JPH065760B2 - Sensitive device - Google Patents
Sensitive deviceInfo
- Publication number
- JPH065760B2 JPH065760B2 JP58022534A JP2253483A JPH065760B2 JP H065760 B2 JPH065760 B2 JP H065760B2 JP 58022534 A JP58022534 A JP 58022534A JP 2253483 A JP2253483 A JP 2253483A JP H065760 B2 JPH065760 B2 JP H065760B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- photosensitive
- optical filter
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
【発明の詳細な説明】 （イ） 産業上の利用分野 本発明は光学フィルタを備えた感光装置に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a photosensitive device having an optical filter.
（ロ） 従来技術 アモルファスシリコンの如きアモルファス半導体等の薄
膜状光半導体層を光活性層とする感光装置が実用化され
るに至って来た。欺る感光装置は薄膜状光半導体層を有
するが故に、該半導体層を支持する支持基板は不可欠な
存在である。本願出願人は上記不可欠な支持基板として
透光性の材料を使用することにより、該支持基板を受光
面とする感光装置を実用化し、更には上記支持基板の光
入射面、即ち上記光半導体層が配置せしめられている主
面とは逆の主面に光学フィルタを被着せしめた感光装置
をも試作した。(B) Prior Art A photosensitive device using a thin-film optical semiconductor layer such as an amorphous semiconductor such as amorphous silicon as a photoactive layer has come into practical use. Since the deceptive photosensitive device has a thin-film optical semiconductor layer, a supporting substrate supporting the semiconductor layer is indispensable. The present applicant put into practical use a photosensitive device having a light receiving surface of the supporting substrate by using a light-transmitting material as the indispensable supporting substrate, and further, the light incident surface of the supporting substrate, that is, the optical semiconductor layer. We also prototyped a photosensitive device in which an optical filter was attached to the main surface opposite to the main surface on which was placed.
第１図は欺る感光装置を示し、(1)は例えばガラス・耐
熱プラスチック等から成る透光性の支持基板、(2)は該
支持基板(1)の一方の主面に設けられた感光領域で、該
感光領域(2)は支持基板(1)側から第１電極層(3)、薄膜
状半導体層(4)及び第２電極層(5)が順次積層された構造
を持つ。上記第１電極層(3)は酸化スズ（ＳｎＯ２）・
酸化インジウムスズ（Ｉｎ２Ｏ３−ＳｎＯ２）等の透光
性材料から成り、上記半導体層(4)は面方向にＰ型層、
Ｉ型層、Ｎ型層を重畳せしめたＰＩＮ接合を有する膜厚
サブミクロン乃至ミクロンオーダのアモルファスシリコ
ンから形成され、更に上記第２電極層(5)は該アモルフ
ァスシリコンとオーミック接触するアルミニウム等の金
属から成っている。FIG. 1 shows a deceptive photosensitive device. (1) is a light-transmissive supporting substrate made of, for example, glass or heat-resistant plastic, and (2) is a photosensitive substrate provided on one main surface of the supporting substrate (1). In the region, the photosensitive region (2) has a structure in which a first electrode layer (3), a thin film semiconductor layer (4) and a second electrode layer (5) are sequentially stacked from the supporting substrate (1) side. The first electrode layer (3) is tin oxide (SnO 2 ).
The semiconductor layer (4) is made of a translucent material such as indium tin oxide (In 2 O 3 —SnO 2 ), and the semiconductor layer (4) is a P-type layer in the plane direction,
The second electrode layer (5) is formed of amorphous silicon of a submicron to micron order having a PIN junction in which an I-type layer and an N-type layer are superposed, and the second electrode layer (5) is a metal such as aluminum which makes ohmic contact with the amorphous silicon. Made of.
従って、上記支持基板(1)並びに第１電極層(3)を透過し
て光が光半導体層(4)に照射せしめられると、上記両電
極(3)(5)間に光起電力が生起せしめられる。Therefore, when light is irradiated onto the optical semiconductor layer (4) through the supporting substrate (1) and the first electrode layer (3), a photoelectromotive force is generated between the electrodes (3) and (5). Be punished.
(6)は上記支持基板(1)の他方の主面に透光性の接着剤
(7)を介して被着せしめられた例えば特定の波長帯域の
みの光を透過せしめる帯域透過型の光学フィルタで、よ
り具体的にはゼラチン等の有機物質を赤、緑若しくは青
等に青色せしめた有色フィルタである。斯る有色の光学
フィルタ(6)としては例えばイーストマン・コダック社
のWrattengelatin filterが市販されており、赤色フィ
ルタとしてはそのＮｏ．25、緑色フィルタとしはＮｏ．
58、また青色フィルタとしてはＮｏ．47Ｂの各品番のも
のが使用される。(6) is a translucent adhesive on the other main surface of the supporting substrate (1)
For example, it is a band-pass type optical filter that transmits light of only a specific wavelength band deposited through (7), more specifically, an organic substance such as gelatin is blue, red, green or blue. It is a colored filter. As such a colored optical filter (6), for example, a Wrattengelatin filter manufactured by Eastman Kodak Company is commercially available, and as a red filter, the No. No. 25 for the green filter
No. 58 as a blue filter. 47B each part number is used.
この様に支持基板(1)の光入射面に光学フィルタ(6)を配
置することによって斯るフィルタ特性に応じた特定波長
の光が感光領域(2)に照射せしめられる。By arranging the optical filter (6) on the light incident surface of the support substrate (1) in this manner, light having a specific wavelength corresponding to the filter characteristic is irradiated onto the photosensitive region (2).
尚、第１図に於いて、(8)(8)は光照射により発生した光
起電力を外部に導出する一対のリード体で、上記第１電
極層(3)並びに第２電極層(5)と電気的且つ機械的に結合
されている。更に、(9)は上記リード体(8)(8)並びに感
光領域(2)をモールドするエポキシ系の着色モールド体
である。In FIG. 1, (8) and (8) are a pair of lead bodies that lead out the photoelectromotive force generated by light irradiation to the outside, and are the first electrode layer (3) and the second electrode layer (5). ) Electrically and mechanically. Further, (9) is an epoxy-based colored mold body for molding the lead bodies (8), (8) and the photosensitive area (2).
然し乍ら、斯る構造の感光装置は構成に欠くことのでき
ない支持基板(1)によって光学フィルタ(6)の支持をも兼
用せしめることができる反面、光学フィルタ(6)が光入
射面に露出するために傷付き易く、この傷により光学フ
ィルタ(6)透過後の入射光が散乱する危惧を有してい
た。特に第２図の如く光学フィルタ(6)として上記赤、
緑及び青各色フィルタ(6R)(6G)(6B)を並置すると共に、
各色フィルタ(6R)(6G)(6B)に対向して３個の感光領域(2
R)(2G)(2B)を配置した所謂フルカラーセンサに於いて、
入射光の散乱が発生すると、該散乱により隣接せる感光
領域(2R)(2G)、(2R)(2B)、(2G)(2B)に到達してはならな
い光が到達する結果、クロストークを生ぜしめ色識別感
度の低下をもたらしたり、中間色等では誤識別する事故
を招く。However, in the photosensitive device having such a structure, the supporting substrate (1) which is indispensable for the structure can be used also as the support of the optical filter (6), while the optical filter (6) is exposed to the light incident surface. There was a risk that the incident light after passing through the optical filter (6) would be scattered due to being easily scratched. In particular, as shown in FIG. 2, the above red as the optical filter (6),
Along with juxtaposing the green and blue color filters (6R) (6G) (6B),
Opposite the filters (6R) (6G) (6B) of each color, three photosensitive areas (2
In a so-called full color sensor in which R) (2G) (2B) is arranged,
When the scattering of incident light occurs, the light that should not reach the photosensitive areas (2R) (2G), (2R) (2B), (2G) (2B) adjacent to each other due to the scattering arrives, and as a result, crosstalk occurs. This may result in a decrease in the sensitivity of the natural color identification, and an accidental identification in the case of intermediate colors.
また、上記傷が深くなると、光学フィルタ(6)により規
制された波長帯域以外の光（ホワイト光）が透過し、Ｓ
／Ｎ比を劣化せしめる原因となる。When the scratch becomes deeper, light (white light) other than the wavelength band regulated by the optical filter (6) is transmitted, and S
This causes deterioration of the / N ratio.
斯るホワイト光は、上記の光学フィルタ(6)の傷の他
に、支持基板(1)の側面から感光領域(2)に到達すること
もあり、色識別感度の他の低下原因となっている。Such white light may reach the photosensitive area (2) from the side surface of the supporting substrate (1) in addition to the scratches on the optical filter (6), which causes another decrease in the color identification sensitivity. There is.
更に、光学フィルタ(6)として安価な有機物質のフィル
タを使用すると、該有機フィルタは高価なガラスフィル
タ等に較べ表面硬度が低いために、上記光散乱及びＳ／
Ｎ比の劣化の原因となる傷が付く確率が高いのみなら
ず、信頼性の点についても問題を含んでいる。即ち、有
機フィルタは耐湿性に欠け湿気により波打ったり一方向
に反ったり、遂には剥離したりすることがあると共に、
光学的な特性をも変動する欠点を有している。Furthermore, when an inexpensive organic material filter is used as the optical filter (6), the surface hardness of the organic filter is lower than that of an expensive glass filter or the like.
Not only is there a high probability of scratches that cause deterioration of the N ratio, but there is also a problem in terms of reliability. That is, the organic filter lacks moisture resistance and may be wavy or warped in one direction due to moisture, and may eventually peel off,
It has a drawback that the optical characteristics also change.
（ハ） 発明の目的 本発明は斯る点に鑑みて為されたものであって、その目
的には、主にクロストーク若しくは感度の低下をもたら
す入射光の散乱及び又はＳ／Ｎ比の劣化を抑圧すること
にある。更に本発明の他の目的は、光学フィルタとして
安価な有機物質から成るフィルタを、信頼性に関する問
題点をも同時に解消せしめた状態で使用可能ならしめる
ことにある。(C) Object of the invention The present invention has been made in view of the above problems, and its purpose is mainly to scatter incident light and / or to deteriorate the S / N ratio, which causes crosstalk or a decrease in sensitivity. To suppress. Still another object of the present invention is to make it possible to use a filter made of an inexpensive organic material as an optical filter in a state in which a problem concerning reliability is also solved at the same time.
（ニ） 発明の構成 本発明は、薄膜状光半導体層を含む感光領域を一方の主
面に支持する透光性の支持基板と、該支持基板の他方の
主面に設けられ上記感光領域と対向する光学フィルタ
と、該光学フィルタの光入射面を覆い受光面を形成する
透光性の受光基板と、上記支持基板の側面と上記感光領
域の背面と上記受光基板の側面または背面の一部と連な
って覆う着色のモールド体と、を備えることを特徴とす
る。(D) Structure of the Invention The present invention relates to a light-transmissive support substrate that supports a photosensitive region including a thin-film optical semiconductor layer on one main surface, and the above-described photosensitive region provided on the other main surface of the support substrate. Opposing optical filters, a translucent light-receiving substrate that covers the light-incident surface of the optical filter to form a light-receiving surface, a side surface of the support substrate, a back surface of the photosensitive region, and a side surface or a part of a back surface of the light-receiving substrate. And a colored mold body which is continuously covered with the colored mold body.
（ホ） 実施例 第３図は本発明の一実施例を示し第１図の従来例と同じ
ものについては同番号が付してあり、(1)は透光性の支
持基板、(2)は感光領域、(3)は第１電極層、(4)はアモ
ルファス半導体等の薄膜状光半導体層、(5)は第２電極
層、(6)は例えば赤、緑若しくは青等に着色せしめられ
た有機物質から成る帯域透過型の光学フィルタ、(7)は
透光性の接着剤、(8)(8)はリード体、(9)はモールド体
で、異なるところは新たに上記光学フィルタ(6)の露出
せる光入射面を覆い受光面を形成する透光性の受光基板
(10)を設けたところと、着色のモールド体(9)が感光領
域(2)の背面に加えて、透光性の支持基板(1)の側面と上
記受光基板(10)の背面の一部をも被覆するようにしたと
ころにある。即ち、上記受光基板(10)はガラス、プラス
チック等の透光性材料から成り、上記光学フィルタ(6)
の光入射面に対し透光性の接着剤(11)を介して被着せし
められ、光学フィルタ(6)の露出せる光入射面を外気か
ら遮断する如く被覆する。(E) Embodiment FIG. 3 shows an embodiment of the present invention and the same parts as those in the conventional example of FIG. 1 are designated by the same reference numerals, (1) is a translucent support substrate, and (2) Is a photosensitive area, (3) is a first electrode layer, (4) is a thin-film optical semiconductor layer such as an amorphous semiconductor, (5) is a second electrode layer, and (6) is, for example, colored in red, green or blue. Band-pass type optical filter made of organic material, (7) is a translucent adhesive, (8) and (8) are lead bodies, and (9) is a molded body. Translucent light-receiving substrate that covers the light-incident surface of (6) and forms the light-receiving surface
(10) is provided, and the colored mold body (9) is provided on one side of the transparent support substrate (1) and one side of the back surface of the light receiving substrate (10) in addition to the back surface of the photosensitive region (2). This is where the part is also covered. That is, the light receiving substrate (10) is made of a translucent material such as glass or plastic, and the optical filter (6)
The light-incident surface of the optical filter (6) is adhered via a translucent adhesive (11), and the exposed light-incident surface of the optical filter (6) is covered so as to be shielded from the outside air.
一方、着色モールド体(9)は透光性の支持基板(1)の側面
をも被覆すべく、受光基板(10)が支持基板(1)の側面か
ら突出する突出部(10a)を備えている。斯る支持基板(1)
の側面被覆構造により、当該側面から入射せんとするホ
ワイト光の遮光が施される。また、上記突出部(10a)の
存在により、モールド体(9)と、感光領域(2)、支持基板
(1)及び受光基板(10)を主体とする被モールド体との接
触面積の増大が図れ、強固なモールド構造が得られる。
斯る突出長ｄの具体例としては、基板サイズにより大き
く変動するが、0.1mm〜10mm程度が適当であり、例えば
第３図の構造に於いて、支持基板（１）として6mm×6mm
の正方形状のガラス基板を用いた場合、8mm×8mmの正方
形状ガラス基板から成る受光基板(10)が使用に供せら
れ、従ってこの実施例に於ける突出長ｄは1mmである。On the other hand, the colored mold body (9) is provided with a protruding portion (10a) protruding from the side surface of the supporting substrate (1) so that the light receiving substrate (10) also covers the side surface of the translucent supporting substrate (1). There is. Such a supporting substrate (1)
With the side surface covering structure, the white light that is incident on the side surface is shielded. Further, due to the presence of the protrusion (10a), the mold body (9), the photosensitive region (2), the support substrate
It is possible to increase the contact area with the object to be molded mainly composed of (1) and the light receiving substrate (10), and to obtain a strong mold structure.
As a specific example of such a protrusion length d, although it largely varies depending on the substrate size, about 0.1 mm to 10 mm is suitable. For example, in the structure of FIG. 3, the supporting substrate (1) is 6 mm × 6 mm.
When the square glass substrate is used, the light receiving substrate 10 made of a 8 mm × 8 mm square glass substrate is used, and therefore the protrusion length d in this embodiment is 1 mm.
尚、上記両基板(1)(10)の肉厚はともに0.4mmであった。The thickness of both substrates (1) and (10) was 0.4 mm.
第４図は本発明の他の実施例を示し、第３図の実施例と
は、支持基板(1)と受光基板(10)の大きさ関係が逆転し
たところが相違する。即ち、この実施例にあっては、支
持基板(1)の方が大きい構成にあり、受光基板(10)の側
面から突出する突出部(1a)を有している。そして、着色
モールド体(9)は支持基板(1)の側面のみならず、受光基
板(10)の側面をも覆っている。FIG. 4 shows another embodiment of the present invention, which is different from the embodiment of FIG. 3 in that the size relationship between the supporting substrate (1) and the light receiving substrate (10) is reversed. That is, in this embodiment, the support substrate (1) is larger in size, and has the protruding portion (1a) protruding from the side surface of the light receiving substrate (10). The colored mold body (9) covers not only the side surface of the support substrate (1) but also the side surface of the light receiving substrate (10).
本実施例においても、着色モールド体(9)を感光領域(2)
の背面から受光基板(10)の側面にまで連なって覆ってい
ることから、受光基板(10)、感光領域(2)そして支持基
板(1)を主体とする被モールド体を強固なモールド構造
とすることが可能となる。Also in this embodiment, the colored mold body (9) is provided with a photosensitive area (2).
Since it covers from the back surface of the light receiving substrate to the side surface of the light receiving substrate (10) continuously, the molded body mainly composed of the light receiving substrate (10), the photosensitive area (2) and the supporting substrate (1) has a strong mold structure. It becomes possible to do.
（ヘ） 発明の効果 本発明は以上の説明から明らかな如く、光学フィルタの
光入射面を透光性の受光基板で覆ったので、該光学フィ
ルタを支持基板と相俟って露出せしめることなく外気か
ら遮断せしめることができ、フィルタが傷付くことを防
止し得、仮に受光基板が傷付いたとしてもそれが光学フ
ィルタに悪影響を与えるものではなく、無視し得る程度
の光散乱が発生するだけであり、従って光学フィルタを
透過する光は散逸せず、Ｓ／Ｎ比の劣化を抑圧せしめる
ことができる。(F) Effect of the Invention As is apparent from the above description, the present invention covers the light incident surface of the optical filter with the light-transmissive light-receiving substrate, so that the optical filter is not exposed in combination with the supporting substrate. It can be blocked from the outside air, can prevent the filter from being damaged, and even if the light-receiving substrate is damaged, it does not adversely affect the optical filter and only causes negligible light scattering. Therefore, the light transmitted through the optical filter is not dissipated, and the deterioration of the S / N ratio can be suppressed.
更に斯るＳ／Ｎ比の劣化は、着色モールド体が支持基板
の側面をも覆うことによって、側面からのホワイト光の
入射を遮断し得る結果、より一層低減でき、色識別感度
の向上が図れる。Further, the deterioration of the S / N ratio can be further reduced by covering the side surface of the supporting substrate with the colored mold body, and as a result, the white light can be blocked from the side surface, and the color discrimination sensitivity can be improved. .
また、その着色モールド体が感光領域の背面と支持基板
の側面と受光基板の側面または背面の一部とに連なって
覆うことにより、そのモールド構造を強固なものとする
ことができる。Further, by covering the back surface of the photosensitive region, the side surface of the support substrate, and a part of the side surface or the back surface of the light receiving substrate with the colored mold body, the mold structure can be strengthened.
しかも、光学フィルタを外気から遮断せしめることがで
きるので、機械的強度及び耐湿性に欠ける安価な有機物
質から成るフィルタを使用するにも拘らず高信頼性を実
現することができる。Moreover, since the optical filter can be shielded from the outside air, high reliability can be realized despite using a filter made of an inexpensive organic material lacking mechanical strength and moisture resistance.
第１図は従来例の断面図、第２図は他の従来例の断面
図、第３図は本発明の一実施例の断面図、第４図は本発
明の他の実施例断面図、を夫々示している。 (1)…支持基板、(2)…感光領域、 (4)…薄膜状光半導体層、 (6)…光学フィルタ、(10)…受光基板、 (12)…凹部。FIG. 1 is a sectional view of a conventional example, FIG. 2 is a sectional view of another conventional example, FIG. 3 is a sectional view of one embodiment of the present invention, and FIG. 4 is a sectional view of another embodiment of the present invention. Are shown respectively. (1) ... Support substrate, (2) ... Photosensitive area, (4) ... Thin film optical semiconductor layer, (6) ... Optical filter, (10) ... Light receiving substrate, (12) ... Recessed portion.
フロントページの続き (72)発明者 中島 三郎 大阪府守口市京阪本通２丁目18番地 三洋 電機株式会社内 (72)発明者 中山 正一郎 大阪府守口市京阪本通２丁目18番地 三洋 電機株式会社内 (72)発明者 八木 啓吏 大阪府守口市京阪本通２丁目18番地 三洋 電機株式会社内 (72)発明者 中野 昭一 大阪府守口市京阪本通２丁目18番地 三洋 電機株式会社内 (72)発明者 桑野 幸徳 大阪府守口市京阪本通２丁目18番地 三洋 電機株式会社内 (56)参考文献 特公 昭48−22033（ＪＰ，Ｂ１) 特公 昭53−26797（ＪＰ，Ｂ２)Front page continued (72) Inventor Saburo Nakajima 2-18 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Inventor Shoichiro Nakayama 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Keiki Yagi 2-18, Keihan Hon-dori, Moriguchi-shi, Osaka, Sanyo Electric Co., Ltd. (72) Inventor Shoichi Nakano 2--18, Keihan Hon-dori, Moriguchi, Osaka (72) Inventor Yukinori Kuwano 2-18-18 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (56) References Japanese Patent Publication No. 48-22033 (JP, B1) Japanese Patent Publication No. 53-26797 (JP, B2)
Claims (4)
面に支持する透光性の支持基板、該支持基板の他方の主
面に設けられ上記感光領域と対向する光学フィルタ、該
光学フィルタの光入射面を覆い受光面を形成する透光性
の受光基板、上記支持基板の側面と上記感光領域の背面
と上記受光基板の側面または背面の一部とを連なって覆
う着色のモールド体、を備えることを特徴とする感光装
置。1. A translucent support substrate for supporting a photosensitive region including a thin-film semiconductor layer on one main surface, an optical filter provided on the other main surface of the support substrate and facing the photosensitive region, and the optical element. A light-transmitting light-receiving substrate that covers the light-incident surface of the filter and forms a light-receiving surface, a colored molded body that covers the side surface of the support substrate, the back surface of the photosensitive region, and the side surface or part of the back surface of the light-receiving substrate in a continuous manner. And a photosensitive device.
を特徴とした特許請求の範囲第１項記載の感光装置。2. The photosensitive device according to claim 1, wherein the optical filter is made of an organic material.
体を主体とすることを特徴とした特許請求の範囲第１項
若しくは第２項記載の感光装置。3. The photosensitive device according to claim 1, wherein the thin-film optical semiconductor layer is mainly composed of an amorphous semiconductor.
することを特徴とした特許請求の範囲第１項乃至第３項
何れか記載の感光装置。4. The photosensitive device according to claim 1, wherein the supporting substrate and the light receiving substrate have different sizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58022534A JPH065760B2 (en) | 1983-02-14 | 1983-02-14 | Sensitive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58022534A JPH065760B2 (en) | 1983-02-14 | 1983-02-14 | Sensitive device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59148372A JPS59148372A (en) | 1984-08-25 |
| JPH065760B2 true JPH065760B2 (en) | 1994-01-19 |
Family
ID=12085462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58022534A Expired - Lifetime JPH065760B2 (en) | 1983-02-14 | 1983-02-14 | Sensitive device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065760B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755666A (en) * | 1986-06-16 | 1988-07-05 | Sanyo Electric Co., Ltd. | Photosensor frame |
| DE3782201T2 (en) * | 1986-07-16 | 1993-04-15 | Canon Kk | SEMICONDUCTOR PHOTOSENSOR AND METHOD FOR THE PRODUCTION THEREOF. |
| JPH0351855U (en) * | 1989-09-26 | 1991-05-20 | ||
| JPH0385664U (en) * | 1989-12-22 | 1991-08-29 | ||
| JP5317712B2 (en) | 2008-01-22 | 2013-10-16 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method of semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822158Y2 (en) * | 1976-07-07 | 1983-05-11 | シチズン時計株式会社 | solar battery clock |
| JPS5822158U (en) * | 1981-08-06 | 1983-02-10 | ヤマハ株式会社 | badminton racket frame |
-
1983
- 1983-02-14 JP JP58022534A patent/JPH065760B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59148372A (en) | 1984-08-25 |
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