JPH028125U - - Google Patents
Info
- Publication number
- JPH028125U JPH028125U JP8614688U JP8614688U JPH028125U JP H028125 U JPH028125 U JP H028125U JP 8614688 U JP8614688 U JP 8614688U JP 8614688 U JP8614688 U JP 8614688U JP H028125 U JPH028125 U JP H028125U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- leg
- chip
- extending downward
- gripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の電子部品の一実施例を示す外
観斜視図、第２図は第１図の正面図、第３図は本
考案の電子部品の変形例を示す正面図、第４図は
本考案の電子部品の従来例を示す外観斜視図であ
る。
２……チツプ型電子部品本体、３，４……外部
電極、５，６……端子部材、７，８……把持部、
７ａ，８ａ……接触片、７ｂ，８ｂ……フラツプ
、１３，１３′，１４，１４′……脚部、１５，
１５′，１６，１６′……接地部、１７，１８…
…受け部。
FIG. 1 is an external perspective view showing an embodiment of the electronic component of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a front view of a modification of the electronic component of the present invention, and FIG. 4 1 is an external perspective view showing a conventional example of the electronic component of the present invention. 2... Chip-type electronic component body, 3, 4... External electrode, 5, 6... Terminal member, 7, 8... Gripping part,
7a, 8a...contact piece, 7b, 8b...flap, 13, 13', 14, 14'...leg, 15,
15', 16, 16'...Grounding part, 17, 18...
...Receiving part.
Claims (1)
部品本体と、 前記チツプ型電子部品本体の各外部電極をそれ
ぞれ把持した把持部と、この把持部の下端部から
下方に延びた脚部と、この脚部から折り曲げられ
た接地部とからなる端子部材、とからなる電子部
品であつて、 前記脚部は、把持部の下端部から下方へ分岐し
て延びた複数本にて構成されていることを特徴と
する電子部品。[Scope of Claim for Utility Model Registration] A chip-type electronic component body having external electrodes formed at each end, a gripping portion that grips each external electrode of the chip-type electronic component body, and a lower end portion of this gripping portion. An electronic component comprising a terminal member consisting of a leg extending downward and a grounding part bent from the leg, the leg branching and extending downward from the lower end of the gripping part. An electronic component characterized by being composed of multiple pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086146U JPH0625951Y2 (en) | 1988-06-29 | 1988-06-29 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086146U JPH0625951Y2 (en) | 1988-06-29 | 1988-06-29 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028125U true JPH028125U (en) | 1990-01-19 |
| JPH0625951Y2 JPH0625951Y2 (en) | 1994-07-06 |
Family
ID=31310790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086146U Expired - Lifetime JPH0625951Y2 (en) | 1988-06-29 | 1988-06-29 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625951Y2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104138U (en) * | 1977-01-25 | 1978-08-22 | ||
| US8223471B2 (en) | 2009-01-20 | 2012-07-17 | Tdk Corporation | Multilayer capacitor |
| US8570708B2 (en) | 2011-06-22 | 2013-10-29 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| JP2015023228A (en) * | 2013-07-23 | 2015-02-02 | 株式会社村田製作所 | Ceramic electronic component |
| WO2018146990A1 (en) * | 2017-02-13 | 2018-08-16 | 株式会社村田製作所 | Laminated ceramic electronic component |
| JP2019149570A (en) * | 2019-05-10 | 2019-09-05 | Tdk株式会社 | Electronic component |
| JP2023080022A (en) * | 2021-11-29 | 2023-06-08 | サムソン エレクトロ－メカニックス カンパニーリミテッド． | Multilayer electronic component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6048215B2 (en) | 2013-02-28 | 2016-12-21 | 株式会社デンソー | Electronic component and electronic control device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60193308A (en) * | 1984-03-15 | 1985-10-01 | Tdk Corp | Inductor and manufacture thereof |
| JPS6231107A (en) * | 1985-08-02 | 1987-02-10 | 松下電器産業株式会社 | Chip-like electronic component |
-
1988
- 1988-06-29 JP JP1988086146U patent/JPH0625951Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60193308A (en) * | 1984-03-15 | 1985-10-01 | Tdk Corp | Inductor and manufacture thereof |
| JPS6231107A (en) * | 1985-08-02 | 1987-02-10 | 松下電器産業株式会社 | Chip-like electronic component |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104138U (en) * | 1977-01-25 | 1978-08-22 | ||
| US8223471B2 (en) | 2009-01-20 | 2012-07-17 | Tdk Corporation | Multilayer capacitor |
| US8570708B2 (en) | 2011-06-22 | 2013-10-29 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| JP2015023228A (en) * | 2013-07-23 | 2015-02-02 | 株式会社村田製作所 | Ceramic electronic component |
| WO2018146990A1 (en) * | 2017-02-13 | 2018-08-16 | 株式会社村田製作所 | Laminated ceramic electronic component |
| JP2018133355A (en) * | 2017-02-13 | 2018-08-23 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| US11170937B2 (en) | 2017-02-13 | 2021-11-09 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| JP2019149570A (en) * | 2019-05-10 | 2019-09-05 | Tdk株式会社 | Electronic component |
| JP2023080022A (en) * | 2021-11-29 | 2023-06-08 | サムソン エレクトロ－メカニックス カンパニーリミテッド． | Multilayer electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625951Y2 (en) | 1994-07-06 |