JPH066784B2 - Thin film production equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to an apparatus for producing various metal thin films.

2. Description of the Related Art A metal thin film is manufactured by placing a material in a vacuum chamber and attaching it to a substrate by vacuum deposition or sputtering.

Problems to be Solved by the Invention In this case, in order to enhance the uniformity of film thickness, composition, structure, etc.,
It is necessary to make a film while rotating the substrate. Also,
If a large number of thin films can be formed by setting a large number of substrates in a vacuum chamber and exchanging the substrates without breaking the vacuum or gas atmosphere, improvement in working efficiency and reliability in thin film formation can be expected. In the same way, using multiple materials,
Fabricating a multilayer film by moving the substrate is a method with a lot of potential from the viewpoint of searching for new materials.

Means for Solving the Problems The present invention is an apparatus that satisfies all of the above requirements, in which a disk-shaped first upper lid is rotatably provided in a vacuum chamber equipped with one or more thin film material generation sources, A circular hole is eccentrically provided in the first upper lid, and a second upper lid is rotatably provided therein, and the second upper lid has a substrate holder capable of rotating and vertically moving at a position eccentric from a rotation center. , A mask holder to which a mask is attached so as to be movable up and down, is provided so as to hang down in a vacuum chamber, an openable and closable shutter is provided between a thin film material generation source and a substrate, and rotation of the first and second upper lids And their timing, rotation and vertical movement of the board holder and their timing,
A thin film forming apparatus comprising a microcomputer device for automatically controlling the vertical movement of a mask and its timing, and the opening and closing of a shutter and its timing.

EXAMPLE The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an example of the embodiment, and 1 is a vacuum chamber.

The vacuum chamber 1 is provided with one or a plurality of thin film material generation sources 2, a substrate holder 3 is provided on the upper portion thereof, and a plurality of substrates 4 are attached. A shutter 5 is provided directly above the thin film material generation source 2, and a mask 6 is provided directly below the substrate holder 3. The mask 6 is attached to a mask holder 7 so as to be vertically movable.

A disk-shaped first upper lid 8 is rotatably provided on an upper portion of the vacuum chamber 1, and a circular hole 9 is eccentrically provided in the first upper lid 8 and a second upper lid 10 is rotatably provided in the hole 9. Set up. Its second lid
The above-mentioned substrate holder 3 is provided at a position eccentric from the center of 10 so as to be vertically movable. The mask holder 7 described above
The upper end of is attached to the second upper lid 10.

The rotation of the first upper lid 8 and the second upper lid 10, the rotation and vertical movement of the substrate holder 3, the vertical movement of the mask 6, the opening and closing of the shutter 5, and their timing are determined according to a program pre-installed in the microcomputer device 11. Control automatically. Further, rotation, vertical movement of the above-mentioned members, and opening / closing of the shutter 5 can be performed by a known mechanism. In other words, with the recent development of computer technology, it is common for computers to automatically control the equipment in the production department, and the software development for that is easy, and the associated hardware is also widely known. The operation of the present invention described above can be designed by those skilled in the art at any time. Therefore, detailed design such as a micromotor and a power transmission mechanism is omitted in the drawing.

As the thin film material generation source 2, a gun type sputtering source, an evaporation boat, or the like is used, and a sputtering or vacuum deposition technique can be applied.

An atomic flow is generated from such a thin film material generation source 2, and the atomic flow is made to reach the substrate holder 3 through the opened shutter 5 and mask 6, and is made to adhere to the surface of the substrate 4. Such an action is performed in various modes. Can be done.

FIG. 2 shows an example thereof, and the center P of the first upper lid 8 and the center Q of the second upper lid 10 are eccentric. The substrate holder 3 is provided on the second upper lid 10 with its rotation center R eccentric to the Q point, and the first upper lid 8 and the second upper lid 10 are rotated so that the R point coincides with the P point. Adjusted according to the instructions of the computer 11. A large number of substrates 4 are set on the substrate holder 3 along the outer periphery thereof. There are two thin film material generation sources 2, and a single layer or a multi-layer film can be produced by performing film formation sequentially or alternately through the holes of the mask 6 formed directly above each. Further, if the hole of the mask 3 and one of the substrates 4 are provided at an intermediate position between the two thin film material generation sources 2 and 2, the thin film material generation sources 2 and 2 are simultaneously operated to produce an alloy thin film on the substrate 4. can do.

The mask 6 is placed at an appropriate distance directly below the substrate 4 so that the atomic flow from the thin film material generation source 2 does not reach, except for the one on which the film is formed among the plurality of substrates 4. Is moved up and down along the mask holder 7.

FIG. 3 shows an example in which the relative positions of the first upper lid 8 and the second upper lid 10 are changed, and the rotation center R of the substrate holder 3 is brought directly above one thin film material generation source 2. In this case, a thin film can be produced while rotating the substrate, and a uniform film can be obtained.

FIG. 4 shows an example in which the rotation center R of the substrate holder 3 is located at an intermediate position between the two thin film material generation sources 2, 2. At this time, if the substrate 4 is set at the center of the substrate holder 3, it is possible to produce a uniform alloy thin film by simultaneously operating the two thin film material generation sources 2 while rotating the substrate 4. If a plurality of substrates 4 are set on the outer periphery of the substrate holder 3 and the substrate holder 3 is rotated, the substrates 4
Are alternately placed on the two thin film material generation sources 2, so that a multilayer film can be produced. In this case, if the microcomputer device 11 controls the rotation of the substrate holder 3 using a pulse motor, the film thickness of each layer can be controlled.

In the above, three typical usage examples have been described, but in any mode, if the minimum necessary information is input to the microcomputer device 11, the relative position of the two upper lids is instructed and the pulse motor is controlled through the controller. Can be moved to automatically control the direction of the substrate holder 3, the timing of rotation, the speed, the timing of opening and closing the shutter, and the like.

EFFECTS OF THE INVENTION As described above, according to the present invention, a large number of substrates can be set using the same vacuum chamber and a large number of thin films can be formed without breaking the atmosphere, which improves work efficiency and reliability of thin film formation. Not only is it improved, but since it is possible to carry out thin film forming means of various aspects in the same vacuum chamber, it is not necessary to separately prepare vacuum chambers suitable for the purpose, which is economical. Not only that, by combining various uses, it becomes possible to fabricate a thin film having a new structure.

[Brief description of drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIGS. 2 to 4 are plan views of examples of its usage. DESCRIPTION OF SYMBOLS 1 ... Vacuum tank, 2 ... Thin film material generation source, 3 ... Substrate holder, 4 ... Substrate, 5 ... Shutter, 6 ... Mask, 7 ... Mask holder, 8 ... First upper lid, 9 ... Hole, 10 ... Second upper lid , 11… Microcomputer equipment.

Claims (1)

[Claims] 1. A disk-shaped first upper lid is rotatably provided in a vacuum chamber provided with one or more thin film material generating sources, and a circular hole is eccentrically provided in the first upper lid, and a second hole is provided therein. An upper lid is rotatably provided, and the second upper lid is provided with a substrate holder that can be rotated and moved up and down at a position eccentric from a rotation center, and a mask holder on which a mask is vertically movable. And a shutter that can be opened and closed between the thin film material generation source and the substrate. Rotation of the first and second upper lids and their timing, rotation and vertical movement of the substrate holder and their timing, mask A thin film manufacturing apparatus comprising a microcomputer device for automatically controlling the vertical movement of the shutter and its timing, and the opening and closing of the shutter and its timing.