TW252213B - - Google Patents
Info
- Publication number
- TW252213B TW252213B TW083111332A TW83111332A TW252213B TW 252213 B TW252213 B TW 252213B TW 083111332 A TW083111332 A TW 083111332A TW 83111332 A TW83111332 A TW 83111332A TW 252213 B TW252213 B TW 252213B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5321200A JPH07153720A (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置のウェハ自給装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW252213B true TW252213B (zh) | 1995-07-21 |
Family
ID=18129915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083111332A TW252213B (zh) | 1993-11-26 | 1994-12-06 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH07153720A (zh) |
KR (1) | KR950015630A (zh) |
GB (1) | GB2284303B (zh) |
TW (1) | TW252213B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022016623A1 (zh) * | 2020-07-24 | 2022-01-27 | 杭州众硅电子科技有限公司 | 晶圆传输设备、化学机械平坦化装置及晶圆传输方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013049001A (ja) * | 2011-08-30 | 2013-03-14 | Panasonic Corp | 液剤塗布装置及び液剤塗布方法 |
JP6435669B2 (ja) * | 2014-07-04 | 2018-12-12 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
US5064337A (en) * | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
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1993
- 1993-11-26 JP JP5321200A patent/JPH07153720A/ja active Pending
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1994
- 1994-11-25 GB GB9423850A patent/GB2284303B/en not_active Expired - Fee Related
- 1994-11-26 KR KR1019940031393A patent/KR950015630A/ko not_active Application Discontinuation
- 1994-12-06 TW TW083111332A patent/TW252213B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022016623A1 (zh) * | 2020-07-24 | 2022-01-27 | 杭州众硅电子科技有限公司 | 晶圆传输设备、化学机械平坦化装置及晶圆传输方法 |
Also Published As
Publication number | Publication date |
---|---|
GB9423850D0 (en) | 1995-01-11 |
GB2284303A (en) | 1995-05-31 |
KR950015630A (ko) | 1995-06-17 |
GB2284303B (en) | 1997-10-08 |
JPH07153720A (ja) | 1995-06-16 |