JPH065734A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To eliminate necessity of modifying signal wires after an integrated circuit package is mounted on a device board and providing a signal pad for an electric test on the board by exposing a signal pattern wire for connecting a semiconductor integrated circuit to outer leads on the surface of the package. CONSTITUTION:A signal wire of a semiconductor integrated circuit 2 placed on an integrated circuit package 1 is connected to a signal pattern wire 1 of the package 1. A signal pattern wire 11 is once output to a surface of the package 1 before it is connected to outer lead 10 to form a signal pad 12. The pad 12 is formed of an inner signal pad 21, an outer signal pad 20 and a connecting wire 22. When connection of a signal is altered after the package is mounted on a device board, the wire 22 is cut, and a signal wire may be newly connected from the pad 20 or 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit package mounting a semiconductor integrated circuit.

[0002]

2. Description of the Related Art In a conventional integrated circuit package 1, as shown in FIG. 2, a signal pattern line 11 connecting a semiconductor integrated circuit 2 and an external lead 10 passes through an inner layer of the integrated circuit package 1.

[0003]

In this conventional integrated circuit package, since the signal pattern line connecting the semiconductor integrated circuit and the external lead passes through the inner layer of the integrated circuit package, the integrated circuit package is The problem is that it is necessary to provide a dedicated signal pad on the device board in order to modify the signal line after mounting it on the device board or to apply voltage to the signal line for electrical testing, which impedes high-density mounting. was there.

[0004]

In the integrated circuit package of the present invention, the signal pattern line connecting between the semiconductor integrated circuit and the external lead is exposed on the surface of the integrated circuit package.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1A is a sectional view of an integrated circuit package according to an embodiment of the present invention. The signal line of the semiconductor integrated circuit 2 mounted on the integrated circuit package 1 is connected to the signal pattern line 11 of the integrated circuit package 1 by the bonding wire 3. The signal pattern line 11 passes through the inner layer of the integrated circuit package 1 and once comes out on the surface of the integrated circuit package 1 before being connected to the external lead 10.
Is formed.

The connection of the signal line between the semiconductor integrated circuit 2 and the integrated circuit package 1 does not necessarily have to be performed by the bonding wire 3.

Next, FIG. 1B shows an example of the structure of the signal pad 12 in the embodiment integrated circuit package 1 shown in FIG.

The signal pad 12 is an internal signal pad 21 connected to the semiconductor integrated circuit 2 via a signal pattern line 11.
And an external signal pad 20 connected to the external lead 10 of the integrated circuit package 1 via the signal pattern line 11, and a connection line 22 connecting the internal signal pad 21 and the external signal pad 20.

After the integrated circuit package of the present invention is mounted on the device substrate, modification is required. When changing the signal connection, the connection line 22 is cut and the external signal pad 20 is used.
Alternatively, a new signal line is connected from the internal signal pad 21.

Also, when an electrical test is carried out after mounting on the device substrate, it is possible to apply a signal from the outside through the external signal pad 20 or the internal signal pad 21 and observe the signal of the semiconductor integrated circuit. It is possible.

[0012]

As described above, according to the present invention, since the signal pattern line connecting the semiconductor integrated circuit and the external lead is exposed on the surface of the integrated circuit package, this integrated circuit package is mounted on the device substrate. The result is that it is not necessary to provide a signal pad for modifying the signal line after mounting and a signal pad for an electrical test on the device substrate, which enables high-density mounting.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Integrated Circuit Package 2 Semiconductor Integrated Circuit 3 Bonding Wire 10 External Lead 11 Signal Pattern Line 12 Signal Pad 20 External Signal Pad 21 Internal Signal Pad 22 Connection Line

Claims (2)

[Claims] 1. An integrated circuit package, wherein a signal pattern line connecting between a semiconductor integrated circuit and an external lead is exposed on a surface of the integrated circuit package. 2. The integrated circuit package according to claim 1, further comprising a signal pad on the surface of the integrated circuit package that enables disconnection and connection of the signal pattern line from the outside.