JPH07118595B2 - Method and device for replacing chip component storage pack - Google Patents

Method and device for replacing chip component storage pack

Info

Publication number
JPH07118595B2
JPH07118595B2 JP3015813A JP1581391A JPH07118595B2 JP H07118595 B2 JPH07118595 B2 JP H07118595B2 JP 3015813 A JP3015813 A JP 3015813A JP 1581391 A JP1581391 A JP 1581391A JP H07118595 B2 JPH07118595 B2 JP H07118595B2
Authority
JP
Japan
Prior art keywords
chip component
storage
chip
empty
pack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3015813A
Other languages
Japanese (ja)
Other versions
JPH04340300A (en
Inventor
哲生 高橋
邦夫 茂木
孝治 工藤
武 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP3015813A priority Critical patent/JPH07118595B2/en
Publication of JPH04340300A publication Critical patent/JPH04340300A/en
Publication of JPH07118595B2 publication Critical patent/JPH07118595B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リード線の無い小型チ
ップ部品を収納したチップ部品収納パックの交換方法及
び装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for replacing a chip component storage pack that accommodates small chip components without lead wires.

【0002】[0002]

【従来の技術】本出願人は、特願平1−140994号
において、連続的に周回した収納路をケース内部に形成
し、前記収納路にチップ部品を収納したチップ部品収納
パック(商品名:ディスクパック)を提案している。こ
のチップ部品収納パックは、部品の梱包と供給という全
く別の機能を一体化したもので、ケース内部の収納路に
チップ部品を整列状態で保管できるとともに、前記収納
路に圧縮空気を送り込むことにより収納路端部の部品送
出口よりチップ部品を整列射出することができる。
2. Description of the Related Art The applicant of the present invention discloses in Japanese Patent Application No. 1-140994 that a chip part storage pack is formed in which a storage path that continuously circulates is formed inside a case, and chip parts are stored in the storage path. Disc pack) is proposed. This chip parts storage pack integrates completely different functions of packing and supplying parts, and can store chip parts in an aligned state in the storage path inside the case, and by sending compressed air to the storage path. Chip components can be aligned and ejected from the component delivery port at the end of the storage path.

【0003】[0003]

【発明が解決しようとする課題】ところで、従来、チッ
プ部品収納パックを用いたチップ部品装着機のチップ部
品供給部においては、チップ部品収納パックが空になっ
た場合の交換は手作業に頼っていた。しかしながらプリ
ント基板にチップ部品を装着するためのチップ部品装着
機の連続運転を実現するために、チップ部品供給部のチ
ップ部品収納パックを自動的に交換できることが要望さ
れるようになってきている。
By the way, conventionally, in a chip component supply unit of a chip component mounting machine using a chip component storage pack, replacement when the chip component storage pack becomes empty depends on manual work. It was However, in order to realize continuous operation of the chip component mounting machine for mounting the chip components on the printed circuit board, it has been demanded that the chip component storage pack of the chip component supply unit can be automatically replaced.

【0004】本発明は、上記の点に鑑み、チップ部品収
納パックを用いるチップ部品供給部から空きのチップ部
品収納パックを取り出し、新しいチップ部品が充填され
たチップ部品収納パックを装備可能としたチップ部品の
交換方法及び装置を提供することを目的とする。
In view of the above points, the present invention takes out an empty chip component storage pack from a chip component supply unit using the chip component storage pack, and makes it possible to equip a chip component storage pack filled with new chip components. An object of the present invention is to provide a method and apparatus for replacing parts.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明のチップ部品収納パックの交換方法は、連続
的に周回した収納路にチップ部品を収納してなるチップ
部品収納パックを出し入れ自在に収納する複数の区画を
有し、該複数の区画のうち一部は空き区画とした収納マ
ガジンを用い、チップ部品装着機が有するチップ部品供
給部の複数の区画に着脱自在に装備されたチップ部品収
納パックのうち空きのものが位置する区画と前記収納マ
ガジンの空き区画とを対向させ、前記チップ部品供給部
の空きのチップ部品収納パックを解放して当該空きのチ
ップ部品収納パックを前記収納マガジンの空き区画に排
出した後、新しいチップ部品収納パックが位置する前記
収納マガジンの区画を前記空きのチップ部品収納パック
を排出した前記チップ部品供給部の区画に対向させ、
記収納マガジンの区画に収納されていた前記新しいチッ
プ部品収納パックを前記チップ部品供給部に装備するよ
うにしている。
In order to achieve the above object, the method for replacing a chip component storage pack according to the present invention is a continuous method.
To the circulation was housing passage has a plurality of compartments and out freely accommodating the chip component storage pack formed by housing the chip component, using a storage magazine and an empty compartment some of the compartments of the plurality of chips Of the chip component storage packs detachably mounted in the plurality of compartments of the chip component supply unit of the component mounting machine, the space where the empty one is located and the storage container
The chip component supply section is made to face the empty section of Gajin.
Release the empty chip parts storage pack of
Put the parts storage pack in the empty compartment of the storage magazine.
After taking out, the new chip parts storage pack is located
The storage magazine section is filled with the empty chip parts storage pack.
It was opposed to the partition of the chip component supply unit which is discharged, and the new chip component storage pack is housed in a compartment of the storage magazine to equip the chip component supply unit.

【0006】また、本発明のチップ部品収納パックの交
換装置は、連続的に周回した収納路にチップ部品を収納
してなるチップ部品収納パックを出し入れ自在に収納す
る複数の区画を有し、該複数の区画のうち一部は空き区
画とした収納マガジンと、前記チップ部品収納パックを
着脱自在に装備する複数の区画を有するチップ部品装着
機のチップ部品供給部と、前記収納マガジン又はチップ
部品供給部の少なくとも一方を移動させて前記収納マガ
ジン側の所定区画と前記チップ部品供給部側の所定区画
とを対向させる手段と、前記収納マガジン及び前記チッ
プ部品供給部の相互に対向する区画間でチップ部品収納
パックを移し変える手段とを備えた構成としている。
Further, in the chip component storage pack exchanging device of the present invention, the chip components are stored in the storage path which is continuously circulated.
And a plurality of compartments which chip components accommodated a housing pack freely out comprising, a storage magazine and an empty compartment some of the compartments of the plurality, the plurality equipped with the chip component storage pack detachably Mounting of chip parts with compartments
And the chip component supply section of the machine, said moving at least one of the storage magazine or chip component supply unit housing Maga
Predetermined section on the gin side and predetermined section on the chip component supply unit side
And a means for making the storage magazine and the chip
And a means for transferring the chip component storage pack between the mutually facing compartments of the component supply section .

【0007】[0007]

【作用】本発明においては、チップ部品供給部側の空き
チップ部品収納パックを収納マガジンの空き区画に移し
変え、その後収納マガジンに保持されていた新しいチッ
プ部品収納パックをチップ部品供給部に対して装備する
ことができ、この結果チップ部品供給部よりチップ部品
を連続的に供給でき、ひいてはチップ部品装着機の連続
稼動が可能になる。
In the present invention, the empty chip component storage pack on the side of the chip component supply unit is moved to the empty section of the storage magazine, and then the new chip component storage pack held in the storage magazine is transferred to the chip component supply unit. As a result, chip components can be continuously supplied from the chip component supply unit, and thus the chip component mounting machine can be continuously operated.

【0008】[0008]

【実施例】以下、本発明に係るチップ部品収納パックの
交換方法及び装置の実施例を図面に従って説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention will be described below with reference to the drawings.

【0009】図1乃至図3において、1はチップ部品装
着機が有するチップ部品供給部であり、複数個のチップ
部品収納パックDPを装備する区画2を有している。各
区画2には圧縮空気導入時に膨張し、圧縮空気排気時に
収縮するベロフラム4が配設されており、チップ部品収
納パックDPが着脱自在に配置されるようになってい
る。すなわち、チップ部品収納パックDPを区画2内に
配置したときには、ベロフラム4に圧縮空気を導入して
ベロフラム4の膨張によりチップ部品収納パックDPを
固定する。逆に区画2からチップ部品収納パックDPを
排出する場合にはベロフラム4から圧縮空気を抜きベロ
フラム4を収縮状態としてチップ部品収納パックDPを
解放する。このようなチップ部品供給部1は、例えばプ
リント基板にチップ部品を装着するためのチップ部品装
着機に対して固定である。
In FIGS. 1 to 3, reference numeral 1 denotes a chip component supply section of the chip component mounting machine, which has a compartment 2 for mounting a plurality of chip component storage packs DP. Each compartment 2 is provided with a bellows 4 that expands when compressed air is introduced and contracts when compressed air is exhausted, and the chip component storage pack DP is detachably arranged. That is, when the chip component storage pack DP is arranged in the compartment 2, compressed air is introduced into the bellows drum 4 to expand the bellows drum 4 to fix the chip component storage pack DP. On the contrary, when the chip component storage pack DP is discharged from the compartment 2, the compressed air is released from the bellows 4 and the bellows drum 4 is contracted to release the chip component storage pack DP. Such a chip component supply unit 1 is fixed to, for example, a chip component mounting machine for mounting a chip component on a printed circuit board.

【0010】一方、収納マガジン10はチップ部品収納
パックDPを出し入れ自在に収納する区画11を備えて
おり、各区画11には1個おきに新しいチップ部品が詰
められたチップ部品収納パックDPが配置されている。
即ちチップ部品収納パックDPが配置される区画と空き
区画とが交互に位置するようになっている。ここで、各
区画11の配列間隔をP1(例えば10mm)としたと
き、チップ部品供給部1側の区画2の配列間隔は2×P
1である。このような収納マガジン10は移動手段(例
えば移動載置台)により前記チップ部品供給部に沿って
(近接対向状態で)移動可能なようになっている。
On the other hand, the storage magazine 10 is provided with compartments 11 for accommodating the chip component storage packs DP so that they can be freely taken in and out, and each compartment 11 has a chip component storage pack DP filled with every other new chip component. Has been done.
That is, the section in which the chip component storage pack DP is arranged and the empty section are alternately located. Here, when the array interval of each partition 11 is P1 (for example, 10 mm), the array interval of the partition 2 on the chip component supply unit 1 side is 2 × P.
It is 1. Such a storage magazine 10 can be moved along the chip component supply section (in a close proximity state) by moving means (for example, a moving mounting table).

【0011】今、チップ部品供給部1のある区画のチッ
プ部品収納パックDPが空になった場合、図2のように
移動手段によって収納マガジン10を配列間隔P1だけ
移動させ、収納マガジン10の空き区画11をチップ部
品供給部1側の空きチップ部品収納パックDPが位置す
る区画2に対向させておき、ベロフラム4を収縮状態と
してチップ部品収納パックDPを解放状態に設定する。
次いで、チップ部品供給部1側の移し変え手段としての
伸縮自在なプッシャ5により区画2内の空きチップ部品
収納パックDPを収納マガジン側の空き区画11に押し
出し、空きチップ部品収納パックDPを収納マガジン側
に移し変える。その後、図3のようにチップ部品供給部
1の空きになった区画2に対し、収納マガジン10の配
列間隔P1分の移動により新しいチップ部品の詰まった
チップ部品収納パックDPを保持した区画11を対向さ
せ、収納マガジン側移し変え手段としての伸縮自在なプ
ッシャ12により新しいチップ部品収納パックDPをチ
ップ部品供給部1に移し変えて装備させる。それから、
チップ部品供給部側のベロフラム4が圧縮空気により膨
張し、チップ部品収納パックDPを確実に保持する。
When the chip component storage pack DP in a section of the chip component supply unit 1 is emptied, the storage magazine 10 is moved by the arrangement interval P1 by the moving means as shown in FIG. The compartment 11 is opposed to the compartment 2 where the empty chip component storage pack DP on the side of the chip component supply unit 1 is located, and the bellows drum 4 is contracted to set the chip component storage pack DP to the open state.
Next, the extensible pusher 5 as a transfer means on the chip component supply unit 1 side pushes the empty chip component storage pack DP in the compartment 2 into the empty compartment 11 on the storage magazine side to store the empty chip component storage pack DP in the storage magazine. Move to the side. After that, as shown in FIG. 3, with respect to the empty section 2 of the chip component supply unit 1, the section 11 holding the chip component storage pack DP filled with new chip components is moved by moving the storage magazine 10 by the arrangement interval P1. The new chip component storage pack DP is transferred to the chip component supply unit 1 by the retractable pusher 12 as a transfer means on the storage magazine side so as to be mounted. then,
The bellows drum 4 on the side of the chip component supply unit is expanded by the compressed air to securely hold the chip component storage pack DP.

【0012】上記実施例によれば、チップ部品供給部1
に対して収納マガジン10を近接対向配置とすることが
可能で占有スペースが少なく、また収納マガジン10の
区画11において交互に空き区画を設けたので、収納マ
ガジン10の移動ストロークを必要最小限に抑えること
ができる。なお、各区画2,11の空きはセンサにより
確認することができる。
According to the above embodiment, the chip component supply unit 1
On the other hand, the storage magazines 10 can be arranged in close proximity to each other and occupy a small space, and since empty sections are alternately provided in the sections 11 of the storage magazines 10, the movement stroke of the storage magazines 10 can be minimized. be able to. The vacancy of each section 2 and 11 can be confirmed by a sensor.

【0013】図4は本発明の他の実施例であり、30は
プリント基板にチップ部品を装着するためのチップ部品
装着機であり、該チップ部品装着機30が備えるチップ
部品供給部1の構造及び収納マガジン10の構造自体は
図1乃至図3の場合と同様である。この図4の実施例で
は収納マガジン10を移動載置台20上に着脱自在に配
置し、空となった(保持するチップ部品収納パックDP
が全て空きのものとなった)収納マガジン10を排出ト
ランスファ(コンベア)21に送り出し、新しいチップ部
品収納パックを保持した新規の収納マガジン10を搬入
トランスファ(コンベア)22より移動載置台20上に受
け入れてこれを保持するようにしたものである。
FIG. 4 shows another embodiment of the present invention, in which 30 is a chip component mounting machine for mounting a chip component on a printed circuit board, and the structure of the chip component supply unit 1 provided in the chip component mounting machine 30. The structure itself of the storage magazine 10 is the same as that shown in FIGS. In the embodiment of FIG. 4, the storage magazine 10 is detachably arranged on the movable mounting table 20 and becomes empty (the chip component storage pack DP to be held).
The storage magazine 10 that has become empty) is sent to the discharge transfer (conveyor) 21, and the new storage magazine 10 holding a new chip component storage pack is received from the transfer transfer (conveyor) 22 on the movable mounting table 20. It is designed to hold this.

【0014】図4の構成によれば、収納マガジン10の
交換も自動で行えるため、チップ部品収納パックDPの
交換工程の管理がさらに容易となり、ロッド替えの自動
化等にも適応可能となる。
According to the configuration shown in FIG. 4, since the storage magazine 10 can be replaced automatically, the replacement process of the chip component storage pack DP can be more easily managed and the rod replacement can be automated.

【0015】なお、上記実施例では収納マガジンの区画
においてチップ部品収納パックを有する区画と空き区画
とが交互に存在するようにしたが、空き区画を複数個連
続的に設けるようにしても差し支えない。
In the above embodiment, the compartments of the storage magazine are arranged so that the compartments containing the chip component storage packs and the empty compartments are alternately present. However, a plurality of empty compartments may be continuously provided. .

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
チップ部品収納パックを利用したチップ部品供給部に対
して新しいチップ部品収納パックを迅速に補充でき、チ
ップ部品供給部からチップ部品を継続して供給すること
ができ、ひいてはチップ部品装着機の連続運転を可能に
することができる。
As described above, according to the present invention,
A new chip component storage pack can be quickly replenished to the chip component supply unit using the chip component storage pack, chip components can be continuously supplied from the chip component supply unit, and in turn, continuous operation of the chip component mounting machine. Can be enabled.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るチップ部品収納パックの交換方法
及び装置の実施例の概略平面図である。
FIG. 1 is a schematic plan view of an embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention.

【図2】実施例においてチップ部品供給部から収納マガ
ジンへチップ部品収納パックを移し変える動作を示す部
分平面図である。
FIG. 2 is a partial plan view showing the operation of transferring the chip component storage pack from the chip component supply unit to the storage magazine in the embodiment.

【図3】実施例において収納マガジンからチップ部品供
給部へチップ部品収納パックを移し変える動作を示す部
分平面図である。
FIG. 3 is a partial plan view showing an operation of transferring the chip component storage pack from the storage magazine to the chip component supply unit in the embodiment.

【図4】本発明の他の実施例を示す概略平面図である。FIG. 4 is a schematic plan view showing another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 チップ部品供給部 2,11 区画 4 ベロフラム 5,12 プッシャ 10 収納マガジン 20 移動台 21 排出トランスファ 22 搬入トランスファ 1 Chip Component Supply Section 2, 11 Section 4 Bellofrum 5,12 Pusher 10 Storage Magazine 20 Moving Stand 21 Ejecting Transfer 22 Carrying In Transfer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 伊藤 武 東京都中央区日本橋一丁目13番1号ティー ディーケイ株式会社内 (56)参考文献 特開 平1−225399(JP,A) 実開 平2−111682(JP,U) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takeshi Ito 1-13-1 Nihonbashi, Chuo-ku, Tokyo, TDK Corporation (56) References JP-A-1-225399 (JP, A) -111682 (JP, U)

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 連続的に周回した収納路にチップ部品を
収納してなるチップ部品収納パックを出し入れ自在に収
納する複数の区画を有し、該複数の区画のうち一部は空
き区画とした収納マガジンを用い、チップ部品装着機が
有するチップ部品供給部の複数の区画に着脱自在に装備
されたチップ部品収納パックのうち空きのものが位置す
る区画と前記収納マガジンの空き区画とを対向させ、前
記チップ部品供給部の空きのチップ部品収納パックを解
放して当該空きのチップ部品収納パックを前記収納マガ
ジンの空き区画に排出した後、新しいチップ部品収納パ
ックが位置する前記収納マガジンの区画を前記空きのチ
ップ部品収納パックを排出した前記チップ部品供給部の
区画に対向させ、前記収納マガジンの区画に収納されて
いた前記新しいチップ部品収納パックを前記チップ部品
供給部に装備することを特徴とするチップ部品収納パッ
クの交換方法。
1. A chip component is placed in a storage path that is continuously circulated.
A chip component mounting machine is provided which has a plurality of compartments for accommodating the stored chip component storage packs so that the chip component storage packs can be freely taken in and out, and some of the plurality of compartments are empty compartments.
The empty ones of the chip component storage packs that are detachably mounted in the multiple compartments of the chip component supply unit
Front section and the empty section of the storage magazine,
Open the empty chip parts storage pack in the chip parts supply section.
Let go of the empty chip parts storage pack
After discharging to the empty space of the gin,
Section of the storage magazine in which the
Of the chip component supply section that has discharged the component storage pack
It is opposed to the partition, replacing the chip component storage pack, characterized in that it equipped with the new chip component storage pack is housed in a compartment of the storage magazine to the chip component supply unit.
【請求項2】 連続的に周回した収納路にチップ部品を
収納してなるチップ部品収納パックを出し入れ自在に収
納する複数の区画を有し、該複数の区画のうち一部は空
き区画とした収納マガジンを載置台上に着脱自在に配置
し、チップ部品装着機が有するチップ部品供給部の複数
の区画に着脱自在に装備されたチップ部品収納パックの
うち空きのものが位置する区画と前記収納マガジンの空
き区画とを対向させ、前記チップ部品供給部の空きのチ
ップ部品収納パックを解放して当該空きのチップ部品収
納パックを前記収納マガジンの空き区画に排出した後、
新しいチップ部品収納パックが位置する前記収納マガジ
ンの区画を前記空きのチップ部品収納パックを排出した
前記チップ部品供給部の区画に対向させ、前記収納マガ
ジンの区画に収納されていた前記新しいチップ部品収納
パックを前記チップ部品供給部に装備し、前記収納マガ
ジンが保持するチップ部品収納パックが全て空きのもの
になったとき、前記載置台上の前記収納マガジンを排出
トランスファに送り出し、搬入トランスファを介して新
しいチップ部品収納パックを保持した新規の収納マガジ
ンを前記載置台上に配置することを特徴とするチップ部
品収納パックの交換方法。
2. A chip part is placed in a storage path which is continuously circulated.
It has a plurality of compartments for storing the stored chip component storage packs so that it can be freely taken in and out, and a storage magazine in which some of the plurality of compartments are empty compartments is detachably arranged on the mounting table to mount the chip components. Of the chip parts supply section of the machine
Of the chip parts storage packs that are detachably installed in the compartment of
And the empty compartment of the chip component supply section.
Release the parts storage pack to collect the empty chip parts.
After discharging the delivery pack to the empty section of the storage magazine,
The storage box where the new chip parts storage pack is located
The empty chip parts storage pack was discharged from the
Said chip component is opposed to the partition of the feed section, the said new chip component storage pack is housed in a compartment of the storage magazine is equipped with the chip component supply unit, the chip component storage pack storing magazine holds all vacant When it becomes the one of the above, the storage magazine on the mounting table is sent to the discharge transfer, and a new storage magazine holding a new chip component storage pack is arranged on the mounting table via the transfer transfer. How to replace the chip parts storage pack.
【請求項3】 連続的に周回した収納路にチップ部品を
収納してなるチップ部品収納パックを出し入れ自在に収
納する複数の区画を有し、該複数の区画のうち一部は空
き区画とした収納マガジンと、前記チップ部品収納パッ
クを着脱自在に装備する複数の区画を有するチップ部品
装着機のチップ部品供給部と、前記収納マガジン又はチ
ップ部品供給部の少なくとも一方を移動させて前記収納
マガジン側の所定区画と前記チップ部品供給部側の所定
区画とを対向させる手段と、前記収納マガジン及び前記
チップ部品供給部の相互に対向する区画間でチップ部品
収納パックを移し変える手段とを備えたことを特徴とす
るチップ部品収納パックの交換装置。
3. A chip part is placed in a storage path which is continuously circulated.
A plurality of compartments and out freely accommodating the housing and the chip component storage pack comprising: a housing magazine which was vacant compartment some of the compartments of the plurality of the plurality equipped with the chip component storage pack detachably Chip part having a compartment
The chip parts supply section of the mounting machine and at least one of the storage magazine or the chip parts supply section are moved to store them.
Predetermined section on the magazine side and predetermined section on the chip component supply unit side
Means for facing the compartment , the storage magazine and the
A device for exchanging chip component storage packs, comprising means for transferring the chip component storage packs between mutually facing sections of the chip component supply unit .
【請求項4】 前記収納マガジンはチップ部品収納パッ
クを収納した区画と空き区画とが交互に配置されている
請求項3記載のチップ部品収納パックの交換装置。
4. The chip component storage pack exchanging device according to claim 3, wherein the storage magazines are arranged such that the compartments storing the chip component storage packs and the empty compartments are alternately arranged.
JP3015813A 1991-01-16 1991-01-16 Method and device for replacing chip component storage pack Expired - Fee Related JPH07118595B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3015813A JPH07118595B2 (en) 1991-01-16 1991-01-16 Method and device for replacing chip component storage pack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3015813A JPH07118595B2 (en) 1991-01-16 1991-01-16 Method and device for replacing chip component storage pack

Publications (2)

Publication Number Publication Date
JPH04340300A JPH04340300A (en) 1992-11-26
JPH07118595B2 true JPH07118595B2 (en) 1995-12-18

Family

ID=11899287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3015813A Expired - Fee Related JPH07118595B2 (en) 1991-01-16 1991-01-16 Method and device for replacing chip component storage pack

Country Status (1)

Country Link
JP (1) JPH07118595B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2623646B2 (en) * 1988-03-04 1997-06-25 松下電器産業株式会社 Component mounting device
JPH0752072Y2 (en) * 1989-02-23 1995-11-29 ティーディーケイ株式会社 Electronic component storage pack

Also Published As

Publication number Publication date
JPH04340300A (en) 1992-11-26

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