provided on the surface of the flange 202 of FIG. 2 as a positioning portion for the reader / writer for IC tag communication.
  • the reader / writer device or the electronic component assembly is placed on a table or a robot arm that can be moved in XY coordinates, and the mark of the positioning portion is detected by a camera provided in the reader / writer for IC tag communication.
  • the relative positional relationship between the two is confirmed, the reader / writer device and the electronic component assembly are accurately positioned, and then reverse insertion is detected in the same manner as in the first embodiment.
  • the electronic component assembly by embedding the IC tag in a predetermined position of the electronic component assembly, the electronic component assembly is not contacted from outside without affecting the characteristics of the electronic component assembly, and the electronic component assembly can be efficiently performed. It is possible to detect the back pin of the conductive pin.
  • SYMBOLS 100 ... 1st container, 102 ... Electronic component, 103 ... Tag attachment auxiliary sheet, 104 ... Hole, 105 (105-1, 105-2, 105-n) ... IC tag, 1052 ... IC chip, 1053 ... Coil antenna 200 ... Metal second container, 202 ... Flange, 203 ... Pair of holes, 204 ... Opening, 300 ... Resin, 500 ... Reader / writer device for IC tag communication, 530 ... Detector.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

This electronic component assembly is provided with a metal container, and an electronic component that is immobilized inside the metal container. The electronic component comprises an electronic component, and a plurality of conductive pins connected to the electronic component via an insulating layer. One end of each of the plurality of conductive pins extends to a connector connection space inside the metal container. An IC tag is positioned inside the insulating layer, in the vicinity of any one of the plurality of conductive pins. A positioning part corresponding to the position of the IC tag is provided to the metal container.

Description

ＩＣタグ取り付け電子部品組み立て体及びその誤差し検知システム並びに誤差し検知方法IC tag-attached electronic component assembly, error detection system thereof, and error detection method
　本発明は、ＩＣタグ取り付け電子部品組み立て体及びその誤差し検知システム並びに誤差し検知方法に関する。 The present invention relates to an IC tag-attached electronic component assembly, an error detection system thereof, and an error detection method.
　電子部品組み立て体として、電子部品を金属製の容器などに収納して樹脂等の絶縁体で被覆・固定し、電子部品の電源端子や各種の信号端子となる複数の導電ピンを絶縁体から外側の空間に突出させた構造のものがある。これら複数の導電ピンが、各々、コネクタにより、電源や信号源に正しく接続されることにより、電子部品が本来の機能を発揮する。 As an electronic component assembly, the electronic component is housed in a metal container, covered and fixed with an insulator such as resin, and a plurality of conductive pins that serve as power supply terminals and various signal terminals of the electronic component are placed outside the insulator There is a structure that protrudes into the space. Each of the plurality of conductive pins is properly connected to a power source or a signal source by a connector, so that the electronic component exhibits its original function.
　従来から、電子部品の表面に製造情報や仕様を直接刻印したり印刷する、あるいはバーコードなどで印刷する技術が知られている。これにより、複数の導電ピンをどのように接続すべきかを判別することができる。電子部品が容器に誤差しされたものは、不良品である。しかし、金属の容器などに収納され樹脂等で封止された電子部品の状態を外部から観察もしくは検出するのは困難であり、不良品のまま、例えば電源の極性を間違えて、導電ピンがコネクタに接続されることが考えられる。 Conventionally, techniques for directly stamping or printing manufacturing information and specifications on the surface of an electronic component, or printing with a barcode or the like are known. Thereby, it is possible to determine how to connect the plurality of conductive pins. An electronic component that has been misaligned into a container is a defective product. However, it is difficult to externally observe or detect the state of an electronic component housed in a metal container or the like and sealed with a resin or the like. It is possible to be connected to.
　特許文献１には、絶縁体で被覆されたＬＳＩなどの電子部品と並んでＩＣタグが配置され全体を絶縁体で被覆した構造とし、梱包された状態でも電子部品の情報を正確に把握できるようにしたものが開示されている。 In Patent Document 1, an IC tag is arranged side by side with an electronic component such as an LSI covered with an insulator and the whole is covered with an insulator so that information on the electronic component can be accurately grasped even in a packaged state. What has been disclosed is disclosed.
　また、特許文献２には、ＬＳＩパッケージ内部に半導体ＬＳＩチップとＩＣタグとが同一の絶縁被覆のパッケージで一体化された電子部品が開示されている。 Also, Patent Document 2 discloses an electronic component in which a semiconductor LSI chip and an IC tag are integrated in the same insulation coating package inside the LSI package.
　さらに、特許文献３には、微小ループを備え小型金属ＲＦＩＤタグと通信するＲＦＩＤタグリーダ／ライタ装置が開示されている。 Further, Patent Document 3 discloses an RFID tag reader / writer device that includes a micro loop and communicates with a small metal RFID tag.
特開２００７-２２６５７４号公報JP 2007-226574 A 特開２０００－３０６０６４号公報JP 2000-306064 A 特開２００８－９０８１３号公報JP 2008-90813 A
　複数の導電ピンを有するＬＳＩ等の小型の電子部品はその動作を確実にするために、正確な組み立てが求められる。製造情報や仕様を部品表面に直接刻印もしくは印刷、あるいはバーコードなどで印刷する従来技術では、組み立て段階で導電ピンの逆刺し検出をＸ線画像の目視チェックなど実施すると、ヒューマンエラーが発生する可能性がある。 ¡Small electronic components such as LSIs having a plurality of conductive pins are required to be assembled accurately to ensure their operation. In the conventional technology in which manufacturing information and specifications are directly stamped or printed on the surface of the part, or printed with a barcode, human error may occur if the backlash detection of the conductive pin is performed at the assembly stage, such as visual check of the X-ray image. There is sex.
　さらに、小型の電子部品は用途によっては、金属製の容器で保護される。金属製の容器で保護された電子部品組立体に関しては、その内部にＩＣタグを配置することが出来なかった。それは金属製の容器によるシールド効果でＩＣタグの動作のための電磁波も遮断してしまいＩＣタグの通信が出来なくなるためである。このようなことから、金属製の容器の外部に金属対応のＩＣタグを取り付けることが提案されている。但し、この場合は、電子部品のサイズが大きくなってしまうという課題がある。 In addition, small electronic components are protected by metal containers depending on the application. Regarding an electronic component assembly protected by a metal container, an IC tag could not be disposed therein. This is because the electromagnetic wave for the operation of the IC tag is blocked by the shielding effect by the metal container, and the communication of the IC tag becomes impossible. For this reason, it has been proposed to attach a metal-compatible IC tag to the outside of a metal container. However, in this case, there is a problem that the size of the electronic component becomes large.
　一方、ＩＣタグはその用途によっては、雑音電磁波遮断の機能と、衝撃に対する機械的強度（耐衝撃力や耐ヒートショック等）が要求される。金属製の容器による保護の無いＩＣタグを一般的な樹脂で一体的に成型した電子部品組み立て体では、ＩＣタグが潰れたり、割れたりする可能性がある。 On the other hand, the IC tag is required to have a function of blocking noise and electromagnetic waves and a mechanical strength against impact (impact resistance, heat shock resistance, etc.) depending on its application. In an electronic component assembly in which an IC tag that is not protected by a metal container is integrally molded with a general resin, the IC tag may be crushed or broken.
　例えば、特許文献１の電子部品は、金属製の容器内に収容されること想定したものではないため、衝撃から電子部品の内部を保護できないという課題が生じる。 For example, since the electronic component of Patent Document 1 is not supposed to be housed in a metal container, there arises a problem that the inside of the electronic component cannot be protected from an impact.
　特許文献２の電子部品も、部品が絶縁物で覆われているので、衝撃に対する機械的強度に課題がある。 The electronic component of Patent Document 2 also has a problem in mechanical strength against impact since the component is covered with an insulator.
　また、特許文献１乃至特許文献３には、電子部品の信号ピンの逆刺し検出に関する解決策は開示されていない。 Further, Patent Documents 1 to 3 do not disclose a solution relating to the detection of the back pin of the signal pin of the electronic component.
　本発明は、効率良く電子部品の信号ピンの逆刺し検出を行うことのできる、電子部品組立体及びその誤差し検知システム並びに誤差し検知方法を提供することを課題とする。 It is an object of the present invention to provide an electronic component assembly, an error detection system thereof, and an error detection method capable of efficiently detecting the back pin of the signal pin of the electronic component.
　本発明の代表的なものを示すと次の通りである。電子部品組立体は、金属製の容器と、前記金属製容器内に固定された電子部品とを備え、前記電子部品には、複数の導電ピンが接続されており、前記複数の導電ピンと前記電子部品との間に絶縁層が介在しており、前記複数の導電ピンの他端は前記金属製容器内のコネクタ接続用空間に延びており、前記絶縁層内でかつ前記複数の導電ピンの近傍に、少なくとも１つのＩＣタグが配置されており、前記少なくとも１つのＩＣタグは、特定の前記導電ピンと対応付けて設置されており、前記金属製容器に、前記少なくとも１つのＩＣタグの位置に対応した誤差し検知用の位置決め部が設けられていることを特徴とする。 The typical ones of the present invention are as follows. The electronic component assembly includes a metal container and an electronic component fixed in the metal container, and a plurality of conductive pins are connected to the electronic component, and the plurality of conductive pins and the electronic component are connected to the electronic component. An insulating layer is interposed between the components, and the other ends of the plurality of conductive pins extend to a connector connection space in the metal container, and are in the insulating layer and in the vicinity of the plurality of conductive pins In addition, at least one IC tag is disposed, and the at least one IC tag is installed in association with the specific conductive pin, and corresponds to the position of the at least one IC tag in the metal container. A positioning portion for detecting error is provided.
　本発明によれば、電子部品組立体の所定の位置にＩＣタグを埋設することで、外部から効率よく、電子部品の信号ピンの逆刺し検出を行うことができる。 According to the present invention, by embedding the IC tag at a predetermined position of the electronic component assembly, it is possible to efficiently detect the back pin of the signal pin of the electronic component from the outside.
本発明の一実施例に係る、電子部品を保持した第１の容器の斜視図である。It is a perspective view of the 1st container holding electronic parts concerning one example of the present invention. 図１Ａの電子部品の回路図である。It is a circuit diagram of the electronic component of FIG. 1A. 本発明の一実施例に係る、電子部品組立体の斜視図である。1 is a perspective view of an electronic component assembly according to an embodiment of the present invention. 図２の電子部品組立体の縦断面図である。It is a longitudinal cross-sectional view of the electronic component assembly of FIG. 図１の電子部品の各導電ピンとＩＣタグの関係を説明する図である。It is a figure explaining the relationship between each conductive pin of the electronic component of FIG. 1, and an IC tag. 電子部品組立体に埋設されるＩＣタグの正面図である。It is a front view of the IC tag embedded in the electronic component assembly. 図５ＡのＩＣタグの側断面図である。It is a sectional side view of the IC tag of FIG. 5A. 本実施例における、ＩＣタグ通信用リーダ／ライタ装置の説明図である。It is explanatory drawing of the reader / writer apparatus for IC tag communication in a present Example. ＩＣタグ通信用リーダ／ライタ装置の検出部の正面図である。It is a front view of the detection part of the reader / writer apparatus for IC tag communication. ＩＣタグ通信用リーダ／ライタ装置を電子部品組立体の所定の位置にセットし、複数の導電ピンの差し込み状態を、非接触で検出する構成を説明する、縦断面図である。It is a longitudinal cross-sectional view explaining the structure which sets the reader / writer apparatus for IC tag communication in the predetermined position of an electronic component assembly, and detects the insertion state of a several conductive pin by non-contact. 図８のＡ部の拡大図である。It is an enlarged view of the A section of FIG. ＩＣタグ通信用リーダ／ライタ装置の検出部の作用を説明する図である。It is a figure explaining the effect | action of the detection part of the reader / writer apparatus for IC tag communication. 電子部品の複数の導電ピンの差し込みが正常な状態における磁束を示す図である。It is a figure which shows the magnetic flux in the state in which insertion of the some conductive pin of an electronic component is normal. 図１１Ａの状態の磁束を示す斜視図である。It is a perspective view which shows the magnetic flux of the state of FIG. 11A. 電子部品の複数の導電ピンの差し込みが逆の状態の、電子部品組立体の斜視図である。It is a perspective view of an electronic component assembly in a state where insertion of a plurality of conductive pins of the electronic component is reversed. 図１２Ａの、導電ピンの差し込みが逆の状態における磁束を示す図である。It is a figure which shows the magnetic flux in the state where the insertion of the conductive pin of FIG. 12A is reverse.
　本発明の実施形態によれば、電子部品組立体の金属製容器の内部回路から絶縁層を介して外部へ複数の電気信号線（導電ピン）が引き出されるものにおいて、少なくとも１つの導電ピンの近傍の絶縁層の内部に逆差検知用のＩＣタグを設置し、このＩＣタグを検出する窓として金属製容器内のコネクタ接続用空間を利用する。この場合、金属製容器内の検出すべき導電ピンの直近にＩＣタグを組み込み、絶縁層の外部側からリーダ/ライタの電磁波を検出すべき導電ピンの直近に直接ピンポイントで送り、絶縁層の向こう側に対向して設置しているＩＣタグを呼び出すことでＩＣタグ通信を行う。ＩＣタグリーダ/ライタの微小ループアンテナには１次電流が流れ、絶縁層を介して反対側にはＩＣタグのコイルアンテが対向しているものとする。この配置により、２次電流がＩＣタグのコイルアンテナに誘起される。この原理によりＩＣタグ通信が可能となり、ＩＣタグのコイルアンテナに２次電流が誘起されるか否かにより、導電ピンの差し込みが正常か逆かを検知することができる。 According to the embodiment of the present invention, a plurality of electric signal lines (conductive pins) are led out from an internal circuit of a metal container of an electronic component assembly to the outside through an insulating layer, and in the vicinity of at least one conductive pin An IC tag for reverse difference detection is installed inside the insulating layer, and a connector connection space in a metal container is used as a window for detecting the IC tag. In this case, an IC tag is incorporated in the metal container in the immediate vicinity of the conductive pin to be detected, and the electromagnetic wave of the reader / writer is sent directly from the outside of the insulating layer to the immediate vicinity of the conductive pin to be detected. IC tag communication is performed by calling an IC tag installed opposite to the other side. It is assumed that the primary current flows through the micro loop antenna of the IC tag reader / writer, and the coil antenna of the IC tag is opposed to the opposite side through the insulating layer. With this arrangement, a secondary current is induced in the coil antenna of the IC tag. By this principle, IC tag communication is possible, and whether the insertion of the conductive pin is normal or reverse can be detected based on whether or not a secondary current is induced in the coil antenna of the IC tag.
　第１の容器と信号線の絶縁層を１次電流と２次電流の電磁結合の場として使うため、ＩＣタグを覆う絶縁層の厚みが薄いほど結合能率が良くなる。 Since the insulating layer of the first container and the signal line is used as a field for electromagnetic coupling between the primary current and the secondary current, the thinner the insulating layer covering the IC tag, the better the coupling efficiency.
　本発明の電子部品組立体を利用できる装置としては、例えば、各種の増幅回路、センサー、比較器、演算回路、コンバータ、発振回路、電源回路あるいは、これらの各回路を組み合わせた各種電子機器の制御や駆動用の複合電子回路等を挙げることができる。これにより、最終的に組み立てられた各種の電子機器の信頼性も向上する。 As an apparatus that can use the electronic component assembly of the present invention, for example, various amplifier circuits, sensors, comparators, arithmetic circuits, converters, oscillation circuits, power supply circuits, or control of various electronic devices combining these circuits. And a composite electronic circuit for driving. Thereby, the reliability of the various electronic devices finally assembled is also improved.
　次に、本発明の電子部品組立体の第一の実施形態を説明する。図１Ａは、本発明の一実施例に係る電子部品を保持した第１の容器の斜視図である。図１Ｂは、図１Ａの電子部品の回路図の一例である。第１の容器１００の内部には、内部回路としての電子部品１０２が保持され、この電子部品から第１の容器１００のタグ取り付け補助シート１０３の穴１０４を介して外部へ複数の電気信号線（導電ピン）Ｐ１，Ｐ２，Ｐｎが引き出されている。本発明の電子部品組立体は、例えば、少なくとも２本の導電ピンを有するＬＳＩパッケージである。第１の容器１００は、金属材料、非金属材料の何れで構成されていても良い。タグ取り付け補助シート１０３の表面でかつ、各導電ピンＰ１，Ｐ２，Ｐｎの近傍には、各々、ＩＣタグ１０５（１０５－１，１０５－２，１０５－ｎ）が固定されている。 Next, a first embodiment of the electronic component assembly of the present invention will be described. FIG. 1A is a perspective view of a first container holding an electronic component according to an embodiment of the present invention. FIG. 1B is an example of a circuit diagram of the electronic component of FIG. 1A. An electronic component 102 as an internal circuit is held inside the first container 100, and a plurality of electric signal lines (from the electronic component to the outside through the hole 104 of the tag attachment auxiliary sheet 103 of the first container 100 ( Conductive pins (P1, P2, Pn) are drawn out. The electronic component assembly of the present invention is, for example, an LSI package having at least two conductive pins. The first container 100 may be made of either a metal material or a non-metal material. IC tags 105 (105-1, 105-2, 105-n) are fixed on the surface of the tag attachment auxiliary sheet 103 and in the vicinity of the conductive pins P1, P2, Pn, respectively.
　図１Ｂに示した電子部品１０２は、PNPトランジスタとNPNトランジスタのエミッタ側を共通にして接続したプッシュプル増幅回路であり、このプッシュプル増幅回路の端子である導電ピンＰ１と導電ピンＰ５が電源に接続され、導電ピンＰ３に接続された負荷抵抗（図示略）には、導電ピンＰ２、導電ピンＰ４からの入力信号に応じて増幅された出力電圧が出力される。 The electronic component 102 shown in FIG. 1B is a push-pull amplifier circuit in which the emitter sides of the PNP transistor and the NPN transistor are connected in common, and the conductive pin P1 and the conductive pin P5, which are terminals of this push-pull amplifier circuit, are used as a power source. An output voltage amplified in response to input signals from the conductive pins P2 and P4 is output to a load resistor (not shown) connected to the conductive pin P3.
　このような電子部品１０２が半導体ＬＳＩチップとして第１の容器１００内に収容され、絶縁性の樹脂等で封止され、外部へ引き出された各導電ピンは、各々、所定の電気的な回路を構成するように、コネクタに接続される。 Such an electronic component 102 is housed in the first container 100 as a semiconductor LSI chip, sealed with an insulating resin or the like, and each conductive pin drawn to the outside has a predetermined electric circuit. Connected to the connector to configure.
　図２は、本発明の一実施例に係る電子部品組立体の斜視図であり、図３は、図２の電子部品組立体の縦断面図である。 FIG. 2 is a perspective view of an electronic component assembly according to an embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of the electronic component assembly of FIG.
　金属製の第２の容器２００内には、電子部品１０２を収容した第１の容器１００が収納され、絶縁性の樹脂３００で封止されている。金属製の第２の容器２００の上部の開口２０４の周囲のフランジ２０２には一対の穴２０３が設けられている。この一対の穴２０３は、複数の導電ピンの中心を通る軸線に沿った位置に設けられている。この穴２０３は、後で述べるＩＣタグ通信用リーダ・ライタに対する位置決め部となるものである。この位置決め部は、各導電ピンの位置を特定するために使用されるので、例えば一対の穴２０３の径の大きさを左右で異ならせるなど、検知時には、ＩＣタグ通信用リーダ・ライタに対して電子部品組立体が必ず所定の位置関係で両者が固定されるようにする。なお、置合わせ部は、穴に限定されるものでは無く、例えば位置決め用の凹凸構造等、複数の導電ピンとＩＣタグ通信用リーダ・ライタとの相対的な位置関係を固定できるものであればどのような構造であっても良い。 In the second container 200 made of metal, the first container 100 containing the electronic component 102 is housed and sealed with an insulating resin 300. A pair of holes 203 are provided in the flange 202 around the opening 204 at the top of the second container 200 made of metal. The pair of holes 203 are provided at positions along an axis passing through the centers of the plurality of conductive pins. This hole 203 serves as a positioning portion for an IC tag communication reader / writer described later. Since this positioning unit is used to specify the position of each conductive pin, for example, the diameter of the pair of holes 203 is different on the left and right, and at the time of detection, the reader / writer for IC tag communication is used. The electronic component assembly is always fixed in a predetermined positional relationship. The alignment portion is not limited to a hole, and any positioning device can be used as long as it can fix the relative positional relationship between a plurality of conductive pins and an IC tag communication reader / writer, such as an uneven structure for positioning. Such a structure may be used.
　本発明では、金属製の第２の容器２００と電子部品１０２を収容した第１の容器１００の一体化されたものを、電子部品組立体と定義する。 In the present invention, an integrated part of the second container 200 made of metal and the first container 100 containing the electronic component 102 is defined as an electronic component assembly.
　電子部品組立体において、複数の導電ピンの周囲は、筒状の保護リング２０１で囲まれたコネクタの差し込み空間となっている。 In the electronic component assembly, the periphery of the plurality of conductive pins is a connector insertion space surrounded by a cylindrical protective ring 201.
　電子部品組立体は、第１の容器１００を、導電ピンの根元部分と共に金属製の第２の容器２００内に差し込み、絶縁樹脂等の絶縁層３００で封止することによって、一体化される。そのため、第１の容器１００を第２の容器２００内に封止した後は、複数の導電ピンのみが外側に伸び、電子部品１０２やＩＣタグ１０５は見えない。もし、電子部品１０２の導電ピンが左右逆になった状態で第２の容器２００内に差し込まれ（逆差し）、樹脂で封止された電子部品組立体が製造されたとしても、外観ではわからない。図３は、説明の都合上、電子部品組立体の導電ピンＰ１，Ｐ２，Ｐｎが、正規に差し込まれた状態を表現している。 The electronic component assembly is integrated by inserting the first container 100 into the second container 200 made of metal together with the base portion of the conductive pin and sealing with an insulating layer 300 such as an insulating resin. Therefore, after the first container 100 is sealed in the second container 200, only the plurality of conductive pins extend outward, and the electronic component 102 and the IC tag 105 cannot be seen. Even if the electronic component 102 is inserted into the second container 200 in a state where the conductive pins of the electronic component 102 are reversed right and left (reverse insertion) and the electronic component assembly sealed with resin is manufactured, the appearance is not known. . FIG. 3 represents a state in which the conductive pins P1, P2, and Pn of the electronic component assembly are properly inserted for convenience of explanation.
　図４により、電子部品の各導電ピンとＩＣタグの関係を説明する。まず、絶縁性のタグ取り付け補助シート１０３には、各導電ピンを通す穴１０４に対応した位置の凹部等に、ＩＣタグ１０５（１０５－１，１０５－２，１０５－ｎ）が樹脂等により封止され、固定される。各ＩＣタグ１０５は、各導電ピンに対して非対象の位置となるように配置される。例えば、各導電ピン（穴１０４）が補助シート１０３の面の中心を通る直線に沿って等間隔に配置されていると仮定した場合、導電ピンＰ１に対応するＩＣタグ１０５－１を導電ピンＰ１の手前、導電ピンＰ２に対応するＩＣタグ１０５－２を導電ピンＰ２の後側、導電ピンＰ３に対応するＩＣタグ１０５－３を導電ピンＰ３の手前、のように、交互に位置をずらしながら配置する。これにより、隣接する導電ピンに対応するＩＣタグ相互の距離を確保し、混信を避けることができる。 Referring to FIG. 4, the relationship between each conductive pin of the electronic component and the IC tag will be described. First, the IC tag 105 (105-1, 105-2, 105-n) is sealed with a resin or the like in a concave portion at a position corresponding to the hole 104 through which each conductive pin passes. Stopped and fixed. Each IC tag 105 is arranged so as to be a non-target position with respect to each conductive pin. For example, assuming that the conductive pins (holes 104) are arranged at equal intervals along a straight line passing through the center of the surface of the auxiliary sheet 103, the IC tag 105-1 corresponding to the conductive pin P1 is connected to the conductive pin P1. The IC tag 105-2 corresponding to the conductive pin P2 is positioned behind the conductive pin P2, and the IC tag 105-2 corresponding to the conductive pin P3 is shifted in front of the conductive pin P3 while alternately shifting the position. Deploy. Thereby, the distance between IC tags corresponding to adjacent conductive pins can be ensured, and interference can be avoided.
　なお、誤差し検知を目的とする限りにおいて、ＩＣタグ１０５の数は、１個の電子部品１０２に対して、１個でも良い。図１Ａの電子部の例では、複数の導電ピンの中の特定の導電ピン、例えば導電ピンＰ１、の近傍にのみ1個のＩＣタグ１０５－１を固定しても良い。但し、補助シート１０３の面の中心、換言するとコネクタの差し込み空間の中心にある導電ピンでは、その逆差しを検知できない。そのため、この特定の１個の導電ピンや対応するＩＣタグは、補助シート１０３の面の中心、換言するとコネクタの差し込み空間の中心よりも半径方向外側にずれた位置に存在するものでなければならない。逆差しの場合、コネクタの差し込み空間の中心からずれた位置の１個のＩＣタグが、ＩＣタグ通信用リーダ・ライタに対して「応答なし」になり、逆差しを検知できる。また、１個のＩＣタグの設置を前提として、ＩＣタグ通信用リーダ・ライタにより、ＩＣタグの未設置、ＩＣタグの故障を検知することができる。 Note that the number of IC tags 105 may be one for one electronic component 102 as long as error detection is intended. In the example of the electronic unit in FIG. 1A, one IC tag 105-1 may be fixed only in the vicinity of a specific conductive pin, for example, the conductive pin P1 among the plurality of conductive pins. However, the reverse insertion cannot be detected by the conductive pin at the center of the surface of the auxiliary sheet 103, in other words, at the center of the connector insertion space. Therefore, the specific one conductive pin and the corresponding IC tag must be present at a position shifted radially outward from the center of the surface of the auxiliary sheet 103, in other words, the center of the connector insertion space. . In the case of reverse insertion, one IC tag at a position shifted from the center of the connector insertion space becomes “no response” to the IC tag communication reader / writer, and reverse insertion can be detected. Also, assuming that one IC tag is installed, the IC tag communication reader / writer can detect whether the IC tag is not installed or the IC tag is faulty.
　このようなタグ取り付け補助シート１０３を、第１の容器１００に固定することにより、各導電ピンと各ＩＣタグ１０５とは所定の位置関係を有することになる。ＩＣタグ１０５は平板状であり、ＩＣタグの配置は導電ピンと直角、若しくはそれに近い角度に設置する。すなわち、電子部品１０２から外部に向かって出る各導電ピンに直角、若しくはそれに近い角度となるようにして、ＩＣタグ１０５を設置する。 By fixing such a tag attachment auxiliary sheet 103 to the first container 100, each conductive pin and each IC tag 105 have a predetermined positional relationship. The IC tag 105 has a flat plate shape, and the IC tag is disposed at a right angle with or close to the conductive pin. That is, the IC tag 105 is installed so as to be at a right angle or close to each conductive pin coming out from the electronic component 102 toward the outside.
　次に、電子部品組立体に埋設されるＩＣタグについて説明する。図５ＡはＩＣタグの正面図、図５Ｂは、ＩＣタグの側断面図である。ＩＣタグ１０５は、平板状の基板の表面側に設けられたＩＣタグ本体部１０５１と、基板の裏面に形成されたＩＣタグ絶縁基板１０５４とを有している。ＩＣタグ本体部１０５１は、ＩＣチップ１０５２と、このＩＣチップ１０５２の周囲に螺旋条に複数回巻かれた面状のコイルアンテナ１０５３、及び、保護材等で構成されている。コイルアンテナはその内端がＩＣチップ１０５２に接続され、その外端も裏面の絶縁層を介してＩＣチップ１０５２に接続されている。 Next, the IC tag embedded in the electronic component assembly will be described. FIG. 5A is a front view of the IC tag, and FIG. 5B is a side sectional view of the IC tag. The IC tag 105 has an IC tag main body 1051 provided on the front surface side of a flat substrate and an IC tag insulating substrate 1054 formed on the back surface of the substrate. The IC tag main body 1051 includes an IC chip 1052, a planar coil antenna 1053 wound around the IC chip 1052 in a spiral manner, and a protective material. The coil antenna has an inner end connected to the IC chip 1052 and an outer end connected to the IC chip 1052 via an insulating layer on the back surface.
　なお、UHFやマイクロ波帯のＩＣタグには、大別すると、（１）波長依存性が顕著な半波長共振ダイポール基調のアンテナを内蔵する１辺が１０ｃｍ程度のＩＣタグと、（２）波長依存性がないコイルやコンデンサを用いた共振回路を内蔵した１辺が１０ｍｍ以下の超小型サイズのＩＣタグ、とがある。 UHF and microwave band IC tags can be broadly classified as follows: (1) an IC tag having a half-wavelength resonant dipole-based antenna with remarkable wavelength dependence, and (2) a wavelength. There is an ultra-small size IC tag with a side of 10 mm or less that incorporates a resonance circuit using a coil or a capacitor having no dependency.
　本発明では、取付け相手の電子部品１０２の近傍にＩＣタグを組み込むために、超小型サイズのＩＣタグを用いる。このような小型化の用途に適したものとして、例えば、外形寸法が、２．５mm×２．５mｍ、厚みが０．４ｍｍのUHF帯の超小型タグ（（株）日立化成（登録商標）IM5－PK2525型タグ）が有る。このタグは、一例として、ＩＣタグ通信用リーダ・ライタの所定の検出電波出力で、数ｍｍ程度の飛距離が得られる。 In the present invention, in order to incorporate an IC tag in the vicinity of the electronic component 102 to be attached, an ultra-small IC tag is used. As a device suitable for such downsizing applications, for example, a UHF band ultra-small tag (Hitachi Chemical Co., Ltd. IM5) having an outer dimension of 2.5 mm × 2.5 mm and a thickness of 0.4 mm. -PK2525 type tag). As an example, this tag can provide a flight distance of about several millimeters with a predetermined detection radio wave output from an IC tag communication reader / writer.
　次に、電子部品１０２の導電ピンが正常の状態で第２の容器２００内に差し込まれ、樹脂で封止された電子部品組立体が製造されているかを検知する手段について、説明する。  
　図６は、本実施例における、ＩＣタグ通信用リーダ／ライタ装置５００の説明図である。図７は、ＩＣタグ通信用リーダ／ライタ装置の検出部５３０の正面図である。 Next, a description will be given of means for detecting whether or not an electronic component assembly sealed with resin is manufactured by inserting the conductive pins of the electronic component 102 into the second container 200 in a normal state.
FIG. 6 is an explanatory diagram of the IC tag communication reader / writer device 500 in this embodiment. FIG. 7 is a front view of the detection unit 530 of the IC tag communication reader / writer device.
　ＩＣタグ通信用リーダ／ライタ装置５００は、高周波アンテナ回路（図示略）を有する本体５１０と、この本体に一対の信号伝送部（ケーブル）５２０で接続された検知コイル（微小ループ）５３３を有する検出部５３０と、データベース５４０とを備えている。本体５１０は、ネットワーク５５０を介してバックアップデータベース５６０に接続されている。 The IC tag communication reader / writer device 500 includes a main body 510 having a high-frequency antenna circuit (not shown), and a detection coil (micro loop) 533 connected to the main body by a pair of signal transmission units (cables) 520. A section 530 and a database 540. The main body 510 is connected to the backup database 560 via the network 550.
　本体５１０には、制御回路部５１１、表示画面５１２、及び、ポート切り替え部５１３が設けられている。検出部５３０は、ベースプレート５３１と、係合部（凹部あるいは凸部）５３２と、ケーブル５２０の軸に直角な方向において弧状に伸びた複数の検知コイル５３３と、位置決め用の穴５３５と、検出用空間５３６、導電ピン５３４に対応する穴５３７とを備えている。ＩＣタグ通信用リーダ／ライタ装置５００の係合部５３２を電子部品組立体の位置合わせ勘合部と機械的に嵌合させることにより、その検出部５３０の検知コイル５３３が電子部品組立体の筒状のコネクタ差し込み空間内の所定の位置、すなわち、電子部品組立体の特定の導電ピンＰｎに対応した特定のＩＣタグを検出可能な位置及び所定の深さに固定されるようになっている。なお、導電ピンが複数であってもＩＣタグを１個組み込む場合は、検知コイル５３３も１個で構成することで十分である。 The main body 510 is provided with a control circuit unit 511, a display screen 512, and a port switching unit 513. The detection unit 530 includes a base plate 531, an engagement unit (concave or convex) 532, a plurality of detection coils 533 extending in an arc shape in a direction perpendicular to the axis of the cable 520, a positioning hole 535, and a detection hole A space 536 and a hole 537 corresponding to the conductive pin 534 are provided. By mechanically engaging the engaging portion 532 of the IC tag communication reader / writer device 500 with the alignment fitting portion of the electronic component assembly, the detection coil 533 of the detecting portion 530 is in the cylindrical shape of the electronic component assembly. Are fixed to a predetermined position in the connector insertion space, that is, a position where a specific IC tag corresponding to a specific conductive pin Pn of the electronic component assembly can be detected and a predetermined depth. Even when there are a plurality of conductive pins, when one IC tag is incorporated, it is sufficient to configure one detection coil 533.
　図８は、ＩＣタグ通信用リーダ／ライタ装置の検出部５３０を電子部品組立体の所定の位置にセットし、複数の検知コイル５３３の差し込み状態を、非接触で検出する構成を説明する、縦断面図である。図９は、図８のＡ部の拡大図である。 FIG. 8 is a longitudinal cross-sectional view illustrating a configuration in which the detection unit 530 of the IC tag communication reader / writer device is set at a predetermined position of the electronic component assembly and the inserted state of the plurality of detection coils 533 is detected in a non-contact manner. FIG. FIG. 9 is an enlarged view of a portion A in FIG.
　ＩＣタグ通信用リーダ／ライタ装置５００の係合部５３２を電子部品組立体のフランジと係合させ、検出部５３３を機械的にコネクタ差し込み空間内の所定の回転位置と所定の深さにセットする。すなわち、逆差しを検知する為に、検知コイル５３３をコネクタ差し込み空間内に差し込んで、ＩＣタグの直近まで接近させた状態である。この状態において、ＩＣタグ通信用リーダ／ライタ装置５００の検出部５３０の微小ループすなわち検知コイル５３３とＩＣタグのコイルとが電磁結合することで、特定の導電ピン５３４の根本に組み込まれた超小型のＩＣタグの有無を非接触で検出する。 The engagement portion 532 of the IC tag communication reader / writer device 500 is engaged with the flange of the electronic component assembly, and the detection portion 533 is mechanically set at a predetermined rotational position and a predetermined depth in the connector insertion space. . That is, in order to detect reverse insertion, the detection coil 533 is inserted into the connector insertion space and is brought close to the IC tag. In this state, the micro loop of the detection unit 530 of the IC tag communication reader / writer device 500, that is, the detection coil 533 and the coil of the IC tag are electromagnetically coupled to each other, so that the microminiature incorporated in the root of the specific conductive pin 534 The presence or absence of the IC tag is detected without contact.
　係合部５３２は、例えば係合部５３２側の直近に第１導電ピンP1、遠い側に第ｎ導電ピンPｎが配置される時を「正」、この逆差しを「誤」として区別する目印の役割がある。さらに、例えば第１導電ピンP1の根本に組み込まれる超小型のＩＣタグ１００を検出するために検知コイル５３３を筒に差し込んだ状態で、ＩＣタグ通信用リーダ／ライタ装置５００を機械的に所定の回転位置と所定の深さを決定する役割を有する。 The engagement portion 532 is a mark for distinguishing, for example, that the first conductive pin P1 is disposed in the immediate vicinity of the engagement portion 532 and the nth conductive pin Pn is disposed on the far side as “correct”, and the reverse insertion as “false”. There is a role. Further, for example, the IC tag communication reader / writer device 500 is mechanically predetermined in a state where the detection coil 533 is inserted into the cylinder in order to detect the ultra-small IC tag 100 incorporated in the root of the first conductive pin P1. It has the role of determining the rotational position and the predetermined depth.
　図９に示すように、検出部５３０の検知コイル（微小ループ）５３３のコイル面と絶縁層３００を介して対向するＩＣタグ１０５のコイル面とが平行になり、磁束Φにより電磁結合する。Φは電磁誘導の磁力線を示している。このＩＣタグ通信用リーダ/ライタ装置５００は、電子部品組立体の位置合わせ勘合部と１対１に対応する。ＩＣタグ通信用リーダ/ライタ装置５００の高周波アンテナ回路から信号伝送部５２０までを一連の検出装置とする。係合部の深さが所定であって、ここにＩＣタグ通信用リーダ/ライタ装置５００が勘合したときのみ、その微小ループがＩＣタグ１００のコイルの面と平行になり、かつ、微小ループとＩＣタグが所定の距離内に固定され、この状態で、微小ループとＩＣタグは磁束Φにより電磁結合する。 As shown in FIG. 9, the coil surface of the detection coil (micro loop) 533 of the detection unit 530 and the coil surface of the IC tag 105 facing each other through the insulating layer 300 are parallel to each other and electromagnetically coupled by the magnetic flux Φ. Φ indicates a magnetic field line of electromagnetic induction. This IC tag communication reader / writer device 500 has a one-to-one correspondence with the alignment fitting portion of the electronic component assembly. A series of detection devices is made from the high-frequency antenna circuit of the IC tag communication reader / writer device 500 to the signal transmission unit 520. Only when the depth of the engaging portion is predetermined and the IC tag communication reader / writer device 500 is fitted here, the minute loop becomes parallel to the surface of the coil of the IC tag 100, and the minute loop The IC tag is fixed within a predetermined distance, and in this state, the micro loop and the IC tag are electromagnetically coupled by the magnetic flux Φ.
　図１０は、ＩＣタグ通信用リーダ／ライタ装置の検出部５３０の作用を説明する図である。導電ピンＰｎの近傍のＩＣタグ１０５のコイル面と検知コイル５３３のコイル面とが平行であり、磁束Φ１～磁束Φ３により電磁結合している。 FIG. 10 is a diagram for explaining the operation of the detection unit 530 of the IC tag communication reader / writer device. The coil surface of the IC tag 105 near the conductive pin Pn and the coil surface of the detection coil 533 are parallel to each other and are electromagnetically coupled by the magnetic fluxes Φ1 to Φ3.
　図１１Ａは、電子部品の複数の導電ピンの差し込みが正常な状態における磁束を示す図であり、図１１Ｂは、図１１Ａの状態の磁束を示す斜視図である。６００は検出部５３０の検知コイル（微小ループ）５３３から出る磁力線の範囲の断面を示しており、各導電ピン５３４とその近傍のＩＣタグ１０５に跨って、磁力線が生じている。但し、各磁力線の範囲６００は、隣合う導電ピンＰｎやその近傍のＩＣタグ１０５には及んでおらず、通信の混信を生じないようになっている。 FIG. 11A is a diagram showing the magnetic flux in a state where the insertion of the plurality of conductive pins of the electronic component is normal, and FIG. 11B is a perspective view showing the magnetic flux in the state of FIG. 11A. Reference numeral 600 denotes a cross section of the range of the magnetic force lines coming out from the detection coil (micro loop) 533 of the detection unit 530, and magnetic force lines are generated across the conductive pins 534 and the IC tag 105 in the vicinity thereof. However, the range 600 of each magnetic force line does not reach the adjacent conductive pin Pn or the IC tag 105 in the vicinity thereof, so that communication interference does not occur.
　図１１Ａは、第１導電ピンP１に近接した側の磁力線の範囲６００－１にＩＣタグ１０５－１、第ｎ導電ピンPｎに近接した側の磁力線の範囲６００－ｎにＩＣタグ１０５－ｎが埋設されており、電子部品組立体の第１導電ピンP１、第ｎ導電ピンPｎ等の差し込みが正常な状態である。微小ループとＩＣタグとが所定の距離内に固定され、検知コイル５３３とＩＣタグは磁力線の範囲６００で磁束Φにより電磁結合し、正常な状態であることを検知する。 FIG. 11A shows the IC tag 105-1 in the magnetic field line range 600-1 on the side close to the first conductive pin P1, and the IC tag 105-n in the magnetic field line range 600-n on the side close to the nth conductive pin Pn. It is buried and the insertion of the first conductive pin P1, the nth conductive pin Pn, etc. of the electronic component assembly is in a normal state. The minute loop and the IC tag are fixed within a predetermined distance, and the detection coil 533 and the IC tag are electromagnetically coupled by the magnetic flux Φ in the magnetic force range 600 to detect that they are in a normal state.
　すなわち、正規差しの場合、微小ループ５３３がＩＣタグ１０５のループ面と電磁結合することで、リーダ/ライタ装置５００と通信可能となる。ＩＣタグと微小ループ５３３はトランスの１次コイル、２次コイルの関係が成り立つ。微小ループ５３３の高周波電流を1次電流とすると、この１次電流によって誘起した磁力線がＩＣタグのコイルアンテナ１０５３に２次電流を発生させる（図示略）。この２次電流で動作したＩＣタグ１０５は、そのIDなどの信号を微小ループ５３３からケーブル５２０を逆に辿ってリーダ/ライタ装置５００へ返す。ＩＣタグ通信用リーダ/ライタ装置５００から見たときの感度は、微小ループ５３３、すなわち検知コイルとタグ１０５が接近しているほど高い感度になる。そのため、微小ループ５３３の位置合わせ嵌合部５３２が電子部品組立体の位置決め構造と一致したとき、検知コイルである微小ループ５３３の直下直近においてＩＣタグ１０５を検出し、その結果が、ＩＣタグ通信用リーダ／ライタ装置５００の表示部５１２に表示される。 That is, in the case of regular insertion, the minute loop 533 is electromagnetically coupled to the loop surface of the IC tag 105, so that communication with the reader / writer device 500 becomes possible. The IC tag and the micro loop 533 have a relationship between the primary coil and the secondary coil of the transformer. When the high-frequency current of the minute loop 533 is a primary current, the magnetic field lines induced by the primary current generate a secondary current in the coil antenna 1053 of the IC tag (not shown). The IC tag 105 operated with the secondary current returns a signal such as an ID from the micro loop 533 to the reader / writer device 500 following the cable 520 in the reverse direction. When viewed from the IC tag communication reader / writer device 500, the sensitivity becomes higher as the micro loop 533, that is, the detection coil and the tag 105 are closer to each other. Therefore, when the alignment fitting portion 532 of the micro loop 533 coincides with the positioning structure of the electronic component assembly, the IC tag 105 is detected immediately below the micro loop 533 as the detection coil, and the result is the IC tag communication. Is displayed on the display unit 512 of the reader / writer device 500.
　このような磁力線の有無をＩＣタグ通信用リーダ／ライタ装置５００の検出部５３０により検知することで、各導電ピンＰｎに対応するＩＣタグ１０５を検知することにより、電子部品組立体の各導電ピンＰｎが正規の状態で一体化されているか、否かを容易に判別することができる。 By detecting the presence / absence of such magnetic field lines by the detection unit 530 of the IC tag communication reader / writer device 500, the IC tag 105 corresponding to each conductive pin Pn is detected, whereby each conductive pin of the electronic component assembly is detected. It is possible to easily determine whether or not Pn is integrated in a normal state.
　もし誤って第１導電ピンP1、第２導電ピンP2等が電子部品組立体内に差し込まれたとき、ＩＣタグは所定の位置からずれる。図１２Ａは、電子部品の複数の導電ピンの差し込みが逆の状態の、電子部品組立体の斜視図である。図１２Ｂは、図１２Ａの、導電ピンの差し込みが逆の状態における磁束の断面（６００）を示す図である。 If the first conductive pin P1, the second conductive pin P2, etc. are accidentally inserted into the electronic component assembly, the IC tag is displaced from a predetermined position. FIG. 12A is a perspective view of the electronic component assembly in which the insertion of the plurality of conductive pins of the electronic component is reversed. FIG. 12B is a diagram illustrating a cross section (600) of the magnetic flux in the state where the insertion of the conductive pin is reversed in FIG. 12A.
　図１２Ａでは、図３とは逆に、金属製の第２の容器２００の左側に第ｎ導電ピンPｎ、金属製の第２の容器２００の右側に第１導電ピンP１が埋設されており、第１導電ピンP１、第２導電ピンP2の差し込みが逆の場合である。このとき、第ｎ導電ピンPｎに対応するＩＣタグ１０５－ｎは、検知コイル５３３の磁束Φ‘により検出可能な範囲６００－１の外に有り、ＩＣタグ通信用リーダ/ライタ装置５００はＩＣタグ１０５－ｎを検出できない。同様に、第１導電ピンPｎに対応するＩＣタグ１０５－１は、検知コイル５３３の磁束Φ‘により検出可能な範囲６００－ｎの外に有り、ＩＣタグ通信用リーダ/ライタ装置５００はＩＣタグ１０５－１を検出できない。その結果、ＩＣタグ通信用リーダ／ライタ装置５００の表示部５１２は何も表示されないので、図１２Ａの状態は、誤差しであると判定される。 In FIG. 12A, contrary to FIG. 3, the nth conductive pin Pn is embedded on the left side of the metal second container 200, and the first conductive pin P1 is embedded on the right side of the metal second container 200, This is a case where the insertion of the first conductive pin P1 and the second conductive pin P2 is reversed. At this time, the IC tag 105-n corresponding to the nth conductive pin Pn is outside the range 600-1 that can be detected by the magnetic flux Φ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-n cannot be detected. Similarly, the IC tag 105-1 corresponding to the first conductive pin Pn is outside the range 600-n that can be detected by the magnetic flux Φ ′ of the detection coil 533, and the IC tag communication reader / writer device 500 is the IC tag. 105-1 cannot be detected. As a result, since nothing is displayed on the display unit 512 of the IC tag communication reader / writer device 500, the state of FIG. 12A is determined to be an error.
　このように、電子部品組立体の複数の導電ピンと少なくとも１個のＩＣタグとタグとを一体化し、これらが電子部品組立体内に逆向きに誤差しされるとＩＣタグ１０５の位置が、係合部５３２に対し、反対側にずれる。図１２Ｂの状態は、このずれ巾が検知コイル５３３によって検出できない電磁的距離となる様に調整されている。 As described above, when the plurality of conductive pins of the electronic component assembly, at least one IC tag, and the tag are integrated, and the error is reversed in the electronic component assembly, the position of the IC tag 105 is engaged. It shifts to the opposite side with respect to the part 532. The state of FIG. 12B is adjusted so that the deviation width is an electromagnetic distance that cannot be detected by the detection coil 533.
　本実施例によれば、電子部品組立体の所定の位置にＩＣタグを埋設することで、電子部品組立体の電気部品の特性に影響を及ぼさず外部から効率よく、電子部品の導電ピンの逆刺し検出を行うことができる。 According to the present embodiment, by embedding the IC tag in a predetermined position of the electronic component assembly, it is possible to efficiently perform the reverse of the conductive pin of the electronic component without affecting the characteristics of the electric component of the electronic component assembly. Sting detection can be performed.
　本実施例の判別方法を採用すれば、電子部品組立体が有する複数の導電ピンを容易にかつ従来法により低コストで判別することができる。このため、電子部品の組立においても、複数の導電ピンを取り違えることなく、各導電ピンに対応する電子部品の接続端子に適切に接続されるように組み立てることができ、これらの装置に対する信頼性も向上される。 If the discriminating method of the present embodiment is employed, the plurality of conductive pins of the electronic component assembly can be discriminated easily and at low cost by the conventional method. For this reason, even in the assembly of electronic components, it is possible to assemble the electronic components so that they are properly connected to the connection terminals of the electronic components corresponding to the respective conductive pins without confusing a plurality of conductive pins. Be improved.
　なお、ＩＣタグ通信用リーダ／ライタ装置５００は、全体として、第１の実施例で述べたような一体的な構造で無くても良く、例えばポート切替部５１３等、リーダ／ライタ装置の各部分を個別に分離して構成し、これらがケーブルや電磁的にワイヤレスで相互に接続されるようにしても良い。 The IC tag communication reader / writer device 500 does not have to have an integral structure as described in the first embodiment as a whole. For example, each part of the reader / writer device such as the port switching unit 513 or the like. May be configured separately, and these may be connected to each other wirelessly with a cable or electromagnetically.
　実施例１における位置合わせ部は、機械的な構造で確保するものに限定されない。 The alignment portion in the first embodiment is not limited to the one secured by a mechanical structure.
　実施例２では、光学式検知機構を採用する。例えば、図２のフランジ２０２の表面に、ＩＣタグ通信用リーダ・ライタに対する位置決め部として検知用のマークを設ける。そして、リーダ／ライタ装置若しくは電子部品組立体を、ＸＹ座標で移動可能なテーブル上やロボットアーム上に置き、位置決め部のマークを、ＩＣタグ通信用リーダ・ライタに設けたカメラで検知し、画像処理して両者の相対的な位置関係を確認し、リーダ／ライタ装置と電子部品組立体との正確な位置決めを行った後、実施例１と同様にして、逆差しの検知を行う。 In Example 2, an optical detection mechanism is adopted. For example, a detection mark is provided on the surface of the flange 202 of FIG. 2 as a positioning portion for the reader / writer for IC tag communication. Then, the reader / writer device or the electronic component assembly is placed on a table or a robot arm that can be moved in XY coordinates, and the mark of the positioning portion is detected by a camera provided in the reader / writer for IC tag communication. After processing, the relative positional relationship between the two is confirmed, the reader / writer device and the electronic component assembly are accurately positioned, and then reverse insertion is detected in the same manner as in the first embodiment.
　本実施例によれば、電子部品組立体の所定の位置にＩＣタグを埋設することで、電子部品組立体の電気部品の特性に影響を及ぼさず外部から非接触で、効率よく、電子部品の導電ピンの逆刺し検出を行うことができる。 According to the present embodiment, by embedding the IC tag in a predetermined position of the electronic component assembly, the electronic component assembly is not contacted from outside without affecting the characteristics of the electronic component assembly, and the electronic component assembly can be efficiently performed. It is possible to detect the back pin of the conductive pin.
１００…第１の容器、１０２…電子部品、１０３…タグ取り付け補助シート、１０４…穴、１０５（１０５－１，１０５－２，１０５－ｎ）…ＩＣタグ、１０５２…ＩＣチップ、１０５３…コイルアンテナ、２００…金属製の第２の容器、２０２…フランジ、２０３…一対の穴、２０４…開口、３００…樹脂、５００…ＩＣタグ通信用リーダ/ライタ装置、５３０…検出部。 DESCRIPTION OF SYMBOLS 100 ... 1st container, 102 ... Electronic component, 103 ... Tag attachment auxiliary sheet, 104 ... Hole, 105 (105-1, 105-2, 105-n) ... IC tag, 1052 ... IC chip, 1053 ... Coil antenna 200 ... Metal second container, 202 ... Flange, 203 ... Pair of holes, 204 ... Opening, 300 ... Resin, 500 ... Reader / writer device for IC tag communication, 530 ... Detector.

Claims (15)

  1. 　金属製の容器と、
    　前記金属製容器内に固定された電子部品とを備え、
    　前記電子部品には、複数の導電ピンが接続されており、
    　前記複数の導電ピンと前記電子部品との間に絶縁層が介在しており、
    　前記複数の導電ピンの他端は前記金属製容器内のコネクタ接続用空間に延びており、
    　前記絶縁層内でかつ前記複数の導電ピンの近傍に、少なくとも１つのＩＣタグが配置されており、
    　前記少なくとも１つのＩＣタグは、特定の前記導電ピンと対応付けて設置されており、
    　前記金属製容器に、前記少なくとも１つのＩＣタグの位置に対応した誤差し検知用の位置決め部が設けられている
    ことを特徴とする電子部品組立体。     A metal container;
    An electronic component fixed in the metal container,
    A plurality of conductive pins are connected to the electronic component,
    An insulating layer is interposed between the plurality of conductive pins and the electronic component,
    The other ends of the plurality of conductive pins extend to a connector connection space in the metal container,
    At least one IC tag is disposed in the insulating layer and in the vicinity of the plurality of conductive pins;
    The at least one IC tag is installed in association with the specific conductive pin,
    An electronic component assembly, wherein the metal container is provided with an error detection positioning portion corresponding to the position of the at least one IC tag.
  2. 　請求項１において、
    　前記ＩＣタグは、ＩＣチップと、該ＩＣチップの周囲に巻かれたコイルアンテナとを有し、
    　前記ＩＣタグは、前記コイルアンテナの面が前記対応する導電ピンと直角若しくはそれに近い角度に配置されている
    ことを特徴とする電子部品組立体。     In claim 1,
    The IC tag has an IC chip and a coil antenna wound around the IC chip,
    The electronic tag assembly according to claim 1, wherein the surface of the coil antenna is disposed at a right angle or an angle close to the corresponding conductive pin.
  3. 　請求項１において、
    　電子部品
    　前記ＩＣタグは、コイルやコンデンサなどを用い平面に形成した共振回路を内蔵しＩＣタグであり、
    　前記ＩＣタグは、前記コイルにより形成されるアンテナの面が前記導電ピンと直角もしくはそれに近い角度に配置されている
    ことを特徴とする電子部品組立体。     In claim 1,
    Electronic component The IC tag is an IC tag with a built-in resonance circuit formed in a plane using a coil or a capacitor,
    An electronic component assembly, wherein the IC tag is arranged such that an antenna surface formed by the coil is perpendicular to or close to the conductive pin.
  4. 　請求項１において、
    　前記位置決め部は、前記金属製容器のフランジ部に設けられ前記一対の導電ピンの中心を通る軸線に直角方向に伸びた凹凸構造である
    ことを特徴とする電子部品組立体。     In claim 1,
    The electronic component assembly according to claim 1, wherein the positioning portion has a concavo-convex structure provided in a flange portion of the metal container and extending in a direction perpendicular to an axis passing through the centers of the pair of conductive pins.
  5. 　請求項１において、
    　前記電子部品は、その内部の前記電子部品や前記導電ピンの根元部分と共に、前記金属製容器内に差し込まれ、樹脂で封止されている
    ことを特徴とする電子部品組立体。     In claim 1,
    The electronic component assembly is inserted into the metal container together with the electronic component and the base portion of the conductive pin therein, and is sealed with resin.
  6. 　請求項１において、
    　前記位置決め部は、
    　前記電子部品組立体とＩＣタグ通信用リーダ／ライタ装置との位置合わせ用の位置合わせ嵌合部である
    ことを特徴とする電子部品組立体。     In claim 1,
    The positioning part is
    An electronic component assembly, which is an alignment fitting portion for aligning the electronic component assembly and an IC tag communication reader / writer device.
  7. 　請求項１において、
    　前記位置決め部は、前記金属製容器のフランジ部に設けられた、光学式検知機構による検知用のマークである
    ことを特徴とする電子部品組立体。     In claim 1,
    The electronic component assembly according to claim 1, wherein the positioning portion is a mark for detection by an optical detection mechanism provided on a flange portion of the metal container.
  8. 　ＩＣタグ通信用リーダ／ライタ装置を用いた、電子部品組立体の誤差し検知システムであって、
    　前記電子部品組立体は、
    　金属製の容器と、該金属製容器内に固定された電子部品を備え、
    　前記電子部品には、複数の導電ピンが接続されており、
    　前記複数の導電ピンと前記電子部品との間に絶縁層が介在しており、
    　前記複数の導電ピンの他端は前記金属製容器内のコネクタ接続用空間に延びており、
    　前記絶縁層内でかつ前記複数の導電ピンの近傍に、少なくとも１つのＩＣタグが配置されており、
    　前記少なくとも１つのＩＣタグは、特定の前記導電ピンと対応付けて設置されており、
    　前記金属製容器に、前記ＩＣタグの位置に対応した、前記ＩＣタグ通信用リーダ／ライタ装置用の、位置決め部が設けられており、
    　前記コネクタ接続用空間を、前記ＩＣタグ通信用リーダ／ライタ装置により前記ＩＣタグを検出する窓として利用する
    ことを特徴とする電子部品組立体の誤差し検知システム。     An electronic component assembly error detection system using an IC tag communication reader / writer device,
    The electronic component assembly is
    A metal container, and an electronic component fixed in the metal container,
    A plurality of conductive pins are connected to the electronic component,
    An insulating layer is interposed between the plurality of conductive pins and the electronic component,
    The other ends of the plurality of conductive pins extend to a connector connection space in the metal container,
    At least one IC tag is disposed in the insulating layer and in the vicinity of the plurality of conductive pins;
    The at least one IC tag is installed in association with the specific conductive pin,
    The metal container is provided with a positioning unit for the reader / writer device for IC tag communication corresponding to the position of the IC tag,
    An error detection system for an electronic component assembly, wherein the connector connection space is used as a window for detecting the IC tag by the IC tag communication reader / writer device.
  9. 　請求項８において、
    　前記ＩＣタグ通信用リーダ/ライタ装置は、ＩＣタグ通信用の電磁波を放射する高周波アンテナ回路及び検出部を備えており、
    　前記ＩＣタグ通信用リーダ/ライタ装置を前記金属製容器の所定の位置に対応させた状態において、前記検出部のコイル部が前記ＩＣタグのコイルの面と平行になり、
    　前記検出部と前記ＩＣタグが所定の距離内に固定されているときは、前記検出部と前記ＩＣタグは磁束により電磁結合し、
    　前記検出部と前記ＩＣタグが所定の距離外に固定されているときは、前記検出部と前記ＩＣタグは磁束による検出可能な範囲の外となる
    ことを特徴とする電子部品組立体の誤差し検知システム。     In claim 8,
    The IC tag communication reader / writer device includes a high-frequency antenna circuit that emits electromagnetic waves for IC tag communication and a detection unit,
    In a state where the IC tag communication reader / writer device is made to correspond to a predetermined position of the metal container, the coil portion of the detection unit is parallel to the surface of the coil of the IC tag,
    When the detection unit and the IC tag are fixed within a predetermined distance, the detection unit and the IC tag are electromagnetically coupled by magnetic flux,
    When the detection unit and the IC tag are fixed outside a predetermined distance, the detection unit and the IC tag are outside a detectable range by magnetic flux. Detection system.
  10. 　請求項９において、
    　前記ＩＣタグ通信用リーダ／ライタ装置は、
    　本体の内部に設けられた高周波アンテナ回路と、
    　前記本体の先端部に一体的に設けられた前記検出部と、
    　係合部とを備えており、
    　前記検出部は、前記本体先端から下方に伸びた信号伝送部に接続され、
    　前記検出部は、前記信号伝送部の軸に直角な方向において、検知コイルとして構成されており、
    　前記係合部を前記位置決め部に対応させることにより、該検出部が前記電子部品の前記コネクタ差し込み空間内の所定の位置に固定される
    ことを特徴とする電子部品組立体の誤差し検知システム。     In claim 9,
    The IC tag communication reader / writer device is
    A high-frequency antenna circuit provided inside the main body,
    The detection unit provided integrally with the tip of the main body;
    An engaging portion,
    The detection unit is connected to a signal transmission unit extending downward from the tip of the main body,
    The detection unit is configured as a detection coil in a direction perpendicular to the axis of the signal transmission unit,
    An error detection system for an electronic component assembly, wherein the detecting portion is fixed at a predetermined position in the connector insertion space of the electronic component by making the engaging portion correspond to the positioning portion.
  11. 　請求項９において、
    　前記ＩＣタグ通信用リーダ／ライタ装置は、
    　本体の内部に設けられた第一の高周波アンテナ回路と、
    　前記本体とは別部材として一体に設けられた、第二のアンテナ、及び検出部と、
    　前記第二のアンテナに設けられた係合部とを備えており、
    　前記検出部は、前記信号伝送部の軸に直角な方向において、検知コイルとして構成されており、
    　前記係合部を前記位置決め部と機械的に嵌合させることにより、該検出部が前記電子部品の前記コネクタ差し込み空間内の所定の位置に固定される
    ことを特徴とする電子部品組立体の誤差し検知システム。     In claim 9,
    The IC tag communication reader / writer device is
    A first high-frequency antenna circuit provided inside the main body;
    A second antenna integrally provided as a separate member from the main body, and a detector;
    An engagement portion provided on the second antenna,
    The detection unit is configured as a detection coil in a direction perpendicular to the axis of the signal transmission unit,
    An error of the electronic component assembly, wherein the detecting portion is fixed at a predetermined position in the connector insertion space of the electronic component by mechanically fitting the engaging portion with the positioning portion. Detection system.
  12. 　ＩＣタグ通信用リーダ／ライタ装置を用いた、電子部品組立体の誤差し検知方法であって、
    　前記電子部品組立体は、
    　位置決め部を有する金属製容器と、
    　前記金属製容器内に固定された電子部品とを備え、
    　前記電子部品は、
    　電子部品と、
    　絶縁層を介して前記電子部品に接続された一対の導電ピンとを有し、
    　前記一対の導電ピンの他端は、前記金属製容器内のコネクタ接続用空間に延びており、
    　前記絶縁層内でかつ前記一対の導電ピンの何れか一方の近傍に、ＩＣタグが配置されており、
    　前記ＩＣタグ通信用リーダ／ライタ装置は、ＩＣタグ通信用の電磁波を放射する高周波アンテナ回路及び検出部を備えており、
    　前記ＩＣタグ通信用リーダ／ライタ装置を前記金属製容器の前記位置決め部にセットし、
    　前記コネクタ接続用空間を、前記ＩＣタグを検出する窓として利用し、
    　前記検出部と前記ＩＣタグとの磁束による電磁結合を検知したとき時、前記一対の導電ピンが前記電子部品に対して正規の位置に接続されていると判定し、
    　前記検出部と前記ＩＣタグとの磁束による電磁結合を検出できない時、記一対の導電ピンが前記電子部品に対して正規の位置に接続されていないと判定する
    ことを特徴とする電子部品組立体の誤差し検知方法。     An error detection method for an electronic component assembly using a reader / writer device for IC tag communication,
    The electronic component assembly is
    A metal container having a positioning portion;
    An electronic component fixed in the metal container,
    The electronic component is
    Electronic components,
    A pair of conductive pins connected to the electronic component through an insulating layer;
    The other end of the pair of conductive pins extends to the connector connection space in the metal container,
    An IC tag is disposed in the insulating layer and in the vicinity of one of the pair of conductive pins,
    The reader / writer device for IC tag communication includes a high-frequency antenna circuit that radiates electromagnetic waves for IC tag communication and a detection unit,
    Set the IC tag communication reader / writer device on the positioning part of the metal container,
    The connector connection space is used as a window for detecting the IC tag,
    When the electromagnetic coupling due to the magnetic flux between the detection unit and the IC tag is detected, it is determined that the pair of conductive pins are connected to a regular position with respect to the electronic component,
    An electronic component assembly, wherein when the electromagnetic coupling due to the magnetic flux between the detection unit and the IC tag cannot be detected, it is determined that the pair of conductive pins is not connected to a regular position with respect to the electronic component. Error detection method.
  13. 　請求項１２において、
    　前記絶縁層の外側から前記ＩＣタグ通信用リーダ／ライタ装置の電磁波を前記検出部により前記金属製容器内の前記導電ピンの直近に直接ピンポイントで送り、前記絶縁層の向こう側に対向して設置されている前記ＩＣタグを呼び出すことでＩＣタグ通信を行う
    ことを特徴とする電子部品組立体の誤差し検知方法。     In claim 12,
    From the outside of the insulating layer, the electromagnetic wave of the IC tag communication reader / writer device is sent by the detection unit directly to the vicinity of the conductive pin in the metal container at a pinpoint, and opposed to the other side of the insulating layer. An error detection method for an electronic component assembly, wherein IC tag communication is performed by calling an IC tag installed.
  14. 　請求項１３において、
    　前記ＩＣタグは、ＩＣチップと、該ＩＣチップの周囲に巻かれたコイルアンテナとを有し、
    　前記ＩＣタグは、前記コイルアンテナの面が前記導電ピンと直角若しくはそれに近い角度に配置されており、
    　前記ＩＣタグは、高周波の１次電流から２次電流を誘導することで動作し、該ＩＣタグの情報が２次電流から1次電流へと逆に辿るように誘導されることにより、前記ＩＣタグ通信用リーダ／ライタ装置とのＩＣタグ通信を行う
    ことを特徴とする電子部品組立体の誤差し検知方法。     In claim 13,
    The IC tag has an IC chip and a coil antenna wound around the IC chip,
    The IC tag is arranged such that the surface of the coil antenna is at a right angle with or close to the conductive pin,
    The IC tag operates by inducing a secondary current from a high-frequency primary current, and information on the IC tag is induced so as to trace back from the secondary current to the primary current. An error detection method for an electronic component assembly, comprising performing IC tag communication with a reader / writer device for tag communication.
  15. 　請求項１４において、
    　前記ＩＣタグ通信用リーダ/ライタ装置が前記金属製容器に嵌合したとき、前記検出部のコイル部が前記ＩＣタグのコイルの面と平行になり、かつ、前記検出部と前記ＩＣタグが所定の距離内に固定されているときのみ、前記検出部と前記ＩＣタグが磁束により電磁結合し前記ＩＣタグとのＩＣタグ通信を行う、
    ことを特徴とする電子部品組立体の誤差し検知方法。     In claim 14,
    When the IC tag communication reader / writer device is fitted into the metal container, the coil portion of the detection unit is parallel to the surface of the coil of the IC tag, and the detection unit and the IC tag are predetermined. The detection unit and the IC tag are electromagnetically coupled by magnetic flux to perform IC tag communication with the IC tag only when they are fixed within a distance of
    An electronic component assembly error detection method characterized by the above.
PCT/JP2013/057715 2013-03-18 2013-03-18 Electronic component assembly with ic tag, and error detection system and error detection method therefor WO2014147723A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015506406A JP6077105B2 (en) 2013-03-18 2013-03-18 IC tag-attached electronic component assembly, error detection system thereof, and error detection method
PCT/JP2013/057715 WO2014147723A1 (en) 2013-03-18 2013-03-18 Electronic component assembly with ic tag, and error detection system and error detection method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/057715 WO2014147723A1 (en) 2013-03-18 2013-03-18 Electronic component assembly with ic tag, and error detection system and error detection method therefor

Publications (1)

Publication Number Publication Date
WO2014147723A1 true WO2014147723A1 (en) 2014-09-25

Family

ID=51579458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/057715 WO2014147723A1 (en) 2013-03-18 2013-03-18 Electronic component assembly with ic tag, and error detection system and error detection method therefor

Country Status (2)

Country Link
JP (1) JP6077105B2 (en)
WO (1) WO2014147723A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281161A (en) * 1989-04-24 1990-11-16 Hioki Ee Corp Method for detecting erroneous insertion of terminal of ic part on mounting board
JPH07153875A (en) * 1993-11-29 1995-06-16 Nec Corp Ic socket device
JP2006053702A (en) * 2004-08-11 2006-02-23 Ntn Corp Ic tag utilization method for machine component with ic tag
JP2006275884A (en) * 2005-03-30 2006-10-12 Jtekt Corp Bearing device and its testing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4324059B2 (en) * 2004-09-03 2009-09-02 株式会社日立製作所 IC tag mounting harness
JP4565413B2 (en) * 2006-04-04 2010-10-20 株式会社ひたちなかテクノセンター Wiring connection management system
JP5241479B2 (en) * 2008-12-26 2013-07-17 日立Ｇｅニュークリア・エナジー株式会社 Method for associating RFID with cable connection diagram and cable work support system using the same
JP2012044518A (en) * 2010-08-20 2012-03-01 Kansai Electric Power Co Inc:The Antenna element, antenna module, device for wiring management system provided with the same, and wiring management system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281161A (en) * 1989-04-24 1990-11-16 Hioki Ee Corp Method for detecting erroneous insertion of terminal of ic part on mounting board
JPH07153875A (en) * 1993-11-29 1995-06-16 Nec Corp Ic socket device
JP2006053702A (en) * 2004-08-11 2006-02-23 Ntn Corp Ic tag utilization method for machine component with ic tag
JP2006275884A (en) * 2005-03-30 2006-10-12 Jtekt Corp Bearing device and its testing method

Also Published As

Publication number Publication date
JP6077105B2 (en) 2017-02-08
JPWO2014147723A1 (en) 2017-02-16

Similar Documents

Publication Publication Date Title
JP3957000B1 (en) Antenna coil for board mounting and antenna device
US8304671B2 (en) Position indicator and coordinate input device
CN104134512B (en) Electromagnetic connector
JP4905506B2 (en) Antenna device
CN105164502B (en) Micro- inductive pick-up
JP5429182B2 (en) Wireless IC device
WO2011055702A1 (en) Wireless ic tag, reader/writer, and information processing system
WO2014123142A1 (en) Magnetic sensor device
JP5800118B1 (en) ANTENNA DEVICE AND ELECTRONIC DEVICE
JP5672874B2 (en) Wireless IC tag and RFID system
WO2015194605A1 (en) Magnetic sensor device and method for producing same
WO2017169740A1 (en) Magnetic sensor device
WO2013035820A1 (en) Antenna device, rfid tag, and metal article with antenna device
JPH0794354A (en) Noncontact connector
JP6077105B2 (en) IC tag-attached electronic component assembly, error detection system thereof, and error detection method
JP2007008498A (en) Fastening band containing radio ic tag
WO2012086412A1 (en) Device having reader and writer functions, and article having rfid tag
US12093766B2 (en) Module
CN213904385U (en) RFID tag and article with RFID tag
JP2016170808A (en) Radio ic tag and rfid system
US20110070831A1 (en) Coupler and communication system
JP2008042744A (en) Antenna coil and portable electronic device
JP2007141012A (en) Non-contact ic card reader device
JP5093412B2 (en) Antenna coil and antenna device
JP2018170679A (en) Antenna device and electronic apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13878859

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015506406

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13878859

Country of ref document: EP

Kind code of ref document: A1