JPH0673340B2 - Chip-shaped electronic components - Google Patents
Chip-shaped electronic componentsInfo
- Publication number
- JPH0673340B2 JPH0673340B2 JP60171531A JP17153185A JPH0673340B2 JP H0673340 B2 JPH0673340 B2 JP H0673340B2 JP 60171531 A JP60171531 A JP 60171531A JP 17153185 A JP17153185 A JP 17153185A JP H0673340 B2 JPH0673340 B2 JP H0673340B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- chip
- molded body
- resin molded
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は各種電子機器に用いられるチップ状電子部品に
関するものである。TECHNICAL FIELD The present invention relates to a chip-shaped electronic component used in various electronic devices.
従来の技術 従来のチップ状電子部品は第４図に示すような構造にな
っていた。同図において、10は角柱状の樹脂成形体であ
り、金属板端子11a,11bの各々に電気的に接続されたコ
ンデンサやコイル等の回路素子（図示せず）を封止して
いる。金属板端子11a,11bの他端は各々樹脂成形体10の
外面に沿って曲げられ外部端子となっている。2. Description of the Related Art A conventional chip-shaped electronic component has a structure as shown in FIG. In the figure, 10 is a prismatic resin molded body that seals circuit elements (not shown) such as capacitors and coils electrically connected to each of the metal plate terminals 11a and 11b. The other ends of the metal plate terminals 11a and 11b are bent along the outer surface of the resin molded body 10 to serve as external terminals.
発明が解決しようとする問題点 従来の構成のチップ状電子部品では、外部端子の組み立
て工程における金属板端子11a,11bの曲げ加工時に樹脂
成形体10との封止境界部近傍の曲げ角度が鋭角になり、
この曲げ部に亀裂等が発生し機械的強度が劣化する。こ
のようなチップ状電子部品を回路基板に実装した場合、
外部からの機械的及び熱的衝撃により曲げ部が破断する
という欠点を有していた。Problems to be Solved by the Invention In the chip-shaped electronic component of the conventional configuration, the bending angle near the sealing boundary portion with the resin molded body 10 at the time of bending the metal plate terminals 11a, 11b in the assembly process of the external terminals is an acute angle. become,
A crack or the like is generated in this bent portion and mechanical strength is deteriorated. When such a chip-shaped electronic component is mounted on a circuit board,
It has a defect that the bent portion is broken by mechanical and thermal shock from the outside.
また、上記問題の発生を防止するための、封止境界部の
曲げ部に適度な曲げ半径が得られるような加工方法がと
られるが、この加工法は複雑で機械化が困難であり、ま
た曲げ半径のバラツキ等の問題を有していた。Further, in order to prevent the occurrence of the above problems, a processing method is adopted so that an appropriate bending radius can be obtained in the bent portion of the sealing boundary portion, but this processing method is complicated and difficult to mechanize, and bending is also difficult. There was a problem such as radius variation.
本発明の目的は、上記問題点を除去し複雑な加工方法を
必要とすることなく金属板端子の曲げ加工ができるチッ
プ状電子部品を提供することである。An object of the present invention is to eliminate the above-mentioned problems and to provide a chip-shaped electronic component capable of bending a metal plate terminal without requiring a complicated processing method.
問題点を解決するための手段 本発明のチップ状電子部品は、両側面より導出する金属
板端子を角柱状の樹脂成形体に沿って側面から底面にか
けＬ字状に折り曲げ、前記金属板端子は主平面の長手方
向の中心線を軸とし、ほぼ左右対称の形状をなし、先端
または端子導出部に切り込みを設けるとともに、切り込
みを設けない導出部または先端部の端子の幅をこの切り
込みの幅と同等もしくはそれ以下としたものである。Means for Solving the Problems In the chip-shaped electronic component of the present invention, metal plate terminals led out from both side surfaces are bent in an L shape from a side surface to a bottom surface along a prismatic resin molded body, and the metal plate terminals are With the centerline in the longitudinal direction of the main plane as an axis, it has a shape that is almost bilaterally symmetrical and has a notch at the tip or the lead-out portion of the terminal. It is equivalent or less.
作用 本発明によるチップ状電子部品は端子加工は上金型と下
金型の上下運動によって行うことができる。すなわち、
本発明の金属板端子の形状は前記の端子加工時に樹脂成
形体に沿って曲げ補助板をあてて加工することを可能に
したものであり、樹脂成形体との封止境界部近傍の曲げ
部に曲げ補助板に応じた曲げ半径をもたせることができ
る。これにより、樹脂成形体との封止境界部近傍の曲げ
部の亀裂等が発生するのを防止することができる。Function In the chip-shaped electronic component according to the present invention, the terminal processing can be performed by the vertical movement of the upper mold and the lower mold. That is,
The shape of the metal plate terminal of the present invention makes it possible to apply a bending auxiliary plate along the resin molded body at the time of processing the above-mentioned terminal, and the bent portion near the sealing boundary with the resin molded body. Can have a bending radius according to the bending assist plate. As a result, it is possible to prevent cracks and the like in the bent portion near the sealing boundary with the resin molded body.
実施例 以下、本発明の実施例について説明する。第１図は本発
明の一実施例を示す斜視図である。同図において、１は
角柱状の樹脂成形体であり、金属板端子2a,2bの一端
と、これに各々電気的に接続されたコンデンサやコイル
等の回路素子（図示せず）を封止している。Examples Examples of the present invention will be described below. FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, reference numeral 1 denotes a prismatic resin molded body which seals one end of the metal plate terminals 2a and 2b and circuit elements (not shown) such as capacitors and coils electrically connected to the metal plate terminals 2a and 2b, respectively. ing.
金属板端子2a,2bは樹脂成形体１の側面から底面にかけ
て外形に沿うように折り曲げられ、この金属板端子2a,2
bの端部には切り込み2cが設けてあり、また樹脂成形体
１の封止境界部近傍の端子部2dの幅の前記切り込み2cの
幅と同等もしくは狭くしてある。The metal plate terminals 2a, 2b are bent along the outline from the side surface to the bottom surface of the resin molded body 1, and the metal plate terminals 2a, 2b are
A cut 2c is provided at the end of b, and the width of the terminal 2d near the sealing boundary of the resin molding 1 is equal to or narrower than the width of the cut 2c.
第２図ａ〜ｃは本実施例の端子加工工程を示した図であ
る。第２図ａは端子加工前の図であり、１は樹脂成形体
を、2a,2bは金属板端子を示している。2A to 2C are views showing the terminal processing step of this embodiment. FIG. 2a is a view before processing the terminals, in which 1 is a resin molded body and 2a and 2b are metal plate terminals.
樹脂成形体１の底面に沿うように金属板端子2a,2bを加
工するには、まず樹脂成形体１の導出部近傍を曲げる前
に、底面に沿う部分の端子も直角もしくは鋭角に曲げる
ことにより樹脂成形体１の側面から底面にかけ樹脂成形
体１に密着するようにＬ字状に曲げることが必要であ
る。第２図ｂはその状態図を示す。To process the metal plate terminals 2a and 2b along the bottom surface of the resin molded body 1, first bend the terminals along the bottom surface at a right angle or an acute angle before bending the vicinity of the lead-out portion of the resin molded body 1. It is necessary to bend the resin molded body 1 in an L-shape from the side surface to the bottom surface so as to be in close contact with the resin molded body 1. FIG. 2b shows the state diagram.
図において、3a,3bは製品ホルダーを、４は上金型を、
５は下金型を示す。In the figure, 3a and 3b are product holders, 4 is an upper mold,
5 shows a lower mold.
第２図ｃは、端子加工工程の最終加工図であり、6a,6b
は製品ホルダーを、７は上金型を、８は曲げ補助板9a,9
bを取りつけた下金型を示す。FIG. 2c is a final processing drawing of the terminal processing step, and 6a, 6b.
Is a product holder, 7 is an upper mold, and 8 is a bending auxiliary plate 9a, 9
Shows the lower mold with b attached.
このような構成よりなる本発明のチップ状電子部品は、
下金型８に曲げ補助板9a,9bを取りつけ端子加工と同時
に金型の上下運動のみで、この曲げ補助板9a,9bの厚み
分だけ樹脂成形体１の導出部近傍の金属板端子2a,2bの
曲げ部に曲げ半径をもたすことができる。The chip-shaped electronic component of the present invention having such a configuration,
Bending auxiliary plates 9a and 9b are attached to the lower die 8, and only the vertical movement of the die is performed at the same time as the terminal processing, and the metal plate terminals 2a and 2a near the lead-out portion of the resin molding 1 are formed by the thickness of the bending assistance plates 9a and 9b. A bend radius can be given to the bent portion of 2b.
また、下金型８に取りつけた曲げ補助板9a,9bの幅は、
樹脂成形体１の導出部近傍の端子2dの幅と同等もしくは
それ以上とする。これは樹脂成形体１の導出部近傍の端
子2dの幅全体に曲げ補助板9a,9bを当てることにより曲
げ半径のバラツキを少なくし、また端子に均一な曲げ応
力を加えるためである。The width of the bending assist plates 9a and 9b attached to the lower mold 8 is
The width is equal to or larger than the width of the terminal 2d near the lead-out portion of the resin molded body 1. This is because the bending assist plates 9a and 9b are applied to the entire width of the terminal 2d near the lead-out portion of the resin molded body 1 to reduce the variation of the bending radius and to apply a uniform bending stress to the terminal.
以上述べたように本発明の金属板端子2a,2bの形状は曲
げ部の亀裂の発生を防止することができ、曲げ半径のバ
ラツキも少なくすることができる。As described above, the shape of the metal plate terminals 2a and 2b of the present invention can prevent the occurrence of cracks in the bent portion and reduce variations in the bending radius.
第３図は他の実施例であり、１は樹脂成形体を示し、金
属板端子2a,2bの一端とこれに各々電気的に接続された
コンデンサやコイル等の回路素子（図示せず）を封止し
ている。FIG. 3 shows another embodiment, in which 1 is a resin molded body, and one end of the metal plate terminals 2a, 2b and circuit elements (not shown) such as capacitors and coils electrically connected to the metal plate terminals 2a, 2b, respectively. It is sealed.
金属板端子2a,2bの形状は樹脂成形体１の封止境界近傍
には中央に切り込み2cを設けて２分割してあり、また樹
脂成形体１の側面から底面にかけての金属板端子2a,2b
は前記切り込み2cと同等もしくはそれ以下の幅としてい
る。The shape of the metal plate terminals 2a and 2b is divided into two by providing a notch 2c in the center in the vicinity of the sealing boundary of the resin molded body 1, and the metal plate terminals 2a and 2b from the side surface to the bottom surface of the resin molded body 1 are formed.
Has a width equal to or smaller than the cut 2c.
本実施例における端子加工工程は、曲げ補助板の先端形
状が異なるのみで基本的には第２図に示した前記実施例
と同一である。従って本実施例においても前記実施例と
同様の効果がある。The terminal processing step of this embodiment is basically the same as that of the embodiment shown in FIG. 2 except that the shape of the tip of the bending assisting plate is different. Therefore, this embodiment also has the same effect as the above embodiment.
発明の効果 本発明によるチップ状電子部品は従来のような複雑な加
工工程を必要とせず機械化が容易にでき、端子の曲げ部
半径のバラツキを少なくし、均一な曲げ応力を加えるこ
とができるため曲げ部の亀裂の発生が防止でき、しかも
樹脂成形体の側面と底面に密着させることができ品質向
上が図れる等の効果がある。EFFECTS OF THE INVENTION The chip-shaped electronic component according to the present invention can be easily mechanized without requiring a complicated processing step as in the conventional art, can reduce the variation in the radius of the bent portion of the terminal, and can apply a uniform bending stress. It is possible to prevent the occurrence of cracks in the bent portion, and moreover, it is possible to bring the resin molded body into close contact with the side surface and the bottom surface, thereby improving quality.
第１図は本発明の一実施例によるチップ状電子部品の斜
視図、第２図ａ〜ｃは本発明の端子加工工程図、第３図
は本発明の他の実施例を示すチップ状電子部品の斜視
図、第４図は従来のチップ状電子部品の斜視図である。 １……樹脂成形体、2a,2b……金属板端子、2c……切り
込み、2d……端子部。FIG. 1 is a perspective view of a chip-shaped electronic component according to an embodiment of the present invention, FIGS. 2a to 2c are views of a terminal processing step of the present invention, and FIG. 3 is a chip-shaped electronic part showing another embodiment of the present invention. FIG. 4 is a perspective view of a component, and FIG. 4 is a perspective view of a conventional chip-shaped electronic component. 1 ... Resin molding, 2a, 2b ... Metal plate terminal, 2c ... Notch, 2d ... Terminal part.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 今井 直 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 北野 幸弘 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 大嶽 博志 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 実開 昭61−34723（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nao Imai 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Yukihiro Kitano 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Hiroshi Otaki 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References: 61-34723 (JP, U)
Claims (1)
柱状の樹脂成形体に沿って側面から底面にかけてＬ字状
に折り曲げ、前記金属板端子は主平面の長手方向の中心
線を軸とし、ほぼ左右対称の形状をなし先端または端子
導出部に切り込みを設けるとともに切り込みを設けない
導出部または先端部の端子の幅をこの切り込みの幅と同
等もしくはそれ以下としたチップ状電子部品。1. A pair of metal plate terminals extending from both side surfaces are bent in an L shape from a side surface to a bottom surface along a prismatic resin molded body, and the metal plate terminals have a center line in a longitudinal direction of a main plane as an axis. A chip-shaped electronic component having a substantially symmetrical shape and having a notch at the tip or the terminal lead-out portion and a terminal width at the lead-out portion or the tip portion not having the notch equal to or less than the width of the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171531A JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171531A JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6231107A JPS6231107A (en) | 1987-02-10 |
| JPH0673340B2 true JPH0673340B2 (en) | 1994-09-14 |
Family
ID=15924849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60171531A Expired - Fee Related JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0673340B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013125896A (en) * | 2011-12-15 | 2013-06-24 | Sumida Corporation | Coil component |
| US10875969B2 (en) | 2015-04-20 | 2020-12-29 | Merck Patent Gmbh | Composition for forming coating film and method for forming coating film using same |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0625951Y2 (en) * | 1988-06-29 | 1994-07-06 | 株式会社村田製作所 | Electronic parts |
| JPH0523511U (en) * | 1991-08-31 | 1993-03-26 | 太陽誘電株式会社 | Chip type electronic parts with lead terminals |
| JPH0621217U (en) * | 1992-08-11 | 1994-03-18 | 株式会社トーキン | Wire wound chip inductor |
| JP4665603B2 (en) * | 2005-05-19 | 2011-04-06 | パナソニック株式会社 | Coil parts |
| CN102939634B (en) | 2010-06-09 | 2015-10-07 | 株式会社村田制作所 | Electronic component and manufacture method thereof |
| JP5891344B2 (en) * | 2011-08-02 | 2016-03-23 | パナソニックＩｐマネジメント株式会社 | Surface mount electronic components |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134723U (en) * | 1984-07-31 | 1986-03-03 | 岡谷電機産業株式会社 | Molded capacitor |
-
1985
- 1985-08-02 JP JP60171531A patent/JPH0673340B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013125896A (en) * | 2011-12-15 | 2013-06-24 | Sumida Corporation | Coil component |
| US10875969B2 (en) | 2015-04-20 | 2020-12-29 | Merck Patent Gmbh | Composition for forming coating film and method for forming coating film using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6231107A (en) | 1987-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |