JPS5918226B2 - Recording head manufacturing method - Google Patents
Recording head manufacturing methodInfo
- Publication number
- JPS5918226B2 JPS5918226B2 JP50101859A JP10185975A JPS5918226B2 JP S5918226 B2 JPS5918226 B2 JP S5918226B2 JP 50101859 A JP50101859 A JP 50101859A JP 10185975 A JP10185975 A JP 10185975A JP S5918226 B2 JPS5918226 B2 JP S5918226B2
- Authority
- JP
- Japan
- Prior art keywords
- needle electrode
- etching
- recording head
- forming
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Electrophotography Using Other Than Carlson'S Method (AREA)
- Facsimile Heads (AREA)
Description
【発明の詳細な説明】
本発明はファクシミリ装置等に於て用いるマルチスタイ
ラス(多針電極)を有する記録ヘッドの製造方法に関す
るものであり、更には絶縁基板上に多針電極を形成した
記録ヘッドの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a recording head having a multi-stylus (multi-stylus electrode) used in facsimile machines and the like, and further relates to a recording head having a multi-stylus electrode formed on an insulating substrate. The present invention relates to a manufacturing method.
従来ファクシミリに於て用いる多針電極は、多数の絶縁
された金属細線を一列に等間隔で固定するか、又は絶縁
基板上に銅張り面を形成し、この銅張り面をエッチング
することにより構成されていた。Conventional multi-needle electrodes used in facsimile machines are constructed by fixing a large number of thin insulated metal wires in a row at equal intervals, or by forming a copper-clad surface on an insulating substrate and etching this copper-clad surface. It had been.
しかしながら上述の金属細線を固定する方式は、工数が
多く、作業が煩雑となつており、又夫々の電極をその駆
動回路へ取り付ける取付け作業も煩雑なものである。However, the method of fixing the thin metal wires described above requires a large number of man-hours and is complicated, and the installation work of attaching each electrode to its drive circuit is also complicated.
一方上記エッチングによる方法に於ては、多針電極の作
成も容易であり、又多針電極の駆動回路も同一の絶縁基
板上に作成できるので、正確に、且つ、安価に、且つ、
コンパクトに形成できるものであるが、多針電極の厚み
を大きくとれないという欠点を有しているものである。On the other hand, in the above etching method, it is easy to create multi-needle electrodes, and the drive circuit for the multi-needle electrodes can also be created on the same insulating substrate, so it can be done accurately, inexpensively, and
Although it can be formed compactly, it has the disadvantage that the thickness of the multi-needle electrode cannot be increased.
即ち、絶縁基板上の金属面の厚さは該金属面上に形成す
るパターンの密度(この場合は多針電極密度)に支配さ
れるので、パターンの密度が高くなると、必要とする厚
みは得ることができない。In other words, the thickness of the metal surface on the insulating substrate is controlled by the density of the pattern formed on the metal surface (in this case, the density of multi-needle electrodes), so the higher the pattern density, the more difficult it is to obtain the required thickness. I can't.
例えば多針電極の密度が8本/mmであると、最も厚く
しても50ttm程度の厚みしかとれない。その程度の
厚さでは摩耗を伴う記録方式、例えば、多針電極と記録
紙を直接接触させる記録方式に於ては用いることができ
ず、又かかる多針電極により記録紙上に形成されるドッ
トの副走査方向の幅を充分広くとることができないので
得られる印字の質も良好なものではなかつた。更には第
1図に示す如く絶縁基板11上にエッチングにより形成
した電極12は、本来その断面が矩形状に形成されるべ
きところが、シャープな形には仕上がらず、電極構造が
くずれてしまい、良好なる画質を得ることができないも
のであつた。For example, if the density of the multi-needle electrode is 8 needles/mm, the maximum thickness can only be about 50 ttm. With such a thickness, it cannot be used in a recording method that causes wear, such as a recording method in which a multi-needle electrode is in direct contact with the recording paper, and the dots formed on the recording paper by such a multi-needle electrode cannot be used. Since the width in the sub-scanning direction cannot be made sufficiently wide, the quality of the print obtained is also not good. Furthermore, as shown in FIG. 1, the electrode 12 formed by etching on the insulating substrate 11 should originally have a rectangular cross section, but it was not finished in a sharp shape, and the electrode structure collapsed, resulting in poor quality. It was not possible to obtain a good image quality.
本発明は上述の如き従前の欠点を除去するものにして、
絶縁基板上の導電部材のエッチングにより多針電極の附
設回路を構成し、しかる後、その上に金属層を形成して
厚みを大きくした前記絶縁基板上の多針電極群形成用端
部を切削して多針電極を形成する記録ヘツドの製造方法
を提示するものである。以下本発明を図面と共にその一
実施例について説明するならば、第2図は絶縁物質例え
ばエポキシ樹脂より成る基板13上の30Itmの銅箔
をエツチングすることにより、多数の多針電極16を有
する多針電極部14(後述の処理により、ここに多針電
極部を形成するので多針電極形成用端部とも呼ぶことと
する。The present invention obviates the above-mentioned drawbacks of the prior art, and
A multi-needle electrode auxiliary circuit is formed by etching the conductive member on the insulating substrate, and then a metal layer is formed thereon to increase the thickness, and the end portion for forming the multi-needle electrode group on the insulating substrate is cut. This paper presents a method for manufacturing a recording head in which multi-needle electrodes are formed. Below, the present invention will be described with reference to the drawings and an embodiment thereof. FIG. Needle electrode portion 14 (as a multi-needle electrode portion will be formed here through the process described below, it will also be referred to as a multi-needle electrode forming end portion).
)及び、かかる多針電極を駆動する駆動回路(附設回路
)15(但し第2図に於ては図面の繁雑化をさける為そ
の一部しか開示していない)を形成した図であるが、本
発明においては、基板上に予め駆動回路15のみを形成
し(多針電極部14は銅箔のまま残しておく)、しかる
後多針電極16を形成すべき銅箔20の上に金属メツキ
を約60μmの厚さで施こして(クロム若しくは口ジニ
ウムの如く銅よりも耐摩耗性の高い金属が好ましい)第
3図に示す如き金属層を得、かかる金属層21と銅箔2
0とを一定間隔D1でレーザビーム19により共に切削
して、第4図に示す如き多針電極群を得るものである。
又、この実施例に於て前記金属メツキの代りに金属シー
トを貼着して第3図に示した金属層21を形成してもよ
いのは勿論である。又この実施例に於ては予め駆動回路
15のみを基板13上に形成すると述べたが、前記金属
層21として駆動回路15を銅箔等のエツチングにより
形成するに際して使用するエツチング液に侵されない物
質を用いるならば、予め多針電極部を構成する銅箔部を
金属層21により覆つた後、かかる基板の全てをエツチ
ング液に浸して処理することにより、駆動回路形成時、
多針電極を構成する銅箔を特別なるマスク手段によりマ
スクして、次にエツチングをして駆動回路を構成し、し
かる後このマスク手段を除去してメツキを施こす作業に
於て、マスクを施こし、そしてマスクを除去する手間を
除けるものである。) and a drive circuit (attached circuit) 15 for driving such a multi-needle electrode (however, only a part of it is shown in FIG. 2 to avoid complication of the drawing), In the present invention, only the drive circuit 15 is formed on the substrate in advance (the multi-needle electrode section 14 is left as a copper foil), and then metal plating is applied on the copper foil 20 on which the multi-needle electrode 16 is to be formed. is applied to a thickness of about 60 μm (preferably a metal with higher wear resistance than copper, such as chromium or tinium) to obtain a metal layer as shown in FIG.
0 are cut together with a laser beam 19 at a constant interval D1 to obtain a multi-needle electrode group as shown in FIG.
Further, in this embodiment, it is of course possible to form the metal layer 21 shown in FIG. 3 by pasting a metal sheet instead of the metal plating. Further, in this embodiment, it has been described that only the drive circuit 15 is formed on the substrate 13 in advance, but the metal layer 21 may be made of a material that is not corroded by the etching solution used when forming the drive circuit 15 by etching copper foil or the like. When using this method, after covering the copper foil part constituting the multi-needle electrode part with the metal layer 21 in advance, the entire board is immersed in an etching solution, so that when forming the drive circuit,
The copper foil constituting the multi-needle electrode is masked using a special masking means, and then etched to form the drive circuit, and then this masking means is removed and the mask is applied during plating. This eliminates the hassle of applying and removing the mask.
第5図Cは上述の如くして得た本発明の記録ヘツドによ
る記録軌跡を示すものであるが、第5図Aに多数の金属
細線を用いた記録軌跡、第5図Bの従来のプリント板に
よる多針電極を用いた記録軌跡と比して副走査方向の隙
間Dを小さくでき、副走査方向のステツプ送りの量に合
わせて任意の厚みを得ることも容易である。FIG. 5C shows a recording trajectory by the recording head of the present invention obtained as described above, FIG. 5A shows a recording trajectory using a large number of thin metal wires, and FIG. 5B shows a conventional print. Compared to a recording trajectory using a multi-needle electrode using a plate, the gap D in the sub-scanning direction can be made smaller, and it is also easy to obtain an arbitrary thickness according to the amount of step feed in the sub-scanning direction.
以上述べた如く本発明による多針電極製造方法は、厚み
の大きい電極を絶縁基板上に得ることができ、又電極の
耐摩耗性も容易に向上させることができるものであるの
で、容易に所望の多針電極を得ることができるものであ
る。As described above, the method for manufacturing a multi-needle electrode according to the present invention makes it possible to obtain thick electrodes on an insulating substrate, and also to easily improve the abrasion resistance of the electrodes. It is possible to obtain a multi-needle electrode.
なお、上記実施例に於ては切削手段としてレーザビーム
を例示したのみであるが、機械的切削手段を含むその他
の切削手段を使用し得るのは勿論である。Note that in the above embodiments, only a laser beam is used as an example of the cutting means, but it goes without saying that other cutting means including mechanical cutting means can be used.
又上記1駆動回路(附設回路)とは広い意味での回路を
指すものであり、多針電極若しくは電極として機能する
部分以外のものを総称しているものである。Moreover, the above-mentioned one drive circuit (attached circuit) refers to a circuit in a broad sense, and is a general term for anything other than the multi-needle electrode or the part that functions as an electrode.
第1図は従来の多針電極を示す断面図、第2図は基板を
示す斜視図、第3〜4図は本発明による製造法の説明に
供する基板側面図、第5図は記録パターンを示す正面図
である。Fig. 1 is a sectional view showing a conventional multi-needle electrode, Fig. 2 is a perspective view showing a substrate, Figs. FIG.
Claims (1)
を除く部分をエッチングして多針電極の附設回路を形成
するエッチング工程と、絶縁基板上の導電部材で多針電
極が形成される領域に対して前記エッチング工程の前又
は後に前記導電部材とは異なる金属層を被覆形成する被
覆工程と、前記導電部材と金属層とを共に切削して多針
電極を形成する工程とを有する事を特徴とする記録ヘッ
ド製造方法。 2 前記被覆工程は前記エッチング工程の前に前記エッ
チングによつて侵されない金属層を被覆形成する事を特
徴とする特許請求の範囲第1項記載の記録ヘッド製造方
法。[Scope of Claims] 1. An etching process for forming an auxiliary circuit for the multi-needle electrode by etching a portion of the conductive member on the insulating substrate excluding the region where the multi-needle electrode is to be formed; A covering step of forming a metal layer different from the conductive member before or after the etching step on a region where the needle electrode is to be formed, and forming a multi-needle electrode by cutting the conductive member and the metal layer together. A recording head manufacturing method comprising the steps of: 2. The recording head manufacturing method according to claim 1, wherein the coating step includes forming a coating with a metal layer that is not attacked by the etching before the etching step.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50101859A JPS5918226B2 (en) | 1975-08-22 | 1975-08-22 | Recording head manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50101859A JPS5918226B2 (en) | 1975-08-22 | 1975-08-22 | Recording head manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5226114A JPS5226114A (en) | 1977-02-26 |
JPS5918226B2 true JPS5918226B2 (en) | 1984-04-26 |
Family
ID=14311732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50101859A Expired JPS5918226B2 (en) | 1975-08-22 | 1975-08-22 | Recording head manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5918226B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6189732U (en) * | 1984-11-15 | 1986-06-11 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63108709U (en) * | 1987-01-07 | 1988-07-13 |
-
1975
- 1975-08-22 JP JP50101859A patent/JPS5918226B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6189732U (en) * | 1984-11-15 | 1986-06-11 |
Also Published As
Publication number | Publication date |
---|---|
JPS5226114A (en) | 1977-02-26 |
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