JP2508434B2 - Electronic component mounting device - Google Patents

Description

The present invention relates to an apparatus for mounting electronic components on a printed wiring board, and more particularly to an electronic component mounting apparatus capable of mounting plural types of odd-shaped electronic components at high speed. It is a thing.

[Outline of Invention]

According to the present invention, the supply parts of the electronic parts are arranged on both sides of the mounting part, and the required electronic parts are taken in by the separate electronic part taking-in members from both the supplying parts. In the state where the electronic parts are being supplied, the other part is put on standby by the standby part so that the electronic parts are alternately supplied from the two take-in members to the mounting part, so that plural kinds of odd-shaped electronic parts can be mounted at high speed. It was done.

[Conventional technology]

Conventional electronic component mounting apparatuses for automatically supplying electronic components to mount them on a printed wiring board include those disclosed in Japanese Patent Publication No. 60-18160 and Japanese Patent Publication No. 61-76224.

In the former device, electronic components are fixed on a tape in advance at equal intervals, and a large number of tape feeding units with the tape-connected electronic components are mounted in the left-right direction with respect to a component mounting head portion provided in the central portion of the device body. The tape feeding unit having the selected predetermined component is mounted on the front surface of the mounting head unit by loading the unit on the unit moving base, and the lead of the predetermined component is read on the mounting head unit. The wire is cut and separated from the tape, and the lead wire is formed into a predetermined shape and mounted on the printed wiring board.

In the latter device, the stick containing the electronic parts is mounted on the holder and placed vertically on the base of the parts supply unit, and the stick changer shifts the parts so that they are sequentially replaced. Is dropped onto the chute portion, conveyed to the mounting portion by the work member, and mounted on the printed wiring board.

[Problems to be solved by the invention]

In such a conventional electronic component mounting apparatus, in the former case, the electronic component supply unit is moved with respect to the mounting head unit to take out a predetermined component, and in the latter device, the electronic component supply unit is fixed. The work member is moved to and from the mounting head part to take out a predetermined component, but a drawback common to both is that in order to speed up the movement of the mounting device, the electronic component supply part It is necessary to optimally arrange the parts in the supply part or reorganize the program so that the parts are always arranged in the vicinity of the mounting head part according to the program of the mounting order, and it takes time to prepare the work when changing the mounting model. This requires a lot of work and reduces the overall work efficiency.

In view of the above point, the present invention provides an electronic component mounting apparatus that realizes high-speed operation and easy mounting program change without changing the arrangement of the component supply unit even when the mounting model is changed. The purpose is to

[Means for solving problems]

In order to solve the above-described problems, the present invention provides an electronic component supply unit located on both sides of an electronic component mounting head unit of an apparatus main body, takes in electronic components corresponding to each supply unit, and mounts a mounting head. The transfer member is arranged so as to be movable, and the electronic components are separately supplied to the both side transfer members from the supply section. One of the transfer members supplies the electronic component to the mounting head. In the state in which the electronic parts are loaded, the other part is placed in a standby state in which the electronic parts are loaded, and the electronic parts are alternately supplied from the loading transfer members to the mounting head portion.

[Action]

With this configuration, when the electronic component selected by one of the electronic component supply units is supplied to the mounting head unit by one of the loading members and mounted, the electronic component of the other electronic component supply unit is mounted. Is selected and the operation of taking in the other taking-in member is performed, and the other taking-in member is waited in the vicinity of the mounting head portion. Then, when mounting of the electronic component supplied from one supply unit is completed, the electronic component of the other supply unit is supplied to the mounting head from the other take-in member on standby, and mounting is performed.

In this way, the electronic components are alternately supplied to the mounting head from both supply units, and the mounting on the printed wiring board is continuously performed at a high speed.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

In the figure, (1) shows the main body of the electronic component mounting apparatus,
(2) is a mounting head portion of the electronic component.
A), (2b), (2c) and (2d) are moved up and down by the drive cam mechanism. (3) is a board positioner section (XY table) which is located below the mounting head section (2) and holds the wiring board, and moves forward, backward, leftward and rightward to position the wiring board for mounting.
(4) and (5) are electronic component supply sections arranged on both sides of the rear of the mounting head section 2, and (6) and (7) are front end sides of the supply sections (4) and (5), respectively. A sequencer that moves in the left-right direction along the direction of loading electronic components, (8), (9)
Is an electronic component transfer pallet that is moved downward from both sides of the mounting head part (2) corresponding to the front ends of the supply parts (4) and (5), that is, the substrate positioner part. A loader section (L side) (10a) and an unloader section (UL side) (10b) are provided across the board positioner section by a board loader that transfers the wiring board to (3) and discharges it after mounting electronic components. .

The electronic component supply units (4) and (5) are configured to load and store electronic components on the stick (11), and a plurality of sticks (11) are stored in one stick magazine (12). In the stick magazine (12) of this example, the base plate (13) and the slide plate (14) are slidably engaged in the front-rear direction to form a pair of slide plates (14) having a substantially U-shaped cross section. The stick holder guides (15) and (16) are arranged so as to face each other in the front and back, and the stick (11) is attached to the stick holder guides (15) and (16).
Is provided with an engaging mechanism so as to be stored and discharged to one by one, and an escape drive unit (17) for driving this engaging mechanism is made to correspond thereto.

The stick magazine (12) has an electronic component supply unit (4) at the rear end of the base plate (13).
The escape drive unit (17) is fixed to the support frames (4a) and (5a) so as to be attachable to and detachable from the support frames (4a) and (5a) so as to be pivotable. , A state in which the stick magazine (12) with respect to this unit (17) is swung downward from a horizontally raised position for supplying the stick (11) to the stick holder guides (15) and (16), That is, by being placed in the set state, it corresponds to the lateral direction.

When the stick (11) is ejected in the set state of the stick magazine (12), its mouth is located above the shooter (18) from which electronic parts are ejected, and the shooter (18) is a sequencer (6). , (7) below the moving part.

Next, the operation of the apparatus of this example configured as described above
It will be described with reference to the drawings.

Different types of electronic components are discharged to the shooters (18) corresponding to the stick magazines (12) of the electronic component supply units (4) and (5) on both sides. In this state, both sequencers (6) and (7) follow other programs according to the program,
That is, regardless of the operations of the mounting head portion (2), the substrate positioner portion (3), and the transfer pallets (8), (9), the desired electronic components on the shooter (18) can be freely moved to the left or right to obtain 1 to 4 of them. In this state, the sequencers (6) and (7) move the electronic components that have been taken in by moving to the transfer pallets (8) and (9) that are on standby on both sides of the mounting head section (2). Place on transfer pallets (8), (9).

On the other hand, for example, the transfer pallet (8) on the left side moves to the lower side of the mounting head portion (2) and stops, and in this state, each mounting head (2a), (2b), (2c), (2d) Move down to grab the corresponding electronic components and move up again, and then the transfer pallet (8) returns to the left side supply part (4) side, that is, the left side standby position. During this operation, the substrate positioner unit (3) has a loader unit (L side) of the substrate loader (10).
The wiring board is sent in and set by (10a).

Then, the mounting heads (2a) to (2d) holding the electronic components of the mounting head portion (2) are lowered to sequentially insert the electronic components into the wiring board. The mounting heads (2a) to (2d) move up again after inserting the electronic components, and by this rise, for example, the transfer pallet (9) on the right side of the supply unit (5) side.
Moves to the lower side of the mounting head portion (2), and while
That is, as in the case where the transfer pallet (8) on the left side is moved, the electronic components on the transfer pallet (9) on the right side are gripped by the mounting heads (2a) to (2d), and wiring is performed again as described above. Electronic components are inserted, that is, mounted on the substrate.

During this operation, that is, during the transfer of electronic components to the mounting heads (2a) to (2d) by the right side transfer pallet (9) and the mounting operation on the wiring board by this mounting head, the left side supply unit (4) side , The electronic parts are selected by the sequencer (6), loaded, placed on the left side transfer pallet (8) located in the left side part of the mounting head part (2), that is, the left side standby part, and this left side transfer pallet (8) Stands by for the mounting head section (2) with the required electronic components mounted thereon. When the mounting of the electronic component from the right side transfer pallet (9) is completed, the electronic component is delivered from the left side transfer pallet (8) to the mounting heads (2a) to (2d) by the above-mentioned operation.

The above operation is repeated in sequence and the substrate positioner unit (3)
Electronic components are mounted over the entire wiring board. When this mounting is completed, the wiring board is unloaded from the unloader (UL side) (10b) of the board loader section (10) to obtain an electronic component mounted wiring board.

The above operation is performed based on the operation flow chart shown in FIG. 4 as an example.

In the above configuration, the sequencer (6),
(7) and the transfer pallets (8) and (9) may be combined and integrated, and the configurations of the supply units (4) and (5) are not limited to those of the embodiment, and the accommodated electronic components may be selected. Any electronic component may be ejected from each accommodation part so that it can be taken in.

〔The invention's effect〕

As described above, according to the present invention, the electronic component supply units are wired on both sides of the mounting head unit, and the electronic components are taken in and transferred to the mounting head unit corresponding to each electronic component supply unit. The take-in members are arranged, and the both take-in members supply the electronic heads alternately selected from both sides to the mounting head of the mounting head portion to mount them on the wiring board. Since it suffices to selectively load the electronic components on the other side when the electronic components are supplied from the mounting side, it is possible to have a margin in this selective loading time and it is not necessary to consider the housing arrangement position of each electronic component It is easy to assemble and electronic components can be mounted at high speed. Also, when changing the model, the placement position of new electronic components can only be changed to the empty supply line or unnecessary placement position. It is easy to change the model and the investment effect is improved, especially so-called odd-shaped electronic parts such as dip ICs and keyboard switches have various shapes and the number of mounting on one wiring board is small, so it is fast It is hoped that the time required for mounting and model change will be shortened, but this can be fully accommodated.

[Brief description of drawings]

1 is a perspective view of an example of an electronic component mounting apparatus according to the present invention, FIG. 2 is a side sectional view of the apparatus shown in FIG. 1, FIG. 3 is the same operation explanatory view of the apparatus, and FIG. 4 is an operation flow. It is a figure. In the figure, (1) is the apparatus main body, (2) is the mounting head section,
(3) is a substrate positioner unit, (4) and (5) are electronic component supply units, (6) and (7) are sequencers, (8),
(9) is a transfer pallet, (11) is a stick, and (12) is a stick magazine.

Claims (1)

(57) [Claims] 1. An electronic component supply section is disposed on both sides of a mounting head section of an apparatus main body, and an electronic component is taken in and transferred to the mounting head section corresponding to each of the electronic component supply sections. An intake / transport member is arranged so that the electronic components can be separately taken into the both-side intake / transport members from the supply section, respectively. When one of the intake / transport members supplies the electronic component to the mounting head section, the other is transferred to the other side. The electronic component mounting apparatus is characterized in that the electronic components are alternately supplied from the both take-in transfer members to the mounting head portion while being waited for.