JPH0686323U - Surface mount type package - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to ensure soldering of a terminal in a surface mount type package using a lead frame for the terminal. [Structure] In a surface mount type package, as a means for floating the terminal so that the solder can fully go under the terminal, 0.05 to 0.15 is provided on the soldering surface of the terminal.
A protrusion of mm was provided to float the entire part and float the terminal. As a result, the molten solder is accumulated in the solder and the solder is not blown out, so that the soldering can be reliably performed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a terminal structure of a surface mount type package.

[0002]

[Prior art]

 In the past, it was customary for the soldering surface of the terminal to be a single plane in the surface mount type package using the resin mold in which the lead frame was used for the terminal.

[0003]

[Problems to be solved by the device]

 In the past, surface mount type parts were small, so when soldering, the parts were lifted up by the solder, and solder could be achieved with the solder sufficiently wrapping around the underside of the component's terminals. However, recently, as a result of the shift to larger surface-mounting types than before, the weight of the component itself becomes large and the terminal area becomes relatively small compared to the component body. As a result, the solder under the terminal was blown out to the edge of the terminal, leaving almost no solder under the terminal, resulting in insufficient soldering. Alternatively, the air bubbles accumulated at the bottom of the component may lift the component.

[0004]

[Means for solving the problem]

 As a means to solve the problem, as a means to float the terminal so that the solder can fully go under the terminal, a protrusion of 0.1 ± 0.05 mm is provided on the soldering surface of the terminal to float the entire component Floated.

[0005]

【Example】

 As shown in Fig. 1, when a protrusion is provided on the soldering surface of the terminal, a gap is created between the soldering surface of the terminal and the conductor of the board to form a solder pool, and the above-mentioned problem of solder blowing does not occur. Soldering is reliable and complete.

FIG. 4 shows an example in which the terminal projects from the side surface of the component. In this case as well, the parts under the parts are in the same situation as in FIGS. Here, the terminal portion protruding from the side surface of the component will be described. In FIG. 4, the solder surface of the terminal is the same as in FIG. 2, there is no pool of solder, and soldering is not reliable. Unlike the terminal shown in Fig. 2, the other side of the terminal has a free space on the side, so the solder can escape to the side of the terminal. Even then, the remaining part becomes solder balls and scatters. Since this state is not preferable, as shown in FIG. 3, by providing a protrusion on the soldering surface of the terminal, the same solution as in FIG. 1 was achieved.

FIG. 5 shows a usage example. It shows that the lower surface of the terminal is flush with the lower surface of the component and that the terminal is provided with protrusions. Although the figure shows an example in which the terminal protrudes from the side surface of the component, the terminal cut along the dotted line corresponds to an example in which the terminal does not protrude.

FIG. 6 shows an example of the projection shape. (A) An example of an arc-shaped extrusion protrusion by a pressing die is shown. (B) An example of a claw-shaped projection by a punching die is shown.

[0009]

[Effect of device]

 According to the present invention, when a protrusion is provided on the soldering surface of the terminal, a gap is created between the soldering surface of the terminal and the conductor of the board during soldering, and a solder pool is formed. No problems occurred, and soldering became reliable and complete.

[Brief description of drawings]

FIG. 1 is a side view showing a soldered state of a terminal having a protrusion when the terminal does not protrude to the side surface of the component.

FIG. 2 is a side view showing a soldered state of a terminal having no protrusion when the terminal does not protrude to the side surface of the component.

FIG. 3 is a side view showing a state in which a terminal having a protrusion is soldered when the terminal is protruding from the side surface of the component.

FIG. 4 is a side view showing a state in which a terminal without a protrusion is soldered when the terminal is protruding from the side surface of the component.

FIG. 5 is a side view and a bottom view of a surface mount type package having terminals with protrusions.

FIG. 6 shows a projection shape of a terminal.

[Explanation of symbols]

 1 terminal 2 resin mold 3 protrusion 4 solder 5 conductor 6 substrate

Claims (3)

[Scope of utility model registration request] 1. A surface mounting type package using a lead frame for a terminal, wherein a projection is provided on a soldering surface of the terminal. 2. The surface mount type package according to claim 1, characterized in that each terminal has one protrusion. 3. The protrusions are formed from the lead frame terminal surface to 0.
The surface mount type package according to claim 1, characterized in that it projects by 05 to 0.15 mm.