JPS56155447U - - Google Patents
Info
- Publication number
- JPS56155447U JPS56155447U JP5308280U JP5308280U JPS56155447U JP S56155447 U JPS56155447 U JP S56155447U JP 5308280 U JP5308280 U JP 5308280U JP 5308280 U JP5308280 U JP 5308280U JP S56155447 U JPS56155447 U JP S56155447U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5308280U JPS56155447U (enrdf_load_stackoverflow) | 1980-04-17 | 1980-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5308280U JPS56155447U (enrdf_load_stackoverflow) | 1980-04-17 | 1980-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56155447U true JPS56155447U (enrdf_load_stackoverflow) | 1981-11-20 |
Family
ID=29647904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5308280U Pending JPS56155447U (enrdf_load_stackoverflow) | 1980-04-17 | 1980-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56155447U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6267692U (enrdf_load_stackoverflow) * | 1985-10-16 | 1987-04-27 |
-
1980
- 1980-04-17 JP JP5308280U patent/JPS56155447U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6267692U (enrdf_load_stackoverflow) * | 1985-10-16 | 1987-04-27 |