JPH0682583U - Multiple IC contact mechanism with lead frame at high and low temperatures - Google Patents

Abstract

(57) [Abstract] [Purpose] IC1 with lead frame is
A mechanism for surely contacting a large number of C sockets 4 simultaneously is provided. [Structure] An IC 1 is housed in a plurality of recesses 2A of an IC container 2. The IC carrier 3 holds a plurality of IC containers 2 so as to be horizontally movable. The IC carrier 3 moves onto the measurement substrate 5 in the thermostatic chamber 10 and then descends to form the reference hole 2B and the guide hole 2.
C enters the reference pin 5A and the guide pin 4A, and positions the IC container 2 and the measurement substrate 5. IC1 guide hole 1
The guide pin 4A of the IC socket 4 is inserted into A, and the lead of the IC 1 and the contact of the IC socket 4 are positioned. The pressing plate 6 is lowered and the IC 1 is pressed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a mechanism for bringing a plurality of ICs with lead frames (hereinafter referred to as ICs) housed in an IC carrier into contact with a plurality of IC sockets provided on a measurement board in a thermostatic chamber. . An apparatus using this contact mechanism is, for example, an auto handler with a high / low temperature measuring function.

[0002]

[Prior art]

 Next, the structure of the contact mechanism of the IC according to the prior art will be described with reference to FIG. In FIG. 5, 1 is an IC, 4 is an IC socket, 13 is an IC carrier, 15 is a measurement substrate, and 16 is a pressing plate.

In FIG. 5, the IC carrier 13 is formed with a plurality of recesses 13A for accommodating the IC 1 vertically and horizontally and has a reference hole 13B. A plurality of IC sockets 4 are arranged on the measurement board 15 at positions corresponding to the recesses 13A, and reference pins 15A for positioning the IC carrier 13 in the reference holes 13B are formed. The pressing plate 16 has a plurality of convex portions 16A formed at positions corresponding to the concave portions 13A, and has a reference hole 16B which is positioned by the reference pin 15A.

Next, the operation of FIG. 5 will be described with reference to FIGS. 6 and 7. FIG. 5 is a state diagram before the contact of the IC 1, and the IC carrier 13 moves to the state shown in FIG. 6 after moving onto the measurement substrate 15 and then descending. In FIG. 6, the guide pin 4A provided in the IC socket 4 is inserted into the guide hole 1A of the IC1, and the lead of the IC1 is positioned with the contact of the IC socket 4. Next, the pressing plate 16 descends, and the state shown in FIG. 7 is obtained. FIG. 7 is a state diagram in which the convex portion 16A presses the IC1 and the IC1 and the IC socket 4 are in contact with each other.

[0005]

[Problems to be solved by the device]

 Fig. 5 shows the contact mechanism at room temperature. There is a problem that if a large number of ICs are simultaneously contacted at high and low temperatures, the ICs and IC sockets cannot be accurately positioned due to the heat change of the members.

According to the present invention, a plurality of ICs are accommodated in the recess of the IC container, the IC container is held by the IC carrier so as to be horizontally movable, and the reference pin and the IC container that enter the reference hole of the IC container are held. The purpose of the present invention is to provide a multiple IC contact mechanism in which the IC carrier is systematically attached to the measurement board on which the guide pins that enter the guide holes of .

[0007]

[Means for Solving the Problems]

 In order to achieve this object, in the present invention, a plurality of recesses 2A for accommodating the IC 1 with the lead frame are formed, and the IC container 2 having the reference hole 2B and the guide hole 2C and the IC container 2 are arranged vertically and horizontally. An IC carrier 3 which is arranged to hold the IC container 2 so as to be horizontally movable, and a plurality of IC sockets 4 are arranged at positions corresponding to the recesses 2A, and a reference pin 5A which enters the reference hole 2B and a guide hole. The measurement board 5 is provided with a guide pin 5B that stands in the 2C and a pressing plate 6 that forms a plurality of convex portions 6A at positions corresponding to the concave portions 2A. The IC carrier 3 is a measurement substrate 5 in the thermostatic chamber 10. After moving up, it descends and the guide pin 4A standing on the IC socket 4 enters the guide hole 1A of the IC1, the lead of the IC1 is positioned with the contactor of the IC socket 4, the pressing plate 6 descends, and The part 6A presses the IC1.

[0008]

[Action]

 Next, the structure of the contact mechanism according to the present invention will be described with reference to FIGS. FIG. 1 is a block diagram of an IC carrier according to the present invention, and 2 in FIG. 1 is an IC container and 3 is an IC carrier.

FIG. 2 is an external view of the IC container 2, in which 2A is a concave portion, 2B is a reference hole, and 2C is a guide hole. In FIG. 2, the IC container 2 can accommodate eight ICs 1, and the recess 2A is formed with a taper so as to easily accommodate the IC 1. Further, the recess 2A has an escape hole 2D for the contact of the IC socket 4. Two elliptical guide holes 2C are formed on the same line as the center of the reference hole 2B and are guided by guide pins 5B of the measurement substrate 5 described later. The reason why the guide hole 2C is an elliptical hole in FIG. 2 is to allow the IC container and the measurement board to be system-locked at high and low temperatures, and expansion and contraction due to temperature changes are considered. Further, steps 21 are formed on both side surfaces in the longitudinal direction of the IC container 2.

FIG. 1 shows four IC containers 2 of FIG. 2 arranged vertically and horizontally. In FIG. 1, the IC carrier 3 is formed with a recess 31 to be mounted in the step 21 of the IC container 2, and the upper surface of the IC carrier 3 is covered with a lid 3A. In FIG. 1, the IC container 2 is held in the IC carrier 3 so as to be movable in the horizontal direction. Rollers 3B are held at the four corners of the IC carrier 3 to facilitate the transfer of the IC carrier 3.

FIG. 3 is an external view of the measurement substrate 5. In FIG. 3, IC sockets 4 are arranged corresponding to the arrangement of the IC containers 2. Two guide pins 5B are erected on the measurement substrate 5 side by side with the reference pin 5A. The reference pin 5A enters the reference hole 2B of the IC container 2, and the guide pin 5B enters the guide hole 2C of the IC container 2. Further, the reference pin 5A and the guide pin 5B are formed with a taper at their tips to facilitate their insertion into the holes.

Next, an embodiment in which the contact mechanism according to the present invention is incorporated in an apparatus will be described with reference to FIG. In FIG. 4, since four IC containers 2 are mounted on the IC carrier 3, four measurement substrates 5 and four pressing plates 6 are also arranged. The IC carrier 3 moves up and down by the elevating mechanism 22, and the pressing plate 6 descends by the pressing mechanism 9 to apply a constant pressure to the IC 1.

In FIG. 4, the IC carrier 3 accommodating the IC 1 is carried into the constant temperature bath 10 and held by the elevating mechanism 22. Next, the elevating mechanism 22 descends, and the IC container 2 is positioned with respect to the measurement substrate 5 by the reference pin 5A and the guide pin 5B. When the elevating mechanism 22 is further lowered, the guide pins 1A of the IC sockets 4 are inserted into the guide holes 1A of the ICs 1 in the IC container 2, and the leads of the ICs 1 are positioned with the contacts of the IC sockets 4. Next, when the pressing mechanism 9 descends the pressing plate 6, the convex portion 6A of the pressing plate 6 presses the IC 1 to ensure contact.

[0014]

[Effect of device]

 This invention accommodates a plurality of ICs in a recess of an IC container, holds the IC container by an IC carrier so as to be horizontally movable, and inserts a reference pin into a reference hole of the IC container and a guide hole of the IC container. The IC carrier is fixed to the measurement board on which the guide pin is set up and the IC is contacted with the IC socket by pressing the IC with the convex part of the pressing plate. It is possible to contact a large number of

[Brief description of drawings]

FIG. 1 is a block diagram of an IC carrier according to the present invention.

FIG. 2 is an external view of an IC container according to the present invention.

FIG. 3 is an external view of a measurement board according to the present invention.

FIG. 4 is a view showing an embodiment in which a contact mechanism according to the present invention is incorporated in an apparatus.

FIG. 5 is a configuration diagram of a contact mechanism of an IC with a lead frame according to a conventional technique.

6 is a state diagram in which the IC carrier is lowered from the state of FIG.

7 is a state diagram in which the pressing plate is lowered from the state of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 1A Guide hole 2 IC container 2A Recess 2B Reference hole 2C Guide hole 3 IC carrier 4 IC socket 4A Guide pin 5 Measurement board 5A Reference pin 5B Guide pin 6 Press plate 6A Convex section 10 Temperature chamber

Claims (1)

[Scope of utility model registration request] 1. An IC container (2) having a plurality of recesses (2A) for accommodating an IC (1) with a lead frame and having a reference hole (2B) and a guide hole (2C), and an IC container (2). 2) are arranged vertically and horizontally, and an IC carrier (3) that holds the IC container (2) so that it can move horizontally and a plurality of IC sockets (4) are arranged at positions corresponding to the recesses (2A). , The reference pin (5A) that goes into the reference hole (2B), the measurement board (5) that vertically installs the guide pin (5B) that goes into the guide hole (2C), and the multiple protrusions at the positions corresponding to the recesses (2A). With the pressing plate (6) forming the part (6A), the IC carrier (3) moves onto the measurement board (5) in the thermostat (10) and then descends to guide the IC (1). IC socket on (1A) (4)
The guide pin (4A) that stands upright is inserted, the lead of the IC (1) is positioned with the contact of the IC socket (4), and the pressing plate (6)
The contact mechanism of a large number of ICs with a lead frame under high and low temperatures, characterized in that the IC (1) is pressed by the convex part (6A) when the IC drops.