JPH0668357U - Electronic element multi-layer built-in connector - Google Patents

Electronic element multi-layer built-in connector

Info

Publication number
JPH0668357U
JPH0668357U JP687593U JP687593U JPH0668357U JP H0668357 U JPH0668357 U JP H0668357U JP 687593 U JP687593 U JP 687593U JP 687593 U JP687593 U JP 687593U JP H0668357 U JPH0668357 U JP H0668357U
Authority
JP
Japan
Prior art keywords
electronic element
connector
bent portion
lead terminal
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP687593U
Other languages
Japanese (ja)
Inventor
光章 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP687593U priority Critical patent/JPH0668357U/en
Publication of JPH0668357U publication Critical patent/JPH0668357U/en
Withdrawn legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 横方向に肥大化せず、小さな面積の取付スペ
ースに容易に収納可能な電子素子多層内蔵コネクタを提
供する。 【構成】 回路基板1上に電子素子3とリード端子4と
を接続させた電子素子内蔵コネクタにおいて、リード端
子の基部に電子素子と対向して屈曲部5を形成させ、屈
曲部上に他の電子素子7を載置接続させる。また前記屈
曲部を多段に折り返し形成させ、各屈曲部毎に電子素子
を載置接続させる。
(57) [Abstract] [Purpose] To provide a connector with a built-in electronic element multi-layer, which can be easily accommodated in a small mounting space without lateral enlargement. In a connector with a built-in electronic element in which an electronic element 3 and a lead terminal 4 are connected on a circuit board 1, a bent portion 5 is formed at the base of the lead terminal so as to face the electronic element, and another bent portion is formed on the bent portion. The electronic element 7 is mounted and connected. Further, the bent portion is formed by folding back in multiple stages, and an electronic element is mounted and connected for each bent portion.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、回路基板上にリード端子の屈曲部を利用してダイオード等の電子素 子を多層に配設させた電子素子多層内蔵コネクタに関するものである。 The present invention relates to an electronic element multilayer built-in connector in which electronic elements such as diodes are arranged in multiple layers on a circuit board by utilizing bent portions of lead terminals.

【0002】[0002]

【従来の技術】[Prior art]

図7は従来の電子素子内蔵コネクタを示すものである。 該電子素子内蔵コネクタ20は、回路基板1上に形成された略並列なプリント 回路2上にダイオード等の複数の電子素子3をハンダ接続させて各回路2を並列 に接続させると共に、各回路2の端末2aにそれぞれリード端子21の基部をハ ンダ接続させ、該回路基板1と電子素子3とリード端子21の基部とを樹脂材9 でモールドさせて成るものである。 FIG. 7 shows a conventional connector with a built-in electronic element. The electronic element built-in connector 20 is configured such that a plurality of electronic elements 3 such as diodes are solder-connected to a substantially parallel printed circuit 2 formed on the circuit board 1 to connect the respective circuits 2 in parallel, and at the same time, the respective circuits 2 are connected. The bases of the lead terminals 21 are soldered to the terminals 2a, and the circuit board 1, the electronic element 3, and the bases of the lead terminals 21 are molded with a resin material 9.

【0003】 該電子素子3はダイオードであればリード端子21からの電流を一方向に整流 させたり、図示しない抵抗回路より特性の良いバイアスを得る等の作用を行い得 る。 しかしながら上記従来の構造にあっては、回路2の数を増して電子素子3を増 加させた場合にコネクタ20自体が横方向に肥大化し、それにより多くの取付面 積が必要となって車両等の小さなスペースに収納できなくなるという問題があっ た。If the electronic element 3 is a diode, it can perform such functions as rectifying the current from the lead terminal 21 in one direction and obtaining a bias having better characteristics than a resistor circuit (not shown). However, in the above-described conventional structure, when the number of circuits 2 is increased and the number of electronic elements 3 is increased, the connector 20 itself is enlarged in the lateral direction, which necessitates a large amount of mounting area. There was a problem that it could not be stored in a small space such as.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

本考案は、上記した点に鑑み、回路数を増して電子素子を増加させた際にコネ クタ自体が横方向に肥大化せず、車両等の小さな取付面積のスペースに容易に収 納できる電子素子内蔵コネクタを提供することを目的とする。 In view of the above points, the present invention is an electronic device that can be easily stored in a space of a small mounting area such as a vehicle without lateral enlargement of the connector itself when the number of circuits is increased and the number of electronic elements is increased. An object is to provide a connector with a built-in element.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するために、本考案は、回路基板上に電子素子とリード端子と を接続させた電子素子内蔵コネクタにおいて、該リード端子の基部に該電子素子 と対向して屈曲部を形成させ、該屈曲部上に他の電子素子を載置接続させて成る 構造を基本とする。そして前記屈曲部を多段に折り返し形成させ、各屈曲部毎に 電子素子を載置接続させて成る構造も可能である。 In order to achieve the above object, the present invention provides an electronic element built-in connector in which an electronic element and a lead terminal are connected on a circuit board, and a bent portion is formed at the base of the lead terminal so as to face the electronic element. The basic structure is that another electronic element is mounted and connected on the bent portion. A structure in which the bent portions are folded back in multiple stages and an electronic element is placed and connected for each bent portion is also possible.

【0006】[0006]

【作用】[Action]

回路基板上でリード端子基部に形成した屈曲部に電子素子が高さ方向に多層に 配設接続される。これによりコネクタ自体の横方向への肥大化が防止され、小さ な取付面積のスペースに収納が可能となる。 Electronic elements are arranged and connected in multiple layers in the height direction on the bent portion formed on the lead terminal base on the circuit board. As a result, the connector itself is prevented from expanding laterally and can be stored in a space with a small mounting area.

【0007】[0007]

【実施例】【Example】

図1〜3は本考案に係る電子素子多層内蔵コネクタの第一実施例を示すもので ある。 図1は従来同様の回路基板1と該基板1上のプリント回路2に接続されたダイ オード等の第一の電子素子3並びに該回路2の端末に接続されるリード端子4を 示す。該リード端子4は基部に一段上向きに屈曲された屈曲部5を有し、図2〜 3の如く該屈曲部5を第一の電子素子3に対向させた状態でリード端子2の中間 部6を回路2の端末2aにハンダ接続させる。 1 to 3 show a first embodiment of a connector with a built-in electronic element according to the present invention. FIG. 1 shows a conventional circuit board 1, a first electronic element 3 such as a diode connected to a printed circuit 2 on the board 1, and a lead terminal 4 connected to a terminal of the circuit 2. The lead terminal 4 has a bent portion 5 which is bent upward by one step at the base, and the middle portion 6 of the lead terminal 2 in a state where the bent portion 5 faces the first electronic element 3 as shown in FIGS. Is soldered to the terminal 2a of the circuit 2.

【0008】 該屈曲部5上にはさらに第二の電子素子7がハンダ接続される。該第二の電子 素子7はその両端部8,8を、隣接する各リード端子4上に載置接続させて、各 リード端子4を並列方向に接続させる。さらに回路基板1と電子素子3,7とリ ード端子4の基部とを樹脂材9でモールドさせる。A second electronic element 7 is further soldered on the bent portion 5. The second electronic element 7 has its both ends 8, 8 mounted and connected on the adjacent lead terminals 4 to connect the lead terminals 4 in parallel. Further, the circuit board 1, the electronic elements 3 and 7, and the base portion of the lead terminal 4 are molded with the resin material 9.

【0009】 該第二の電子素子7のハンダ接続に際しては第一の電子素子3よりも融点の低 いハンダを使用するのが好ましい。またスポットによるハンダ接続も可能である 。また第一の電子素子3に直接、リード端子4の屈曲部5をハンダ接続させるこ とも可能である。以上の構造により多様な電子素子回路を得ることができる。When soldering the second electronic element 7, it is preferable to use solder having a melting point lower than that of the first electronic element 3. Also, solder connection by spot is possible. It is also possible to solder the bent portion 5 of the lead terminal 4 directly to the first electronic element 3. With the above structure, various electronic device circuits can be obtained.

【0010】 図4〜6は本考案に係る電子素子多層内蔵コネクタの第二実施例を示すもので ある。 この構造は上記第一実施例におけるリード端子4の基部を図5の如くに折り返 し屈曲延長させ、折り返し屈曲部10上にさらに第三の電子素子11をハンダ接 続させたものである。すなわち回路基板1のプリント回路2上に第一の電子素子 3をハンダ接続させ、該第一の電子素子3に対向してリード端子14の第一の屈 曲部15に第二の電子素子7を載置接続させ、第二の折り返し屈曲部10に第三 の電子素子11を載置接続させたものである。4 to 6 show a second embodiment of the electronic element multilayer built-in connector according to the present invention. In this structure, the base portion of the lead terminal 4 in the first embodiment is folded back and extended as shown in FIG. 5, and the third electronic element 11 is further soldered on the folded back portion 10. That is, the first electronic element 3 is soldered onto the printed circuit 2 of the circuit board 1, and the second electronic element 7 is connected to the first bent portion 15 of the lead terminal 14 so as to face the first electronic element 3. Is mounted and connected, and the third electronic element 11 is mounted and connected to the second folded and bent portion 10.

【0011】 該リード端子14の屈曲部10,15は二段に限らず多段に成形可能であり、 これにより第一実施例よりも複雑な電子素子回路の形成が可能となる。最後に樹 脂材16のモールドさせて完成となる。The bent portions 10 and 15 of the lead terminal 14 can be formed in multiple stages without being limited to two stages, which allows a more complicated electronic element circuit to be formed than in the first embodiment. Finally, the resin material 16 is molded and completed.

【0012】[0012]

【考案の効果】[Effect of device]

以上の如くに、本考案によれば、回路基板上でリード端子基部に形成した屈曲 部に電子素子を多層に配設接続させることができるから、コネクタ自体を横方向 に肥大化させることなく複雑且つ多様な電子素子回路を得ることができ、車両等 の小さな取付面積のスペースに難無く組み付けることができるものである。 As described above, according to the present invention, since the electronic elements can be arranged and connected in multiple layers on the bent portion formed on the lead terminal base portion on the circuit board, the connector itself can be complicated without lateral enlargement. In addition, various electronic element circuits can be obtained, and the electronic element circuit can be easily assembled in a small mounting area such as a vehicle.

【提出日】平成5年7月7日[Submission date] July 7, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0007[Correction target item name] 0007

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0007】[0007]

【実施例】【Example】

図1〜3は本考案に係る電子素子多層内蔵コネクタの第一実施例を示すもので ある。 図1は従来同様の回路基板1と該基板1上のプリント回路2に接続されたダイ オード等の第一の電子素子3並びに該回路2の端末に接続されるリード端子4を 示す。該リード端子4は基部に一段上向きに屈曲された屈曲部5を有し、図2〜 3の如く該屈曲部5を第一の電子素子3に対向させた状態でリード端子の中間 部6を回路2の端末2aにハンダ接続させる。1 to 3 show a first embodiment of a connector with a built-in electronic element according to the present invention. FIG. 1 shows a conventional circuit board 1, a first electronic element 3 such as a diode connected to a printed circuit 2 on the board 1, and a lead terminal 4 connected to a terminal of the circuit 2. The lead terminal 4 has a bent portion 5 which is bent upward by one step at the base portion, and the middle portion 6 of the lead terminal 4 in a state where the bent portion 5 faces the first electronic element 3 as shown in FIGS. Is soldered to the terminal 2a of the circuit 2.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案に係る電子素子多層内蔵コネクタの第一
実施例における回路基板と第一の電子素子とリード端子
を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing a circuit board, a first electronic element and lead terminals in a first embodiment of a connector with a built-in electronic element multilayer according to the present invention.

【図2】同じくリード端子上に第二の電子素子を接続す
る状態を示す分解斜視図である。
FIG. 2 is an exploded perspective view showing a state in which the second electronic element is similarly connected to the lead terminal.

【図3】図2の縦断面図である。FIG. 3 is a vertical cross-sectional view of FIG.

【図4】本考案に係る電子素子多層内蔵コネクタの第二
実施例を示す要部斜視図である。
FIG. 4 is a perspective view of an essential part showing a second embodiment of the electronic element multilayer built-in connector according to the present invention.

【図5】同じくリード端子を示す斜視図である。FIG. 5 is a perspective view showing a lead terminal of the same.

【図6】図4の縦断面図である。6 is a vertical cross-sectional view of FIG.

【図7】従来例を示す斜視図である。FIG. 7 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 回路基板 2 プリント回路 3,7,11 電子素子 4,14 リード端子 5,10,15 屈曲部 1 circuit board 2 printed circuit 3,7,11 electronic element 4,14 lead terminal 5,10,15 bent part

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 回路基板上に電子素子とリード端子とを
接続させた電子素子内蔵コネクタにおいて、該リード端
子の基部に該電子素子と対向して屈曲部を形成させ、該
屈曲部上に他の電子素子を載置接続させて成ることを特
徴とする電子素子多層内蔵コネクタ。
1. In a connector with a built-in electronic element in which an electronic element and a lead terminal are connected on a circuit board, a bent portion is formed at a base portion of the lead terminal so as to face the electronic element, and another portion is provided on the bent portion. An electronic element multi-layer built-in connector, characterized in that the electronic element of (1) is mounted and connected.
【請求項2】 前記屈曲部を多段に折り返し形成させ、
各屈曲部毎に電子素子を載置接続させて成る請求項1記
載の電子素子多層内蔵コネクタ。
2. The bent portion is folded back in multiple stages,
2. The electronic element multilayer built-in connector according to claim 1, wherein an electronic element is mounted and connected for each bent portion.
JP687593U 1993-02-24 1993-02-24 Electronic element multi-layer built-in connector Withdrawn JPH0668357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP687593U JPH0668357U (en) 1993-02-24 1993-02-24 Electronic element multi-layer built-in connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP687593U JPH0668357U (en) 1993-02-24 1993-02-24 Electronic element multi-layer built-in connector

Publications (1)

Publication Number Publication Date
JPH0668357U true JPH0668357U (en) 1994-09-22

Family

ID=11650406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP687593U Withdrawn JPH0668357U (en) 1993-02-24 1993-02-24 Electronic element multi-layer built-in connector

Country Status (1)

Country Link
JP (1) JPH0668357U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459294B1 (en) * 1997-01-31 2005-05-13 니뽄 도쿠슈 도교 가부시키가이샤 Mold-type electronic part-containing connector
JP2010282752A (en) * 2009-06-02 2010-12-16 Sumitomo Wiring Syst Ltd Electronic component structure and connector with built-in electronic component structure
JP2011100718A (en) * 2009-10-05 2011-05-19 Yazaki Corp Connector
JP2012256476A (en) * 2011-06-08 2012-12-27 Tyco Electronics Japan Kk Connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459294B1 (en) * 1997-01-31 2005-05-13 니뽄 도쿠슈 도교 가부시키가이샤 Mold-type electronic part-containing connector
JP2010282752A (en) * 2009-06-02 2010-12-16 Sumitomo Wiring Syst Ltd Electronic component structure and connector with built-in electronic component structure
JP2011100718A (en) * 2009-10-05 2011-05-19 Yazaki Corp Connector
JP2012256476A (en) * 2011-06-08 2012-12-27 Tyco Electronics Japan Kk Connector

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Effective date: 19970508