JPH07118596B2 - Method and device for replacing chip component storage pack - Google Patents
Method and device for replacing chip component storage packInfo
- Publication number
- JPH07118596B2 JPH07118596B2 JP3031978A JP3197891A JPH07118596B2 JP H07118596 B2 JPH07118596 B2 JP H07118596B2 JP 3031978 A JP3031978 A JP 3031978A JP 3197891 A JP3197891 A JP 3197891A JP H07118596 B2 JPH07118596 B2 JP H07118596B2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- chip
- storage pack
- storage
- pack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
- Container Filling Or Packaging Operations (AREA)
- Packaging Frangible Articles (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リード線の無い小型チ
ップ部品を収納したチップ部品収納パックの交換方法及
び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for replacing a chip component storage pack that accommodates small chip components without lead wires.
【０００２】[0002]
【従来の技術】本出願人は、特願平１−１４０９９４号
において、連続的に周回した収納路をケース内部に形成
し、前記収納路にチップ部品を収納したチップ部品収納
パック(商品名：ディスクパック）を提案している。こ
のチップ部品収納パックは、部品の梱包と供給という全
く別の機能を一体化したもので、ケース内部の収納路に
チップ部品を整列状態で保管できるとともに、前記収納
路に圧縮空気を送り込むことにより収納路端部の部品送
出口よりチップ部品を整列射出することができる。2. Description of the Related Art The applicant of the present invention discloses in Japanese Patent Application No. 1-140994 that a chip part storage pack is formed in which a storage path that continuously circulates is formed inside a case, and chip parts are stored in the storage path. Disc pack) is proposed. This chip parts storage pack integrates completely different functions of packing and supplying parts, and can store chip parts in an aligned state in the storage path inside the case, and by sending compressed air to the storage path. Chip components can be aligned and ejected from the component delivery port at the end of the storage path.
【０００３】[0003]
【発明が解決しようとする課題】ところで、従来、チッ
プ部品収納パックを用いたチップ部品装着機のチップ部
品供給部においては、チップ部品収納パックが空になっ
た場合の交換は手作業に頼っていた。しかしながらプリ
ント基板にチップ部品を装着するためのチップ部品装着
機の連続運転を実現するために、チップ部品供給部のチ
ップ部品収納パックを自動的に交換できることが要望さ
れるようになってきている。By the way, conventionally, in a chip component supply unit of a chip component mounting machine using a chip component storage pack, replacement when the chip component storage pack becomes empty depends on manual work. It was However, in order to realize continuous operation of the chip component mounting machine for mounting the chip components on the printed circuit board, it has been demanded that the chip component storage pack of the chip component supply unit can be automatically replaced.
【０００４】本発明は、上記の点に鑑み、チップ部品収
納パックの上下方向の移動を利用してチップ部品収納パ
ックを用いるチップ部品供給部に新しいチップ部品が充
填されたチップ部品収納パックを装備可能としたチップ
部品収納パックの交換方法及び装置を提供することを目
的とする。In view of the above points, the present invention is equipped with a chip component storage pack in which a new chip component is filled in a chip component supply unit using the chip component storage pack by utilizing the vertical movement of the chip component storage pack. An object of the present invention is to provide a method and an apparatus for replacing a chip component storage pack that is possible.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明のチップ部品収納パックの交換方法は、チッ
プ部品装着機が有するチップ部品供給部が、連続的に周
回した収納路にチップ部品を収納してなるチップ部品収
納パックを着脱自在に装備する複数の区画を有するもの
とし、該チップ部品供給部の上方に配置されてチップ部
品収納パックを着脱自在に収納する複数の区画を有する
収納マガジンを用い、空のチップ部品収納パックの位置
する前記チップ部品供給部の区画から当該空きのチップ
部品収納パックを落下乃至降下させて空き区画とし、前
記収納マガジンの新しいチップ部品収納パックを収納し
た区画を前記チップ部品供給部の空き区画の真上に位置
させ、当該収納マガジンの区画から新しいチップ部品収
納パックを前記チップ部品供給部の空き区画に降下させ
るようにしている。In order to achieve the above object, the method for replacing a chip component storage pack according to the present invention is a chip.
The chip component supply unit of the component mounting machine continuously
One having a plurality of compartments in which a chip part storage pack in which chip parts are stored is detachably mounted in a turned storage path
And is disposed above the chip component supply unit.
Has multiple compartments for detachable storage of product storage packs
Location of empty chip parts storage pack using storage magazine
The empty chip from the section of the chip component supply section
Drop or drop the parts storage pack to create an empty space
Store the new chip parts storage pack in the storage magazine
Located above the empty space of the chip component supply section
The new chip parts are collected from the storage magazine section.
The delivery pack is dropped to an empty section of the chip component supply unit .
【０００６】また、本発明のチップ部品収納パックの交
換装置は、チップ部品収納パックを着脱自在に装備する
とともに該チップ部品収納パックを第１の開閉支持部材
で落下乃至降下自在に支持する複数の区画を有するチッ
プ部品装着機のチップ部品供給部と、該チップ部品供給
部の上方に配置されていて、チップ部品収納パックを着
脱自在に収納するとともに該チップ部品収納パックを第
２の開閉支持部材で落下乃至降下自在に支持する複数の
区画を有する収納マガジンと、前記収納マガジンの区画
内のチップ部品収納パックを降下させて前記チップ部品
供給部の区画に移し変える昇降移し変え手段とを備え、
前記チップ部品供給部及び前記収納マガジンを相対移動
自在として、前記収納マガジンの新しいチップ部品収納
パックを収納した区画を前記チップ部品供給部の空き区
画の真上に位置させ、当該収納マガジンの区画から新し
いチップ部品収納パックを前記チップ部品供給部の空き
区画に前記昇降移し変え手段で降下させることを特徴と
している。 Further, the chip component storing pack exchanging device of the present invention is equipped with the chip component storing pack detachably.
Together with the chip component storage pack, a first opening / closing support member
With a plurality of compartments that support
Chip component supply section of the component mounting machine and the chip component supply
Is placed above the part to detachably store the chip component storage pack and
A plurality of open / close support members that can be dropped or lowered
Storage magazine with compartments and compartments of said storage magazines
An elevating transfer changing means for lowering the chip component storage pack inside and transferring to the compartment of the chip component supply section ,
Relative movement of the chip component supply unit and the storage magazine
Flexible storage of new chip parts in the storage magazine
The space containing the pack is the empty space of the chip component supply unit.
Position it right above the image and refresh it from the compartment of the storage magazine concerned.
Insert a chip component storage pack into the empty chip component supply section.
It is characterized in that it is lowered to the compartment by the lifting / lowering transfer changing means.
are doing.
【０００７】[0007]
【作用】本発明においては、チップ部品供給部内の空き
チップ部品収納パックはチップ部品供給部より落下乃至
降下させることにより排出し、チップ部品が充填された
新しいチップ部品収納パックは収納マガジンからチップ
部品供給部に降下させることによって当該チップ部品供
給部に装備することができる。このように、チップ部品
収納パックを上から下方に移動させることによって、チ
ップ部品収納パックの補充を合理的かつ迅速に実行でき
る。この結果チップ部品供給部よりチップ部品を連続的
に供給でき、ひいてはチップ部品装着機の連続稼動が可
能になる。In the present invention, the empty chip part storage pack in the chip part supply part is discharged by dropping or dropping from the chip part supply part, and the new chip part storage pack filled with chip parts is supplied from the storage magazine. The chip component supply unit can be equipped by lowering it to the supply unit. In this way, by moving the chip component storage pack from the top to the bottom, the chip component storage pack can be refilled reasonably and quickly. As a result, the chip components can be continuously supplied from the chip component supply unit, and the chip component mounting machine can be continuously operated.
【０００８】[0008]
【実施例】以下、本発明に係るチップ部品収納パックの
交換方法及び装置の実施例を図面に従って説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention will be described below with reference to the drawings.
【０００９】図１乃至図５において、１はチップ部品装
着機が有するチップ部品供給部であり、複数個のチップ
部品収納パックＤＰを装備する区画２を有している。各
区画２には圧縮空気導入時に膨張し、圧縮空気排気時に
収縮するベロフラム等が配設されていてチップ部品収納
パックＤＰが着脱自在に配置可能となっている。また、
各区画２の下部にはチップ部品収納パックＤＰを落下乃
至降下自在に支持する開閉支持部材３が設けられてい
る。該開閉支持部材３はシリンダ等により水平状態(チ
ップ部品収納パック支持状態)から垂直状態(チップ部品
収納パック解放状態)に駆動されるようになっている。
このようなチップ部品供給部１は、例えばプリント基板
にチップ部品を装着するためのチップ部品装着機２０に
対して固定である。In FIGS. 1 to 5, reference numeral 1 denotes a chip component supply section of the chip component mounting machine, which has a compartment 2 for mounting a plurality of chip component storage packs DP. Each compartment 2 is provided with a bellowram or the like that expands when compressed air is introduced and contracts when compressed air is exhausted, so that the chip component storage pack DP can be detachably arranged. Also,
An opening / closing support member 3 that supports the chip component storage pack DP so as to drop or descend is provided at the bottom of each compartment 2. The opening / closing support member 3 is driven by a cylinder or the like from a horizontal state (chip component storage pack support state) to a vertical state (chip component storage pack release state).
Such a chip component supply unit 1 is fixed to, for example, a chip component mounting machine 20 for mounting a chip component on a printed circuit board.
【００１０】一方、チップ部品供給部１の上方に所定間
隔を置いて平行に配置された収納マガジン１０は、チッ
プ部品収納パックＤＰを着脱自在に収納する区画１１を
備えており、各区画１１には新しいチップ部品が詰めら
れたチップ部品収納パックＤＰが配置されている。ここ
で、各区画１１の下部にはチップ部品収納パックＤＰを
落下乃至降下自在に支持する開閉支持部材１２が設けら
れており、該開閉支持部材１２はシリンダ等により水平
状態(チップ部品収納パック支持状態)から垂直状態(チ
ップ部品収納パック解放状態)に駆動されるようになっ
ている。この収納マガジン１０はチップ部品装着機２０
に対して横方向スライダ２１を介して取り付けられる。
すなわち、チップ部品供給部１に対して水平方向に相対
移動自在である。On the other hand, the storage magazine 10 arranged in parallel above the chip component supply unit 1 at a predetermined interval is provided with compartments 11 for detachably accommodating the chip component storage pack DP, and each compartment 11 has a compartment 11 therein. Is provided with a chip part storage pack DP filled with new chip parts. Here, an opening / closing support member 12 that supports the chip component storage pack DP so as to drop or descend is provided at the bottom of each compartment 11, and the opening / closing support member 12 is in a horizontal state by a cylinder or the like (chip component storage pack support). The state is driven from the vertical state (chip component storage pack released state). This storage magazine 10 is a chip component mounting machine 20.
Is attached via a lateral slider 21.
That is, it is relatively movable in the horizontal direction with respect to the chip component supply unit 1.
【００１１】図５のように、前記収納マガジン１０から
チップ部品供給部１へチップ部品収納パックＤＰを移し
変えるために昇降移し変え手段としての上下搬送ロボッ
ト３０が設置されており、該上下搬送ロボット３０は下
端部にチップ部品収納パックＤＰを保持可能なチャック
３１を有している。該ロボット３０はチップ部品供給部
１の全部の区画２にチップ部品収納パックＤＰを移し変
えることができるようにチップ部品供給部１の長手方向
（図１の紙面に垂直）に沿う水平方向位置を変えること
ができるようになっている。As shown in FIG. 5, an up / down transfer robot 30 is installed as an up / down transfer changing means for transferring the chip part storage pack DP from the storage magazine 10 to the chip part supply unit 1. The lower end 30 has a chuck 31 capable of holding the chip component storage pack DP. The robot 30 moves a horizontal position along the longitudinal direction (perpendicular to the paper surface of FIG. 1) of the chip component supply unit 1 so that the chip component storage pack DP can be transferred to all the compartments 2 of the chip component supply unit 1. It can be changed.
【００１２】なお、空きチップ部品収納パックの受け皿
３５がチップ部品供給部１の下方に配置されている。The tray 35 for the empty chip component storage pack is arranged below the chip component supply unit 1.
【００１３】今、チップ部品供給部１のある区画２のチ
ップ部品収納パックＤＰが空になった場合、その空きチ
ップ部品収納パックＤＰの位置する区画２の開閉支持部
材３が図４のように垂直状態に開いて空きチップ部品収
納パックＤＰを解放し、チップ部品収納パックＤＰを自
重で受け皿３５上に落下させる。その後、図５のように
空きとなった区画２の真上に位置する収納マガジン側区
画１１内の新しいチップ部品収納パックＤＰを上下搬送
ロボット３０のチャック３１で保持(挟持)してから当該
区画１１の開閉支持部材１２を垂直状態に開き、チャッ
ク３１の下降動作により新しいチップ部品収納パックＤ
Ｐを降下させて水平状態に復帰したチップ部品供給部側
区画２の開閉支持部材３上に載置する。その後、新しい
チップ部品収納パックＤＰはベロフラム等の働きで当該
区画２側に固定的に支持され、新しいチップ部品収納パ
ックＤＰからチップ部品がチップ部品装着機２０に供給
されることになる。When the chip component storage pack DP in the compartment 2 in which the chip component supply unit 1 is present is empty, the open / close support member 3 of the compartment 2 in which the empty chip component storage pack DP is located is as shown in FIG. It is opened vertically to release the empty chip component storage pack DP, and the chip component storage pack DP is dropped on the tray 35 by its own weight. After that, as shown in FIG. 5, the new chip component storage pack DP in the storage magazine-side compartment 11 located right above the empty compartment 2 is held (sandwiched) by the chuck 31 of the vertical transport robot 30, The open / close support member 12 of 11 is opened vertically, and a new chip component storage pack D
P is lowered and placed on the open / close support member 3 of the section 2 on the side of the chip component supply unit that has returned to the horizontal state. After that, the new chip component storage pack DP is fixedly supported on the section 2 side by the action of the bellows or the like, and the chip components are supplied from the new chip component storage pack DP to the chip component mounting machine 20.
【００１４】なお、空きとなったチップ部品供給部側区
画２の真上に位置する収納マガジン側区画１１に該当す
る新しいチップ部品収納パックＤＰが存在しない場合に
は、該当する新しいチップ部品収納パックＤＰが存在す
る区画１１が真上に来るまで収納マガジン１０を移動さ
せてから図５に示す上下搬送ロボット３０の動作を実行
すればよい。If there is no new chip component storage pack DP corresponding to the storage magazine side compartment 11 located directly above the empty chip component supply section side compartment 2, the corresponding new chip component storage pack DP is not present. It suffices to move the storage magazine 10 until the section 11 in which the DP is present is directly above and then execute the operation of the vertical transport robot 30 shown in FIG.
【００１５】上記実施例では、チップ部品供給部１から
の空きチップ部品収納パックＤＰの排出を自重による落
下で行ったが、空きチップ部品収納パックＤＰの排出動
作にも上下搬送ロボットを用いてチップ部品収納パック
ＤＰをチャックしながら受け皿まで降下させても良い。
なお、各区画２,１１の空きはセンサにより確認するこ
とができる。In the above-described embodiment, the empty chip component storage pack DP is discharged from the chip component supply unit 1 by dropping it by its own weight. However, the vertical transfer robot is also used for discharging the empty chip component storage pack DP. The component storage pack DP may be chucked and lowered to the tray.
The vacancy of each section 2, 11 can be confirmed by a sensor.
【００１６】[0016]
【発明の効果】以上説明したように、本発明によれば、
チップ部品収納パックを利用したチップ部品供給部に対
してチップ部品収納パックを上下方向に移動させること
によって新しいチップ部品収納パックを合理的かつ迅速
に補充でき、チップ部品供給部からチップ部品を継続し
て供給することができ、ひいてはチップ部品装着機の連
続運転を可能にすることができる。As described above, according to the present invention,
By moving the chip part storage pack up and down with respect to the chip part supply part using the chip part storage pack, a new chip part storage pack can be rationally and quickly replenished, and the chip parts are continued from the chip part supply part. It is possible to continuously supply the chip component mounting machine.
【図１】本発明に係るチップ部品収納パックの交換方法
及び装置の実施例の概略正面図である。FIG. 1 is a schematic front view of an embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention.
【図２】実施例において用いる収納マガジンの平面図で
ある。FIG. 2 is a plan view of a storage magazine used in the embodiment.
【図３】実施例において用いるチップ部品供給部の平面
図である。FIG. 3 is a plan view of a chip component supply unit used in an example.
【図４】実施例における空きチップ部品収納パックの排
出動作を説明する正面図である。FIG. 4 is a front view illustrating the discharging operation of the empty chip component storage pack according to the embodiment.
【図５】実施例における新しいチップ部品収納パックの
供給動作を説明する正面図である。 １ チップ部品供給部 ２,１１ 区画 １０ 収納マガジン ２０ チップ部品装着機 ３０ 上下搬送ロボット ３１ チャック反転アーム ＤＰ チップ部品収納パックFIG. 5 is a front view illustrating a supply operation of a new chip component storage pack according to the embodiment. 1 Chip Component Supply Unit 2,11 Section 10 Storage Magazine 20 Chip Component Mounting Machine 30 Vertical Transfer Robot 31 Chuck Reversing Arm DP Chip Component Storage Pack
フロントページの続き (72)発明者 伊藤 武 東京都中央区日本橋一丁目13番１号 ティ ーディーケイ株式会社内 (56)参考文献 特開 平１−225399（ＪＰ，Ａ) 実開 平２−111682（ＪＰ，Ｕ)Front Page Continuation (72) Inventor Takeshi Ito 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (56) Reference JP-A-1-225399 (JP, A) Mitsuihei 2-111682 ( JP, U)
Claims (2)
給部は、連続的に周回した収納路にチップ部品を収納し
てなるチップ部品収納パックを着脱自在に装備する複数
の区画を有するものであり、該チップ部品供給部の上方
に配置されてチップ部品収納パックを着脱自在に収納す
る複数の区画を有する収納マガジンを用い、空のチップ
部品収納パックの位置する前記チップ部品供給部の区画
から当該空きのチップ部品収納パックを落下乃至降下さ
せて空き区画とし、前記収納マガジンの新しいチップ部
品収納パックを収納した区画を前記チップ部品供給部の
空き区画の真上に位置させ、当該収納マガジンの区画か
ら新しいチップ部品収納パックを前記チップ部品供給部
の空き区画に降下させることを特徴とするチップ部品収
納パックの交換方法。1. A chip component supply provided in a chip component mounting machine.
The feeding part stores the chip parts in the storage path that continuously circulates.
Multiple equipped with the chip component storage pack detachably composed Te
Above the chip component supply section.
The chip parts storage pack is detachably stored.
Using a storage magazine with multiple compartments, empty chips
Section of the chip component supply unit in which the component storage pack is located
Drop or drop the empty chip parts storage pack from
Let it be an empty section, and use the new tip section of the storage magazine.
The compartment containing the product storage pack is
Position it directly above the empty compartment, and
New chip parts storage pack from the chip parts supply section
A method for replacing a chip component storage pack, characterized by lowering it to an empty space .
するとともに該チップ部品収納パックを第１の開閉支持
部材で落下乃至降下自在に支持する複数の区画を有する
チップ部品装着機のチップ部品供給部と、該チップ部品
供給部の上方に配置されていて、チップ部品収納パック
を着脱自在に収納するとともに該チップ部品収納パック
を第２の開閉支持部材で落下乃至降下自在に支持する複
数の区画を有する収納マガジンと、前記収納マガジンの
区画内のチップ部品収納パックを降下させて前記チップ
部品供給部の区画に移し変える昇降移し変え手段とを備
え、 前記チップ部品供給部及び前記収納マガジンを相対移動
自在として、前記収納マガジンの新しいチップ部品収納
パックを収納した区画を前記チップ部品供給部の空き区
画の真上に位置させ、当該収納マガジンの区画から新し
いチップ部品収納パックを前記チップ部品供給部の空き
区画に前記昇降移し変え手段で降下させること を特徴と
するチップ部品収納パックの交換装置。2. A chip component storage pack is detachably mounted and the chip component storage pack is supported by a first opening / closing support.
Has multiple compartments that are supported by members so that they can be dropped or lowered
Chip component supply unit of chip component mounting machine and the chip component
The chip component storage pack is arranged above the supply unit and detachably stores the chip component storage pack.
The second opening / closing support member so as to be freely dropped or lowered.
A storage magazine with several compartments and the storage magazine
And means for lowering and moving the chip component storage pack in the compartment and transferring it to the compartment of the chip component supply unit.
Eh, the chip parts supply section and the storage magazine are moved relative to each other.
Flexible storage of new chip parts in the storage magazine
The space containing the pack is the empty space of the chip component supply unit.
Position it right above the image and refresh it from the compartment of the storage magazine concerned.
Insert a chip component storage pack into the empty chip component supply section.
A device for exchanging a chip component storage pack, characterized in that the device is lowered into the compartment by the elevating and transferring means .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3031978A JPH07118596B2 (en) | 1991-01-31 | 1991-01-31 | Method and device for replacing chip component storage pack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3031978A JPH07118596B2 (en) | 1991-01-31 | 1991-01-31 | Method and device for replacing chip component storage pack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0548292A JPH0548292A (en) | 1993-02-26 |
| JPH07118596B2 true JPH07118596B2 (en) | 1995-12-18 |
Family
ID=12346035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3031978A Expired - Fee Related JPH07118596B2 (en) | 1991-01-31 | 1991-01-31 | Method and device for replacing chip component storage pack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07118596B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011316A (en) * | 2016-10-21 | 2017-01-12 | 富士機械製造株式会社 | Cassette type feeder replacement system of component mounting machine |
| JP6717866B2 (en) * | 2018-02-07 | 2020-07-08 | 株式会社Ｆｕｊｉ | Cassette mounter replacement system for component mounters |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2623646B2 (en) * | 1988-03-04 | 1997-06-25 | 松下電器産業株式会社 | Component mounting device |
| JPH0752072Y2 (en) * | 1989-02-23 | 1995-11-29 | ティーディーケイ株式会社 | Electronic component storage pack |
-
1991
- 1991-01-31 JP JP3031978A patent/JPH07118596B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0548292A (en) | 1993-02-26 |
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|---|---|---|---|
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Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960611 |
|
| S533 | Written request for registration of change of name |
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| R350 | Written notification of registration of transfer |
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| LAPS | Cancellation because of no payment of annual fees |