JPH0669084A - Lamination type solid electrolytic capacitor - Google Patents

Lamination type solid electrolytic capacitor

Info

Publication number
JPH0669084A
JPH0669084A JP21987392A JP21987392A JPH0669084A JP H0669084 A JPH0669084 A JP H0669084A JP 21987392 A JP21987392 A JP 21987392A JP 21987392 A JP21987392 A JP 21987392A JP H0669084 A JPH0669084 A JP H0669084A
Authority
JP
Japan
Prior art keywords
solid electrolytic
electrolytic capacitor
lead frame
anode
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21987392A
Other languages
Japanese (ja)
Other versions
JP2998440B2 (en
Inventor
Tomoji Arai
智次 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21987392A priority Critical patent/JP2998440B2/en
Publication of JPH0669084A publication Critical patent/JPH0669084A/en
Application granted granted Critical
Publication of JP2998440B2 publication Critical patent/JP2998440B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To improve yield when welding the anode part and the lead frame of a lamination type solid electrolytic capacitor and to achieve welding regardless of the number of lamination layers. CONSTITUTION:A metal plate 6 with a projection is provided between anode parts 1 and is connected to a lead frame 5, thus reducing the damage to a capacitor on connection as compared with a method for connecting the lead frame 5 directly to the anode parts and achieving connection regardless of the number of lamination layers.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は積層型固体電解コンデン
サの構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a laminated solid electrolytic capacitor.

【0002】[0002]

【従来の技術】従来の固体電解コンデンサ、例えばアル
ミニウム固体電解コンデンサは、アルミニウム箔の表面
をエッチングして、箔の単位面積当りの表面積を増加さ
せて酸化皮膜を形成し、これを誘電体として、その上に
導電性高分子等を形成してアルミニウム箔を陽極、導電
性高分子等を陰極としてコンデンサを構成している。
2. Description of the Related Art Conventional solid electrolytic capacitors, for example, aluminum solid electrolytic capacitors, etch the surface of aluminum foil to increase the surface area per unit area of the foil to form an oxide film, which is used as a dielectric. A conductive polymer or the like is formed on the aluminum foil to form an anode and the conductive polymer or the like as a cathode to form a capacitor.

【0003】このようなアルミニウム固体電解コンデン
サは、アルミニウム箔を基本とした構造のため長さ、幅
方向に比べて厚み方向の寸法が極端に小さい。よってこ
のようなアルミニウム固体電解コンデンサを厚み方向に
積層すれば容量が大きく、体積効率のよい積層型固体電
解コンデンサが得られる。
Since such an aluminum solid electrolytic capacitor has a structure based on aluminum foil, the dimension in the thickness direction is extremely smaller than that in the length and width directions. Therefore, by laminating such an aluminum solid electrolytic capacitor in the thickness direction, a laminated solid electrolytic capacitor having a large capacity and good volume efficiency can be obtained.

【0004】図3に従来の積層型固体電解コンデンサの
縦断面を示す。金属箔の表面をエッチングし、酸化皮膜
を形成した陽極部1の一部の面に導電性高分子層、グラ
ファイト層、銀ペースト層を形成して陰極部2として1
個のコンデンサを構成する。さらに、このコンデンサ複
数個を積層して陰極部2間は導電性接着剤3によって、
陽極部1間は、陽極部1と陰極部2の厚みの差をうめる
ための金属板4を挿入して抵抗溶接あるいはレーザ溶接
によって接続している。またリードフレーム5との接続
は陰極部2が導電性接着剤3、陽極部1が抵抗溶接によ
って接続している。
FIG. 3 shows a vertical section of a conventional laminated solid electrolytic capacitor. The surface of the metal foil is etched to form a conductive polymer layer, a graphite layer, and a silver paste layer on a part of the surface of the anode part 1 on which an oxide film is formed to form a cathode part 2.
Configure the individual capacitors. Further, a plurality of these capacitors are laminated, and a conductive adhesive 3 is provided between the cathode parts 2,
A metal plate 4 for filling the difference in thickness between the anode part 1 and the cathode part 2 is inserted between the anode parts 1 and connected by resistance welding or laser welding. The cathode part 2 is connected to the lead frame 5 by a conductive adhesive 3 and the anode part 1 is connected by resistance welding.

【0005】[0005]

【発明が解決しようとする課題】この従来の積層型固体
電解コンデンサではリードフレーム5と陽極部1との接
続は抵抗溶接によっている。このため溶接電極による応
力によってコンデンサが変形して特性が劣化する場合や
溶接電流がコンデンサ側にまわりこんでコンデンサを破
壊する場合があり、この工程で特性不良が発生するとい
う問題点がある。
In this conventional laminated solid electrolytic capacitor, the lead frame 5 and the anode part 1 are connected by resistance welding. Therefore, the capacitor may be deformed due to the stress caused by the welding electrode and the characteristics may be deteriorated, or the welding current may flow into the capacitor side to destroy the capacitor, resulting in a problem that characteristic defects occur in this process.

【0006】また、このような構造ではコンデンサの積
層数が増える程溶接電極間の距離が長くなり溶接が難し
くなるという問題点があった。
Further, in such a structure, there is a problem that as the number of laminated capacitors increases, the distance between the welding electrodes becomes longer and welding becomes difficult.

【0007】本発明の目的は陽極部にリードフレームを
溶接する際に、生じる特性不良をなくし、かつ積層枚数
によらない安定した溶接条件で溶接できる積層型固体電
解コンデンサを提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a laminated solid electrolytic capacitor which eliminates characteristic defects that occur when a lead frame is welded to an anode part and which can be welded under stable welding conditions regardless of the number of laminated layers.

【0008】[0008]

【課題を解決するための手段】本発明の積層型固体電解
コンデンサは、陽極部にリードフレームとの接続のため
の突起形状をした金属板を備えている。
The laminated solid electrolytic capacitor of the present invention is provided with a metal plate in the form of a protrusion for connecting to the lead frame at the anode part.

【0009】[0009]

【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例の積層型固体電解コンデン
サの縦断面図、及び斜視図である。
The present invention will be described below with reference to the drawings. FIG. 1 is a vertical sectional view and a perspective view of a laminated solid electrolytic capacitor according to an embodiment of the present invention.

【0010】表面をエッチッグ処理した後酸化皮膜を形
成した長さ4mm、幅3mm、厚み150μmのアルミ
ニウム箔からなる陽極部1の一部の面に、周知の方法に
よってポリピロールから成る導電性高分子、グラファイ
ト層、銀ペースト層を順次形成し陰極部2として、定格
電圧16V、容量1.5μFのコンデンサ素子1個を得
た。
A conductive polymer made of polypyrrole is formed on a part of the surface of the anode part 1 made of aluminum foil having a length of 4 mm, a width of 3 mm, and a thickness of 150 μm, which has an oxide film formed after the surface is etched by a known method. A graphite layer and a silver paste layer were sequentially formed, and as the cathode part 2, one capacitor element having a rated voltage of 16 V and a capacity of 1.5 μF was obtained.

【0011】次に、陽極部1に金属板4を抵抗溶接す
る。この際積層時に中間の位置になるコンデンサには後
工程でリードフレーム5に取りつけるための突起をもっ
た形状の突起付金属板6を抵抗溶接する。
Next, the metal plate 4 is resistance-welded to the anode portion 1. At this time, a metal plate 6 with a protrusion having a shape for attaching to the lead frame 5 in a later step is resistance-welded to the capacitor which is at an intermediate position during lamination.

【0012】次に、陰極部2に導電性接着剤を塗布して
積層し150℃の恒温槽で硬化する。陽極部1間は突起
付金属板6の突起のある側からレーザをあて、陽極部1
の両端の2箇所を積層方向に掃引して溶接する。
Next, the cathode portion 2 is coated with a conductive adhesive and laminated, and then cured in a constant temperature bath at 150.degree. A laser beam is applied between the anode parts 1 from the side of the metal plate 6 with the protrusions having the protrusions.
The two ends of the are swept in the stacking direction and welded.

【0013】次に、突起付金属板6とリードフレーム5
とを抵抗溶接し、モールド外装、エージングをして、定
格電圧16V、容量4.7μFのコンデンサになる。
Next, the metal plate 6 with protrusions and the lead frame 5
Are resistance-welded, mold-molded, and aged to form a capacitor having a rated voltage of 16 V and a capacity of 4.7 μF.

【0014】従来、陽極部1とリードフレーム5とを直
接抵抗溶接した場合特性不良が下表のように約10%あ
ったのに対し、本実施例では特性不良は発生しなかっ
た。また、このような構造をとることによって、リード
フレームに溶接できる積層数の制限がなくなり、積層数
によらず一定の溶接条件で溶接ができる。
Conventionally, when the anode part 1 and the lead frame 5 were directly resistance-welded, the characteristic defect was about 10% as shown in the table below, whereas in the present embodiment, the characteristic defect did not occur. Further, by adopting such a structure, there is no limitation on the number of layers that can be welded to the lead frame, and welding can be performed under constant welding conditions regardless of the number of layers.

【0015】図2は本発明の他の実施例の断面図及び斜
視図である。本実施例では突起付金属板6の形状を図2
のように両側に2つの突起があるものとした。これによ
って陽極部1のレーザ溶接の際、レーザの掃引を中央部
に1回行うだけでよく、レーザ溶接の時間を短縮するこ
とができる。また、本実施例でも陽極部1とリードフレ
ーム5の溶接の際に特性不良は発生せず実施例1と同様
の効果を確認した。
FIG. 2 is a sectional view and a perspective view of another embodiment of the present invention. In this embodiment, the shape of the protruding metal plate 6 is shown in FIG.
It is assumed that there are two protrusions on both sides. As a result, at the time of laser welding the anode part 1, it is only necessary to sweep the laser once in the central part, and the laser welding time can be shortened. In addition, in the present embodiment as well, no characteristic failure occurred during welding of the anode part 1 and the lead frame 5, and the same effect as in the first embodiment was confirmed.

【0016】表1は本発明の実施例1,実施例2および
従来例のリードフレーム溶接時の特性不良率を示したも
のであり、実施例1および実施例2は何れも漏れ電流不
良,容量不良,tanδ不良は0%であった。
Table 1 shows the characteristic defect ratios at the time of lead frame welding of the first and second embodiments of the present invention and the conventional example. In both of the first and second embodiments, the leakage current defect and the capacity are large. Defects and tan δ defects were 0%.

【0017】表1 Table 1

【0018】[0018]

【発明の効果】以上説明したように本発明は、リードフ
レームとの接続のための突起をもった金属板を陽極部に
設けることによってリードフレームとの溶接の際に生じ
る特性不良をなくし、また、積層枚数によらない安定し
た溶接条件で溶接できるという効果がある。
As described above, according to the present invention, by providing a metal plate having a projection for connection with a lead frame on the anode part, the characteristic defect that occurs during welding with the lead frame is eliminated, and The effect is that welding can be performed under stable welding conditions regardless of the number of laminated layers.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例縦断面図及び斜視図である。FIG. 1 is a vertical sectional view and a perspective view of an embodiment of the present invention.

【図2】本発明の他の実施例縦断面図及び斜視図であ
る。
FIG. 2 is a vertical sectional view and a perspective view of another embodiment of the present invention.

【図3】従来の積層型固体電解コンデンサの一例の縦断
面図である。
FIG. 3 is a vertical cross-sectional view of an example of a conventional laminated solid electrolytic capacitor.

【符号の説明】[Explanation of symbols]

1 陽極部 2 陰極部 3 導電性接着剤 4 金属板 5 リードフレーム 6 突起付金属板 1 Anode part 2 Cathode part 3 Conductive adhesive 4 Metal plate 5 Lead frame 6 Metal plate with protrusions

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 弁作用を有する金属箔を陽極とし、前記
金属箔表面に誘電体酸化皮膜を形成し、前記誘電体酸化
皮膜上に導電性高分子あるいは無機半導体を陰極として
形成したものを複数個積層してなる積層型固体電解コン
デンサにおいて、前記積層型固体電解コンデンサの陽極
間に金属板を備え、かつそのうちの一つが前記陽極およ
び前記金属板より突出した形状を有し、該金属板の突出
部にリードフレームを接続したことを特徴とする積層型
固体電解コンデンサ。
1. A plurality of metal foils having a valve action as an anode, a dielectric oxide film formed on the surface of the metal foil, and a conductive polymer or an inorganic semiconductor formed on the dielectric oxide film as a cathode. In a laminated solid electrolytic capacitor formed by stacking individual pieces, a metal plate is provided between the anodes of the laminated solid electrolytic capacitor, and one of them has a shape protruding from the anode and the metal plate. A laminated solid electrolytic capacitor having a lead frame connected to the protrusion.
JP21987392A 1992-08-19 1992-08-19 Multilayer solid electrolytic capacitors Expired - Lifetime JP2998440B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21987392A JP2998440B2 (en) 1992-08-19 1992-08-19 Multilayer solid electrolytic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21987392A JP2998440B2 (en) 1992-08-19 1992-08-19 Multilayer solid electrolytic capacitors

Publications (2)

Publication Number Publication Date
JPH0669084A true JPH0669084A (en) 1994-03-11
JP2998440B2 JP2998440B2 (en) 2000-01-11

Family

ID=16742399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21987392A Expired - Lifetime JP2998440B2 (en) 1992-08-19 1992-08-19 Multilayer solid electrolytic capacitors

Country Status (1)

Country Link
JP (1) JP2998440B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6661645B1 (en) 1999-05-28 2003-12-09 Showa Denko K.K. Solid electrolytic capacitor and manufacturing method thereof
JP2007287723A (en) * 2006-04-12 2007-11-01 Nec Tokin Corp Laminated capacitor
JP2008205108A (en) * 2007-02-19 2008-09-04 Tdk Corp Solid electrolytic capacitor and its manufacturing method
DE10262263B4 (en) * 2002-05-21 2008-12-04 Epcos Ag Surface-mountable solid electrolytic capacitor, process for its production and system carrier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6661645B1 (en) 1999-05-28 2003-12-09 Showa Denko K.K. Solid electrolytic capacitor and manufacturing method thereof
EP2259276A1 (en) 1999-05-28 2010-12-08 Murata Manufacturing Co., Ltd. Solid electrolytic capacitor and manufacturing method thereof
DE10262263B4 (en) * 2002-05-21 2008-12-04 Epcos Ag Surface-mountable solid electrolytic capacitor, process for its production and system carrier
JP2007287723A (en) * 2006-04-12 2007-11-01 Nec Tokin Corp Laminated capacitor
JP2008205108A (en) * 2007-02-19 2008-09-04 Tdk Corp Solid electrolytic capacitor and its manufacturing method

Also Published As

Publication number Publication date
JP2998440B2 (en) 2000-01-11

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Effective date: 19991005