JPH0548292A - Method and apparatus for replacement of chip-component housing pack - Google Patents

Method and apparatus for replacement of chip-component housing pack

Info

Publication number
JPH0548292A
JPH0548292A JP3031978A JP3197891A JPH0548292A JP H0548292 A JPH0548292 A JP H0548292A JP 3031978 A JP3031978 A JP 3031978A JP 3197891 A JP3197891 A JP 3197891A JP H0548292 A JPH0548292 A JP H0548292A
Authority
JP
Japan
Prior art keywords
chip component
chip
storage pack
pack
component storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3031978A
Other languages
Japanese (ja)
Other versions
JPH07118596B2 (en
Inventor
Tetsuo Takahashi
哲生 高橋
Kunio Mogi
邦夫 茂木
Koji Kudo
孝治 工藤
Takeshi Ito
武 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP3031978A priority Critical patent/JPH07118596B2/en
Publication of JPH0548292A publication Critical patent/JPH0548292A/en
Publication of JPH07118596B2 publication Critical patent/JPH07118596B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Automatic Assembly (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To take out an empty chip-component feed pack and to automatically mount a new chip-component housing pack, in which chip components are housed, on a chip-component feed part in a chip-component mounting machine. CONSTITUTION:The title method and apparatus are constituted being provided in the following manner: a housing magazine 10 which houses a chip-component housing pack DP so as to be freely attachable and detachable is installed at the upper position of a chip-component feed part 1 in a chip-component mounting machine 20; an empty chip-component housing pack is dropped or lowered from the chip-component feed part; a new chip-component housing pack is dropped or lowered to the chip-component feed part from the housing magazine.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リード線の無い小型チ
ップ部品を収納したチップ部品収納パックの交換方法及
び装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for replacing a chip component storage pack containing a small chip component without lead wires.

【0002】[0002]

【従来の技術】本出願人は、特願平1−140994号
において、連続的に周回した収納路をケース内部に形成
し、前記収納路にチップ部品を収納したチップ部品収納
パック(商品名:ディスクパック)を提案している。こ
のチップ部品収納パックは、部品の梱包と供給という全
く別の機能を一体化したもので、ケース内部の収納路に
チップ部品を整列状態で保管できるとともに、前記収納
路に圧縮空気を送り込むことにより収納路端部の部品送
出口よりチップ部品を整列射出することができる。
2. Description of the Related Art The applicant of the present invention discloses in Japanese Patent Application No. 1-140994 that a chip part storage pack is formed in which a storage path that continuously circulates is formed inside a case, and chip parts are stored in the storage path. Disc pack) is proposed. This chip parts storage pack integrates completely different functions of packing and supply of parts, and can store chip parts in the storage path inside the case in an aligned state, and by sending compressed air to the storage path. The chip components can be aligned and ejected from the component delivery port at the end of the storage path.

【0003】[0003]

【発明が解決しようとする課題】ところで、従来、チッ
プ部品収納パックを用いたチップ部品装着機のチップ部
品供給部においては、チップ部品収納パックが空になっ
た場合の交換は手作業に頼っていた。しかしながらプリ
ント基板にチップ部品を装着するためのチップ部品装着
機の連続運転を実現するために、チップ部品供給部のチ
ップ部品収納パックを自動的に交換できることが要望さ
れるようになってきている。
By the way, conventionally, in a chip component supply unit of a chip component mounting machine using a chip component storage pack, replacement when the chip component storage pack becomes empty depends on manual work. It was However, in order to realize continuous operation of the chip component mounting machine for mounting the chip components on the printed circuit board, it has been demanded that the chip component storage pack of the chip component supply unit can be automatically replaced.

【0004】本発明は、上記の点に鑑み、チップ部品収
納パックの上下方向の移動を利用してチップ部品収納パ
ックを用いるチップ部品供給部に新しいチップ部品が充
填されたチップ部品収納パックを装備可能としたチップ
部品収納パックの交換方法及び装置を提供することを目
的とする。
In view of the above points, the present invention is equipped with a chip component storage pack in which a new chip component is filled in a chip component supply section using the chip component storage pack by utilizing the vertical movement of the chip component storage pack. An object of the present invention is to provide a method and an apparatus for replacing a chip component storage pack that is possible.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明のチップ部品収納パックの交換方法は、チッ
プ部品収納パックを着脱自在に装備するチップ部品供給
部から空のチップ部品収納パックを落下乃至降下させ、
該チップ部品供給部の上方に配置されてチップ部品収納
パックを着脱自在に収納する収納マガジンから新しいチ
ップ部品収納パックを前記チップ部品供給部に降下させ
るようにしている。
In order to achieve the above object, a method of exchanging a chip component storage pack according to the present invention is such that an empty chip component storage pack is detached from a chip component supply section equipped with the chip component storage pack detachably. Drop or drop
A new chip component storage pack is arranged above the chip component supply unit and detachably stores the chip component storage pack, and a new chip component storage pack is dropped to the chip component supply unit.

【0006】また、本発明のチップ部品収納パックの交
換装置は、チップ部品収納パックを着脱自在に装備する
チップ部品供給部の上方に、チップ部品収納パックを着
脱自在に収納する収納マガジンを配置し、前記収納マガ
ジン内のチップ部品収納パックを降下させて前記チップ
部品供給部に移し変える昇降移し変え手段を設けた構成
としている。
Further, in the chip component storing pack exchanging device according to the present invention, a storing magazine for detachably storing the chip component storing pack is arranged above the chip component supplying portion for detachably mounting the chip component storing pack. An arrangement is provided in which the chip component storage pack in the storage magazine is moved down and moved to the chip component supply unit to move up and down.

【0007】[0007]

【作用】本発明においては、チップ部品供給部内の空き
チップ部品収納パックはチップ部品供給部より落下乃至
降下させることにより排出し、チップ部品が充填された
新しいチップ部品収納パックは収納マガジンからチップ
部品供給部に降下させることによって当該チップ部品供
給部に装備することができる。このように、チップ部品
収納パックを上から下方に移動させることによって、チ
ップ部品収納パックの補充を合理的かつ迅速に実行でき
る。この結果チップ部品供給部よりチップ部品を連続的
に供給でき、ひいてはチップ部品装着機の連続稼動が可
能になる。
According to the present invention, the empty chip component storage pack in the chip component supply unit is discharged by dropping or dropping from the chip component supply unit, and a new chip component storage pack filled with chip components is stored in the storage magazine. It is possible to equip the chip component supply unit by lowering it to the supply unit. In this way, by moving the chip component storage pack from the top to the bottom, the chip component storage pack can be refilled reasonably and quickly. As a result, chip components can be continuously supplied from the chip component supply unit, and the chip component mounting machine can be continuously operated.

【0008】[0008]

【実施例】以下、本発明に係るチップ部品収納パックの
交換方法及び装置の実施例を図面に従って説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention will be described below with reference to the drawings.

【0009】図1乃至図5において、1はチップ部品装
着機が有するチップ部品供給部であり、複数個のチップ
部品収納パックDPを装備する区画2を有している。各
区画2には圧縮空気導入時に膨張し、圧縮空気排気時に
収縮するベロフラム等が配設されていてチップ部品収納
パックDPが着脱自在に配置可能となっている。また、
各区画2の下部にはチップ部品収納パックDPを落下乃
至降下自在に支持する開閉支持部材3が設けられてい
る。該開閉支持部材3はシリンダ等により水平状態(チ
ップ部品収納パック支持状態)から垂直状態(チップ部品
収納パック解放状態)に駆動されるようになっている。
このようなチップ部品供給部1は、例えばプリント基板
にチップ部品を装着するためのチップ部品装着機20に
対して固定である。
In FIGS. 1 to 5, reference numeral 1 denotes a chip component supply section of the chip component mounting machine, which has a compartment 2 for mounting a plurality of chip component storage packs DP. Each compartment 2 is provided with a bellowram or the like that expands when compressed air is introduced and contracts when compressed air is exhausted, so that the chip component storage pack DP can be detachably arranged. Also,
An opening / closing support member 3 that supports the chip component storage pack DP so as to drop or descend is provided at the bottom of each compartment 2. The open / close support member 3 is driven by a cylinder or the like from a horizontal state (chip component storage pack support state) to a vertical state (chip component storage pack release state).
Such a chip component supply unit 1 is fixed to, for example, a chip component mounting machine 20 for mounting a chip component on a printed circuit board.

【0010】一方、チップ部品供給部1の上方に所定間
隔を置いて平行に配置された収納マガジン10は、チッ
プ部品収納パックDPを着脱自在に収納する区画11を
備えており、各区画11には新しいチップ部品が詰めら
れたチップ部品収納パックDPが配置されている。ここ
で、各区画11の下部にはチップ部品収納パックDPを
落下乃至降下自在に支持する開閉支持部材12が設けら
れており、該開閉支持部材12はシリンダ等により水平
状態(チップ部品収納パック支持状態)から垂直状態(チ
ップ部品収納パック解放状態)に駆動されるようになっ
ている。この収納マガジン10はチップ部品装着機20
に対して横方向スライダ21を介して取り付けられる。
すなわち、チップ部品供給部1に対して水平方向に相対
移動自在である。
On the other hand, the storage magazine 10 arranged in parallel above the chip component supply unit 1 at a predetermined interval is provided with compartments 11 for detachably accommodating the chip component storage pack DP, and each compartment 11 has a compartment 11 therein. Is provided with a chip part storage pack DP filled with new chip parts. Here, an opening / closing support member 12 that supports the chip component storage pack DP so as to be dropped or lowered is provided at the bottom of each compartment 11, and the opening / closing support member 12 is in a horizontal state (chip component storage pack support It is designed to be driven from the state) to the vertical state (chip component storage pack released state). This storage magazine 10 is a chip component mounting machine 20.
Is attached via a lateral slider 21.
In other words, it is movable relative to the chip component supply unit 1 in the horizontal direction.

【0011】図5のように、前記収納マガジン10から
チップ部品供給部1へチップ部品収納パックDPを移し
変えるために昇降移し変え手段としての上下搬送ロボッ
ト30が設置されており、該上下搬送ロボット30は下
端部にチップ部品収納パックDPを保持可能なチャック
31を有している。該ロボット30はチップ部品供給部
1の全部の区画2にチップ部品収納パックDPを移し変
えることができるようにチップ部品供給部1の長手方向
(図1の紙面に垂直)に沿う水平方向位置を変えること
ができるようになっている。
As shown in FIG. 5, an up-and-down transfer robot 30 is installed as an up-and-down transfer changing means for transferring the chip component storage pack DP from the storage magazine 10 to the chip component supply unit 1. The lower end 30 has a chuck 31 capable of holding the chip component storage pack DP. The robot 30 moves a horizontal position along the longitudinal direction (perpendicular to the paper surface of FIG. 1) of the chip component supply unit 1 so that the chip component storage pack DP can be transferred to all the compartments 2 of the chip component supply unit 1. It can be changed.

【0012】なお、空きチップ部品収納パックの受け皿
35がチップ部品供給部1の下方に配置されている。
The tray 35 for the empty chip component storage pack is arranged below the chip component supply unit 1.

【0013】今、チップ部品供給部1のある区画2のチ
ップ部品収納パックDPが空になった場合、その空きチ
ップ部品収納パックDPの位置する区画2の開閉支持部
材3が図4のように垂直状態に開いて空きチップ部品収
納パックDPを解放し、チップ部品収納パックDPを自
重で受け皿35上に落下させる。その後、図5のように
空きとなった区画2の真上に位置する収納マガジン側区
画11内の新しいチップ部品収納パックDPを上下搬送
ロボット30のチャック31で保持(挟持)してから当該
区画11の開閉支持部材12を垂直状態に開き、チャッ
ク31の下降動作により新しいチップ部品収納パックD
Pを降下させて水平状態に復帰したチップ部品供給部側
区画2の開閉支持部材3上に載置する。その後、新しい
チップ部品収納パックDPはベロフラム等の働きで当該
区画2側に固定的に支持され、新しいチップ部品収納パ
ックDPからチップ部品がチップ部品装着機20に供給
されることになる。
When the chip component storage pack DP in the compartment 2 in which the chip component supply unit 1 is present is empty, the open / close support member 3 of the compartment 2 in which the empty chip component storage pack DP is located is as shown in FIG. It is opened vertically to release the empty chip component storage pack DP, and the chip component storage pack DP is dropped onto the tray 35 by its own weight. After that, as shown in FIG. 5, the new chip component storage pack DP in the storage magazine-side compartment 11 located right above the empty compartment 2 is held (sandwiched) by the chuck 31 of the vertical transport robot 30, The opening / closing support member 12 of 11 is opened vertically, and a new chip component storage pack D
P is lowered and placed on the open / close support member 3 of the section 2 on the chip component supply section side that has returned to the horizontal state. After that, the new chip component storage pack DP is fixedly supported on the section 2 side by the action of the bellows or the like, and the chip components are supplied from the new chip component storage pack DP to the chip component mounting machine 20.

【0014】なお、空きとなったチップ部品供給部側区
画2の真上に位置する収納マガジン側区画11に該当す
る新しいチップ部品収納パックDPが存在しない場合に
は、該当する新しいチップ部品収納パックDPが存在す
る区画11が真上に来るまで収納マガジン10を移動さ
せてから図5に示す上下搬送ロボット30の動作を実行
すればよい。
If there is no new chip component storage pack DP corresponding to the storage magazine side compartment 11 located right above the empty chip component supply section side compartment 2, the corresponding new chip component storage pack DP is not present. It suffices to move the storage magazine 10 until the section 11 in which the DP is present is directly above, and then execute the operation of the vertical transport robot 30 shown in FIG.

【0015】上記実施例では、チップ部品供給部1から
の空きチップ部品収納パックDPの排出を自重による落
下で行ったが、空きチップ部品収納パックDPの排出動
作にも上下搬送ロボットを用いてチップ部品収納パック
DPをチャックしながら受け皿まで降下させても良い。
なお、各区画2,11の空きはセンサにより確認するこ
とができる。
In the above-described embodiment, the empty chip component storage pack DP is discharged from the chip component supply unit 1 by dropping it by its own weight, but the vertical transfer robot is also used for discharging the empty chip component storage pack DP. The component storage pack DP may be chucked and lowered to the tray.
The vacancy of each section 2, 11 can be confirmed by a sensor.

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
チップ部品収納パックを利用したチップ部品供給部に対
してチップ部品収納パックを上下方向に移動させること
によって新しいチップ部品収納パックを合理的かつ迅速
に補充でき、チップ部品供給部からチップ部品を継続し
て供給することができ、ひいてはチップ部品装着機の連
続運転を可能にすることができる。
As described above, according to the present invention,
By moving the chip component storage pack up and down with respect to the chip component supply unit that uses the chip component storage pack, a new chip component storage pack can be rationally and quickly replenished, and the chip components are continued from the chip component supply unit. Can be supplied as a result, which in turn enables continuous operation of the chip component mounting machine.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るチップ部品収納パックの交換方法
及び装置の実施例の概略正面図である。
FIG. 1 is a schematic front view of an embodiment of a method and apparatus for replacing a chip component storage pack according to the present invention.

【図2】実施例において用いる収納マガジンの平面図で
ある。
FIG. 2 is a plan view of a storage magazine used in the embodiment.

【図3】実施例において用いるチップ部品供給部の平面
図である。
FIG. 3 is a plan view of a chip component supply unit used in an example.

【図4】実施例における空きチップ部品収納パックの排
出動作を説明する正面図である。
FIG. 4 is a front view for explaining the discharging operation of the empty chip component storage pack in the embodiment.

【図5】実施例における新しいチップ部品収納パックの
供給動作を説明する正面図である。 1 チップ部品供給部 2,11 区画 10 収納マガジン 20 チップ部品装着機 30 上下搬送ロボット 31 チャック反転アーム DP チップ部品収納パック
FIG. 5 is a front view illustrating a supply operation of a new chip component storage pack according to the embodiment. 1 Chip Component Supply Unit 2,11 Section 10 Storage Magazine 20 Chip Component Mounting Machine 30 Vertical Transfer Robot 31 Chuck Reversing Arm DP Chip Component Storage Pack

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 チップ部品収納パックを着脱自在に装備
するチップ部品供給部から空のチップ部品収納パックを
落下乃至降下させ、該チップ部品供給部の上方に配置さ
れてチップ部品収納パックを着脱自在に収納する収納マ
ガジンから新しいチップ部品収納パックを前記チップ部
品供給部に降下させることを特徴とするチップ部品収納
パックの交換方法。
1. An empty chip component storage pack is dropped or dropped from a chip component supply unit which is equipped with a chip component storage pack detachably, and the chip component storage pack is detachably arranged above the chip component supply unit. A method for exchanging a chip component storage pack, characterized in that a new chip component storage pack is dropped from the storage magazine to be stored in the chip component storage unit to the chip component supply unit.
【請求項2】 チップ部品収納パックを着脱自在に装備
するチップ部品供給部の上方に、チップ部品収納パック
を着脱自在に収納する収納マガジンを配置し、前記収納
マガジン内のチップ部品収納パックを降下させて前記チ
ップ部品供給部に移し変える昇降移し変え手段を設けた
ことを特徴とするチップ部品収納パックの交換装置。
2. A storage magazine for detachably storing the chip component storage pack is arranged above a chip component supply unit that detachably equips the chip component storage pack, and the chip component storage pack in the storage magazine is lowered. An apparatus for exchanging chip component storage packs, which is provided with an elevating / displacement changing means for changing and moving to the chip component supply section.
【請求項3】 前記チップ部品供給部及び前記収納マガ
ジンがチップ部品収納パックを落下乃至降下自在に支持
するものである請求項2記載のチップ部品収納パックの
交換装置。
3. The chip component storage pack exchanging device according to claim 2, wherein the chip component supply unit and the storage magazine support a chip component storage pack so that it can be dropped or lowered.
【請求項4】 前記チップ部品供給部及び前記収納マガ
ジンが相対移動自在である請求項2記載のチップ部品収
納パックの交換装置。
4. The chip component storage pack replacement device according to claim 2, wherein the chip component supply unit and the storage magazine are movable relative to each other.
JP3031978A 1991-01-31 1991-01-31 Method and device for replacing chip component storage pack Expired - Fee Related JPH07118596B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3031978A JPH07118596B2 (en) 1991-01-31 1991-01-31 Method and device for replacing chip component storage pack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3031978A JPH07118596B2 (en) 1991-01-31 1991-01-31 Method and device for replacing chip component storage pack

Publications (2)

Publication Number Publication Date
JPH0548292A true JPH0548292A (en) 1993-02-26
JPH07118596B2 JPH07118596B2 (en) 1995-12-18

Family

ID=12346035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3031978A Expired - Fee Related JPH07118596B2 (en) 1991-01-31 1991-01-31 Method and device for replacing chip component storage pack

Country Status (1)

Country Link
JP (1) JPH07118596B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017011316A (en) * 2016-10-21 2017-01-12 富士機械製造株式会社 Cassette type feeder replacement system of component mounting machine
JP2018085543A (en) * 2018-02-07 2018-05-31 株式会社Fuji Cassette feeder replacement system of component mounting machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01225399A (en) * 1988-03-04 1989-09-08 Matsushita Electric Ind Co Ltd Component mounting device
JPH02111682U (en) * 1989-02-23 1990-09-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01225399A (en) * 1988-03-04 1989-09-08 Matsushita Electric Ind Co Ltd Component mounting device
JPH02111682U (en) * 1989-02-23 1990-09-06

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017011316A (en) * 2016-10-21 2017-01-12 富士機械製造株式会社 Cassette type feeder replacement system of component mounting machine
JP2018085543A (en) * 2018-02-07 2018-05-31 株式会社Fuji Cassette feeder replacement system of component mounting machine

Also Published As

Publication number Publication date
JPH07118596B2 (en) 1995-12-18

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