JPH0523511U - Chip type electronic parts with lead terminals - Google Patents

Abstract

(57) [Summary] (Corrected) When soldering, the flux is the lead terminal 2 and the exterior material 1.
This prevents fatigue damage due to vibrations of the lead terminals and entering into the gap between and. [Structure] The lead terminals 2 and 2 are bent at a lead-out base portion from the outer package 1, further bent at an edge of an end surface of the outer package 1, and a tip portion is attached to a bottom surface of the outer package 1. In this case, the adhesive 6 is fixed between the lead terminals 2 and 2 and the end surface of the outer package 1. With the adhesives 6, 6, the lead terminals 2,
Flux does not penetrate between 2 and the end surface of the outer package 1.
Further, the lead terminals 2 and 2 are held on the exterior material 1 by the adhesives 6 and 6, vibration is suppressed, and fatigue failure does not occur.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement of a chip-type electronic component with a lead terminal used for an inductor, etc., in which an electronic component is covered with an insulating outer casing such as resin, and a lead terminal derived from this outer casing is bent along the outer casing. ..

[0002]

[Prior Art]

 For example, as shown in Japanese Utility Model Laid-Open No. 2-101524, an inductor may have a chip-type electronic component with lead terminals as described above. The structure and usage of this electronic component will be described with reference to FIGS. 3 and 4. The electronic component main body 8 is covered with the outer casing 1 formed by molding with an insulator, for example, resin, and the electronic component main body 8 is The lead terminals 2 and 2 at both ends are pulled out from both ends of the exterior body 1. The lead terminals 2 and 2 are bent at a base portion extending from the outer package 1 and attached to an end of the outer package 1. This chip-type electronic component is mounted on soldering lands 7, 7 formed on a circuit board 5, and the lead terminals 2, 2 are electrically conductively fixed to the soldering lands 7, 7 by solders 4, 4. To be done.

[0003]

[Problems that the device is trying to solve]

 When soldering the chip-type electronic component to the soldering land, flux-containing paste solder is often used, but this flux must be removed because it is corrosive to the metal forming the lead terminals. is there. For this reason, after soldering, this is ultrasonically cleaned.

However, in the above-described chip-type electronic component with lead terminals, the lead terminals 2 and 2 led out from the side surface of the exterior body 1 are formed because the lead terminals 2 and 2 are bent after the exterior body 1 is formed. Among these, since there are gaps 9 and 9 between the portions beyond the bent portions 3 and 3 and the exterior body 1, the flux that has penetrated into the gaps 9 and 9 may not be completely removed by ultrasonic cleaning. is there. The bent portions 3 and 3 of the lead-out base portion from the outer package 1 are usually formed by bending the lead-out base portion, and the lead terminals 2 and 2 are thin metal plates of 0.2 to 0.5 mm. Therefore, the bent portions 3 and 3 are locally deteriorated by bending. Moreover, since the electronic component body 8 is supported by the lead terminals 2 and 2 only at the lead-out base thereof, after the chip-shaped electronic component is soldered to the circuit board 5, ultrasonic cleaning for flux removal is performed. After that, the parts before the lead terminals 2 and 2 are fixed to the soldering lands, but the electronic component body is not fixed to the circuit board at all, and the lead terminals 2 and 2 are fixed as described above. Since it is a thin metal plate, it is easily bent. As a result, stress is repeatedly generated in the bent portions 3 and 3, and metal fatigue may occur, causing the bent portions 3 and 3 to break. Therefore, an object of the present invention is to solve the above-mentioned conventional problems and to provide a chip-type electronic component with a lead terminal in which flux does not enter the gap and breakage of the lead terminal can be prevented.

[0005]

[Means for Solving the Problems]

 That is, in order to achieve the above-mentioned object, the present invention has an electronic component body 8 covered with the exterior body 1 and lead terminals 2 and 2 connected to the electronic component body 8 and led out from the exterior body 1, In a chip-type electronic component with lead terminals in which the lead terminals 2 and 2 are bent so as to follow the exterior body 1, the lead terminals 2 and 2 and the exterior body 1 which are led out from the exterior body 1 are fixed by an adhesive agent. A chip-type electronic component with a lead terminal is provided.

[0006]

[Action]

 In the chip-type electronic component with lead terminals, the adhesive 6, 6 is interposed between the lead terminals 2 and 2 and the outer package 1 to fill the gap in that portion, and the flux enters there when soldering. Absent. Further, since the lead terminals 2 and 2 and the outer package 1 are fixed by an adhesive, when the chip type electronic component according to the present invention is soldered to the soldering lands 7, 7 on the circuit board, The component body 8 is supported by two points of the lead terminals 2 and 2 of the portion which is led out from the exterior body and the opposing surfaces of the exterior body 1 and the lead terminals 2 and 2 which are fixed by an adhesive. .. Therefore, since the electronic component body 8 is securely fixed to the circuit board, even if the circuit board is vibrated by ultrasonic cleaning or the like, the component itself vibrates differently from the vibration of the circuit board. Disappears. Therefore, stress is not repeatedly generated in the bent portions 3 and 3, and fatigue fracture does not occur in that portion. Also, by providing the bent portion of the lead terminal at a position away from the lead-out base, the lead terminal between the lead-out base and the bend will bend when the circuit board to which the component according to the present invention is soldered receives vibration. .. Therefore, it is possible to absorb the difference between the lead terminal portion of the lead-out base portion and the portion fixed by the adhesive, so that it is possible to further suppress the fatigue of the bent portion. In addition, the adhesive is applied to one or both of the main surface of the lead terminal on the exterior body side and the surface on the exterior body side to fix them, so that the adhesive does not adhere to the outer surface of the lead terminal. Variation can be suppressed. Also, by applying an adhesive to the outer surface of the lead terminal on the exterior side, the lead terminal is bent, and the lead terminal and the exterior body are fixed, so that it can be bent along the lower main surface of the chip-type electronic component. The lead terminals can also be easily fixed with an adhesive.

[0007]

【Example】

 Next, with reference to FIGS. 1 and 2, an embodiment of the present invention will be concretely described along with manufacturing examples and usage examples. The electronic component body 8 such as an inductor has a pair of lead terminals 2 and 2 which are extended from each other on both sides thereof. The electronic component body 8 is placed in a molding die (not shown), and resin, hard rubber, or the like is injected into the die and cured to form the outer casing 1. The outer casing 1 has a substantially cubic shape that covers the electronic component body 8, and the lead terminals 2 are led out from both ends thereof.

The lead terminals 2 and 2 are bent at a substantially right angle at the lead-out portion from the outer package 1, and are further bent at a substantially right angle at the edge of the end face of the outer package 1, and the tip portions are on the bottom surface of the outer package 1. Attached. In this case, of the bent portions of the lead terminals 2 and 2, the resin serving as the adhesives 6 is provided on the side of the end portion of the exterior body 1 at the tip of the first bent portions 3 and 3 on the base side. Is applied in advance and the lead terminals 2 and 2 are bent at the bent portions 3 and 3, and then the resin described above is cured by heating. As a result, the adhesive 6 is fixed between the lead terminals 2 and 2 and the end surface of the outer package 1. Since the tip portions of the lead terminals 2 and 2 bent to the bottom surface side of the exterior material 1 are usually covered with solder during soldering, it is not always necessary to fix the adhesive 6 to the portions. It is sufficient to fill the adhesive 6 only between the lead terminals 2 and 2 and the end surface of the outer package 1 as shown in the figure. It is desirable to apply the adhesives 6, 6 also to the bottom surface side of the exterior material 1 because the lead terminals and the exterior body can be more securely fixed to each other.

The adhesive 6 is generally made of a material such as phenol resin, epoxy resin, or hard rubber. As described above, these materials are applied and cured by heat or light. It is also possible to insert a tape-like material to form the adhesive 6. In addition, the adhesives 6 and 6 are not limited to insulating materials, and may be those containing metal particles to impart conductivity, and further melting, filling and curing a metal having a relatively low melting point. It may be one.

As described above, this chip-type electronic component is mounted on the semi-finished lands 7, 7 formed on the circuit board 5, and the lead terminals 2, 3 are soldered lands 7, respectively. It is electrically conductively fixed to 7 with solders 4 and 4. In this case, a flux-containing paste solder is generally used as the solder material, but an adhesive 6, between the end portions of the bent portions 3 and 3 of the lead terminals 2 and 2 and both end surfaces of the outer casing 1, Since 6 is fixed, flux does not enter here. Further, the lead terminals 2 and 2 are held on the external material 1 by the adhesives 6 and 6, and vibration is suppressed. Further, in the inductor, it is possible to prevent the breakage of the thin wire wound around the core and the end of which is entangled with the lead terminal.

In addition, in the above-described embodiment, as the example of the chip type electronic component with the lead terminal, the one having the two lead terminals 2 and 2 is explained, but the present invention has one or three lead terminals. It can also be applied to one or more chip-type electronic components. Further, not only the inductor as shown in the figure, but also chip type electronic parts that have an outer package and lead terminals such as capacitors, varistors, resistors, transistors, and diodes can be applied to other types of electronic parts. Of course, it is possible and the number of lead terminals is not limited to two. Further, a recess for accommodating the lead terminal may be formed in the exterior body portion along which the lead terminal extends. By doing so, the adhesive is reliably filled between the lead terminal and the outer package, so that the fixing is surely performed.

[0012]

[Effect of the device]

 As explained above, according to the present invention, it is possible to obtain a highly reliable chip-type component with lead terminals, in which the lead terminals do not vibrate and the bent portions thereof do not cause fatigue damage, and the variations in component dimensions are reduced. Be done.

[Brief description of drawings]

FIG. 1 is a perspective view showing a chip type electronic component with lead terminals mounted on a circuit board according to an embodiment of the present invention.

FIG. 2 is a side view in which the same state is sectioned at the center.

FIG. 3 is a perspective view showing a state where a chip-type electronic component with lead terminals is mounted on a circuit board, showing a conventional example.

FIG. 4 is a side view showing a cross section in the center of the same state.

[Explanation of symbols]

 1 outer package 2 lead terminal 3 bent portion of lead terminal 6 adhesive

Continued Front Page (72) Hideki Ogawa Inventor Hideki Ogawa 6-16-20 Ueno Taito-ku Tokyo

Claims (3)

[Reference number] 0030253-01 [Claims for utility model registration] 1. An electronic component body (8) covered with an exterior body (1) and lead terminals (2), (2) connected to the electronic component body (8) and led out from the exterior body (1). And a lead terminal (2), (2) which is bent so as to follow the outer package (1),
The lead terminal (2) derived from the outer package (1),
(2) A chip-type electronic component with a lead terminal, which is fixed to the outer package (1) with an adhesive. 2. The lead terminal (2) bent along the exterior body, and the bent portions (3) and (3) closest to the derived base portion derived from the exterior body of (2) are separated from the derived base portion. The chip-type electronic component with a lead terminal according to claim 1, wherein the chip-type electronic component has a lead terminal. 3. An adhesive agent is applied to one or both of the main surface of the lead terminals (2), (2) on the side of the outer package 1 and the side surface of the outer package 1 and fixed to the outer package 1. The chip-type electronic component with a lead terminal according to claim 1 or 2, wherein