JPS58125867A - Color sensor - Google Patents
Color sensorInfo
- Publication number
- JPS58125867A JPS58125867A JP57009199A JP919982A JPS58125867A JP S58125867 A JPS58125867 A JP S58125867A JP 57009199 A JP57009199 A JP 57009199A JP 919982 A JP919982 A JP 919982A JP S58125867 A JPS58125867 A JP S58125867A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- substrate
- face
- color
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims abstract description 14
- 206010034972 Photosensitivity reaction Diseases 0.000 claims abstract description 11
- 230000036211 photosensitivity Effects 0.000 claims abstract description 11
- 239000010409 thin film Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001887 tin oxide Inorganic materials 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000002238 attenuated effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Light Receiving Elements (AREA)
- Spectrometry And Color Measurement (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はアモルファス半導体を光活性層に用いた色セン
サーに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a color sensor using an amorphous semiconductor as a photoactive layer.
光活性層に単結晶シリコンを用いた色センサーは既に知
られている。その原理的な構成は、第1図に示す如く、
単結晶シリコン基板(1)表面に複数のフォトダイオー
ドflL域(2)、(3)、(4)を設けると共に、こ
れら各領域上に興なる色フィルタ、例えば赤色フィルタ
(5)、緑色フィルタ(6)及び青色フィルタ(7)を
配し、更にその上に赤外カットフィルタ(8)を配した
もので、祈るセンサーにおいて、各フィルタを介して可
視光が基板(11に入射すると、入射可視光の含む色に
応じて、それが赤ならダイオード領域+21に、縁なら
ダイオード領域(3)に、文責ならダイオード領域(4
)に夫々信号が出力される。Color sensors using single crystal silicon for the photoactive layer are already known. Its basic configuration is as shown in Figure 1.
A plurality of photodiode flL regions (2), (3), and (4) are provided on the surface of the single crystal silicon substrate (1), and color filters such as a red filter (5) and a green filter (5) are formed on each of these regions. 6) and a blue filter (7), and an infrared cut filter (8) is placed on top of it.In the prayer sensor, when visible light enters the substrate (11) through each filter, the incident visible light is Depending on the color of the light, if it is red, it is placed in the diode area +21, if it is on the edge, it is placed in the diode area (3), and if it is written, it is placed in the diode area (4).
) signals are output respectively.
単結晶シリコン自体の感光度特性は第2図の曲IAK示
す如く、赤外領域にピークを呈するっ一方、赤色フィル
タ(5)は赤色帯域で透過炭のピークを示すものの、そ
の帯域特性の拡がりは通常減衰しながらも赤外領域にま
です七舒を引いている。The photosensitivity characteristics of single-crystal silicon itself exhibit a peak in the infrared region, as shown by the curve IAK in Figure 2, while the red filter (5) exhibits a transparent peak in the red band, but its band characteristics are broadened. is normally attenuated even into the infrared region.
従って光活性層に単結晶シリコンを用い九場合、赤色フ
ィルタを通すだけでは、フォトダイオード領* (21
は、減衰しながらも共に入射する赤外光に、単結晶シリ
コン自体の感光度特性に応じて強く感応してしまい、正
確な色情報を検出できない。上記従来の色センサーにお
ける赤外カットフィルタ(8)は、この様な入射赤外光
を除去するために設けられており、不可欠の存在である
っ
しかしながら、祈る赤外カットフィルタの存在はセンサ
ーの構成を複雑にするだけでなく、製造被着する工程で
脆弱なシリコン基板を破−しやすいといった欠点をもた
らすっ
本発明は上記の点に艦みてなされたもので、以下本発明
を実施例において説明する。Therefore, when using single-crystal silicon for the photoactive layer, simply passing it through a red filter will not allow the photodiode region* (21
is strongly sensitive to attenuated but incident infrared light, depending on the photosensitivity characteristics of the single crystal silicon itself, making it impossible to detect accurate color information. The infrared cut filter (8) in the above-mentioned conventional color sensor is provided to remove such incident infrared light, and is indispensable. The present invention has been made in view of the above points, and the present invention will be described below with reference to embodiments. explain.
第6図に本実施例としての赤、縁、青の各色に感応する
色センサーQlを示す。この色センサー(11け厚さ0
.3雪程度のガラスやプラスチックスなどからなる透光
性基板11)K設けられ走路1、第2、第5の薄膜状感
光素子(12R)、(12G)、(12B)を含む。こ
れらの各感光素子は基板aυの1主面に設けられた各素
子に個有の色フィルタ膜、即ち、第1感光素子(12R
)Kは赤色フィルタ膜(13R)、第2感光素子(12
G)には緑色フィルタII(13G)、第5感光素子(
12B)には青色フィルタ[1(15B)を有している
。各フィルタ膜としてはイーストマン・コダック社製の
WRATTEN GELATEN FILTERが好適
であり、赤色フィルタ膜(15R)としてはそのム25
、緑色フィルタ膜(13G)としてはム58、又青色フ
ィルタl1l(15B)としてはム47Bの各品番のも
のが用いられ、これらは例えばカナグパルサンなどの透
明樹脂接着材により基板Ql)上に固着される。FIG. 6 shows a color sensor Ql sensitive to red, edge, and blue colors according to this embodiment. This color sensor (11 digits thickness 0
.. A light-transmitting substrate 11)K made of glass, plastic, or the like is provided and includes a running path 1, a second, and a fifth thin-film photosensitive elements (12R), (12G), and (12B). Each of these photosensitive elements has its own color filter film provided on one main surface of the substrate aυ, that is, the first photosensitive element (12R
) K is the red filter film (13R), the second photosensitive element (12
G) includes a green filter II (13G) and a fifth photosensitive element (
12B) has a blue filter [1 (15B). As each filter membrane, WRATTEN GELATEN FILTER manufactured by Eastman Kodak is suitable, and as the red filter membrane (15R), WRATTEN GELATEN FILTER manufactured by Eastman Kodak Company is suitable.
, M58 is used as the green filter film (13G), and M47B is used as the blue filter l1l (15B), and these are fixed onto the substrate Ql) with a transparent resin adhesive such as Kanagpalsan. Ru.
第1〜第5感光素子(12R)、(12G)、(12B
)の夫々は、更に基板αυの他の主面に設けられた第1
電極膜I、光活性層αe及び第2電極膜翰の積層体を備
えており、これら積層体は夫々の感光素子のフィルタ膜
と個別に対向している。1st to 5th photosensitive elements (12R), (12G), (12B
) are further provided on the other main surface of the substrate αυ.
It includes a laminate of an electrode film I, a photoactive layer αe, and a second electrode film, and these laminates individually face the filter films of the respective photosensitive elements.
上記第1電極暎α養は峻化錫やインジウム・錫酸化物な
どの透明導電物からなり、第2電極@QE9はアルミニ
クムなどからなる。The first electrode layer is made of a transparent conductive material such as diluted tin or indium/tin oxide, and the second electrode @QE9 is made of aluminum or the like.
上記光活性層α9は厚さ約1μmのアモルファスシリコ
ン半導体で構成され、第4図にその詳細が示されている
。これを製造方法と共により具体的に説明すると、各素
子(12R)、(12G)(12B)の第1電極Iのみ
を形成済みの基板Uυを反応室に納め、シクンガスや不
純物ガスからなる雰囲気中でのグロー放電により第1電
極Q41上にアモルファスシリコンからなるP型層(1
5m)、夏型層(15b)及びN型層(15c)を順次
堆積して光活性層a→が形成される。その堆積S域はマ
スクの使用により所定部分に限定し得るものである。尚
、グロー放電によるアモルファスシリコンダイオードの
形成自体は持分vB53−57718号公報に開示され
ている様に@知である。The photoactive layer α9 is made of an amorphous silicon semiconductor with a thickness of about 1 μm, and its details are shown in FIG. To explain this in more detail along with the manufacturing method, the substrate Uυ on which only the first electrode I of each element (12R), (12G) and (12B) has been formed is placed in a reaction chamber, and placed in an atmosphere consisting of sulfur gas and impurity gas. A P-type layer (1) made of amorphous silicon is formed on the first electrode Q41 by glow discharge at
5m), a summer type layer (15b) and an N type layer (15c) are sequentially deposited to form a photoactive layer a→. The deposition S area can be limited to a predetermined portion by using a mask. Incidentally, the formation of an amorphous silicon diode by glow discharge itself is well known, as disclosed in Japanese Patent No. vB53-57718.
上記色センサーQlにおいて、各色フィルタ(1SR)
、(13G)、(15B)の存在により、これらフィル
タ側より入射する光は、それが赤色を含む場合、赤色フ
ィルタ(11)及び基板aυを介して第1感光素子(1
2R)K入り、該素子内の主Kl型層(15b)で自由
キャリアを発生せしめる。この自由キャリアは第1、第
2電極Q尋、(lfeK集められ、両電極間に電圧が発
生する。同様にして、入射光が緑色を含む場合、又青色
を含む場合、夫々第2感光素子(12G)、第3感光素
子(12B)において第1、第2電極a◆、Qfe間に
電圧が発生する。よってこれらの電圧を検出することに
より入射光の色検出をなすことができる。In the above color sensor Ql, each color filter (1SR)
, (13G), and (15B), if the light incident from these filters includes red color, it passes through the red filter (11) and the substrate aυ to the first photosensitive element (1
2R) K enters and generates free carriers in the main Kl type layer (15b) within the device. These free carriers are collected at the first and second electrodes (lfeK), and a voltage is generated between the two electrodes.Similarly, when the incident light contains green color and blue color, the second photosensitive element (12G), a voltage is generated between the first and second electrodes a◆ and Qfe in the third photosensitive element (12B).Therefore, by detecting these voltages, the color of the incident light can be detected.
アモルファス半導体の感光度特性は第2図の曲線Bに示
す如く、はとんど可視光@域に納まる帯域を有料ている
。このため、本実施例色センサー員では、たとえ赤色フ
ィルタ(15R)を通して赤外光が入り九としても、そ
れはほとんど検出されず、従って従来必要としていた赤
外力ットフイルりを用いることなく正確な色情報を検出
することができる。又、本実施例色センサーQlにあっ
ては、各色フィルタ(15R)、(15G)(13B)
は光活性層a9とけ反対側の基板表面に取着されるので
、その取着時に光活性層Q9を傷めることもない。As shown by curve B in FIG. 2, the photosensitivity characteristics of amorphous semiconductors mostly fall within the visible light region. For this reason, in the color sensor of this embodiment, even if infrared light enters through the red filter (15R), it is hardly detected, and therefore accurate color information can be obtained without using the conventional infrared filter. can be detected. Moreover, in the color sensor Ql of this embodiment, each color filter (15R), (15G) (13B)
Since it is attached to the surface of the substrate opposite to the photoactive layer a9, the photoactive layer Q9 will not be damaged during attachment.
本発明実施例はこの様な優れた色センサー(lIにおい
て、その色検出精度をより高めんとするものである。即
ち、アモルファス半導体の感光度特性はIN2図で述べ
た様に可視光aXに帯域が納まっているものの、それは
平坦でなく図示の如く約550nm付近にピークを有し
ているっ又各色フィルタ膜(13R)、(13G)、(
15B)の透過度も第5図にて曲線(17R)、(17
G)、(17B)で示す如く同一ではなく、特に赤色フ
ィルタ膜(15R)のそれが最も大きい。このため第1
〜第38光素子((12R)、(12G)、(12B)
の感光度も相違し、同一人射光強度であっても夫々異な
る検出出力を発生することとなる。The embodiment of the present invention aims to further improve the color detection accuracy of such an excellent color sensor (lI).In other words, the photosensitivity characteristics of the amorphous semiconductor are similar to the visible light aX as described in Figure IN2. Although the band is within the range, it is not flat and has a peak around 550 nm as shown in the figure.
The transmittance of curves (17R) and (17B) are also shown in Figure 5.
As shown in G) and (17B), they are not the same, and in particular, that of the red filter film (15R) is the largest. For this reason, the first
~38th optical element ((12R), (12G), (12B)
The photosensitivity is also different, and even if the intensity of human radiation is the same, different detection outputs will be generated.
本発明実施例の最も大きな特徴として、各素子(12R
)(12G)(12B)の受光面積がこの様な各素子の
光感度に対応して興なっており、最も感光度の大きい素
子の受光面積が最も小さくなっている。より具体的には
、第1、第2、@3の感光素子(12k)、(12G)
、(12B) の受光面積の比は約t9:2:2.9
の割合いに設定されており、これによ抄各素子の感光度
(出力電圧/入射光強度)ははソ同一となり、良好な精
度で色検出がなされる。The most significant feature of the embodiments of the present invention is that each element (12R
)(12G)(12B) increases in accordance with the photosensitivity of each element, and the element with the highest photosensitivity has the smallest light receiving area. More specifically, the first, second, @3 photosensitive elements (12k), (12G)
, (12B) The ratio of the light receiving area is approximately t9:2:2.9
As a result, the photosensitivity (output voltage/incident light intensity) of each element becomes the same, and color detection is performed with good accuracy.
上記実施例では、各素子(12R)、<12G)、(1
2B) の光活性層Q5はPIN接合を含む光起電力
型であつ九が、例えば約5μm厚さの!型のアモルファ
スシリコンのみで形成して光導電型の光活性層に変更す
ることもできる。この場合、第6図に示す如く、光活性
層aつの表面に1対の電極(16m)、(16b)を被
着する構成でも良い。In the above embodiment, each element (12R), <12G), (1
2B) The photoactive layer Q5 is of the photovoltaic type, including a PIN junction, and is, for example, approximately 5 μm thick! It is also possible to form only amorphous silicon and change it to a photoconductive type photoactive layer. In this case, as shown in FIG. 6, a pair of electrodes (16m) and (16b) may be attached to the surface of one photoactive layer.
又、上記実施例では、光活性層0$と第1、第2電極$
04)、 (+6)は何れも各素子毎に分離されている
が、光活性層Q!19を分離することなく各素子(12
R)、(12G)、(12B)に連続して設けることも
でき、及びあるいけ、第1電極@I又は第2電極膜舖の
何れか一方をやけり分離することなく各素子に連続して
設けることもできるっ尚、アモルファス半導体からなる
光活性層α!9Viその厚さが極めて小さいので、上記
の如く各素子に連続して設けられても、各素子間のタロ
ストークはほとんどない。In addition, in the above embodiment, the photoactive layer is $0 and the first and second electrodes are $0.
04) and (+6) are both separated for each element, but the photoactive layer Q! Each element (12
R), (12G), and (12B), or alternatively, either the first electrode @I or the second electrode film can be provided continuously to each element without having to be separated. It is also possible to provide a photoactive layer α made of an amorphous semiconductor! Since the thickness of 9Vi is extremely small, there is almost no talostoke between each element even if it is successively provided in each element as described above.
又、上記実施例の光活性層(1鴫に用いたアモルファス
シリコンに代えて、アモルファスシリコンカニバイトな
ど他のものをも使用し得、更には1部に多結晶や微結晶
を混入するととも可能である。In addition, instead of the amorphous silicon used in the photoactive layer (1) of the above embodiment, other materials such as amorphous silicon cannibale may be used, and it is also possible to mix polycrystals or microcrystals into a part of the photoactive layer. It is.
又、盛会に応じて感光素子の数を適宜増減し得る。Also, the number of photosensitive elements can be increased or decreased as appropriate depending on the number of events.
以上の説明より明らかな如く、本発明によれば、赤外カ
ットフィルタを不要にし、その他の色フィルタの取着の
簡単な色センサーを実現でき、又その色検出精度を高め
ることができる。As is clear from the above description, according to the present invention, it is possible to realize a color sensor that does not require an infrared cut filter, to which other color filters can be easily attached, and to improve its color detection accuracy.
第1図は従来例を示す断面図、第2図は感光特性図、第
3図Aは本発明実施例の平面図、第3図BijlilB
−Blllrljl、第s図ch同C−C[m図、第4
図社番部拡大断面図、gI!15図は透過特性図、第6
図は他の実施例の要部断面図である。
on−atii、(12A)、(12B )、(12C
)−41、第2、第3感光素子、αか・・光活性層。
第1図
第2図
涙&(rL判Fig. 1 is a sectional view showing a conventional example, Fig. 2 is a photosensitive characteristic diagram, Fig. 3 A is a plan view of an embodiment of the present invention, Fig. 3 BijlilB
-Blllrljl, Figure s ch Same C-C [Figure m, 4th
Enlarged sectional view of the company number, gI! Figure 15 is a transmission characteristic diagram, No. 6
The figure is a sectional view of a main part of another embodiment. on-atii, (12A), (12B), (12C
)-41, second and third photosensitive elements, α...photoactive layer. Figure 1 Figure 2 Tears & (rL size
Claims (1)
子を含み、該素子の各々は、上記基板の1主面に設けら
れた線素子に個有の色フィルタ膜と、上記基板の他の主
面に設けられ九アモルファス半導体を主体とす不光活性
層及び上記色フィルタ膜の各々と個別に対向する電極膜
の積層体とを備え、上記各素子の受光面積を各素子の光
感度に対応して興ならしめ九ことを特徴とする色センサ
ー。+11 A plurality of thin-film photosensitive elements provided on a light-transmitting substrate, each of which includes a color filter film unique to a line element provided on one main surface of the substrate, and a color filter film unique to the line element provided on one main surface of the substrate, and a color filter film unique to the line element provided on one main surface of the substrate, and A light-inactive layer provided on the main surface and mainly composed of an amorphous semiconductor, and a laminate of electrode films individually facing each of the color filter films, and the light-receiving area of each element corresponds to the photosensitivity of each element. A color sensor featuring nine features.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57009199A JPS58125867A (en) | 1982-01-22 | 1982-01-22 | Color sensor |
GB08300968A GB2115980B (en) | 1982-01-22 | 1983-01-14 | Color sensor |
FR8300882A FR2520557B1 (en) | 1982-01-22 | 1983-01-20 | CHROMATIC SENSOR |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57009199A JPS58125867A (en) | 1982-01-22 | 1982-01-22 | Color sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58125867A true JPS58125867A (en) | 1983-07-27 |
JPH0477471B2 JPH0477471B2 (en) | 1992-12-08 |
Family
ID=11713821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57009199A Granted JPS58125867A (en) | 1982-01-22 | 1982-01-22 | Color sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58125867A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63222473A (en) * | 1987-03-11 | 1988-09-16 | Matsushita Electronics Corp | Manufacture of semiconductor device |
JP2010261838A (en) * | 2009-05-08 | 2010-11-18 | Tyntek Corp | Output proportion adjusting method of optical sensor |
JP2011112452A (en) * | 2009-11-25 | 2011-06-09 | Olympus Corp | Color sensor |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846280A (en) * | 1971-10-05 | 1973-07-02 | ||
JPS53129525A (en) * | 1977-04-18 | 1978-11-11 | Matsushita Electric Ind Co Ltd | Solid pickup color camera |
JPS562784A (en) * | 1979-06-22 | 1981-01-13 | Nippon Telegr & Teleph Corp <Ntt> | Image pickup device |
JPS564286A (en) * | 1979-06-25 | 1981-01-17 | Canon Inc | Photoelectric converter |
JPS56103573A (en) * | 1980-01-22 | 1981-08-18 | Canon Inc | Color reading device |
JPS56135980A (en) * | 1980-03-28 | 1981-10-23 | Canon Inc | Photoelectric conversion element |
JPS56138362A (en) * | 1980-03-31 | 1981-10-28 | Canon Inc | Photoelectric converter |
-
1982
- 1982-01-22 JP JP57009199A patent/JPS58125867A/en active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846280A (en) * | 1971-10-05 | 1973-07-02 | ||
JPS53129525A (en) * | 1977-04-18 | 1978-11-11 | Matsushita Electric Ind Co Ltd | Solid pickup color camera |
JPS562784A (en) * | 1979-06-22 | 1981-01-13 | Nippon Telegr & Teleph Corp <Ntt> | Image pickup device |
JPS564286A (en) * | 1979-06-25 | 1981-01-17 | Canon Inc | Photoelectric converter |
JPS56103573A (en) * | 1980-01-22 | 1981-08-18 | Canon Inc | Color reading device |
JPS56135980A (en) * | 1980-03-28 | 1981-10-23 | Canon Inc | Photoelectric conversion element |
JPS56138362A (en) * | 1980-03-31 | 1981-10-28 | Canon Inc | Photoelectric converter |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63222473A (en) * | 1987-03-11 | 1988-09-16 | Matsushita Electronics Corp | Manufacture of semiconductor device |
JP2010261838A (en) * | 2009-05-08 | 2010-11-18 | Tyntek Corp | Output proportion adjusting method of optical sensor |
JP2011112452A (en) * | 2009-11-25 | 2011-06-09 | Olympus Corp | Color sensor |
US9055180B2 (en) | 2009-11-25 | 2015-06-09 | Olympus Corporation | Color sensor for accurately detecting color components |
Also Published As
Publication number | Publication date |
---|---|
JPH0477471B2 (en) | 1992-12-08 |
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