JPH0667642B2 - Ion flow recording head manufacturing method - Google Patents
Ion flow recording head manufacturing methodInfo
- Publication number
- JPH0667642B2 JPH0667642B2 JP60065168A JP6516885A JPH0667642B2 JP H0667642 B2 JPH0667642 B2 JP H0667642B2 JP 60065168 A JP60065168 A JP 60065168A JP 6516885 A JP6516885 A JP 6516885A JP H0667642 B2 JPH0667642 B2 JP H0667642B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating material
- photoresist layer
- recording head
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、ファクシミリ，プリンター等の書き込み用ヘ
ッドとして用いるイオンフロー記録用ヘッドに関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ion flow recording head used as a writing head for facsimiles, printers and the like.
従来の技術 イオンフロー記録用ヘッド１は第２図に示すように絶縁
板２の一面に共通電極３を形成し、絶縁板２の他面に微
細電極４を形成し、これら共通電極３、絶縁板２及び微
細電極４にφ0.1〜φ0.3mm程度の貫通孔５を形成してい
る。而してイオン源６でイオンを発生させ、イオンフロ
ー記録用ヘッド１の共通電極３と微細電極４にかかる電
圧により、貫通孔５をブロック状態にしてイオンの流れ
を制御し、ドラム７上の誘導体層８に潜像を形成するこ
とができる。2. Description of the Related Art In an ion flow recording head 1, as shown in FIG. 2, a common electrode 3 is formed on one surface of an insulating plate 2, and a fine electrode 4 is formed on the other surface of the insulating plate 2. Through holes 5 of about φ0.1 to φ0.3 mm are formed in the plate 2 and the fine electrodes 4. Thus, ions are generated by the ion source 6, and the voltage is applied to the common electrode 3 and the fine electrode 4 of the ion flow recording head 1 to block the through holes 5 to control the flow of ions, and the ions on the drum 7 are controlled. A latent image can be formed on the derivative layer 8.
従来、上記イオンフロー記録用ヘッド１を製造するには
第４図（Ａ）に示すように絶縁板２の一面に微細電極４
を形成する。この微細電極４は第３図に示すようにリン
グ状部９を有し、このリング状部９はその中心に80μｍ
程度の小孔10を有している。絶縁板２の他面に共通電極
３を形成する。然る後、ドリル11を微細電極４の中心の
小孔10の軸心に合わせ、このドリル11を前進させること
により第４図（Ｂ）に示すように貫通孔５を形成してい
た。Conventionally, in order to manufacture the ion flow recording head 1, as shown in FIG. 4 (A), a fine electrode 4 is formed on one surface of an insulating plate 2.
To form. The fine electrode 4 has a ring-shaped portion 9 as shown in FIG. 3, and the ring-shaped portion 9 has a center of 80 μm.
It has about 10 small holes. The common electrode 3 is formed on the other surface of the insulating plate 2. After that, the drill 11 was aligned with the axis of the small hole 10 at the center of the fine electrode 4, and the drill 11 was advanced to form the through hole 5 as shown in FIG. 4 (B).
発明が解決しようとする問題点 しかしながらドリル11による孔明け作業の際に微細電極
４のリング状部９にバリ12が生じると共に共通電極３側
に大きなバリ13が生じ、これらのバリ12,13により短
絡、スパーク、特性不良を生じる。また多数の貫通孔５
を１個宛加工するため、加工時間が長くかかり、しかも
ドリル11の摩耗，刃こぼれ等により孔形状にもバラツキ
が多い等の問題点があった。Problems to be Solved by the Invention However, during drilling work by the drill 11, burrs 12 are formed on the ring-shaped portion 9 of the fine electrode 4 and large burrs 13 are formed on the common electrode 3 side. Short circuits, sparks, and defective characteristics will occur. In addition, many through holes 5
However, there is a problem that it takes a long time to machine one piece, and there are many variations in hole shape due to wear of the drill 11 and spillage of the blade.
そこで本発明は、短絡、スパーク、特性不良を防止する
ことができ、また加工時間を短縮することができ、しか
も孔形状のバラツキを少なくすることができるようにし
たイオンフロー記録用ヘッドの製造方法を提供すること
を目的とするものである。Therefore, the present invention is a method of manufacturing an ion flow recording head capable of preventing short circuits, sparks, and defective characteristics, shortening the processing time, and reducing variations in hole shape. It is intended to provide.
問題点を解決するための手段 そして上記問題点を解決する本発明は、エッチング加工
が可能な絶縁材を用意する工程と、前記絶縁材の両面に
隣接して第１及び第２の導体層を形成する工程と、前記
第１及び第２の導体層の前記絶縁材と反対側の各々の面
に隣接して、第１及び第２のフォトレジスト層を形成す
る工程と、前記第１及び第２の導体層の一方の導体層
を、その導体層に隣接したフォトレジスト層とともにエ
ッチングし、内孔を有する形状である一方の電極を形成
する工程と、前記一方の電極から前記第１のフォトレジ
スト層を剥離し、前記第２の導体層から前記第２のフォ
トレジスト層を剥離する工程と、少なくとも前記フォト
レジスト層が剥離された一方の電極に隣接し、かつその
内孔の端面よりも内側にはみ出すことがないように第３
のフォトレジスト層を形成し、前記第２の導体層の前記
絶縁材と反対側の面に隣接して、第４のフォトレジスト
層を形成する工程と、前記第３のフォトレジスト層及び
一方の電極をマスクとして、エッチングにより前記絶縁
材に内孔を形成する工程と、少なくとも前記内孔が形成
された絶縁材をマスクとして他方の導体層をエッチング
し、他方の電極を形成する工程と、前記他方の電極が形
成された後に、前記一方の電極から前記第３のフォトレ
ジスト層を剥離し、前記他方の電極から、前記第４のフ
ォトレジスト層を剥離する工程とを有するイオンフロー
記録用ヘッドの製造方法である。Means for Solving the Problems And the present invention for solving the above problems includes a step of preparing an insulating material that can be etched and a first and a second conductor layer adjacent to both surfaces of the insulating material. A step of forming, a step of forming first and second photoresist layers adjacent to respective surfaces of the first and second conductor layers opposite to the insulating material, and steps of forming the first and second photoresist layers. A step of etching one conductor layer of the two conductor layers together with a photoresist layer adjacent to the conductor layer to form one electrode having a shape having an inner hole; A step of peeling the resist layer and peeling the second photoresist layer from the second conductor layer, and a step of adjoining at least one electrode from which the photoresist layer has been peeled and an end surface of the inner hole thereof. It won't stick out inside Sea urchin third
Forming a photoresist layer, and forming a fourth photoresist layer adjacent to the surface of the second conductor layer opposite to the insulating material; Forming an inner hole in the insulating material by etching using the electrode as a mask; and etching the other conductor layer using at least the insulating material having the inner hole as a mask to form the other electrode, An ion flow recording head having a step of peeling the third photoresist layer from the one electrode and peeling the fourth photoresist layer from the other electrode after the other electrode is formed. Is a manufacturing method.
作用 本発明では、第３のフォトレジスト層と一方の電極を用
いて絶縁材のエッチングを行い、そして少なくともその
絶縁材をマスクとして他方の導体層のエッチングを行
う。Function In the present invention, the insulating material is etched using the third photoresist layer and one electrode, and the other conductor layer is etched using at least the insulating material as a mask.
実施例 以下、本発明の実施例を図面に基いて詳細に説明する。
第１図（Ａ）に示すようにエッチング可能な絶縁材21の
両面の全面に導体層22を形成し、各導体層22の外面にフ
ォトレジスト23を塗布する。次に一方の導体層22のエッ
チングを行うことにより第１図（Ｂ）に示すようにリン
グ状部24を有する微細電極25を形成すると共にフォトレ
ジスト23を剥離する。次に第１図（Ｃ）に示すように絶
縁材21と微細電極25の外面に微細電極25のリング状部24
の孔26を残してエッチング液に耐え得るフォトレジスト
27を塗布し、他面の導体層22の外面にも同様のフォトレ
ジスト27を塗布する。次に第１図（Ｄ）に示すように微
細電極25のリング状部24の孔26より絶縁材21にエッチン
グを行い、絶縁材21に孔28を形成する。次に第１図
（Ｅ）に示すように微細電極25のリング状部24の孔26及
び絶縁材21の孔28より導体層22にエッチングを行い、導
体層22に孔29を形成して共通電極30を形成すると共にフ
ォトレジスト27を剥離することにより第１図（Ｆ）に示
すように貫通孔31を形成することができる。Examples Hereinafter, examples of the present invention will be described in detail with reference to the drawings.
As shown in FIG. 1 (A), a conductor layer 22 is formed on the entire surface of both sides of an insulating material 21 that can be etched, and a photoresist 23 is applied to the outer surface of each conductor layer 22. Next, one conductor layer 22 is etched to form a fine electrode 25 having a ring-shaped portion 24 as shown in FIG. 1 (B) and the photoresist 23 is peeled off. Next, as shown in FIG. 1C, the ring-shaped portion 24 of the fine electrode 25 is formed on the outer surface of the insulating material 21 and the fine electrode 25.
Photoresist that can withstand etching solution leaving holes 26 in
27 is applied, and the same photoresist 27 is applied to the outer surface of the conductor layer 22 on the other surface. Next, as shown in FIG. 1D, the insulating material 21 is etched through the holes 26 of the ring-shaped portion 24 of the fine electrode 25 to form holes 28 in the insulating material 21. Next, as shown in FIG. 1 (E), the conductor layer 22 is etched through the hole 26 of the ring-shaped portion 24 of the fine electrode 25 and the hole 28 of the insulating material 21 to form a hole 29 in the conductor layer 22 to form a common hole. By forming the electrode 30 and peeling off the photoresist 27, the through hole 31 can be formed as shown in FIG. 1 (F).
従って、より簡便で効率的なエッチング加工によりバリ
がなく、孔形状にバラツキが少ない貫通孔を簡単に同時
加工することができる。Therefore, it is possible to easily and simultaneously process through-holes that are free of burrs and have a small variation in hole shape by a simpler and more efficient etching process.
なお本発明は、予め共通電極を形成し、それを用いて微
細電極に通ずる貫通孔を形成しても良い。In the present invention, a common electrode may be formed in advance and a through hole communicating with the fine electrode may be formed using the common electrode.
さらに上記実施例では貫通孔１ケの場合について説明し
たが、貫通孔は複数個設けても良く、またこの複数個の
貫通孔に共通した電極を設けても良いことはもちろんで
ある。Further, in the above embodiment, the case of one through hole was described, but it is needless to say that a plurality of through holes may be provided and an electrode common to the plurality of through holes may be provided.
発明の効果 以上、要するに本発明は、導体層及び絶縁材をエッチン
グで加工することによりバリがなく、バラツキの少ない
貫通孔を形成することができるだけでなく、フォトレジ
スト層、電極、絶縁体をそのままマスクとして利用し
て、エッチング自体の効率を向上させるとともに、その
精度をもより向上させているため、高い加工精度を有す
る貫通孔を実現し、イオンフロー記録用ヘッドにおける
スパーク、短絡、特性不良を防止することができる。EFFECTS OF THE INVENTION As described above, in short, according to the present invention, by processing the conductor layer and the insulating material by etching, it is possible not only to form a through hole having no burrs but with little variation, but also to leave the photoresist layer, the electrode and the insulator as they are. By using it as a mask to improve the efficiency of etching itself and its accuracy, the through holes with high processing accuracy are realized, and sparks, short circuits, and characteristic defects in the ion flow recording head are prevented. Can be prevented.
またエッチングで多数の貫通孔を同時に加工することが
できるので、作業時間を短縮することができる。Further, since a large number of through holes can be simultaneously processed by etching, the working time can be shortened.
第１図（Ａ）乃至（Ｆ）は本発明のイオンフロー記録用
ヘッドの製造方法の一実施例を示す断面図、第２図はイ
オンフロー記録の原理説明図、第３図は従来のイオンフ
ロー記録用ヘッドに用いる微細電極の平面図、第４図
（Ａ）及び（Ｂ）は従来のイオンフロー記録用ヘッドの
製造方法を示す断面図である。 21……絶縁材、22……導体層、23……フォトレジスト、
24……リング状部、25……微細電極、26……孔、27……
フォトレジスト、28……孔、29……孔、30……共通電
極、31……貫通孔。1 (A) to 1 (F) are cross-sectional views showing an embodiment of a method of manufacturing an ion flow recording head of the present invention, FIG. 2 is an explanatory view of the principle of ion flow recording, and FIG. 3 is a conventional ion. FIGS. 4 (A) and 4 (B) are cross-sectional views showing a conventional method for manufacturing an ion flow recording head, which are plan views of fine electrodes used in the flow recording head. 21 ... Insulation material, 22 ... Conductor layer, 23 ... Photoresist,
24 …… Ring-shaped part, 25 …… Fine electrode, 26 …… Hole, 27 ……
Photoresist, 28 ... hole, 29 ... hole, 30 ... common electrode, 31 ... through hole.
フロントページの続き (72)発明者 豊田 隆一 神奈川県川崎市多摩区東三田３丁目10番１ 号 松下技研株式会社内 (72)発明者 河田 耕一 神奈川県川崎市多摩区東三田３丁目10番１ 号 松下技研株式会社内 (72)発明者 水谷 武 神奈川県川崎市多摩区東三田３丁目10番１ 号 松下技研株式会社内 (56)参考文献 特開 昭56−142551（ＪＰ，Ａ)Front page continued (72) Inventor Ryuichi Toyoda 3-10-1 Higashisanda, Tama-ku, Kawasaki City, Kanagawa Prefecture Matsushita Giken Co., Ltd. No. Matsushita Giken Co., Ltd. (72) Inventor Takeshi Mizutani 3-10-1 Higashisanda, Tama-ku, Kawasaki City, Kanagawa Prefecture Matsushita Giken Co., Ltd. (56) Reference JP-A-56-142551 (JP, A)
Claims (1)
工程と、 前記絶縁材の両面に隣接して第１及び第２の導体層を形
成する工程と、 前記第１及び第２の導体層の前記絶縁材と反対側の各々
の面に隣接して、第１及び第２のフォトレジスト層を形
成する工程と、 前記第１及び第２の導体層の一方の導体層を、その導体
層に隣接したフォトレジスト層とともにエッチングし、
内孔を有する形状である一方の電極を形成する工程と、 前記一方の電極から前記第１のフォトレジスト層を剥離
し、前記第２の導体層から前記第２のフォトレジスト層
を剥離する工程と、 少なくとも前記フォトレジスト層が剥離された一方の電
極に隣接し、かつその内孔の端面よりも内側にはみ出す
ことがないように第３のフォトレジスト層を形成し、前
記第２の導体層の前記絶縁材と反対側の面に隣接して、
第４のフォトレジスト層を形成する工程と、 前記第３のフォトレジスト層及び一方の電極をマスクと
して、エッチングにより前記絶縁材に内孔を形成する工
程と、 少なくとも前記内孔が形成された絶縁材をマスクとして
他方の導体層をエッチングし、他方の電極を形成する工
程と、 前記他方の電極が形成された後に、前記一方の電極から
前記第３のフォトレジスト層を剥離し、前記他方の電極
から、前記第４のフォトレジスト層を剥離する工程とを
有するイオンフロー記録用ヘッドの製造方法。1. A step of preparing an insulating material that can be etched, a step of forming first and second conductor layers adjacent to both surfaces of the insulating material, and the first and second conductor layers. A step of forming first and second photoresist layers adjacent to respective surfaces of the first and second conductor layers opposite to the insulating material, and one conductor layer of the first and second conductor layers is Etching with the photoresist layer adjacent to
Forming one electrode having a shape having an inner hole; peeling the first photoresist layer from the one electrode, and peeling the second photoresist layer from the second conductor layer And a third photoresist layer is formed so as to adjoin at least one of the electrodes from which the photoresist layer has been peeled off and not to protrude inside the end face of the inner hole thereof. Adjacent to the surface of the opposite side of the insulating material,
A step of forming a fourth photoresist layer; a step of forming an inner hole in the insulating material by etching using the third photoresist layer and one electrode as a mask; and an insulation in which at least the inner hole is formed. Etching the other conductor layer using the material as a mask to form the other electrode, and after the other electrode is formed, the third photoresist layer is peeled from the one electrode, and the other electrode is formed. And a step of peeling the fourth photoresist layer from the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60065168A JPH0667642B2 (en) | 1985-03-29 | 1985-03-29 | Ion flow recording head manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60065168A JPH0667642B2 (en) | 1985-03-29 | 1985-03-29 | Ion flow recording head manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61224489A JPS61224489A (en) | 1986-10-06 |
| JPH0667642B2 true JPH0667642B2 (en) | 1994-08-31 |
Family
ID=13279084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60065168A Expired - Fee Related JPH0667642B2 (en) | 1985-03-29 | 1985-03-29 | Ion flow recording head manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0667642B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02102071A (en) * | 1988-10-11 | 1990-04-13 | Olympus Optical Co Ltd | Manufacture of ion flow recording head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56142551A (en) * | 1980-04-09 | 1981-11-06 | Konishiroku Photo Ind Co Ltd | Production of ion modulating electrode |
-
1985
- 1985-03-29 JP JP60065168A patent/JPH0667642B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61224489A (en) | 1986-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |