JPH0667643B2 - Ion flow recording head manufacturing method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ion flow recording head used as a writing head for facsimiles, printers and the like.

2. Description of the Related Art In an ion flow recording head 1, as shown in FIG. 2, a common electrode 3 is formed on one surface of an insulating plate 2, and a fine electrode 4 is formed on the other surface of the insulating plate 2. Through holes 5 of about φ0.1 to φ0.3 mm are formed in the plate 2 and the fine electrodes 4. Thus, ions are generated by the ion source 6, and the voltage is applied to the common electrode 3 and the fine electrode 4 of the ion flow recording head 1 to block the through holes 5 to control the flow of ions, and the ions on the drum 7 are controlled. A latent image can be formed on the derivative layer 8.

Conventionally, in order to manufacture the ion flow recording head 1, as shown in FIG. 4 (A), a fine electrode 4 is formed on one surface of an insulating plate 2.
To form. The fine electrode 4 has a ring-shaped portion 9 as shown in FIG. 3, and the ring-shaped portion 9 has a center of 80 μm.
It has about 10 small holes. The common electrode 3 is formed on the other surface of the insulating plate 2. After that, the drill 11 was aligned with the axis of the small hole 10 at the center of the fine electrode 4, and the drill 11 was advanced to form the through hole 5 as shown in FIG. 4 (B).

Problems to be Solved by the Invention However, during drilling work by the drill 11, burrs 12 are formed on the ring-shaped portion 9 of the fine electrode 4 and large burrs 13 are formed on the common electrode 3, and these burrs 12, 13 cause a short circuit. ，
Sparks and defective characteristics occur. In addition, a large number of through holes 5
There is a problem in that it takes a long processing time to process individual pieces, and there are many variations in hole shape due to wear of the drill 11 and blade spillage.

Therefore, the present invention can prevent short circuits, sparks, and defective characteristics, can shorten the processing time, and can reduce variations in the hole shape, and the relative positions of the fine electrode and the common electrode. It is an object of the present invention to provide a method for manufacturing an ion flow recording head capable of improving the accuracy of the above.

Means for Solving the Problems And the present invention for solving the above problems includes a step of preparing an insulating material that can be etched and a first and a second conductor layer adjacent to both surfaces of the insulating material. A step of forming, a step of forming first and second photoresist layers adjacent to respective surfaces of the first and second conductor layers opposite to the insulating material, and steps of forming the first and second photoresist layers. Adjacent to each surface of the second photoresist layer opposite the first and second conductor layers,
Providing first and second mask patterns, exposing the first and second photoresist layers together using the first and second mask patterns, and exposing the exposed first and second photoresist layers. Etching the first and second conductor layers using the first and second photoresist layers as masks,
Forming first and second electrodes each having an inner hole, and from the first and second electrodes to the first and second electrodes
Of the photoresist layer, a step of forming a protective layer adjacent to one of the first and second electrodes having the inner hole, and the first and second electrodes having the inner hole.
Ion flow having a step of forming an inner hole in the insulating material by etching using the other of the electrodes as a mask, and a step of peeling the protective layer from the one electrode after the inner hole is formed in the insulating material. A method of manufacturing a recording head.

Function In the present invention, the first conductor layer and the second conductor layer are formed by utilizing the first photoresist layer and the second photoresist layer which are simultaneously exposed by using the first mask pattern and the second mask pattern. The conductor layer is etched to form the first electrode and the second electrode, and the insulating material is etched using the second electrode as a mask.

Examples Hereinafter, examples of the present invention will be described in detail with reference to the drawings.
As shown in FIG. 1 (A), a conductor layer 22 is formed on the entire surface of both sides of an insulating material 21 that can be etched, and a photoresist 23 is applied to the outer surface of each conductor layer 22. On the other hand, as shown in FIG. 1B, a fine electrode pattern mask 24 for forming a fine electrode having a ring-shaped portion and a common electrode pattern mask 25 for forming a common electrode are prepared. The fine electrode pattern mask 24 and the common electrode pattern mask 25 are aligned with high accuracy. Next, as shown in FIG. 1 (C), pattern masks 24 and 2 for these fine electrodes and common electrodes are used.
Insulating material 21, conductor layer 22 and photoresist 23 between
Insert. Next, patterns for fine electrodes and common electrodes
Simultaneous double-sided exposure with ultraviolet rays 26 from the outside of 24 and 25.
Next, the conductor layer 22 is etched to form ring-shaped portions on the upper and lower conductor layers, respectively, as shown in FIG. 1 (D).
A fine electrode 28 having 27 and a common electrode 29 are formed, and a photoresist on the outer surface of the fine electrode 28 and the common electrode 29 is formed.
23 is peeled off. Next, as shown in FIG.
A protective coat 30 is formed on the outer surface of 28, and the insulating layer 21 is etched from the common electrode 29 side with an etchant 31 using the common electrode 29 as an etching mask. After etching, protective coat 30
By removing the through hole 32 as shown in FIG.
Can be formed.

Therefore, a large number of through holes 12 without burrs can be simultaneously processed by a simpler and more efficient etching process. In addition, since the pattern masks 24 and 25 for the fine electrodes and the common electrode located on both sides are aligned in advance and the simultaneous exposure is performed from both outer sides, the fine electrodes are not affected by the contraction of the material.
The relative positional accuracy between the common electrode 28 and the common electrode 29 can be improved.

In the above embodiment, the case where there is one through hole has been described, but it goes without saying that a plurality of through holes may be provided and an electrode common to the plurality of through holes may be provided.

Effects of the Invention As described above, according to the present invention, the conductor layer and the insulating material are processed by etching, so that a through hole having no burr and less variation can be formed, and a spark, a short circuit and a characteristic defect can be prevented. In particular, since the second electrode is used as it is as a mask for etching the insulating material, there is no need to add a new mask to position the structure, and a simpler, more efficient, and more accurate etching process can be realized. It effectively contributes to the prevention of defective characteristics of the recording head. Further, since a large number of through holes can be simultaneously processed by etching, the working time can be shortened.
In addition, the pattern masks for the fine electrodes and the common electrode located on both sides are aligned in advance, and simultaneous exposure is performed from both outsides, so the relative positional accuracy of the fine electrodes and the common electrode is improved without being affected by material shrinkage. Can be made.

[Brief description of drawings]

1 (A) to 1 (F) are cross-sectional views showing an embodiment of a method of manufacturing an ion flow recording head of the present invention, FIG. 2 is an explanatory view of the principle of ion flow recording, and FIG. 3 is a conventional ion. FIGS. 4 (A) and 4 (B) are cross-sectional views showing a conventional method for manufacturing an ion flow recording head, which are plan views of fine electrodes used in the flow recording head. 21 ... Insulation material, 22 ... Conductor layer, 23 ... Photoresist,
24 …… Pattern mask for forming fine electrodes, 25 …… Pattern mask for forming common electrodes, 26 …… UV rays, 28 …… Fine electrodes, 29 …… Common electrodes, 30 …… Protective coat, 31 …… Etching liquid, 32 …… Through hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuichi Toyota 3-10-1 Higashisanda, Tama-ku, Kawasaki City, Kanagawa Prefecture Matsushita Giken Co., Ltd. No. 10-1 Matsushita Giken Co., Ltd. (72) Inventor Takeshi Mizutani 3-10-10 Higashisanda, Tama-ku, Kawasaki-shi, Kanagawa Matsushita Giken Co., Ltd. (56) Reference JP-A-56-142551 (JP, A) )

Claims (1)

[Claims] 1. A step of preparing an insulating material that can be etched, a step of forming first and second conductor layers adjacent to both surfaces of the insulating material, and the first and second conductor layers. Forming first and second photoresist layers adjacent to respective surfaces of the first and second photoresist layers opposite to the insulating material, and forming the first and second conductors of the first and second photoresist layers. Providing first and second mask patterns adjacent to respective surfaces opposite to the layer, and using the first and second mask patterns, the first and second photoresists Exposing the layers together, and etching the first and second conductor layers using the exposed first and second photoresist layers as a mask to form first and second conductive layers each having an inner hole. A step of forming a second electrode; and A step of removing the first and second photoresist layers; a step of forming a protective layer adjacent to one of the first and second electrodes having a shape having the inner hole; and a step having a shape having the inner hole. A step of forming an inner hole in the insulating material by etching using the other of the first and second electrodes as a mask; and a step of peeling the protective layer from the one electrode after the inner hole is formed in the insulating material A method for manufacturing an ion flow recording head having: