JPH04104483A - Integrated circuit - Google Patents

Abstract

PURPOSE:To connect a circuit on a printed circuit board and an integrated circuit by soldering in package by forming solder connection faces where a circuit connecting member is brought into direct contact with the circuit on the printed circuit board on the inside from the periphery section of the board. CONSTITUTION:An integrated circuit 10 is mounted at the preset position of a printed circuit board 1 and set so that the solder connection faces of lead pin members 3 of the circuit 10 are correctly located at the connection section of wiring circuits on the board 1. The mounting portion of the circuit 10 on the board 1 is heated by the infrared method to melt the solder stuck to a solder connection section 6 in advance, and the connection faces of the pin members 3 and the circuit on the board 1 are connected by soldering in package. The circuit 10 can be easily mounted on both faces of the board 1, the gap generated between the circuit 10 and the board 1 is only the thickness of the pin members 3 and the thickness of a connection solder layer, the connection faces are provided on the inside of the circuit 10 from the periphery section E of the board 1, thus the integrated circuit 10 is connected to the printed circuit board 1 with high density and a very excellent space factor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an integrated circuit that allows a high-density mounting integrated circuit to be easily mounted and connected to a circuit on a printed wiring board.

[Conventional technology]

The following is an example of the mounting connection state between a conventional integrated circuit and a circuit on a printed wiring board, in which film circuits such as wiring conductors, resistors, electronic circuit element parts such as integrated circuits are mounted on a rectangular insulating substrate. This is shown in Figures 8 and 9.

In FIGS. 8 and 9, 1 is a printed wiring board, 2
is an integrated circuit, and a plurality of glued pin members 4 connected to the circuits of the integrated circuit 2 are arranged around the periphery of the substrate of the integrated circuit 2. The lead pin member 4 is composed of a circuit connecting portion 4a that engages the periphery of the board, and a lead bin 4b that is vertically provided on the circuit connecting portion 4a. Reference numeral 5 denotes a through hole for circuit connection, which is bored in the printed wiring board 1.

In the above configuration, the integrated circuit 2 is mounted at a predetermined position on the printed wiring board 1, the lead bin 4b of the lead pin member 4 is inserted into the through hole 5, and the tip of the lead bin 4b is inserted from the -F side of the printed wiring board 1. The protruding tip of the reed bin 4b is connected to a circuit (not shown) on the printed wiring board 1-t by soldering. In addition, another conventional example is shown in the 10th
In accordance with Figures and Figure 11. 10 and 11, 4A is a lead pin member, and this lead pin part 4A is a lead pin member.
A is formed by bending the tip of the lead pin 4c vertically from the circuit connection part 4a outward at a right angle to form an L-shape, and connecting the solder connection part 6 with the contact length l to the circuit connection part 4a and the printed circuit connection part 4a. It has a stand portion 4d between it and the wiring board 1 and having a height of .

In the above configuration, the integrated circuit 2 is mounted at a predetermined position on the printed wiring board 1, and a rietobin member 4A is mounted on a land (not shown) provided on the printed wiring board 1 as shown in FIG. The solder connection portion 6 is connected by solder.

[Problem to be solved by the invention]

However, in the conventional example, the integrated circuit 2 is
Since the connection between the circuit and the circuit of the printed wiring board 10 is made, is it possible to automate the connection by flow soldering in the case of single-sided mounting of the printed wiring board 1 using the through-hole insertion connection method shown in Fig. 8? When mounting on both sides of a printed wiring board is required, the only way to do so is to rely on mechanical connections or manual solder connections, which makes mounting difficult, resulting in problems such as a decrease in mounting efficiency and a significant increase in processing costs. was there.

In addition, with the mounting method shown in FIG. 11, is it possible to perform double-sided mounting on the printed wiring board 1?The shape of the attachment part of the reitbin member 4A to the printed wiring board 1 is an L-shaped stand type, and there are no lead pins. Part $4' 4 A is manufactured by press punching and bending, so the height h of the rietobin member 4A and the contact length with the printed wiring board 1 may vary due to material splitting and variations in processing accuracy. It is difficult to maintain the quality, it is difficult to process, and the cost of parts increases. Since the lead pin member 4A is formed to have a height h1 of the foot of the lead pin member 4A, the space factor becomes worse by the height h1 of the foot of the lead pin member 4A.

(Means for Solving the Problem) Therefore, in the integrated circuit according to the present invention, film circuits such as wiring conductors and resistors are formed on a rectangular insulating substrate, and chip parts such as small transistors and capacitors and In an integrated circuit on which a group of electronic circuit elements such as circuits are mounted, a plurality of circuit connecting members connected to the integrated circuit are arranged at desired positions on the peripheral edge of the substrate of the integrated circuit at predetermined intervals. , the above object is achieved by forming a solder connection surface on which the circuit connection member directly contacts and solder connects with the circuit on the printed wiring board on which the integrated circuit is mounted, inside the peripheral edge of the board. This is what I am trying to do.

(Function) The integrated circuit according to the present invention configured as described above has an integrated circuit mounted at a predetermined position on a printed wiring board, and a plurality of circuit connection members arranged on the peripheral edge of the board of the integrated circuit. By collectively soldering the solder connection surface of the circuit to the circuit on the printed wiring board, it becomes possible to surface-mount an integrated circuit with an excellent space factor on the printed wiring board at high speed.

〔Example〕

An embodiment of the present invention will be described below based on the drawings.

(Structure) Fig. 1 is a perspective view of a fastening portion of a printed wiring board showing the mounted and connected state of an integrated circuit according to an embodiment of the present invention, and Fig. 2 is a perspective view of a fastening portion of a printed wiring board showing an integrated circuit according to an embodiment of the above. FIG. 3 is a side view of the main part of the printed wiring board showing the mounted and connected state of the integrated circuit of the same embodiment.

In the drawings, parts that are the same as or corresponding to those of the conventional example are represented by the same reference numerals.

In FIGS. 1 to 3, reference numeral 3 denotes a Rietbin member which is a connecting member A, and 16 lead pin members 3 are arranged at predetermined intervals at desired positions on the peripheral edge E of the substrate of the integrated circuit 10. ing.

3a is a circuit connection portion of the word don member 3. Reference numeral 6 indicates a solder connection portion of the lead pin member 3, and this solder connection portion 6 is formed inside the substrate peripheral portion E of the integrated circuit 10. S is a solder connection surface formed on the lower surface of the lead pin portion 3, and this solder connection surface S is the printed wiring board 1.
It is soldered and connected to a circuit (not shown). Reference numeral 7 denotes a lead portion of the lead bin member 3 used as a check terminal.

In the case of this example, 16 Leetbin divisions 3
The integrated circuit 10 is configured such that the circuits are collectively soldered to the printed wiring board 1 through the solder connection surface S.

(motion) The operation will be explained based on the above configuration.

First, the integrated circuit 10 is mounted at a predetermined position on the printed wiring board 1, and the solder connection surface S of the Rietbin member 3 of the integrated circuit 10 is connected to the wiring circuit connection portion (not shown) of the printed wiring board 1''. Set it in the correct position. Subsequently, the part of the printed wiring board 1 where the integrated circuit 10 is mounted is heated by a hot air method or an infrared method, and the solder that has been made to adhere to the solder connection portion 6 in advance is melted to connect the circuit.
Reed part by X-necked flow sorter link method.

The solder connection surface S of the connecting member 3 and the circuit of the printed wiring board 10 are collectively soldered connected. In this way, the integrated circuit 10 can be easily and reliably placed on both sides of the printed wiring board 1.
Moreover, not only can high-density packaging be achieved, but the gap created between the integrated circuit 10 and the mounting surface of the printed wiring board 1 can be determined by the thickness of the Rietbin member 3 and the adhesive solder layer, as shown in FIG. The printed wiring board 1 of the integrated circuit 10 has only a thickness of It is possible to connect the circuit easily, reliably, and economically.

Next, other embodiments of the integrated circuit of the present invention are shown in FIGS. 4 and 6.
This will be explained with reference to a perspective view of the main parts of the printed wiring board showing the mounted and connected state of the integrated circuit shown in the figure, and a perspective view of the Rietbin member shown in FIGS. 5 and 7.

Each of the embodiments described above has a lead pin portion 3A 3.
The only difference is the protruding position and direction of the leet portion 7 of B from the leet bin member 3, and the rest is completely the same as the previous embodiment, so a detailed explanation will be omitted.

As explained above, since the lead pin members 33A and 3B connect the lower surface of the circuit connection portion 3a directly to the circuit of the printed wiring board 1 by soldering, the processing of the lead pin members 3, 3A and 3B is easier than in the past. , machining accuracy is high, and the price can be reduced.

In addition, in this embodiment, the Rietbin member 3° 3A 3
B are provided with lead portions 7 with different protruding directions, respectively.
The present invention is not limited to this, and if a check terminal is not required, the lead portion 7 may not be provided.

Further, as a substitute for the Rietbin member 3 used in the present invention, the Rietbin member 4 shown in FIG. By standing the lead pin member 4b upright and using the lower surface of the lead pin member 4 as a solder connection surface, the lead pin member 4 can be used as a circuit connection part A without having to make a through hole in the printed wiring board 1. (not shown).

〔Effect of the invention〕

As explained above, according to the present invention, a plurality of circuit connection members connected to the integrated circuit are disposed at predetermined intervals at desired positions on the periphery of the substrate of the integrated circuit, and the circuit connection members are connected to the integrated circuit at predetermined intervals. Since the solder connection surface that directly contacts the circuit on the printed wiring board is formed inside the peripheral edge of the board, the circuit on the printed wiring board and the circuit of the integrated circuit can be easily and reliably soldered together. I have something to do. This allows surface mounting of integrated circuits on printed wiring boards on both sides easily, efficiently, and economically, resulting in significant reductions in component costs and processing costs.

In addition to this, it is possible to realize high-density mounting with extremely excellent volumetric efficiency and high-quality surface mounting with a small mounting height and mounting width.

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the present invention, and Fig. 2 is a perspective view of the main parts of a printed wiring board showing the mounted and connected state of a '4'' integrated circuit. Fig. 2 is a perspective view of the circuit connecting member of the above embodiment. 4 and 6 are side views of the main parts of the printed wiring board showing the mounted and connected state of the integrated circuit, and FIGS. 4 and 6 are main parts of the printed wiring board showing the mounted and connected state of the integrated circuit according to other embodiments of the present invention. 5 and 7 are perspective views of circuit connection members according to other embodiments, and FIGS. 8 and 10 are main parts of a printed wiring board showing the mounting and connection state of a conventional integrated circuit. Perspective view, Figures 9 and 11 are side views of main parts of a printed wiring board showing the mounting and connection state of a conventional integrated circuit. 2.10.IOA, IOB...Integrated circuit 3 3
A, 3B, 4, 4A...Lead bin member A...
. . . Circuit connection member E .

Claims (1)

[Claims] In an integrated circuit in which film circuits such as wiring conductors and resistors are formed on a rectangular insulating substrate, and chip parts such as small transistors and capacitors, and electronic circuit elements such as integrated circuits are mounted, the substrate of the integrated circuit is A plurality of circuit connecting members connected to the integrated circuit are arranged at predetermined intervals at desired positions on the periphery, and the circuit connecting members are directly connected to the circuit on the printed wiring board on which the integrated circuit is mounted. An integrated circuit characterized in that a solder connection surface that is brought into contact and soldered is formed inside the peripheral edge of the substrate.