JPH11352184A - Ic testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a required strength of a constitutional member and to realize a small size of the structural member by forming a structure in which a reaction to the pressure of an IC to an IC socket is not transmitted to a surrounding structural member in an IC testing device for simultaneously testing many IC. SOLUTION: A cylinder 130 and a latch means 140 are provided on every pushers giving a pressure contact force to a pin of an IC. A space between the pusher and an IC socket 21 is latched by the latch means 140. An elongation force of the cylinder 130 is absorbed by the latch means 140 by actuating the cylinder 130 in the latched state and a reaction force urging the IC is not transmitted to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a type of IC test in which an IC under test is mounted on a test tray, and the IC under test is brought into contact with an IC socket provided on a test head while being mounted on the test tray to perform a test. Related to the device.

[0002]

2. Description of the Related Art An outline of an IC test apparatus using a test tray will be described with reference to FIGS. FIG. 3 is a plan view schematically showing the IC test apparatus. In the figure, reference numeral 100 denotes a chamber section including a test head, 200 denotes an IC storage section for storing ICs to be tested and ICs to be tested and classified, and 300 denotes an IC to be tested to be sent to the chamber section 100. Loader section, 400 is chamber section 1
The unloader unit that sorts and removes the tested ICs that have been tested at 00, and the TST is loaded with the IC under test by the loader unit 300 and sent to the chamber unit 100. The IC is tested by the chamber unit 100 and is tested. 5 shows an IC transfer tray for transferring the IC to the unloader unit 400. Hereinafter, this will be referred to as a test tray TST.
Reference numeral 00 denotes a constant temperature chamber 101 for applying a desired high or low temperature thermal stress to the IC under test loaded on the test tray TST, and an IC in which a thermal stress is applied in the constant temperature chamber 101 to the test head. Test chamber 102 and ICs tested in test chamber 102
And a heat removal tank 103 for removing the applied thermal stress. That is, when a high temperature is applied in the constant temperature bath 101, it is cooled by blowing air, returned to room temperature, and carried out to the unloader unit 400. In the thermostat 101, for example, -3
When a low temperature of about 0 ° C. is applied, the inside of the tank is heated by warm air or a heater to return the temperature to a level at which dew condensation does not occur, and then carried out to the unloader unit 400.

A constant temperature bath 101 and a heat removal bath 103 are arranged to protrude above the test chamber 102. As shown in FIG. 4, a substrate 105 is inserted between the constant temperature bath 101 and the heat removal bath 103, and a test tray transport unit 108 is mounted on the substrate 105.
In step 08, the test tray TST is transferred from the heat removal tank 103 to the thermostatic chamber 101. Test tray T
In the ST, the IC under test is loaded by the loader unit 300 and is carried into the thermostat 101. The constant temperature bath 101 is provided with a vertical transport unit, and the vertical transport unit supports a plurality of test trays TST to form a test chamber 102.
Wait until is available. During this standby, a high or low temperature thermal stress is applied to the IC under test. Test chamber 10
A test head 104 is disposed at the center of the test head 2, and a test tray TST is carried on the test head 104 so that an IC to be tested is brought into electrical contact with an IC socket provided on the test head 104 to perform a test. After the test, the test tray TST is heat-removed in the heat-removal tank 103, the temperature of the IC is returned to room temperature, and the IC is discharged to the unloader unit 400.

[0004] The IC storage section 200 is provided with an IC tester stocker 201 for storing ICs to be tested and a tested IC stocker 202 for storing ICs classified according to the test results. The IC under test 201
Are stacked and held.
The general-purpose tray KST is carried to the loader unit 300, and the general-purpose tray KST carried to the loader unit 300 is moved from the general-purpose tray KST to the loader unit 3.
The IC under test is transferred to the test tray TST stopped at 00. General-purpose tray KST to test tray TST
As shown in FIG. 4, two rails 301 provided on the upper portion of the substrate 105 are used as IC transport means for transporting the IC to the substrate.
And the test tray TS by these two rails 301
A movable arm 302 capable of reciprocating between the T and the general-purpose tray KST (this direction is defined as a Y direction); and a movable head 303 supported by the movable arm 302 and capable of moving in the X direction along the movable arm 302. XY transport means 304 constituted by A suction head is attached to the movable head 303 downward, and the suction head moves while sucking air, sucks an IC from the general-purpose tray KST, and transports the IC to the test tray TST. For example, about eight suction heads are mounted on the movable head 303, and convey eight ICs to the test tray TST at a time.

FIG. 5 shows the structure of the test tray TST.
In the test tray TST, a plurality of partition frames 13 are formed on a rectangular metal frame 12 in parallel and at equal intervals, and a plurality of mounting pieces are respectively provided on both sides of the partition frame 13 or on sides 12a of the frame 12 facing the partition frame 13. 14 are formed so as to protrude at equal intervals.
The carrier accommodating portions 15 are arranged and arranged between the three or between the partition frame 13 and the side 12a and the two mounting pieces 14. Each carrier storage unit 15 has one I
The C carrier 16 is housed, and is mounted on the two mounting pieces 14 in a floating state by the fastener 17. I
C carrier 16 is 16 × 4 on one test tray TST
It can be mounted in pieces.

[0006] As shown in FIG.
Pin 18 is exposed and held on the lower surface side. In the test head 104, the pins 18 of the exposed IC are
Socket contact 21A of IC socket 21
To bring the IC into electrical contact with the IC socket 21. To this end, an elevating means 120 that can move up and down is arranged above the test head 104, and a support frame 110 that can move up and down is provided below. The test tray TST is positioned and supported by the support frame 110, the test tray TST and the IC are pressed down from above, and the pins 18 of the IC are brought into contact with the socket contacts 21A.

The support frame 110 is, for example, a lower substrate 111
Is vertically movably supported through a vertical shaft 112 implanted in the vertical shaft 112. A biasing force is applied upward by a spring 113, and the vertical shaft 112 is prevented from falling off by a flange 114 provided at an upper end of the vertical shaft 112. The support frame 110 is supported at the height of the flange 114. In this state, by applying a pressing force to the test tray TST and the IC from above by the elevating means 120, the support frame 110 moves downward together with the test tray TST, and brings the pins 18 of the IC into contact with the socket contacts 21A.

The elevating means 120 includes a power cylinder 122 mounted on the upper substrate 121 and the power cylinder 122
And a thrust rod 124 penetrating the upper substrate 121 so as to be freely slidable and connected to an elevating plate 125. Reference numeral 126 denotes a support that integrates the upper substrate 121 and the lower substrate 111.

[0009]

Conventionally, the lifting / lowering means 120 is used.
Test tray TST and I mounted on it
Since a downward pressure contact force is applied to C, the lifting / lowering means 120 needs to generate a relatively large pressing force. In particular, a large pressing force is required because a pressing force is simultaneously applied to a plurality of ICs mounted on the test tray TST.

In order to test a large number of ICs in a short time, the number of ICs to be tested at the same time increases, and becomes about 16 or 32, and this number tends to increase in the future. As a result, the pressing force of the lifting / lowering means 120 increases, and accordingly, the strength of the upper substrate 121, the lower substrate 111, and the support columns 126 must be increased. Therefore, the entire apparatus becomes large and the weight increases. In addition, there is a disadvantage that the manufacturing cost is increased. Since it is expected that the number of ICs to be tested simultaneously will be further increased in the future, this tendency will become stronger and the size of the device will be unavoidable.

[0011]

According to the present invention, there is provided a cylinder for separately applying a pressing force to the ICs to be tested at the same time. The cylinder applies the pressing force to the ICs separately, and the reaction force against the pressing force is reduced. This is configured to be absorbed by latch means provided for each IC.

According to the configuration of the present invention, each IC to be tested
Is given a pressing force from a cylinder provided for each IC.
Further, the reaction force generated by the pressing force is absorbed by the latch means provided for each IC. Therefore, the lifting means 120
It is only necessary to perform the work of raising and lowering the lifting plate, and it is not necessary to generate a large pressing force. As a result, it is not necessary to increase the strength of the upper substrate, the lower substrate, the columns, and the like that support the lifting / lowering means, and the apparatus can be reduced in size and cost.

[0013]

FIG. 1 shows an embodiment of an IC test apparatus according to the present invention. In the present invention, an IC mounted on a test tray TST and held in a state of being mounted on the test tray is pressed against an IC socket of a test head to test the IC. Elevating means 12 for applying downward pressure contact force
A pressing cylinder 130 for each IC to be tested to zero;
It is characterized in that a latch means 140 is provided on one of the pressing cylinder 130 and the IC socket 21.

In the example shown in FIG. 1, the latch means 140 is composed of a pair of latch levers 141 and 141 and this latch lever 1
A case is shown in which the springs 41 and 141 are provided with a spring 142 for applying a biasing force in the direction in which the free ends of rotation come close to each other, and a claw 143 formed at the free end of rotation of the latch lever 141.
According to the latch means 140, when the elevating plate 125 is lowered, the pair of latch levers 141 move the test tray TST.
Of the IC to be tested mounted on the IC socket 21, and the claw 143 engages with the protrusion 21 </ b> B formed on the IC socket 21. This engaged state is maintained by the biasing force of the spring 142.

In this state, when the pressing cylinder 130 is extended, the cylinder 130 presses the pusher 19 to press the pin 18 of the IC against the socket contact 21A. At this time, since the reaction force applied to the cylinder 130 is absorbed by the latch means 140, a plurality of pins 18
Even when a reaction force is generated, the reaction force is not transmitted to the upper substrate 121 and the lower substrate 111.

Therefore, the lifting means 120 is simply a lifting plate 125
It is only necessary to have a driving force enough to raise and lower the upper substrate 1
21, the lower substrate 111, and the columns 126 do not need to have the strength to withstand the reaction force generated from a large number of ICs.
It is sufficient to have the strength to support the weight of 20. In the embodiment of FIG. 1, reference numeral 150 denotes a releasing means for releasing the latch state of the latch means 140. The release means 140 can be constituted by, for example, a cylinder 151 and an actuator 152. The actuator 152 is engaged with the free rotation end of the latch lever 141, and the pawl 143 is
1B, the latch means 140 is released.
Release the latched state of. Therefore, by releasing the latch state of the latch means 140 at the end of the IC test,
The elevating means 120 is raised, and the test tray T
By moving ST one pitch, for example, another IC
To test.

FIG. 2 shows another embodiment of the present invention. In this embodiment, a case is shown in which the latch lever 141 is pivotally supported on the IC socket 21 side, and the pawl 143 formed on the free play end of the latch lever 141 is engaged with the step 127 provided on the lift plate 125 side. It can be easily understood that this structure can provide the same operation and effect as the embodiment shown in FIG.

[0018]

As described above, according to the present invention, the latch means 14 is brought into pressure contact with the IC socket 21 for each IC.
0, and a pressing cylinder 130,
Thus, the reaction force generated when the pin 18 of each IC is pressed against the socket contact 21A of the IC socket 21 is absorbed, so that the upper substrate 121 and the lower substrate 1
11 and the strength of the support 126 need only be the strength supporting the weight of the lifting / lowering means 120.

As a result, the upper substrate 121 and the lower substrate 111
Since the thickness and diameter of the support 126 can be reduced, the size of the apparatus can be reduced, and the overall weight can be reduced. In addition, since the material can be made inexpensive, cost reduction can be expected.

[Brief description of the drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention.

FIG. 2 is a sectional view for explaining another embodiment of the present invention.

FIG. 3 is a schematic plan view for explaining a conventional technique.

FIG. 4 is a perspective view for explaining a conventional technique.

FIG. 5 is an exploded perspective view showing a test tray for explaining a conventional technique.

FIG. 6 is a sectional view for explaining a problem to be solved by the present invention.

[Explanation of symbols]

 18 pin 19 pusher 21 IC socket 21A socket contact 110 support frame 111 lower substrate 120 elevating means 121 upper substrate 122 power cylinder 123 movable plate 124 thrust rod 125 elevating plate 126 column 127 step 130 cylinder 140 latch means 141 latch lever 142 spring 143 Claw 150 release means

Claims (3)

[Claims] 1. A. First Embodiment B. a test tray on which a plurality of ICs are mounted in a plane; B. an IC socket disposed below the IC supported by the test tray; An elevating plate supported on the upper portion of the test tray so as to be movable up and down; A. A plurality of pushers supported by the lift plate and engaging with the ICs supported by the test tray when the lift plate moves downward; B. a pressing cylinder mounted between each pusher and said elevating plate to apply a downward biasing force to each pusher; The lift plate and the IC socket are rotatably supported by one of the IC sockets, and the lift plate engages with the other during the lowering operation to apply the extension force of the pressing cylinder to the IC via the pusher, L. latch means for absorbing a reaction force applied to the pressing cylinder; An IC test apparatus comprising: a release unit for releasing an engagement state of the latch unit. 2. The IC test apparatus according to claim 1, wherein
The latch means is constituted by a pair of latch levers rotatably supported on the lift plate side, and a hook formed at a free play end of the latch lever is engaged with the IC socket when the lift plate is lowered. An IC test apparatus characterized by having a structure for causing the test. 3. The IC test apparatus according to claim 1, wherein
The latch lever constituting the latch means is mounted on the IC
An IC having a structure rotatably supported on a socket side and a pawl formed at a free play end of the latch lever engaged with the lift plate side when the lift plate is lowered.
Testing equipment.