JP3469515B2 - Environmental test equipment for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component environmental test apparatus for performing an environmental test on electronic components such as semiconductor wafers held in a cassette.

[0002]

2. Description of the Related Art Conventionally, there has been known an environmental testing device for electronic parts, which applies a temperature load to a semiconductor wafer (electronic part) held in a cassette to carry out a durability test and a pass / fail judgment test. This kind of environmental test equipment is equipped with a drive circuit that gives a test signal to a semiconductor wafer.However, this drive circuit is usually placed outside the test tank to avoid high temperature and is housed inside the test tank. The cassette was connected to the drive circuit via a connector provided inside the test tank.

On the other hand, the applicant of the present invention has already provided a heater part in the test tank for directly contacting the cassette to locally heat only the cassette, thereby avoiding a high temperature inside the entire test tank. An environmental test device for electronic parts (Japanese Patent Application No. 10-314615, etc.) has been proposed. According to this device, when a cassette is loaded in the cassette support portion provided in the test apparatus main body, the cassette support portion is lowered to connect the one side connector of the cassette to the other side connector of the connection base portion located below, Thus, the semiconductor wafer held in the cassette is connected to the drive circuit in the connection base, and the heater is further lowered to bring the heater into contact with the cassette to locally heat the cassette. Therefore, the drive circuit for applying the test signal to the semiconductor wafer can be arranged inside the test tank having a relatively low temperature, so that the wiring connecting the cassette and the drive circuit can be shortened and the individual semiconductor chips in the cassette can be shortened. It is possible to eliminate the variation in the wiring length between the parts (electronic parts) and the drive circuit.

[0004]

However, in the above-mentioned environmental testing device for electronic parts, by lowering the cassette supporting portion, one side connector of the cassette is connected to the other side connector of the connecting base portion located below. By lowering the heater part, the heater part is brought into contact with the cassette to locally heat the cassette, and therefore the elevating and lowering drive part (a pair of left and right drive cylinders) for elevating and lowering the cassette support part.
And two independent drive units for raising and lowering the heater unit (a pair of left and right drive cylinders), that is, a total of four drive cylinders are required, and the overall size and cost of the device increase as the number of parts increases. There was also an issue to be solved that would invite it.

An object of the present invention is to improve such a problem, and an object thereof is to provide an environment testing device for electronic parts, which can reduce the size and size of the entire device by reducing the number of parts and can reduce the cost.

[0006]

SUMMARY OF THE INVENTION The present invention comprises a cassette 2 for holding electronic components (semiconductor wafer W) and a test apparatus main body 3 for carrying out an environmental test of the electronic components held in the cassette 2. When constructing the electronic component environmental testing apparatus 1 provided, a cassette support portion 4 for loading the cassette 2 and guided in a vertically movable manner, and a heater positioned above the cassette support portion 4 and heating the upper surface of the cassette 2. A heater support portion 6 which is guided to move up and down and supports the portion 5 so as to be displaceable upward, and a cassette support portion so that the cassette support portion 4 can move up and down within a constant stroke range S with respect to the heater support portion 6. 4 has a link part 7 for connecting the heater support part 6 and another connector 9 located below the cassette support part 4 and connected to one connector 8 provided on the cassette 2. A fixed connecting base 10, characterized in that it comprises an elevation drive unit 11 for raising and lowering the heater support 6. In this case, according to a preferred embodiment, the lift drive unit 11 includes a pair of left and right drive cylinders 11p and 11q for moving the heater support 6 up and down.

As a result, when the heater support portion 6 is in the raised position by the lifting drive portion 11, the heater portion 5 supported by the heater support portion 6 is raised and the cassette support portion 4 connected by the link portion 7 is also moved. It is rising. On the other hand, the cassette supporting unit 4 is loaded with the cassette 2, and the lifting drive unit 11
When the heater support portion 6 is lowered by the above, the cassette support portion 4 is also lowered as the heater support portion 6 is lowered. When the one-side connector 8 provided on the cassette 2 held by the cassette supporting portion 4 comes into contact with the other-side connector 9 provided on the connection base portion 10, the descending of the cassette supporting portion 4 is stopped.
At this time, since the cassette support portion 4 is connected to the heater support portion 6 by the link portion 7 so as to be movable up and down within a constant stroke range S, even if the lowering of the cassette support portion 4 is stopped, the heater support portion 4 6 descends further. When the heater portion 5 comes into contact with the upper surface of the cassette 2 due to the lowering of the heater support portion 6, the lowering of the heater portion 5 is stopped. At this time, since the heater portion 5 is supported by the heater support portion 6 so as to be displaceable upward, even if the lowering of the heater portion 5 is stopped, the heater support portion 6 is further lowered. Then, when the heater support portion 6 is lowered relative to the cassette support portion 4 by the stroke range S, the lowering of the heater support portion 6 is transmitted to the cassette support portion 4 via the link portion 7, and the cassette support portion 4 is transferred. Four
Is forcibly pushed down and the one side connector 8 provided on the cassette 2 and the other side connector 9 provided on the connection base 10 are completely connected.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, the structure of the electronic component environmental test apparatus 1 according to the present embodiment will be described with reference to FIGS.

FIG. 2 shows the appearance of the test apparatus main body 3 in the environment test apparatus 1. The test apparatus body 3 is the front panel 2
A test tank 22 having a plurality of inlets / outlets 21 ... In addition, a device box 23 is provided on the right side of the test tank 22, a display 25 and a pull-out keyboard (operation unit) 26 are arranged on a front panel 24 of the device box 23, and a storage unit 27 such as a computer is provided in the lower portion. To provide. In addition, 28a is a touch panel type display part, 28b is a safety lock switch for two-handed operation, and 28c is an emergency stop switch.

On the other hand, FIG. 3 shows a cassette 2 for holding one semiconductor wafer (electronic component) W. This cassette 2
Is stored in the test tank 22 (test apparatus main body 3) and an intended environmental test is performed. The cassette 2 has a rectangular cassette base 71 at the bottom, and the cassette base 7
A reinforcing frame 72 is fixed to the peripheral portion of the lower surface of No. 1 and a locking frame 73 is fixed to the peripheral portion of the upper surface of the cassette base 71. In addition, the cassette base 71 has a positioning pin 33 protruding upward from a connection base 10 described later.
Is inserted and the bush 74 having a positioning hole for positioning with respect to the connection base 10 is provided, and a plurality of one side connectors (for example, inlets) are provided at predetermined positions on the lower surface of the cassette base 71 which is the back surface of the cassette 2. 8
... is provided. It should be noted that the one-side connector 8 is usually provided with ten to twenty connectors each having sixty terminals. Further, a disk-shaped contactor 75 having a built-in sub-heater is attached to the upper surface of the cassette base 71, and the contactor 7
5 and the disk-shaped wafer tray 76 between the semiconductor wafer W
Hold it.

In this case, the disk-shaped wafer tray 76 is provided with an intake port attachment portion 77 protruding in the radial direction on the outer peripheral edge of the disk-shaped wafer tray 76, and at the tip of the intake port attachment portion 77, as shown in FIG. A pair of intake ports 78, 78 having a built-in check valve are attached. The direction of the intake ports 78, 78 is the cassette 2
Radial to the center of. The cassette 2 is
The suction state of the wafer tray 76 and the contactor 75 is maintained by vacuum suction from the intake port 78. The contactor 75 is a glass substrate having a large number of contacts that come into contact with the circuit of the semiconductor wafer W, and each contact is connected to the one-side connector 8.

On the other hand, FIGS. 1, 4 and 5 show the internal structure of the test apparatus body 3. Reference numerals 30 and 31 denote fixed frames inside the test tank 22 that are spaced apart from each other on the left and right sides. A plurality of horizontal support plates 32 are installed between the fixed frames 30 and 31 at regular intervals in the vertical direction. Then, the connection base 10 is fixedly installed on the upper surface of any horizontal support plate 32. The connection base portion 10 has a built-in circuit board portion including a drive circuit for supplying a test signal to the semiconductor wafer W, and has a plurality of other side connectors (for example, outlets) connected to the one side connector 8 of the cassette 2 on the upper surface. ) 9 ...
To arrange. Also, 33 ... Locating pins projecting upward from the upper surface of the connection base 10 are inserted into the bushes 74 provided on the cassette 2 side (see FIG. 3) to connect the connection base 1
It has a function of accurately positioning 0 and cassette 2. In addition, the positioning pins 33 ... Penetrate the connection base 10 and project upward from the upper end surfaces of the pillars 33s standing upright on the horizontal support plate 32. Therefore, the columns 33s ... Support the connection base 10. Further, 32c are lower limit stoppers, which come into contact with the cassette support portion 4 when the one-side connector 8 and the other-side connector 9 are completely connected.

On the other hand, four guide shafts 34 are vertically provided on the upper surface of the horizontal support plate 32, and the cassette support portion 4 and the heater support portion 6 are supported by the guide shafts 34.
Support so that it can move up and down. In this case, the linear bearings 35 are attached to the cassette support portion 4 at positions corresponding to the guide shafts 34, the guide shafts 34 are inserted into the linear bearings 35, and the guide shafts 34 are attached to the heater support portion 6. Install the linear bearing 36 ... at a position corresponding to
The guide shaft 34 is inserted through. This allows
A vertically movable cassette support portion 4 is arranged above the connection base portion 10 whose position is fixed, and further, a vertically movable heater support portion 6 is arranged above the cassette support portion 4.

On the upper surface of the horizontal support plate 32, an elevating and lowering drive section 11 for elevating and lowering the heater support section 6 is provided. The elevating / lowering drive unit 11 includes a pair of left and right drive cylinders 11p and 11q, and a horizontal support plate 3 located in the middle between the left and right front guide shafts 34 and rear guide shafts 34.
2 is fixedly installed on the upper surface of 2, and the drive rod 37
The tips of p and 37q are fixed to the left and right of the heater support 6.
As shown in FIG. 5, recesses 4pc and 4qc for arranging the drive cylinders 11p and 11q are provided on the left and right of the cassette support portion 4.

On the other hand, the cassette supporting portion 4 is shown in FIGS.
As shown in FIG. 5, the left support plate portion 4p, the right support plate portion 4q, and the rear support plate portion 4r are formed in a U shape, and the left support plate portion 4p is formed.
On the inner edge of the right support plate portion 4q, slit rail portions 4ps and 4qs into which the engaging side portions 2p and 2q of the cassette 2 are loaded (inserted) are provided. The cassette support 4
The cassette 2 with slit rails 4ps and 4qs
In addition to an automatic loading section (not shown) that automatically pulls in the cassette 2 and loads it into a regular position when the cassette 2 is moved to a predetermined position in the intake mechanism, as shown by a phantom line in FIG. The automatic suction system connection portion 39 is provided for automatically positioning the 38, 38 and automatically connecting them to the intake ports 78, 78 of the cassette 2.

On the other hand, the heater supporting portion 6 is provided with a heater portion 5 for heating the upper surface of the cassette 2, and the heater portion (main heater) 5 is supported by the heater supporting portion 6 so as to be displaceable upward. In this case, the heater support 6 has an opening 41.
Is formed, and the heater portion 5 is housed inside the opening portion 41, and locking plates 42i and 42j provided so as to project outward from the heater portion 5 are formed on the upper surface of the heater support portion 6 as a stepped concave portion. It mounts on 43i, 43j. Note that the guide pins 44 shown in FIG.
And the locking plate 42 on the guide pins 44.
The guide holes 45 provided in i, 42j are slidably engaged. Further, the bottom surface of the heater unit 5 matches the top surface of the wafer tray 76 described above.

Further, between the cassette support portion 4 and the heater support portion 6, four link portions 7 ... Which connect the cassette support portion 4 and the heater support portion 6 are provided. In this case, the link portions 7 ... Are arranged near the front, rear, left and right corners of the heater support portion 6, respectively. One link part 7 (same for other parts) is formed in a round bar shape, and has a relatively large diameter main body part 7b and this main body part 7b.
And a guide shaft portion 7s having a relatively small diameter from the lower end of the main body portion 7b. Then, the main body portion 7b is fixed to the heater supporting portion 6 using the mounting portion 7c, and the guide shaft portion 7s is
A guide hole 51 formed in the cassette supporting portion 4 is inserted, and a stopper 52 is attached to the lower end of the guide shaft portion 7s. As a result, the cassette support portion 4 can move up and down within a constant stroke range S with respect to the heater support portion 6.

Although the configuration of one stage on the arbitrary horizontal support plate 32 has been described above, the configuration on the horizontal support plates 32 ... In other stages is also the same.

Next, a method of using the environment test apparatus 1 according to this embodiment and the operation of each part will be described with reference to FIGS. Note that only the operation of one stage will be described, but the other stages operate similarly.

First, when not in use, the cassette support portion 4 and the heater support portion 6 are stopped at the raised position. This state is shown in FIG. On the other hand, at the time of use, the cassette 2 prepared in advance is housed in the test tank 22 through the inlet / outlet port 21 of the test apparatus main body 3, and the engaging side portions 2p and 2q of the cassette 2 are accommodated in the slit rail portion 4ps of the cassette support portion 4. 4qs (see FIG. 5). At this time, if the cassette 2 is inserted to a predetermined position and the touch panel of the touch panel type display unit 28a is touch-operated, the cassette 2 is automatically pulled in and loaded at a regular position by an automatic loading unit (not shown).
Further, the intake ports 38, 38 on the intake mechanism side and the intake ports 78, 78 of the cassette 2 are automatically positioned and connected by the automatic intake system connecting portion 39 shown by a phantom line in FIG.

Next, when the start switch is turned on, the drive cylinders 11p and 11q are drive-controlled, and the connection between the cassette 2 and the connection base portion 10 and the setting of the heater portion 5 are performed. This processing procedure will be specifically described with reference to FIGS. 7 and 8 and according to the flowchart of FIG.

First, the drive cylinders 11p and 11q are drive-controlled, and the drive rods 37p and 37q descend. As a result, the entire unit including the heater support portion 6 (heater portion 5) and the cassette support portion 4 (cassette 2) descend together (step S1). Then, the one side connectors 8 ... Provided on the cassette 2 held by the cassette support portion 4 are connected to the connection base portion 10.
When the cassette supporting portion 4 comes into contact with the other side connectors 9 ... At this time, since the cassette supporting portion 4 is connected to the heater supporting portion 6 by the link portions 7 so as to be movable up and down within a constant stroke range S, even if the lowering of the cassette supporting portion 4 is stopped. , The heater support 6 is further lowered (step S
3). Then, when the heater unit 5 contacts the upper surface of the cassette 2, the lowering of the heater unit 5 is stopped (step S4).
At this time, since the heater portion 5 is supported by the heater support portion 6 so as to be displaceable upward, even if the lowering of the heater portion 5 is stopped, the heater support portion 6 is further lowered (step S).
5).

When the heater supporting portion 6 descends relative to the cassette supporting portion 4 by the stroke range S due to the lowering of the heater supporting portion 6, the lower ends of the main body portions 7b of the link portions 7 ... Abut the upper surface of. This state is shown in FIG. In this state, as shown in the figure, the cassette support portion 4 stops at the position lowered by the height Ha from the highest position, and the heater support portion 6 moves from the highest position to the height H.
The heater part 5 is lowered by b, and the heater part 5 is
Is raised (separated) by a predetermined height Hc from the position supported by. Therefore, in order to obtain such a positional relationship at this time, the main body portion 7 in the link portions 7 ...
The length of b ... and the length of the guide shaft portions 7s (stroke range S) are set.

After that, when the heater supporting portion 6 is further lowered, the cassette supporting portion 4 is pressed by the lower ends of the main body portions 7b in the link portions 7 and the cassette supporting portion 4 is forcibly lowered (step S6). ). As a result, the one-side connector 8 provided on the cassette 2 and the other-side connector 9 provided on the connection base 10 are completely connected (step S).
7). On the other hand, when the connectors 8 ... And 9 ... Are completely connected, the drive control of the drive cylinders 11p and 11q is stopped. This state is shown in FIG. In this state, as shown in the figure, the cassette supporting portion 4 is connected to the connector 8 shown in FIG.
… And 9… From the state where they just touched each other, the height Hd
Just descend. The drive strokes of the drive cylinders 11p and 11q in the above operation are set in advance.

As a result, the cassette 2 is replaced by the test apparatus main body 3
The semiconductor wafer W is heated to 125 ° C. by the heater unit (main heater) 5 and the sub-heater built in the contactor 75. Further, the inside of the test tank 22 is maintained at a relatively low temperature of 45 ° C. by a blower fan and a ventilation duct (not shown). On the other hand, a test signal is applied to the semiconductor wafer W from the drive circuit of the connection base 10 via the connectors 9 ... And 8 ..., and the target environmental test is performed for a preset test time.

When the environmental test is completed, the drive cylinder 11
p and 11q are drive-controlled, the heater support 6 is lifted to release the contact between the heater 5 and the cassette 2, and the cassette support 4 is lifted to disconnect the cassette 2 from the connection base 10. It Further, the automatic intake system connecting portion 39 allows the intake ports 38, 38 and the intake ports 78, 78 to be introduced.
Is disconnected. Then, the cassette 2 is automatically pushed to a predetermined position by an unillustrated automatic loading section, so that the operator can manually take it out from the entrance 21 of the test apparatus body 3.

Therefore, according to the electronic component environmental test apparatus 1 of this embodiment, the drive circuit (connection base portion 10) for applying the test signal to the semiconductor wafer W (electronic component) is arranged inside the test tank 22. Since it can be installed, the wiring connecting the cassette 2 and the connection base 10 can be shortened and the variation in the wiring length between the individual semiconductor wafers W in the cassette 2 and the connection base 10 can be eliminated, and in addition, the drive provided for each stage The number of cylinders 11p ... Can be halved, and the overall size and cost of the device can be reduced.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The detailed configuration, shape, material, quantity, numerical values, etc. can be arbitrarily changed, added, or deleted without departing from the scope of the present invention. For example, although the electronic wafer is exemplified by the semiconductor wafer W, it may be any commercialized semiconductor chip, a circuit board, or an arbitrary circuit element such as a capacitor. Moreover, although a pair of drive cylinders is illustrated as the lifting drive unit 11, the case where another power source such as a drive motor is used is not excluded.

[0030]

As described above, the environment testing apparatus for electronic parts according to the present invention is positioned above the cassette support portion and the cassette support portion for loading the cassette, which is guided so as to be movable up and down.
And a heater support part that is vertically movable and supports a heater part that heats the upper surface of the cassette so that the heater part can be displaced upward.
A link part that connects the cassette support part and the heater support part so that the cassette support part can move up and down within a certain stroke range with respect to the heater support part, and a link part that is located below the cassette support part and is provided in the cassette. Since the fixed connection base part having the other side connector connected to the side connector and the elevating drive part for elevating the heater support part are provided, the following remarkable effects are obtained.

A circuit (for example, a drive circuit) that gives a test signal to an electronic component (semiconductor wafer) can be arranged inside the test tank, so that the wiring connecting the cassette and the circuit can be shortened and each electronic in the cassette can be shortened. It is possible to enjoy the basic effect that the variation in the wiring length between the component and the circuit can be eliminated.

The number of parts can be reduced, specifically, the number of drive cylinders provided in each stage can be halved, and the overall size and size of the apparatus can be reduced and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional side view showing a part of the internal structure of an environmental testing device according to a preferred embodiment of the present invention,

FIG. 2 is a front view of the appearance of the environment testing device,

FIG. 3 is a partial cross-sectional front view of a cassette in the same environment testing device,

FIG. 4 is a partial cross-sectional front view showing the internal structure of the environment test apparatus (including the cross section AA in FIG. 5);

FIG. 5 is a partial cross-sectional plan view showing the internal structure of the environmental testing device.

FIG. 6 is a flowchart for explaining a part of the operation of the environment test apparatus,

FIG. 7 is a side view of a partial cross-section for explaining the operation of the environment test apparatus.

FIG. 8 is a partial cross-sectional side view configuration diagram for explaining the operation of the environment testing device,

[Explanation of symbols]

1 Environmental test equipment for electronic components 2 cassettes 3 Test equipment body 4 Cassette support 5 heater part 6 Heater support 7 link section 8 One side connector 9 Other side connector 10 Connection base 11 Lift drive 11p drive cylinder 11q drive cylinder W Semiconductor wafer (electronic parts) S stroke range

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazunori Asanuma 246 Kodaka, Suzaka City, Nagano Prefecture Orion Machinery Co., Ltd. (72) Inventor Katsukazu Ezawa 4-3 Tsunashima Higashi, Kohoku Ward, Yokohama No. 1 within Matsushita Communication Industrial Co., Ltd. (56) Reference JP-A-11-238769 (JP, A) JP-A-11-186349 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB) Name) H01L 21/66 G01R 31/26

Claims (3)

(57) [Claims] 1. An environmental component test apparatus for electronic components, comprising: a cassette for holding electronic components; and a test apparatus main body for performing an environmental test on the electronic components held in the cassettes. A cassette support, a heater support located above the cassette support and movably supported upward for movably supporting the heater for heating the upper surface of the cassette, and to the heater support A link part connecting the cassette support part and the heater support part so that the cassette support part can be raised and lowered within a certain stroke range; and a link part provided below the cassette support part and provided on the cassette. A fixed connection base having another connector connected to the side connector, and an elevating / lowering drive unit for elevating / lowering the heater support. Environmental test equipment for electronic parts. 2. The environmental test apparatus for electronic parts according to claim 1, wherein the elevating and lowering drive unit includes a pair of left and right drive cylinders for elevating and lowering the heater support unit. 3. The environmental test apparatus for electronic parts according to claim 1, wherein the electronic parts are semiconductor wafers.