JPH0685132A - Semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device, in which a characteristic deterioration in a semiconductor chip caused by interfacial flaking between a die pad and a resin sealing body as well as destruction of a resin sealing material is prevented. CONSTITUTION:A semiconductor device comprises a semiconductor chip 1, a plurality of lead members 4, one end of which is connected to the semiconductor device 1, a die pad 7 having on one side an uneven face 7c and an adhesive face 7a for mounting the semiconductor device 1, and a resin sealing body 8 for sealing the semiconductor chip 1 with each one end of the lead members 4 firmly to the die pad 7 after the other face 7b of the die pad 7 is exposed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device in which a semiconductor chip is resin-sealed.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view of a conventional semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a die pad on which the semiconductor chip 1 is mounted and adhered with an adhesive 3, 4 is a plurality of lead pieces extending on the both sides of the die pad 2 on the same plane as the die pad 2 and extending laterally, 5 is a bonding wire for connecting the semiconductor chip 1 and the die pad 2 side of the lead piece 4,
Reference numeral 6 denotes a resin encapsulating body which encloses and fixes the above-mentioned constituent elements 1 to 5 so that a part of the lead piece 4 projects laterally, and in this case, an epoxy resin-based resin is the mainstream, It is composed of an inorganic filler.

Next, the operation will be described. Die pad 2
The semiconductor device having the semiconductor chip 1 mounted thereon and electrically connecting the semiconductor chip 1 and the lead pieces 4 by the bonding wires 5 is molded, sealed and insulated by the resin sealing body 6. This molding is usually performed at 180 ° C by the low pressure transfer method.
Made at around temperature. The resin-encapsulated semiconductor device manufactured by the above process is generally made of materials having different physical property values (coefficient of thermal expansion, elastic modulus, etc.).

[0004]

Since the conventional semiconductor device is constructed as described above, particularly in the surface mount type semiconductor device, the temperature of the entire device is raised during mounting, and the water vapor absorbed by the resin during storage is abrupt. As a result, interface peeling between the back surface of the die pad and the resin encapsulant (9 in FIG. 3) occurs, the characteristics of the semiconductor chip change, the strength of the bonding wire part deteriorates, or the semiconductor resin encapsulant cracks (see FIG. 3). There is a problem such as causing a failure such as 10) shown below.

The present invention has been made to solve the above problems, and prevents deterioration of semiconductor chip characteristics and material destruction of the resin sealing body itself due to interfacial peeling between the die pad and the resin sealing body. The purpose is to obtain a semiconductor device that can be manufactured.

[0006]

A semiconductor device according to the present invention includes a semiconductor chip, a plurality of lead pieces whose one end side is connected to the semiconductor chip by a connecting wire, and a semiconductor chip mounting adhesive surface and an uneven surface on one surface side. A die pad having a surface and a resin sealing body that seals and fixes one end side of the semiconductor chip and the lead piece to the die pad by exposing the other surface of the die pad.

[0007]

The die pad of the semiconductor device according to the present invention is
By exposing the back surface side, the stress acting on the resin sealing body on the back surface side is eliminated. Further, the uneven surface improves the bonding force with the resin sealing body and prevents interfacial peeling.

[0008]

EXAMPLES Example 1. Embodiment 1 of the present invention will be described below with reference to the drawings. 1 is a sectional view showing a semiconductor device according to a first embodiment of the present invention. In the figure, the reference numerals 1, 3 and 5 are the same as the conventional ones, and therefore their explanations are omitted. 7 is a mounting adhesive surface 7a of the semiconductor chip 1 and an uneven surface 7 on one surface side.
A die pad 8 having c and the other surface side 7b being an exposed surface, and 8 is a resin sealing body for exposing the other surface side 7b of the die pad 7 and sealingly fixing one end side of the semiconductor chip 1 and the lead piece 4 to the die pad 7. Is.

Next, the operation will be described. Die pad 7
The resin sealing body 8 is formed by exposing the entire other surface side 7b.
And the other surface side 7b of the die pad 7 disappears, and the resin sealing body 8 and the back surface side of the die pad 8 which are caused by various stresses caused by curing shrinkage, thermal shrinkage of the resin sealing body 8 and temperature cycle, high temperature storage, etc. It is possible to eliminate the interfacial peeling at the same time, and at the same time prevent the occurrence of cracks in the resin sealing body 8. In addition, the uneven surface 7c provided on the die pad 7 increases the adhesion area between the site and the resin sealing body 8 and sufficiently copes with the generated stress to prevent the interface peeling between the die pad 7 and the resin sealing body 8. You can

[0010]

As described above, the semiconductor device according to the present invention includes a semiconductor chip, a plurality of lead pieces whose one end side is connected to the semiconductor chip by a connecting wire, and a semiconductor chip mounting adhesive surface and unevenness on one surface side. Since the die pad having a surface and the resin sealing body that exposes the other surface side of the die pad and seals and fixes one end side of the semiconductor chip and the lead piece with the die pad, the interface between the die pad and the resin sealing body is formed. There is an effect that a semiconductor device capable of preventing deterioration of semiconductor chip characteristics due to peeling and material destruction of the resin sealing body itself can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a conventional semiconductor device.

FIG. 3 is a cross-sectional view showing a defective state of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 4 Lead piece 5 Connection wire 7 Die pad 7a Mounting adhesive surface 7b Exposed surface (other surface side) 7c Uneven surface 8 Resin sealing body

Claims (1)

[Claims] 1. A semiconductor chip, a plurality of lead pieces, one end of which is connected to the semiconductor chip by a connecting wire, a die pad having a mounting adhesive surface of the semiconductor chip and an uneven surface on one surface side, and a die pad of the die pad. A semiconductor device comprising: a resin sealing body that exposes the other surface side and seals and fixes one end side of the semiconductor chip and the lead piece to the die pad.