JPS6231107A - Chip-like electronic component - Google Patents
Chip-like electronic componentInfo
- Publication number
- JPS6231107A JPS6231107A JP60171531A JP17153185A JPS6231107A JP S6231107 A JPS6231107 A JP S6231107A JP 60171531 A JP60171531 A JP 60171531A JP 17153185 A JP17153185 A JP 17153185A JP S6231107 A JPS6231107 A JP S6231107A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- metal plate
- molded body
- resin molded
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に用いられるチップ状電子部品
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to chip-shaped electronic components used in various electronic devices.
従来の技術
従来のチップ状電子部品は第４図に示すような構造にな
っていた。同図において、１０は樹脂成形体であシ、金
属板端子１１ａ、１１ｂの各々に電気的に接続されたコ
ンデンサコイル等の回路素子（図示せず）を封止してい
る。金属板端子１１ａ。Prior Art A conventional chip-shaped electronic component had a structure as shown in FIG. In the figure, 10 is a resin molded body, which seals circuit elements (not shown) such as capacitor coils electrically connected to each of metal plate terminals 11a and 11b. Metal plate terminal 11a.
１１ｂの他端は各々樹脂成形体１ｏの外面に沿って曲げ
られ外部端子となっている。The other end of each of the resin molded bodies 1o is bent along the outer surface of the resin molded body 1o to serve as an external terminal.
発明が解決しようとする問題点
従来の構成のチップ状電子部品では、外部端子の組み立
て工程における金属板端子１１ａ、１１ｂの曲げ加工時
に樹脂成形体１０との封止境界部近傍の曲げ角度が鋭角
になシ、−この曲げ部に亀裂等が発生し、機械的強度が
劣化する。このようなチップ状電子部品を回路基板に実
装した場合、外部からの機械的及び熱的衝撃により曲げ
部が破断するという欠点を有していた。Problems to be Solved by the Invention In chip-shaped electronic components with a conventional configuration, when bending the metal plate terminals 11a and 11b in the external terminal assembly process, the bending angle near the sealing boundary with the resin molded body 10 is acute. - Cracks occur in this bent portion, and mechanical strength deteriorates. When such a chip-shaped electronic component is mounted on a circuit board, it has a drawback that the bent portion breaks due to external mechanical and thermal shock.
また、上記問題の発生を防止するため、封止境界部の曲
げ部に適度な曲げ半径が得られるような加工方法がとら
れるが、この加工方法は複雑で機械化が困難であり、ま
た曲げ半径のバラツキ等の問題を有していた。In addition, in order to prevent the above problem from occurring, a processing method is used to obtain an appropriate bending radius at the bent portion of the sealing boundary, but this processing method is complicated and difficult to mechanize, and the bending radius There were problems such as variations in the results.
本発明の目的は、上記問題点を除去し、複雑な加工方法
を必要とすることなく、金属板端子の曲げ加工ができる
チップ状電子部品を提供すること本発明のチップ状電子
部品は、両側面より導出する金属板端子を樹脂成形体に
沿って側面から底面にかけＬ字状に折シ曲げて成る角形
チップ状部品で、前記金属板端子は主平面の長手方向の
中心線を軸とし、ほぼ左右対称の形状をなし、前記金属
板端子の一方の端に切シ込みを設けると共に、他端の前
記端子の幅をこの切シ込みの幅と同等もしくはそれ以下
としたものである。An object of the present invention is to provide a chip-shaped electronic component that eliminates the above-mentioned problems and allows bending of metal plate terminals without requiring a complicated processing method. A square chip-shaped component formed by bending a metal plate terminal led out from the surface into an L-shape along a resin molded body from the side surface to the bottom surface, the metal plate terminal having the center line in the longitudinal direction of the main plane as its axis, The metal plate terminal has a substantially symmetrical shape, and one end of the metal plate terminal is provided with a notch, and the width of the terminal at the other end is equal to or smaller than the width of the notch.
作 用
本発明によるチップ状電子部品は端子加工は上金型と下
金型の上下運動によって行う。本発明の金属板端子の形
状は前記の端子加工時に樹脂成形体に沿って曲げ補助板
をあてて加工することを可能にしたものであシ、樹脂成
形体との封圧境界部近傍の曲げ部に曲げ補助板に応じた
曲げ半径をもたせることができる。これにより、樹脂成
形体との封止境界部近傍の曲げ部の亀裂等が発生するの
を防止することができる。Function In the chip-shaped electronic component according to the present invention, terminal processing is performed by vertical movement of an upper mold and a lower mold. The shape of the metal plate terminal of the present invention is such that it is possible to process the terminal by applying a bending auxiliary plate along the resin molding during the terminal processing, and bending near the sealing pressure boundary with the resin molding. The bending radius can be set according to the bending auxiliary plate. Thereby, it is possible to prevent cracks from occurring in the bent portion near the sealing boundary with the resin molded body.
実施例
以下、本発明の実施例について説明する。第１図は本発
明の一実施例を示す斜視図である。同図において、１は
樹脂成形体であシ、金属板端子の２ａ、２ｂの一端と、
これに各々電気的に接続されたコンデンサーやコイル等
の回路素子（図示せず）を封止している。Examples Examples of the present invention will be described below. FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, 1 is a resin molded body, and one end of metal plate terminals 2a and 2b;
Circuit elements (not shown) such as capacitors and coils electrically connected to these are sealed.
金属板端子２ａ、２ｂは樹脂成形体１の側面から底面に
かけて外形に沿うように折シ曲げられ、この金属板端子
２ａ、２ｂの端部には切シ込み２ｃが設けてあり、また
樹脂成形体１の封止境界部近傍の端子部２ｄの幅は前記
切り込み２Ｃの幅と同等もしくは狭くしである。The metal plate terminals 2a, 2b are bent to follow the outer shape of the resin molded body 1 from the side surface to the bottom surface, and a notch 2c is provided at the end of the metal plate terminals 2a, 2b. The width of the terminal portion 2d near the sealing boundary of the body 1 is equal to or narrower than the width of the cut 2C.
第２図＆ ”−Ｃは本実施例の端子加工工程を示した図
である。第２図ａは端子加工前の図であシ、１は樹脂成
形体を、２ａ、２ｂは金属板端子を示している。Figure 2&''-C is a diagram showing the terminal processing process of this embodiment. Figure 2a is a diagram before terminal processing, 1 is a resin molded body, and 2a and 2b are metal plate terminals. It shows.
樹脂成形体１の底面に沿うように金属板端子２ａ、２ｂ
を加工するには、まず樹脂成形体１の導出部近傍を曲げ
る前に、底面に沿う部分の端子を直角もしくは鋭角に曲
げることにより樹脂成形体１の側面から底面にかけ樹脂
成形体１に密着するようにＬ字状に曲げることが必要で
ある。第２図すはその状態図を示す。Metal plate terminals 2a and 2b are placed along the bottom surface of the resin molded body 1.
To process the resin molded body 1, first, before bending the vicinity of the lead-out part of the resin molded body 1, bend the terminal along the bottom surface at a right angle or an acute angle so that the terminal extends from the side surface of the resin molded body 1 to the bottom surface and comes into close contact with the resin molded body 1. It is necessary to bend it into an L shape. Figure 2 shows its state diagram.
図において、３ａ、３ｂＩ′ｉ製品ホルダーを、４は上
金型を、６は下金型を示す。In the figure, 3a, 3bI'i product holders are shown, 4 is an upper mold, and 6 is a lower mold.
Ｍ２図Ｃは、端子加工工程の最終加工図であシ、ａａ、
ｅｂ？′ｉ製品ホルダーを、７は止金型を、８は曲げ補
助板９ａ、９ｂを取りつけた下金型を示す。M2 drawing C is the final processing drawing of the terminal processing process, aa,
eb? 'i indicates a product holder, 7 indicates a stopper die, and 8 indicates a lower die to which bending auxiliary plates 9a and 9b are attached.
このような構成よりなる本発明のチップ状電子部品は、
下金型８に曲げ補助板９ａ、９ｂを取シつけ端子加工と
同時に金型の上下運動のみで、この曲げ補助板ｓａ、ｓ
ｂの厚み分だけ樹脂成形体１の導出部近傍の金属板端子
２ａ、２ｂの曲げ部に曲げ半径をもたすことができる。The chip-shaped electronic component of the present invention having such a configuration is as follows:
The bending auxiliary plates 9a and 9b are attached to the lower mold 8, and the bending auxiliary plates sa and s can be made by simply moving the mold up and down at the same time as terminal processing.
The bent portions of the metal plate terminals 2a, 2b near the lead-out portion of the resin molded body 1 can have a bending radius corresponding to the thickness b.
また、下金型８に取りつけた曲げ補助板ｓａ、９ｂの幅
は、樹脂成形体１の導出部近傍の端子２ｄの幅と同等も
しくはそれ以上とする。これは成形体導出部近傍の端子
２ｄの幅全体に曲げ補助板９ａ、９ｂを当てることによ
り曲げ半径の六うツキを少なくし、また端子に均一な曲
げ応力を加えるためである。Further, the width of the bending auxiliary plates sa and 9b attached to the lower mold 8 is equal to or larger than the width of the terminal 2d near the lead-out portion of the resin molded body 1. This is because the bending auxiliary plates 9a, 9b are applied to the entire width of the terminal 2d in the vicinity of the molded body lead-out portion, thereby reducing irregularities in the bending radius and applying uniform bending stress to the terminal.
以上述べたように本発明の端子の形状は曲げ部の亀裂の
発生を防止することができ、曲げ半径のバラツキも少な
くすることができる。As described above, the shape of the terminal of the present invention can prevent the occurrence of cracks in the bent portion, and can also reduce variations in the bending radius.
第３図は他の実施例であり、１は樹脂成形体を示し、金
属板端子２ａ 、２ｂの一端とこれに各々電電的に接続
されたコンデンサーやコイル等の回路素子（図示せず）
を封止している。第３図すは本実施例の３角法に基づい
た図を示す。FIG. 3 shows another embodiment, in which 1 indicates a resin molded body, one end of metal plate terminals 2a and 2b, and circuit elements such as capacitors and coils (not shown) electrically connected to each end of the metal plate terminals 2a and 2b.
is sealed. FIG. 3 shows a diagram based on the trigonometric method of this embodiment.
金属板端子２ａ、２ｂの形状は樹脂成形体１の封止境界
近傍には中央に切シ込み２Ｃを設けて２分割してあシ、
また樹脂成形体１の側面から底面にかけては前記切シ込
み２Ｃと同等もしくはそれ以下の幅としている。The shape of the metal plate terminals 2a, 2b is divided into two by providing a notch 2C in the center near the sealing boundary of the resin molded body 1.
Further, the width from the side surface to the bottom surface of the resin molded body 1 is equal to or smaller than the above-mentioned incision 2C.
本実施例における端子加工工程は、曲げ補助板の先端形
状が異なるのみで基本的には第２図に示した前記実施例
と同一である。従って本実施例においても前記実施例と
同様の効果がある。The terminal processing process in this embodiment is basically the same as that in the embodiment shown in FIG. 2, except that the shape of the tip of the bending auxiliary plate is different. Therefore, this embodiment also has the same effects as the previous embodiment.
発明の効果
本発明によるチップ状電子部品は従来のような複雑な加
工工程を必要とせず機械化が容易にでき、曲げ部の亀裂
の発生が防止でき、品質向上が図れる等の効果がある。Effects of the Invention The chip-shaped electronic component according to the present invention has the following effects: it can be easily mechanized without the need for complicated processing steps as in the past, it can prevent cracks from forming at bent portions, and it can improve quality.
第１図は本発明の一実施例によるチップ状電子部品の斜
視図、第２図ａ ”−Ｃは本発明の端子加工工程図、第
３図は本発明の他の実施例を示すチップ状電子部品の斜
視図、第４図は従来のチップ状電子部品の斜視図である
。
１−・・・・・樹脂成形体、２ａ、２ｂ・・・・・・金
属板端子、２Ｃ・・・・・・切シ込み、２ｄ・・・・・
端子部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第 ２ 図
第３図FIG. 1 is a perspective view of a chip-shaped electronic component according to an embodiment of the present invention, FIG. 2 a"-C is a terminal processing process diagram of the present invention, and FIG. A perspective view of an electronic component. Fig. 4 is a perspective view of a conventional chip-shaped electronic component. 1-...Resin molded body, 2a, 2b...Metal plate terminal, 2C... ...Cut depth, 2d...
Terminal section. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3
Claims (1)
沿って側面から底面にかけてＬ字状に折り曲げ、前記金
属板端子は主平面の長手方向の中心線を軸とし、ほぼ左
右対称の形状をなし先端または端子導出部に切り込みを
設けるとともに切り込みを設けない導出部または先端部
の端子の幅をこの切り込みの幅と同等もしくはそれ以下
としたことを特徴としたチップ状電子部品。A pair of metal plate terminals led out from both sides are bent into an L-shape from the side to the bottom along the resin molded body, and the metal plate terminals have a substantially symmetrical shape with the center line in the longitudinal direction of the main plane as an axis. What is claimed is: 1. A chip-shaped electronic component characterized in that a notch is provided at the tip or the terminal lead-out portion, and the width of the terminal at the lead-out portion or the tip without the notch is equal to or smaller than the width of the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171531A JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171531A JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6231107A true JPS6231107A (en) | 1987-02-10 |
| JPH0673340B2 JPH0673340B2 (en) | 1994-09-14 |
Family
ID=15924849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60171531A Expired - Fee Related JPH0673340B2 (en) | 1985-08-02 | 1985-08-02 | Chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0673340B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028125U (en) * | 1988-06-29 | 1990-01-19 | ||
| JPH0523511U (en) * | 1991-08-31 | 1993-03-26 | 太陽誘電株式会社 | Chip type electronic parts with lead terminals |
| JPH0621217U (en) * | 1992-08-11 | 1994-03-18 | 株式会社トーキン | Wire wound chip inductor |
| JP2006324458A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Coil component |
| JP2013033841A (en) * | 2011-08-02 | 2013-02-14 | Panasonic Corp | Surface-mounted electronic component |
| JP5454684B2 (en) * | 2010-06-09 | 2014-03-26 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5935309B2 (en) * | 2011-12-15 | 2016-06-15 | スミダコーポレーション株式会社 | Coil parts |
| JP2016204487A (en) | 2015-04-20 | 2016-12-08 | アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ | Composition for forming coated film and method for forming coated film using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134723U (en) * | 1984-07-31 | 1986-03-03 | 岡谷電機産業株式会社 | Molded capacitor |
-
1985
- 1985-08-02 JP JP60171531A patent/JPH0673340B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134723U (en) * | 1984-07-31 | 1986-03-03 | 岡谷電機産業株式会社 | Molded capacitor |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028125U (en) * | 1988-06-29 | 1990-01-19 | ||
| JPH0625951Y2 (en) * | 1988-06-29 | 1994-07-06 | 株式会社村田製作所 | Electronic parts |
| JPH0523511U (en) * | 1991-08-31 | 1993-03-26 | 太陽誘電株式会社 | Chip type electronic parts with lead terminals |
| JPH0621217U (en) * | 1992-08-11 | 1994-03-18 | 株式会社トーキン | Wire wound chip inductor |
| JP2006324458A (en) * | 2005-05-19 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Coil component |
| JP4665603B2 (en) * | 2005-05-19 | 2011-04-06 | パナソニック株式会社 | Coil parts |
| JP5454684B2 (en) * | 2010-06-09 | 2014-03-26 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| US8760256B2 (en) | 2010-06-09 | 2014-06-24 | Murata Manufacturing Co., Ltd. | Electronic component and manufacturing method thereof |
| JP2013033841A (en) * | 2011-08-02 | 2013-02-14 | Panasonic Corp | Surface-mounted electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0673340B2 (en) | 1994-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |