JPH0713913Y2 - 半田小片 - Google Patents
半田小片Info
- Publication number
- JPH0713913Y2 JPH0713913Y2 JP1985158004U JP15800485U JPH0713913Y2 JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2 JP 1985158004 U JP1985158004 U JP 1985158004U JP 15800485 U JP15800485 U JP 15800485U JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor
- solder piece
- melting point
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 41
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 239000008188 pellet Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6267692U JPS6267692U (enrdf_load_stackoverflow) | 1987-04-27 |
| JPH0713913Y2 true JPH0713913Y2 (ja) | 1995-04-05 |
Family
ID=31081081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158004U Expired - Lifetime JPH0713913Y2 (ja) | 1985-10-16 | 1985-10-16 | 半田小片 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713913Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4765098B2 (ja) * | 2005-10-13 | 2011-09-07 | 富士電機株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155447U (enrdf_load_stackoverflow) * | 1980-04-17 | 1981-11-20 |
-
1985
- 1985-10-16 JP JP1985158004U patent/JPH0713913Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6267692U (enrdf_load_stackoverflow) | 1987-04-27 |
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