JPH0695509B2 - Cleaning method and its apparatus - Google Patents

Cleaning method and its apparatus

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Publication number
JPH0695509B2
JPH0695509B2 JP20163986A JP20163986A JPH0695509B2 JP H0695509 B2 JPH0695509 B2 JP H0695509B2 JP 20163986 A JP20163986 A JP 20163986A JP 20163986 A JP20163986 A JP 20163986A JP H0695509 B2 JPH0695509 B2 JP H0695509B2
Authority
JP
Japan
Prior art keywords
cleaning
tank
cleaning liquid
discharge
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20163986A
Other languages
Japanese (ja)
Other versions
JPS6358840A (en
Inventor
佳男 前田
Original Assignee
ホ−ヤ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホ−ヤ株式会社 filed Critical ホ−ヤ株式会社
Priority to JP20163986A priority Critical patent/JPH0695509B2/en
Publication of JPS6358840A publication Critical patent/JPS6358840A/en
Publication of JPH0695509B2 publication Critical patent/JPH0695509B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えば半導体プロセスにおいてフオトマスク
ブランクやフオトマスク、あるいは半導体基板等の高清
浄度を必要とする被洗浄物を洗浄する場合に用いて好適
な洗浄方法およびその装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is used, for example, in the case of cleaning a photomask blank or a photomask in a semiconductor process, or a semiconductor substrate or the like that requires high cleanliness. The present invention relates to a suitable cleaning method and its apparatus.
〔従来の技術〕[Conventional technology]
従来、この種の洗浄装置としては、例えば特開昭59−12
1938号公報、特開昭58−210624号公報等に開示された洗
浄装置が知られている。これらの洗浄装置はいずれも洗
浄槽内の洗浄液を供給側から排出側に流動させ、被洗浄
物を洗浄液の流れに逆らって洗浄液排出側から供給側へ
移動させることにより、被洗浄物から遊離した異物の再
付着を防止し、洗浄品質を高めるようにしたものであ
る。
Conventionally, as this type of cleaning device, for example, Japanese Patent Laid-Open No. 59-12
There are known cleaning devices disclosed in JP 1938, JP-A-58-210624 and the like. In all of these cleaning devices, the cleaning liquid in the cleaning tank is made to flow from the supply side to the discharge side, and the object to be cleaned is released from the object to be cleaned by moving it from the cleaning liquid discharge side to the supply side against the flow of the cleaning solution. This is to prevent the reattachment of foreign matter and improve the cleaning quality.
〔発明が解決しようとする問題点〕[Problems to be solved by the invention]
しかしながら、上記した従来の洗浄装置にあっては被洗
浄物から遊離除去された洗浄液より比重の大きい金属粒
子等の異物は、そのまま洗浄槽の底壁上に沈澱、堆積す
るため除去され難く、洗浄品質を向上させることができ
ないという問題があった。また、底壁付近の汚染された
洗浄液を清浄な洗浄液に置換するのに長時間を要するた
め、洗浄液の使用量が多くなり、不経済であるという問
題もあった。
However, in the above-mentioned conventional cleaning device, foreign matter such as metal particles having a larger specific gravity than the cleaning liquid separated and removed from the object to be cleaned is difficult to be removed because it is deposited and accumulated on the bottom wall of the cleaning tank as it is. There was a problem that the quality could not be improved. Further, since it takes a long time to replace the contaminated cleaning liquid near the bottom wall with a clean cleaning liquid, the amount of the cleaning liquid used is large, which is uneconomical.
〔問題点を解決するための手段〕[Means for solving problems]
本発明に係る洗浄方法は上述したようき問題点を解決す
べくなされたもので、洗浄槽の底壁を洗浄液排出側に傾
斜させ、この傾斜した底壁に沿って洗浄液の層流を形成
し、被洗浄物を洗浄液の流れに逆らって移動させて洗浄
を行うようにしたものである。
The cleaning method according to the present invention has been made to solve the above-mentioned problems, in which the bottom wall of the cleaning tank is inclined toward the cleaning liquid discharge side, and a laminar flow of the cleaning liquid is formed along the inclined bottom wall. The object to be cleaned is moved against the flow of the cleaning solution for cleaning.
また、本発明に係る洗浄装置は、洗浄槽と、この洗浄槽
の互いに対向する位置に設けられた洗浄液の排出手段お
よび供給手段と、被洗浄物を洗浄槽の洗浄液排出側から
洗浄液供給側へ移動させる手段とを備え、前記洗浄槽の
洗浄液供給側側壁の洗浄液中に没する部分の面積を、洗
浄液排出側側壁の洗浄液に没する部分の面積より小さく
すると共に、前記洗浄層の底壁を洗浄液供給側から洗浄
液排出側へ向かって下がるように傾斜させたものであ
る。
Further, the cleaning apparatus according to the present invention includes a cleaning tank, a cleaning liquid discharging means and a supplying means provided at positions facing each other in the cleaning tank, and an object to be cleaned from the cleaning liquid discharging side of the cleaning tank to the cleaning liquid supplying side. And a means for moving the cleaning tank, wherein the area of the part of the side wall of the cleaning tank that is immersed in the cleaning solution is smaller than the area of the part of the side wall of the cleaning solution that is immersed in the cleaning solution, and the bottom wall of the cleaning layer is It is inclined so as to descend from the cleaning liquid supply side toward the cleaning liquid discharge side.
〔作用〕[Action]
本発明においては傾斜した底壁とこの底壁に沿って形成
される層流によって底壁上に沈澱、堆積する洗浄液より
比重の大きい異物を洗浄液排出側に確実にかつ速やかに
移動させ、排出することができる。
In the present invention, the slanted bottom wall and the laminar flow formed along the bottom wall reliably and promptly move and discharge the foreign matter having a specific gravity larger than that of the cleaning solution deposited and accumulated on the bottom wall to the cleaning solution discharge side. be able to.
〔実施例〕〔Example〕
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第1図は本発明に係る洗浄装置の一実施例を示す断面
図、第2図は洗浄槽の平面図である。これらの図におい
て、洗浄装置1は、オーバーフロー槽3が設けられた洗
浄槽2と、予備タンク4とを備えている。洗浄槽2は、
該槽の長手方向、すなわち左右方向において対向する一
対の側壁5A,5Bと、長手方向と直交する方向、すなわち
前後方向において対向する前後壁5C,5Dと、底壁5Eとで
構成されている。右側の側壁5Aは2種類の洗浄液A,Bを
洗浄槽2内に供給するための供給口6,7が形成されるこ
とにより、供給側側壁を構成している。一方、左側の側
壁5Bは前記オーバーフロー槽3が設けられることにより
排出側側壁を構成している。底壁5Eは左下りに適宜角度
(例15°)で傾斜し、側壁5Bと底壁5Eとの境部近傍には
洗浄液A,Bを排出するための排出口8が設けられてい
る。すなわち、供給口6,7とオーバーフロー槽3、排出
口8とは実質的に同方向に設けられており、この方向に
向つて洗浄液A,Bが層流となつて流れ、その一部は側壁5
Bよりオーバーフロー槽3に溢流する。また、底壁5Eが
傾斜していることから、側壁5A側ほど容易に層流が生
じ、洗浄液A,B中の金属粒子(汚染物)を排出口8へと
導く。なお、側壁5Aの洗浄液中に設する部分の面積は20
0mm(H1)×150mm(W1)で、側壁5Bの面積440mm(H2
×150mm(W1)より小さい。
FIG. 1 is a sectional view showing an embodiment of a cleaning apparatus according to the present invention, and FIG. 2 is a plan view of a cleaning tank. In these drawings, the cleaning device 1 includes a cleaning tank 2 provided with an overflow tank 3 and a spare tank 4. The cleaning tank 2 is
The tank is composed of a pair of side walls 5A and 5B facing each other in the longitudinal direction, that is, the left-right direction, front and rear walls 5C and 5D facing each other in the direction orthogonal to the longitudinal direction, that is, the front-rear direction, and a bottom wall 5E. The right side wall 5A constitutes a supply side wall by forming supply ports 6 and 7 for supplying the two kinds of cleaning liquids A and B into the cleaning tank 2. On the other hand, the left side wall 5B constitutes a discharge side side wall because the overflow tank 3 is provided. The bottom wall 5E is inclined to the left at an appropriate angle (eg, 15 °), and a discharge port 8 for discharging the cleaning liquids A and B is provided in the vicinity of the boundary between the side wall 5B and the bottom wall 5E. That is, the supply ports 6 and 7, the overflow tank 3 and the discharge port 8 are provided in substantially the same direction, and the cleaning liquids A and B flow in a laminar flow in this direction, and part of them is on the side wall. Five
Overflow from B to overflow tank 3. Further, since the bottom wall 5E is inclined, a laminar flow is more easily generated on the side wall 5A side, and the metal particles (contaminants) in the cleaning liquids A and B are guided to the discharge port 8. The area of the part of the side wall 5A provided in the cleaning liquid is 20
0mm (H 1 ) x 150mm (W 1 ), side wall 5B area 440mm (H 2 )
Smaller than × 150 mm (W 1 ).
また、洗浄装置1は、被洗浄物10を保持し、洗浄槽2内
を洗浄液の排出側から供給側に向つて移動させる移動手
段11と、洗浄液A,Bを洗浄槽2に供給する配管12,13,洗
浄槽2およびオーバーフロー槽3内の洗浄液を排出する
配管14,15、これら配管14,15と予備タンク4および前記
配管13とを接続する配管16,17,配管15の途中に設けられ
た配管18、配管12,13,14,15,16,18に設けられたバルブ1
9,20,21,22,23,24,25,配管13に設けられたポンプ26およ
びフイルター27,底壁5Eの長手方向の約1/2より排出側に
設けられた超音波発生装置30等を備えている。前記予備
タンク4は洗浄液Bを貯蔵しており、該タンク4に前記
配管13の一端が接続されている。超音波発生装置30を底
壁5Eの排出側に設けた理由は、超音波の伝搬により、排
出側の汚染された洗浄液の影響を供給側の洗浄液が受け
ないようにするためである。
Further, the cleaning device 1 holds the article to be cleaned 10 and moves the cleaning tank 2 from the discharge side of the cleaning liquid to the supply side thereof, and the pipe 12 for supplying the cleaning liquids A and B to the cleaning tank 2. , 13, the pipes 14 and 15 for discharging the cleaning liquid in the cleaning tank 2 and the overflow tank 3, and the pipes 16 and 17 for connecting the pipes 14 and 15 to the auxiliary tank 4 and the pipe 13 Pipe 18, valve 1 installed on pipes 12, 13, 14, 15, 16, 18
9,20,21,22,23,24,25, pump 26 and filter 27 provided in pipe 13, ultrasonic generator 30 provided on the discharge side from about half the longitudinal direction of bottom wall 5E Is equipped with. The auxiliary tank 4 stores the cleaning liquid B, and one end of the pipe 13 is connected to the tank 4. The reason for providing the ultrasonic wave generation device 30 on the discharge side of the bottom wall 5E is to prevent the cleaning liquid on the supply side from being affected by the contaminated cleaning liquid on the discharge side due to the propagation of ultrasonic waves.
次に、本例による洗浄動作について説明する。Next, the cleaning operation according to this example will be described.
先ず清浄な再生洗浄液を洗浄槽2に供給して排出側の汚
染されている洗浄液との効率的な置換を行ない、排出側
の洗浄液の汚染濃度を一定値以下に下げるか、あるいは
洗浄液中の粒子が被洗浄物10に再付着するのを防止すべ
く次のような操作がなされる(但し、洗浄液Aを使用す
るときのみの操作)。すなわち、第1図においてバルブ
19,20,22,23を開き、バルブ21,24を閉じ、配管12によつ
て洗浄液Aを供給口6より洗浄槽2に供給する。洗浄槽
2に供給された洗浄液Aの一部は排出口8より排出され
ると同時にオーバーフロー槽3に溢流し、配管14,15,17
を通つてポンプ26により配管13に送られ、フイルター27
によつて過された後供給口7より再び洗浄槽2に戻さ
れる。なお、供給口7から洗浄液が洗浄槽2に供給され
はじめると、バルブ19を閉としてもよい。被洗浄物10は
移動手段11によつて保持され、洗浄槽2の排出側壁5Bに
沿つて洗浄液Aに浸漬され、揺動あるいは超音波照射に
より一定時間洗浄後、再生された洗浄液が供給される供
給側側壁5Aに向つて移動され、洗浄槽2より引き上げら
れる。この時、再生洗浄液は被洗浄物10とは反対に供給
側より排出側に向つて移動しているため、被洗浄物表面
近傍の汚染された洗浄液は清浄な再生洗浄液によつて排
出側へ移動され、結果として液置換が行われる。また、
供給側にて被洗浄物10を引き上げると、汚染された洗浄
液の再付着を防止でき、高品質の洗浄効果が得られる。
First, a clean regenerated cleaning solution is supplied to the cleaning tank 2 to efficiently replace the contaminated cleaning solution on the discharge side to reduce the contaminated concentration of the cleaning solution on the discharge side to a certain value or less, or particles in the cleaning solution. The following operation is performed in order to prevent redeposition on the object to be cleaned 10 (however, only when the cleaning liquid A is used). That is, the valve in FIG.
19, 20, 22, 23 are opened, valves 21, 24 are closed, and the cleaning liquid A is supplied from the supply port 6 to the cleaning tank 2 through the pipe 12. A part of the cleaning liquid A supplied to the cleaning tank 2 is discharged from the discharge port 8 and, at the same time, overflows into the overflow tank 3, and the pipes 14, 15, 17
Through the pump 26 to the pipe 13, and the filter 27
After passing through, the gas is returned to the cleaning tank 2 through the supply port 7. The valve 19 may be closed when the cleaning liquid starts to be supplied to the cleaning tank 2 from the supply port 7. The object to be cleaned 10 is held by the moving means 11 and immersed in the cleaning liquid A along the discharge side wall 5B of the cleaning tank 2, and after cleaning for a certain time by rocking or ultrasonic irradiation, the regenerated cleaning liquid is supplied. It is moved toward the supply side wall 5A and pulled up from the cleaning tank 2. At this time, since the regenerated cleaning liquid is moving from the supply side to the discharge side opposite to the object to be cleaned 10, the contaminated cleaning liquid near the surface of the object to be cleaned is moved to the discharge side by the clean regenerated cleaning liquid. As a result, liquid replacement is performed. Also,
When the article to be cleaned 10 is pulled up on the supply side, it is possible to prevent reattachment of the contaminated cleaning liquid, and a high quality cleaning effect can be obtained.
次に、互いに溶解しない比重の異なる2種類の洗浄液A,
B(比重はdA<dB)を1つの洗浄槽2に連続して供給し
被洗浄物10を洗浄する方法について説明する。
Next, two types of cleaning solutions A with different specific gravities that do not dissolve each other,
A method of continuously supplying B (specific gravity: dA <dB) to one cleaning tank 2 to clean the object to be cleaned 10 will be described.
先ずバルブ20,22,23を閉じ、バルブ19を開き、洗浄液A
を供給口6より洗浄槽2内に供給し、被洗浄物10を洗浄
する。一定時間洗浄後、バルブ19を閉じ、バルブ20,21
を開いて予備タンク4内の洗浄液Bをポンプ26およびフ
イルター27を経て供給口7より洗浄槽2に供給する。す
ると、洗浄液Aは洗浄液Bより比重が小さいため第3図
に示すように押し上げられてオーバーフロー槽3に溢流
する。そしてオーバーフロー槽3に溢流した洗浄液Aは
バルブ25の開により、配管18を通つて排除され、洗浄槽
2から完全に排除されるとバルブ25が再び閉成される。
First, close valves 20, 22, and 23, open valve 19, and wash solution A
Is supplied to the cleaning tank 2 through the supply port 6 to clean the object to be cleaned 10. After washing for a certain period of time, close valve 19 and open valves 20, 21.
And the cleaning liquid B in the auxiliary tank 4 is supplied to the cleaning tank 2 from the supply port 7 via the pump 26 and the filter 27. Then, since the specific gravity of the cleaning liquid A is smaller than that of the cleaning liquid B, the cleaning liquid A is pushed up and overflows into the overflow tank 3 as shown in FIG. Then, the cleaning liquid A overflowing into the overflow tank 3 is removed through the pipe 18 by opening the valve 25, and when completely removed from the cleaning tank 2, the valve 25 is closed again.
洗浄槽2を洗浄液Bで満した後、バルブ22または23を
開、バルブ21を閉とし、排出口8より排出されるかもし
くはオーバーフロー槽3に溢流する洗浄液Bをポンプ2
6,フイルター27を経て過し、再び供給口7より洗浄槽
2に戻し循環させる。洗浄液Bによる一定時間洗浄後、
被洗浄物10を洗浄槽2の洗浄液排出側より供給側に移動
し、しかる後引き上げる。バルブ22又は23,24を開と
し、予備タンク4に洗浄槽2内の洗浄液Bを回収する。
この時ポンプ26は停止している。そして、次の被洗浄物
を洗浄するためバルブ20,22,23,24を閉、バルブ19を開
として洗浄液Aを再び供給する。
After filling the cleaning tank 2 with the cleaning solution B, the valve 22 or 23 is opened and the valve 21 is closed, and the cleaning solution B discharged from the discharge port 8 or overflowing into the overflow tank 3 is pumped.
After passing through the filter 27, it is returned to the cleaning tank 2 through the supply port 7 and circulated. After cleaning for a certain time with the cleaning liquid B,
The object to be cleaned 10 is moved from the cleaning liquid discharge side of the cleaning tank 2 to the supply side, and then pulled up. The valves 22 or 23, 24 are opened and the cleaning liquid B in the cleaning tank 2 is collected in the spare tank 4.
At this time, the pump 26 is stopped. Then, the valves 20, 22, 23, and 24 are closed and the valve 19 is opened to wash the next object to be washed, and the washing liquid A is supplied again.
次に、本洗浄装置を使用してフオトマスク基板を洗浄す
る場合の具体例を説明する。
Next, a specific example of cleaning the photomask substrate using the cleaning device will be described.
実施例1(1種類の洗浄液のとき) 表面寸法が152mm角,厚さ2.3mmのフオトマスク基板10を
移動手段11によつて保持し、洗浄液として洗浄槽2に供
給されている。IPAの排出側に、該基板10の主表面(表
裏面)が洗浄液の移動方向と平行になるように浸漬す
る。IPAはその一部がオーバーフロー槽3に溢流し、ポ
ンプ26によつて再び洗浄槽2に循環供給され、その途中
で孔径0.2μmのフイルター27により過再生される。
フオトマスク基板10を洗浄液の移動方向と平行にする理
由は、汚れの除去を効果的に行うためである。被洗浄物
10をIPA中で1分間揺動,超音波洗浄後,排出側より供
給側に向つて移動させ、その位置で1分間静置後洗浄槽
2より引き上げる。次いで、IPA蒸気により蒸気乾燥
し、フオトマスク基板10の洗浄を終了する。
Example 1 (when using one type of cleaning liquid) A photomask substrate 10 having a surface size of 152 mm square and a thickness of 2.3 mm is held by a moving means 11 and supplied to the cleaning tank 2 as a cleaning liquid. Immersion is performed on the discharge side of the IPA so that the main surface (front and back surfaces) of the substrate 10 is parallel to the moving direction of the cleaning liquid. A part of IPA overflows into the overflow tank 3, is circulated again to the cleaning tank 2 by the pump 26, and is over-regenerated by the filter 27 having a pore diameter of 0.2 μm in the middle thereof.
The reason for making the photomask substrate 10 parallel to the moving direction of the cleaning liquid is to effectively remove dirt. Items to be cleaned
Shake 10 in IPA for 1 minute, ultrasonically clean, move from discharge side to supply side, leave at that position for 1 minute, and then lift from cleaning tank 2. Next, IPA vapor is used for vapor drying, and the cleaning of the photomask substrate 10 is completed.
洗浄後、基板表面を集光ランプで照射し検査したとこ
ろ、清浄なフオトマスク基板が得られたことが確認され
た。
After cleaning, the substrate surface was irradiated with a condenser lamp and inspected, and it was confirmed that a clean photomask substrate was obtained.
実施例2(2種類の洗浄液を使用する場合) 第1図および第3図の洗浄液Aとして超純水とIPA(比
重0.79)の10:1混合液を配管12によつて供給口6より洗
浄槽2に供給する。この混合液は図示しないポンプおよ
びフイルターにより毎分20l過再生され、洗浄槽2に
循環供給されており、この混合液中に上記実施例(1)
と同様にフオトマスク基板10を浸漬し、上下に揺動させ
ながら1分間超音波洗浄を行う。
Example 2 (when two kinds of cleaning liquids are used) As the cleaning liquid A in FIGS. 1 and 3, a 10: 1 mixed liquid of ultrapure water and IPA (specific gravity 0.79) was cleaned from the supply port 6 through the pipe 12. Supply to tank 2. This mixed solution was regenerated by 20 l / min by a pump and a filter (not shown) and circulated and supplied to the cleaning tank 2. In the mixed solution, the above-mentioned embodiment (1) was used.
Similarly, the photomask substrate 10 is immersed, and ultrasonic cleaning is performed for 1 minute while rocking up and down.
次に、フオトマスク基板10を混合液中に浸漬したままバ
ルブ19を閉とし、閉となつていたバルブ20,21を開と
し、予備タンク4に収容されている洗浄液B(1.1.2-ト
リクロル‐1.2.2-トリフルオルエタン,商品名:フレオ
ンTF,比重1.58)を、ポンプ26によつて0.2μm孔径のフ
イルター27に導き過した後供給口7より洗浄槽2に供
給する。第3図はこの様子を示すもので、超純水,IPA,
フレオンの約10:1:10の3成分混合系(なお、IPAの一部
はフレオンに溶解する)ではその溶解度曲線から超純水
とフレオンは互いに溶解せず分離する。
Next, the valve 19 was closed while the photomask substrate 10 was immersed in the mixed solution, and the valves 20 and 21 which were closed were opened, and the cleaning solution B (1.1.2-trichloro-) contained in the spare tank 4 was opened. 1.2.2-Trifluoroethane, trade name: Freon TF, specific gravity 1.58) is introduced by a pump 26 into a filter 27 having a pore size of 0.2 μm, and then supplied to the cleaning tank 2 through the supply port 7. Figure 3 shows this situation.
In a freon ternary mixture system of about 10: 1: 10 (note that a part of IPA dissolves in freon), ultrapure water and freon do not dissolve in each other but separate from the solubility curve.
フレオンが洗浄槽2に注入されると超純水‐IPA液相
は、洗浄槽2よりオーバーフロー槽3に溢流する。そし
て、洗浄槽2を満したフレオンはその一部が溢流して循
環過再生され、この状態においてフオトマスク基板10
を上下揺動させつつ一定時間超音波洗浄し、しかる後洗
浄槽2の排出側より供給側に移動して引き上げ、乾燥さ
せることで基板の洗浄を終了する。この結果、清浄なフ
オトマスク基板が得られた。
When Freon is injected into the cleaning tank 2, the ultrapure water-IPA liquid phase overflows from the cleaning tank 2 into the overflow tank 3. Then, a part of the Freon filling the cleaning tank 2 overflows to be circulated and over-regenerated, and in this state, the photomask substrate 10
The substrate is cleaned by ultrasonically cleaning the substrate for a certain period of time while swinging it up and down, then moving from the discharge side of the cleaning tank 2 to the supply side, pulling it up, and drying it. As a result, a clean photomask substrate was obtained.
なお、実施例(1)の洗浄液AとしてIPAの代りに超純
水,フレオン,塩化メチレン等を、また実施例(2)の
洗浄液としては互いに溶解しない液(例えば超純水‐塩
化メチレン(比重1.33),nヘキサン(比重0.66)−超純
水,nヘキサン‐ジメチルスルホキシド(比重1.10))な
らばさしつかえない。
In addition, as the cleaning liquid A of Example (1), ultrapure water, Freon, methylene chloride or the like was used instead of IPA, and as the cleaning liquid of Example (2), liquids which were not soluble in each other (for example, ultrapure water-methylene chloride (specific gravity 1.33), n-hexane (specific gravity 0.66) -ultra pure water, n-hexane-dimethyl sulfoxide (specific gravity 1.10)) are all right.
なお、本実施例は単槽式の洗浄槽による洗浄装置に適用
した場合について説明したが、本発明はこれに何ら特定
されるものではなく、複数槽を連結したものであつても
よく、その場合任意の1つの洗浄槽は他の洗浄槽と異な
る洗浄液を選択することができる。
In addition, although the present embodiment has been described with respect to the case where it is applied to a cleaning device with a single tank type cleaning tank, the present invention is not limited to this, and a plurality of tanks may be connected. In this case, any one cleaning tank can select a cleaning liquid different from the other cleaning tanks.
また、例えば表面寸法が178mm角のフオトマスク基板等
のように、被洗浄物の大型化に伴い、被洗浄物表面およ
びその近傍の汚染液を、洗浄槽の供給側の清浄な洗浄液
と置換できるように、供給口の数(例えば、循環して
過する系の数)を供給側側壁の垂直方向に増加させるこ
とが望ましい。この理由は供給口から洗浄液が供給され
た直後は複数の層流が発生し、この複数の層流により効
果的に置換できるからである。
Also, for example, as the size of the object to be cleaned increases, such as a photomask substrate having a surface dimension of 178 mm square, the contaminated liquid on the surface of the object to be cleaned and its vicinity can be replaced with a clean cleaning liquid on the supply side of the cleaning tank. In addition, it is desirable to increase the number of supply ports (for example, the number of circulating systems) in the vertical direction of the supply side wall. The reason for this is that a plurality of laminar flows are generated immediately after the cleaning liquid is supplied from the supply port and can be effectively replaced by the plurality of laminar flows.
また、本実施例はいずれもオーバーフロー槽3を付設し
たが、単に洗浄槽2のみであつてもよいことは勿論であ
る。しかし、オーバーフロー槽3があつた方が、層流を
発生させ易く、かつ汚れの除去に有効かつ効果的であ
る。
Further, although the overflow tank 3 is additionally provided in each of the present embodiments, it is needless to say that only the cleaning tank 2 may be provided. However, when the overflow tank 3 is provided, it is easier to generate a laminar flow, and it is effective and effective in removing dirt.
〔発明の効果〕〔The invention's effect〕
以上説明したように本発明に係る洗浄方法およびその装
置によれば、被洗浄物を洗浄液の流れに逆らって移動さ
せ、洗浄槽の底壁を洗浄液の排出側に傾斜させ、この底
壁に沿って層流を形成したので、底壁上に沈澱、堆積す
る比重の大きい異物を洗浄液排出側に確実にかつ速やか
に移動させて排出することができる。その結果、被洗浄
物から遊離除去された異物が再付着することなく被洗浄
物を殆ど異物が存在しない洗浄液供給側で最終的に引き
上げることができるので、洗浄品質を向上させることが
でき、また、底壁付近の汚染された洗浄液を清浄な洗浄
液に置換するのに時間を要さず、洗浄液の使用量が少な
くて済み、経済的である。
As described above, according to the cleaning method and the apparatus therefor of the present invention, the object to be cleaned is moved against the flow of the cleaning solution, the bottom wall of the cleaning tank is inclined toward the discharge side of the cleaning solution, and the bottom wall is moved along the bottom wall. Since the laminar flow is formed by the laminar flow, it is possible to reliably and promptly move and discharge the foreign matter having a large specific gravity that precipitates and accumulates on the bottom wall to the cleaning liquid discharge side. As a result, it is possible to improve the cleaning quality, because the object to be cleaned can be finally pulled up on the cleaning liquid supply side where there is almost no foreign material, without the foreign matter separated and removed from the object to be reattached. It takes no time to replace the contaminated cleaning liquid near the bottom wall with a clean cleaning liquid, and the amount of cleaning liquid used is small, which is economical.
【図面の簡単な説明】 第1図は本発明に係る洗浄装置の一実施例を示す断面
図、第2図は洗浄槽の平面図、第3図は2種類の洗浄槽
を供給した状態を示す図である。 1……洗浄装置、2……洗浄槽、3……オーバーフロー
槽、4……予備タンク、5A……供給側側壁、5B……排出
側側壁、5E……底壁、6,7……供給口、8……排出口、1
0……被洗浄物、11……移動手段。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing an embodiment of a cleaning apparatus according to the present invention, FIG. 2 is a plan view of a cleaning tank, and FIG. 3 shows a state in which two kinds of cleaning tanks are supplied. FIG. 1 ... Cleaning device, 2 ... Cleaning tank, 3 ... Overflow tank, 4 ... Spare tank, 5A ... Supply side wall, 5B ... Discharge side wall, 5E ... Bottom wall, 6,7 ... Supply Mouth, 8 ... outlet, 1
0 …… Item to be cleaned, 11 …… Transportation means.

Claims (2)

    【特許請求の範囲】[Claims]
  1. 【請求項1】洗浄槽の底壁を洗浄液排出側に傾斜させ、
    この傾斜した底壁に沿って洗浄液の層流を形成し、被洗
    浄物を洗浄液の流れに逆らって移動させて洗浄を行うよ
    うにしたことを特徴とする洗浄方法。
    1. A bottom wall of a cleaning tank is inclined toward a cleaning liquid discharge side,
    A cleaning method characterized in that a laminar flow of the cleaning liquid is formed along the inclined bottom wall, and the object to be cleaned is moved against the flow of the cleaning liquid for cleaning.
  2. 【請求項2】洗浄槽と、この洗浄槽の互いに対向する位
    置に設けられた洗浄液の排出手段および供給手段と、被
    洗浄物を洗浄槽の洗浄液排出側から洗浄液供給側へ移動
    させる手段とを備え、前記洗浄槽の洗浄液供給側側壁の
    洗浄液中に没する部分の面積を、洗浄液排出側側壁の洗
    浄液に没する部分の面積より小さくすると共に、前記洗
    浄槽の底壁を洗浄液供給側から洗浄液排出側へ向かって
    下がるように傾斜させたことを特徴とする洗浄装置。
    2. A cleaning tank, a cleaning liquid discharge means and a supply means provided at positions facing each other in the cleaning tank, and a means for moving an object to be cleaned from the cleaning liquid discharge side of the cleaning tank to the cleaning liquid supply side. The area of the portion of the side wall of the cleaning tank that is immersed in the cleaning solution is smaller than the area of the portion of the side wall of the cleaning solution discharge side that is immersed in the cleaning solution, and the bottom wall of the cleaning tank is supplied from the side of the cleaning solution to the cleaning solution. A cleaning device that is inclined so as to descend toward the discharge side.
JP20163986A 1986-08-29 1986-08-29 Cleaning method and its apparatus Expired - Lifetime JPH0695509B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20163986A JPH0695509B2 (en) 1986-08-29 1986-08-29 Cleaning method and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20163986A JPH0695509B2 (en) 1986-08-29 1986-08-29 Cleaning method and its apparatus

Publications (2)

Publication Number Publication Date
JPS6358840A JPS6358840A (en) 1988-03-14
JPH0695509B2 true JPH0695509B2 (en) 1994-11-24

Family

ID=16444417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20163986A Expired - Lifetime JPH0695509B2 (en) 1986-08-29 1986-08-29 Cleaning method and its apparatus

Country Status (1)

Country Link
JP (1) JPH0695509B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101387920B1 (en) * 2012-10-11 2014-04-22 주식회사 케이씨텍 Apparatus of cleaning and drying wafer and method using same
KR101425813B1 (en) * 2012-12-24 2014-08-05 주식회사 케이씨텍 Apparatus of cleaning and drying wafer

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Publication number Priority date Publication date Assignee Title
JP2669655B2 (en) * 1988-07-21 1997-10-29 株式会社東芝 Ultrasonic cleaning equipment
JPH02152232A (en) * 1988-12-05 1990-06-12 Toshiba Corp Cleaning
JPH0378177U (en) * 1989-11-30 1991-08-07
JPH04104871A (en) * 1990-08-21 1992-04-07 Fujitsu Ltd Washing tank
FR2785558B1 (en) * 1998-11-06 2001-01-12 Michel Pierre Bernard Bourdat CLEANING MACHINE FOR PLATES, ESPECIALLY SCREEN STENCILS
KR100355869B1 (en) * 1999-12-31 2002-10-12 아남반도체 주식회사 Reverse cleaning device of cleaning apparatus
JP4541422B2 (en) * 2000-05-15 2010-09-08 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2009010256A (en) * 2007-06-29 2009-01-15 Toho Kasei Kk Substrate drying device and its method
CN102553852A (en) * 2010-12-28 2012-07-11 北京京东方光电科技有限公司 Cleaning device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101387920B1 (en) * 2012-10-11 2014-04-22 주식회사 케이씨텍 Apparatus of cleaning and drying wafer and method using same
KR101425813B1 (en) * 2012-12-24 2014-08-05 주식회사 케이씨텍 Apparatus of cleaning and drying wafer

Also Published As

Publication number Publication date
JPS6358840A (en) 1988-03-14

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