JPH0714864Y2 - 半導体耐久試験用の液槽式前処理装置 - Google Patents

半導体耐久試験用の液槽式前処理装置

Info

Publication number
JPH0714864Y2
JPH0714864Y2 JP1990103033U JP10303390U JPH0714864Y2 JP H0714864 Y2 JPH0714864 Y2 JP H0714864Y2 JP 1990103033 U JP1990103033 U JP 1990103033U JP 10303390 U JP10303390 U JP 10303390U JP H0714864 Y2 JPH0714864 Y2 JP H0714864Y2
Authority
JP
Japan
Prior art keywords
sample
storage tank
test
chamber
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990103033U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459451U (enrdf_load_stackoverflow
Inventor
浩一 赤尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatani Corp
Original Assignee
Iwatani Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatani Corp filed Critical Iwatani Corp
Priority to JP1990103033U priority Critical patent/JPH0714864Y2/ja
Publication of JPH0459451U publication Critical patent/JPH0459451U/ja
Application granted granted Critical
Publication of JPH0714864Y2 publication Critical patent/JPH0714864Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1990103033U 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置 Expired - Lifetime JPH0714864Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990103033U JPH0714864Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990103033U JPH0714864Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Publications (2)

Publication Number Publication Date
JPH0459451U JPH0459451U (enrdf_load_stackoverflow) 1992-05-21
JPH0714864Y2 true JPH0714864Y2 (ja) 1995-04-10

Family

ID=31847759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990103033U Expired - Lifetime JPH0714864Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Country Status (1)

Country Link
JP (1) JPH0714864Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5769653B2 (ja) * 2012-03-12 2015-08-26 三菱電機株式会社 熱処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263836A (ja) * 1984-06-12 1985-12-27 Nippon Saamic:Kk 液槽式熱衝撃試験装置
JP2690970B2 (ja) * 1988-10-03 1997-12-17 タバイエスペック株式会社 液槽式環境試験装置

Also Published As

Publication number Publication date
JPH0459451U (enrdf_load_stackoverflow) 1992-05-21

Similar Documents

Publication Publication Date Title
US5331987A (en) Apparatus and method for rinsing and drying substrate
KR100827465B1 (ko) 기판 검사 장치 및 기판 검사 방법
SG183719A1 (en) Method for treating a transport support for the conveyance and atmospheric storage of semiconductor substrates, and treatment station for the implementation of such a method
CN106024672B (zh) 热处理装置以及热处理方法
JP3901570B2 (ja) 電子冷却素子を利用した半導体装置の低温試験装置
JP4942845B2 (ja) フローはんだ付け装置およびフローはんだ付け方法
JPH0868739A (ja) 石炭類の工業分析装置
JP2023048149A (ja) 半導体集積回路チップのテスト用液冷式テストソケット
JPH0714864Y2 (ja) 半導体耐久試験用の液槽式前処理装置
JPH0749411Y2 (ja) 半導体耐久試験用の液槽式前処理装置
JPH07111995B2 (ja) プローブ装置
JP2975797B2 (ja) プローブ装置
JP2019047111A (ja) 搬送装置、基板処理装置及び搬送方法
JPS61198045A (ja) 表面汚染度観察方法
KR970000712B1 (ko) 전기적 프로우빙 시험장치
US6597444B1 (en) Determination of flux coverage
JPH029906B2 (enrdf_load_stackoverflow)
TW200837364A (en) Device batch testing tool and method thereof
JP4558310B2 (ja) 半導体パッケージのテストシステム及びテスト方法
JP2025127137A (ja) 欠陥検査装置、基板接合装置、および欠陥検査方法
US20250033132A1 (en) Solder reflow apparatus and method of manufacturing electronic device
JPH07234262A (ja) Icソケットの洗浄方法及び洗浄装置
JPH02269982A (ja) 半導体装置の評価方法およびその装置
JP3734028B2 (ja) 電子部品のスクリーニング方法及び装置
JP3372924B2 (ja) 半田ボール検査装置及びその検査方法