JPH06830Y2 - トランジスタのリ−ド - Google Patents

トランジスタのリ−ド

Info

Publication number
JPH06830Y2
JPH06830Y2 JP1987088178U JP8817887U JPH06830Y2 JP H06830 Y2 JPH06830 Y2 JP H06830Y2 JP 1987088178 U JP1987088178 U JP 1987088178U JP 8817887 U JP8817887 U JP 8817887U JP H06830 Y2 JPH06830 Y2 JP H06830Y2
Authority
JP
Japan
Prior art keywords
transistor
lead
circuit board
leads
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987088178U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63197347U (US20110009641A1-20110113-C00256.png
Inventor
和彦 西
直樹 赤沢
雅人 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sawafuji Electric Co Ltd
Original Assignee
Sawafuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sawafuji Electric Co Ltd filed Critical Sawafuji Electric Co Ltd
Priority to JP1987088178U priority Critical patent/JPH06830Y2/ja
Publication of JPS63197347U publication Critical patent/JPS63197347U/ja
Application granted granted Critical
Publication of JPH06830Y2 publication Critical patent/JPH06830Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP1987088178U 1987-06-08 1987-06-08 トランジスタのリ−ド Expired - Lifetime JPH06830Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987088178U JPH06830Y2 (ja) 1987-06-08 1987-06-08 トランジスタのリ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987088178U JPH06830Y2 (ja) 1987-06-08 1987-06-08 トランジスタのリ−ド

Publications (2)

Publication Number Publication Date
JPS63197347U JPS63197347U (US20110009641A1-20110113-C00256.png) 1988-12-19
JPH06830Y2 true JPH06830Y2 (ja) 1994-01-05

Family

ID=30946057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987088178U Expired - Lifetime JPH06830Y2 (ja) 1987-06-08 1987-06-08 トランジスタのリ−ド

Country Status (1)

Country Link
JP (1) JPH06830Y2 (US20110009641A1-20110113-C00256.png)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316866A (en) * 1976-07-29 1978-02-16 Mitsubishi Electric Corp Method of producing hybrid integrated circuit
JPS5735050U (US20110009641A1-20110113-C00256.png) * 1980-08-07 1982-02-24
JPS5926260U (ja) * 1982-08-06 1984-02-18 日本電気株式会社 電子部品のリ−ド構造

Also Published As

Publication number Publication date
JPS63197347U (US20110009641A1-20110113-C00256.png) 1988-12-19

Similar Documents

Publication Publication Date Title
US5731958A (en) Gravity latch for surface mount components
JPH06830Y2 (ja) トランジスタのリ−ド
JPH02169178A (ja) ヒータ棒装置
JP2002093978A (ja) 半導体リード構造及び半導体を放熱板に密着固定する方法
JP2001119182A (ja) ヒートシンク固定構造
JPH0617309Y2 (ja) 半導体の放熱装置
JP2569813B2 (ja) 表面実装型半導体部品の冷却構造
CN216721854U (zh) 高功率发热芯片散热结构及车载导航主机
JP3048757U (ja) 放熱板の基板への取付構造
JP3608258B2 (ja) プリント基板実装構造および実装方法
JPH09139448A (ja) 半導体の取付具及びその取付方法並びにこれを用いた半導体装置
JPH0720923Y2 (ja) 電子部品
JP2519621Y2 (ja) 半導体素子用測定装置
JP2876679B2 (ja) 電気部品用ヒートシンクの取付け構造
JP2566011Y2 (ja) 表示管取付具
JPS6320131Y2 (US20110009641A1-20110113-C00256.png)
JPH0576051U (ja) 混成集積回路装置
JP2502772Y2 (ja) コレクタ用ヒ―トシンク
JPH0129789Y2 (US20110009641A1-20110113-C00256.png)
JPS5910790Y2 (ja) パッケ−ジ構造
JPH0343755Y2 (US20110009641A1-20110113-C00256.png)
JP2000216516A (ja) 発光素子の実装構造
JPS63228574A (ja) 接続端子装置
JPS5832313Y2 (ja) 放熱板取付構造
JPS6157562U (US20110009641A1-20110113-C00256.png)