JPH05267370A - Manufacture of ic - Google Patents

Abstract

PURPOSE:To prevent contact between gold wires or between a gold wire and a frame with wire due to sagging of wire. CONSTITUTION:Prior to pouring resin 6, a chip 2, a gold wire 4, a frame 1 and a lead are covered by using an insulation film 11, which makes it possible to prevent contact between gold wires or contact between the gold wire 4 and the frame 1. It is also possible to protect a device from break-down due to sagging of wire by covering the chip 2, the gold wire 4, the frame 1 and the lead wire with the insulation film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC manufacturing method.

[0002]

2. Description of the Related Art FIG. 5 is a plan view showing a state before a molding resin is poured in a conventional IC, and FIG. 6 is a sectional view showing a state after the molding resin is poured. In the figure, 1 is a frame, 2 is a chip, 3 is a lead, 4 is a gold wire, 5 is a pad, and 6 is a molding resin.

Next, the operation will be described. Solder the chip 2 onto the frame 1 and connect the pad 5 and the lead 3 to the gold wire 4
After the connection was made with, the mold resin 6 was poured from a certain direction.

[0004]

The conventional IC assembly is as described above, and since the mold resin is poured from a certain direction, wire flow may occur, which may cause contact between gold wires and gold wires. The gold wire and the frame may come into contact with each other, causing a short circuit between Vcc and GND, which may damage the device.

The present invention has been made to solve the above problems, and an object thereof is to prevent contact between gold wires and contact between gold wires and a frame even if wire flow occurs.

[0006]

In the method of manufacturing an IC according to the present invention, the chip, the gold wire, the frame and the lead are covered with an insulating film before the molding resin is poured.

Further, in the method of manufacturing an IC according to the present invention, after the chip is soldered on the frame and before the wire bonding, the insulating film is placed on the frame.

[0008]

In the present invention, the chip, the gold wire, the frame, and the lead are covered with the insulating film before the molding resin is poured, so that the contact between the gold wire and the gold wire and the contact between the gold wire and the frame are prevented.

Further, after the chip is soldered on the frame, an insulating film is placed on the frame on which the chip is not placed, so that contact between the gold wire and the frame is prevented.

[0010]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1 and FIG. 2, the same parts as those in the prior art are designated by the same reference numerals. Reference numeral 11 denotes a portion covered with an insulating film. By covering the chip 2, the gold wire 4, the frame 1, the lead 3 and the like with this insulating film in a step before pouring the mold resin 6, the chip, the gold wire,
Since the frame and the leads are insulated, it is possible to prevent the contact between the gold wires and the gold wire and the contact between the gold wire and the frame due to the wire flow. Further, it is possible to improve the moisture resistance of the pad and the adhesiveness of the mold resin.

Embodiment 2. 3 and 4 show another embodiment of the present invention. After the chip 2 is soldered on the frame 1 and before wire bonding, the insulating film 12 is placed on the frame 1 on which the chip is not placed. It was done like this. With the above structure, the same effect as that of the first embodiment can be obtained.

[0012]

As described above, according to the present invention, the chip, the gold wire, the frame and the lead are insulated from each other, so that the contact between the gold wire and the gold wire or the contact between the gold wire and the frame due to the wire flow is prevented. There is an effect that can be prevented. Further, effects such as an improvement in the moisture resistance of the pad and an improvement in the adhesiveness of the mold resin can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a first embodiment of the present invention.

FIG. 3 is a plan view showing a second embodiment of the present invention.

FIG. 4 is a sectional view showing Embodiment 2 of the present invention.

FIG. 5 is a plan view showing a conventional IC.

FIG. 6 is a sectional view showing a conventional IC.

[Explanation of symbols]

 1 frame 2 chip 3 lead 4 gold wire 5 pad 6 mold resin 11 and 12 insulating film

Claims (2)

[Claims] 1. An IC in which a chip is mounted on a frame, a pad and a lead on the chip are connected by a gold wire, and the whole is covered with a mold resin, before the mold is poured, the chip, the gold wire, and the frame. , A method of manufacturing an IC, characterized in that the leads are covered with an insulating film. 2. An IC in which a chip is mounted on a frame and a pad on the chip and a lead are connected by a gold wire.
2. A method of manufacturing an IC, wherein after the chip is soldered on the frame, before the wire bonding, the insulating film is mounted on the frame on which the chip is not mounted.