JPH07153720A - ダイシング装置のウェハ自給装置 - Google Patents
ダイシング装置のウェハ自給装置Info
- Publication number
- JPH07153720A JPH07153720A JP5321200A JP32120093A JPH07153720A JP H07153720 A JPH07153720 A JP H07153720A JP 5321200 A JP5321200 A JP 5321200A JP 32120093 A JP32120093 A JP 32120093A JP H07153720 A JPH07153720 A JP H07153720A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- stocker
- wafer
- stage
- self
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10P72/00—
-
- H10P52/00—
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Warehouses Or Storage Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5321200A JPH07153720A (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置のウェハ自給装置 |
| GB9423850A GB2284303B (en) | 1993-11-26 | 1994-11-25 | Automatic wafer handler for a dicing machine |
| KR1019940031393A KR950015630A (ko) | 1993-11-26 | 1994-11-26 | 자동 웨이퍼 핸들러를 구비한 다이싱 머신 |
| TW083111332A TW252213B (enExample) | 1993-11-26 | 1994-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5321200A JPH07153720A (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置のウェハ自給装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07153720A true JPH07153720A (ja) | 1995-06-16 |
Family
ID=18129915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5321200A Pending JPH07153720A (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置のウェハ自給装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH07153720A (enExample) |
| KR (1) | KR950015630A (enExample) |
| GB (1) | GB2284303B (enExample) |
| TW (1) | TW252213B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031048A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |
| JP2016016525A (ja) * | 2014-07-04 | 2016-02-01 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111604810B (zh) * | 2020-07-24 | 2020-11-03 | 杭州众硅电子科技有限公司 | 一种晶圆传输设备、化学机械平坦化装置及晶圆传输方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
| US5064337A (en) * | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
-
1993
- 1993-11-26 JP JP5321200A patent/JPH07153720A/ja active Pending
-
1994
- 1994-11-25 GB GB9423850A patent/GB2284303B/en not_active Expired - Fee Related
- 1994-11-26 KR KR1019940031393A patent/KR950015630A/ko not_active Withdrawn
- 1994-12-06 TW TW083111332A patent/TW252213B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031048A1 (ja) * | 2011-08-30 | 2013-03-07 | パナソニック株式会社 | 液剤塗布装置及び液剤塗布方法 |
| JP2016016525A (ja) * | 2014-07-04 | 2016-02-01 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2284303A (en) | 1995-05-31 |
| KR950015630A (ko) | 1995-06-17 |
| GB2284303B (en) | 1997-10-08 |
| TW252213B (enExample) | 1995-07-21 |
| GB9423850D0 (en) | 1995-01-11 |
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