JPH0713913Y2 - Solder pieces - Google Patents
Solder piecesInfo
- Publication number
- JPH0713913Y2 JPH0713913Y2 JP1985158004U JP15800485U JPH0713913Y2 JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2 JP 1985158004 U JP1985158004 U JP 1985158004U JP 15800485 U JP15800485 U JP 15800485U JP H0713913 Y2 JPH0713913 Y2 JP H0713913Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor
- solder piece
- melting point
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は半導体素子等の組立において両部品を接合す
る時に使用して好適な半田小片に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a solder piece suitable for use when joining two parts in the assembly of a semiconductor element or the like.
従来、この種の半田小片としては第３図に示すものが知
られている。従来の半導体素子等の組立に使用される半
田小片を第２図，第３図について説明する。ここで、第
３図は高融点半田を母材とするリボン状の半田小片１の
断面図を示す。第２図において、まず半導体用台座2-a
の上に半田小片1-aを設置し、その上に半導体用台座2-b
を設置する。次に、半田小片1-b上に半導体用ペレツト
３を設置する。このような作業を常温で行なつた後、水
素炉等の高温炉に投入する。すると、高温炉内において
半田の融点に到達した時点で半田小片1-a,1-bが完全に
溶け、半導体用台座2-a,2-bおよび半導体用ペレツト３
が接合され、ひとつの半導体素子が形成される。Conventionally, as this kind of solder piece, the one shown in FIG. 3 is known. A small solder piece used for assembling a conventional semiconductor device or the like will be described with reference to FIGS. Here, FIG. 3 shows a cross-sectional view of a ribbon-shaped solder piece 1 having a high melting point solder as a base material. In FIG. 2, first, the semiconductor pedestal 2-a
Place a small piece of solder 1-a on top of it, and mount the semiconductor base 2-b on it.
Set up. Next, the semiconductor pellet 3 is placed on the solder piece 1-b. After performing such work at room temperature, it is put into a high temperature furnace such as a hydrogen furnace. Then, when the melting point of the solder is reached in the high temperature furnace, the solder pieces 1-a, 1-b are completely melted, and the semiconductor pedestals 2-a, 2-b and the semiconductor pellet 3 are melted.
Are joined together to form one semiconductor element.
ところが、従来の半田小片１を使用して半導体用台座2-
a,2-bおよび半導体用ペレツト３を常温で設置して行く
と、常温では半田小片１が溶けないために、組立時の移
送中に各部品が落下したり、位置決めされた各部品の位
置がずれてしまい、再度同様な作業を行なわなければな
らなかつた。また、この作業は非常に注意力が必要とさ
れ、作業能率も悪いという重大な欠点があつた。However, using the conventional solder piece 1, the semiconductor pedestal 2-
When a, 2-b and the semiconductor pellet 3 are installed at room temperature, the solder pieces 1 do not melt at room temperature. Therefore, each part may drop during transportation during assembly or the position of each positioned part. I had to do the same work again. In addition, this work requires a great deal of attention and has a serious drawback that the work efficiency is poor.
この考案は、上記のような問題点を解消するためになさ
れたもので、半導体素子等の組立において接合する両部
品を確実に設置できる半田小片を提供することを目的と
する。The present invention has been made in order to solve the above problems, and an object thereof is to provide a solder piece capable of reliably installing both parts to be joined in the assembly of a semiconductor element or the like.
この考案に係る半田小片は、半田小片の母材より融点の
低い半田をその接合端面に一体成形したものである。The solder piece according to the present invention is one in which a solder having a melting point lower than that of the base material of the solder piece is integrally formed on the joint end surface.
この考案の半田小片においては、組立に際し融点の低い
半田のみを溶かし、接合すべき各部品の一部分を接合さ
せることができる。In the small solder piece of the present invention, only the solder having a low melting point can be melted at the time of assembly, and a part of each component to be bonded can be bonded.
以下、この考案の一実施例を第１図，第２図に基づいて
説明する。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
第１図に示す半田小片は、上記した従来の半田小片１の
両面の一部にその母材より融点の低い低融点の半田11-
a,11-bを一体成形したものである。The small solder piece shown in FIG. 1 has a low melting point solder 11- whose melting point is lower than that of its base material on a part of both surfaces of the conventional small solder piece 1 described above.
It is formed by integrally molding a and 11-b.
次にこの実施例の半田小片を使用した半導体素子の組立
方法を第２図を参照して説明する。昇温されたブロツク
（図示せず）上に半導体用台座2-aを設置し、その上に
半田小片1-aを設置して、さらにその上に半導体台座2-
b,半田小片1-b,半導体用ペレツト３を順次設置する。こ
のとき、半田小片１内に一体成形された半田小片１より
融点の低い半田11-a,11-bが溶ける温度にブロツク上が
昇温しているために、各半田11-a,11-bのみが溶けて半
導体用台座2-aと半導体用台座2-bの一部分が接合され
る。同様に半導体用台座2-bと半導体用ペレツト３の一
部分が接合される。次いで、このようにして接合された
品物を水素炉等の高温炉に投入する。すると、高温炉内
において半田の融点に到達した時点で半田小片１が完全
に溶け、半導体用台座2-a,2-bおよび半導体用ペレツト
３が接合され、ひとつの半導体素子が形成される。Next, a method of assembling a semiconductor device using the solder pieces of this embodiment will be described with reference to FIG. A semiconductor pedestal 2-a is placed on a heated block (not shown), a solder piece 1-a is placed on the pedestal 2-a, and the semiconductor pedestal 2- is placed on the solder pedestal 2-a.
b, the solder piece 1-b, and the semiconductor pellet 3 are sequentially installed. At this time, since the temperature on the block has risen to the temperature at which the solders 11-a, 11-b having a lower melting point than the solder pieces 1 integrally molded in the solder pieces 1 melt, the solders 11-a, 11- Only b is melted and a part of the semiconductor pedestal 2-a and a part of the semiconductor pedestal 2-b are joined. Similarly, the semiconductor pedestal 2-b and a part of the semiconductor pellet 3 are joined. Next, the product thus joined is put into a high temperature furnace such as a hydrogen furnace. Then, when the melting point of the solder is reached in the high temperature furnace, the small solder pieces 1 are completely melted, the semiconductor pedestals 2-a, 2-b and the semiconductor pellet 3 are joined to form one semiconductor element.
このように、この考案に係る半田小片を使用すると、各
部品間は一部分が接合されているため、組立の移送中で
の落下および位置ずれ等は全くなくなり、自動化も可能
になり、大幅な作業能率の向上がはかれる。As described above, when the small solder piece according to the present invention is used, since the parts are partially joined to each other, there is no drop or misalignment during the transfer of the assembly, and automation is also possible. Efficiency can be improved.
なお、以上は半導体素子等の場合について説明したが、
この考案はこれらに限らず、金属と金属を接合する場合
に使用してもよい。In the above, the case of a semiconductor element or the like has been described,
The present invention is not limited to these, and may be used when joining metals to each other.
以上のように、この考案によれば、接合する両部品を確
実に設置できるので、組立に際し移送中での落下，位置
ずれ等がなく、自動化も可能になり、作業能率を大幅に
向上させることができる効果がある。As described above, according to the present invention, since both parts to be joined can be reliably installed, there is no drop or displacement during transfer during assembly, automation is possible, and work efficiency is greatly improved. There is an effect that can be.
第１図はこの考案の一実施例による半田小片を示す断面
図、第２図はこの考案または従来の半田小片を用いた半
導体素子の組立方法を説明するための工程断面図、第３
図は従来の半田小片の断面図である。 １……半田小片、11-a,11-b……融点の低い半田。FIG. 1 is a sectional view showing a solder piece according to an embodiment of the present invention, and FIG. 2 is a process sectional view for explaining a method of assembling a semiconductor device using the solder piece according to the present invention, and FIG.
The figure is a cross-sectional view of a conventional solder piece. 1 ... Solder pieces, 11-a, 11-b ... Solder with low melting point.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 宗形 修 埼玉県草加市谷塚町405番地 千住金属工 業株式会社草加事業所内 (56)参考文献 実開 昭56−155447（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Osamu Munegata 405, Yatsuka-cho, Soka-shi, Saitama Senju Metal Industry Co., Ltd. Soka Works (56) References
Claims (1)
て、該半田小片の母材より融点の低い半田を半田小片の
接合端面に一体成形したことを特徴とする半田小片。1. A solder piece used for joining two parts, wherein a solder having a melting point lower than that of a base material of the solder piece is integrally formed on a joint end surface of the solder piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (en) | 1985-10-16 | 1985-10-16 | Solder pieces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158004U JPH0713913Y2 (en) | 1985-10-16 | 1985-10-16 | Solder pieces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6267692U JPS6267692U (en) | 1987-04-27 |
| JPH0713913Y2 true JPH0713913Y2 (en) | 1995-04-05 |
Family
ID=31081081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158004U Expired - Lifetime JPH0713913Y2 (en) | 1985-10-16 | 1985-10-16 | Solder pieces |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713913Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4765098B2 (en) * | 2005-10-13 | 2011-09-07 | 富士電機株式会社 | Semiconductor device and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155447U (en) * | 1980-04-17 | 1981-11-20 |
-
1985
- 1985-10-16 JP JP1985158004U patent/JPH0713913Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6267692U (en) | 1987-04-27 |
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